JP2018122348A - Ultrasonic bonding apparatus and horn replacement informing device for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an ultrasonic bonding apparatus and a horn replacement informing device for the same in which horn replacement due to deterioration can be easily and surely informed by monitoring heat flow from a bonding object portion by a heat flow sensor.SOLUTION: An ultrasonic bonding apparatus 100 is given in which a work-piece 30 including a bonding object portion 33 is laid on an anvil 20, and ultrasonic vibration is applied to the bonding object portion 33 of the work-piece 30 from an ultrasonic horn 40 while a load is applied thereto so as to bond the bonding object portion 33. A heat flow sensor 83 is arranged at the anvil 20 and a peak heat flow value is detected based on detection output of the heat flow sensor 83. When the peak heat flow value is lower than the threshold value set in advance, a set amplitude value of the ultrasonic vibration is corrected to return the peak heat flow value to the initial peak heat flow value. When the corrected set amplitude value is more than an upper limit set in advance, replacement of an ultrasonic horn 40 is informed.SELECTED DRAWING: Figure 7

Description

  The present invention relates to an ultrasonic bonding apparatus and a horn exchange notification device thereof, and more specifically, an ultrasonic bonding apparatus and a horn thereof in which a heat flow from a bonding target portion is monitored by a heat flow sensor to notify a replacement due to deterioration of the horn. The present invention relates to an exchange notification device.

  The ultrasonic bonding apparatus performs bonding of bonding target portions by applying ultrasonic vibration and weight to the bonding target portions.

  2. Description of the Related Art Conventionally, an ultrasonic bonding apparatus disclosed in Patent Document 1 is known as an ultrasonic bonding apparatus that monitors the temperature of a bonding target portion in order to determine whether or not the bonding target portion is bonded by an ultrasonic bonding apparatus.

  The ultrasonic bonding apparatus disclosed in Patent Document 1 includes a thermo camera that measures the temperature distribution of an electrode tab that has been ultrasonically bonded, and the temperatures of an unbonded region and an ultrasonic bonding region of the electrode tab that are measured for temperature distribution. A calculation unit that calculates the ultrasonic bonding region of the electrode tab using the difference, and calculates the ultrasonic bonding region of the electrode tab from the temperature distribution of the ultrasonically bonded electrode tab. It is comprised so that the joining state of may be test | inspected.

  Further, in Patent Document 1, the temperature distribution of the electrode tab is measured discretely by measuring the temperature at one location of the electrode tab using a temperature sensor made of a thermocouple instead of the thermo camera, and simplified. Describes that the quality of ultrasonic bonding can also be judged.

  By the way, in the conventional ultrasonic bonding apparatus, there is a problem that the bondability (bonding strength) by the ultrasonic bonding apparatus gradually decreases with the knurl wear of the horn tip. A destructive test (strength measurement) was carried out by sampling, and a method of appropriately increasing the set amplitude% of the ultrasonic vibration by human judgment so that the product did not have a predetermined required strength was taken. However, this method is very time-consuming and has a problem of lack of reliability.

JP 2008-145252 A

  Therefore, the present invention provides an ultrasonic bonding apparatus and a horn replacement notification apparatus that can easily and reliably notify replacement due to deterioration of the horn by monitoring the heat flow from the bonding target portion with a heat flow sensor. The purpose is to do.

  In order to achieve the above object, the invention of claim 1 is a method of placing a workpiece including a joining target part on an anvil, applying a weight to the joining target part and applying ultrasonic vibration from an ultrasonic horn, An ultrasonic bonding apparatus for bonding a bonding target site, provided at a position near the bonding target site of the anvil, and a heat flow sensor that detects a heat flow from the bonding target site at the time of bonding the bonding target site; The detection value of the heat flow sensor is monitored, the peak value detection means for detecting the peak heat flow value from the detection output of the heat flow sensor, and the setting of the peak heat flow value preset by the peak heat flow value detected by the peak value detection means And a notifying means for notifying the replacement of the ultrasonic horn when out of the range.

  According to a second aspect of the present invention, in the first aspect of the invention, when the peak heat flow value detected by the peak value detecting means falls below a preset threshold value, the peak heat flow value returns to the initial peak heat flow value. And a setting amplitude correction means for correcting the setting amplitude value of the ultrasonic vibration, and the notification means when the setting amplitude value corrected by the setting amplitude correction means exceeds a preset upper limit value. The replacement of the ultrasonic horn is notified.

  According to a third aspect of the present invention, in the second aspect of the present invention, when the average value of the peak heat flow value relating to the predetermined number of times of bonding is less than the threshold value, the set amplitude correcting means detects the increase in the set amplitude value and Determining a setting amplitude value to return to the initial peak heat flow value based on a ratio with an average value of the peak heat flow value increased by an increase in the setting amplitude value, and correcting the setting amplitude value with the determined setting amplitude value; It is characterized by.

  The invention of claim 4 is the invention of claim 2 or 3, wherein when the peak heat flow value returns to the initial peak heat flow value by the correction of the set amplitude value by the set amplitude correction means, the joining is continued, When the peak heat flow value does not return to the initial peak heat flow value due to the correction of the set amplitude value by the set amplitude correction means, the notification means notifies the replacement of the ultrasonic horn.

  The invention of claim 5 is the invention of any one of claims 1 to 4, characterized in that the ultrasonic horn applies ultrasonic vibration in a lateral direction parallel to the bonding target portion. .

  The invention of claim 6 is the invention of any one of claims 1 to 4, wherein the ultrasonic horn applies ultrasonic vibration in a vertical direction perpendicular to the bonding target portion. .

  According to the seventh aspect of the present invention, an ultrasonic wave is placed on a workpiece including a bonding target part, applies weight to the bonding target part, applies ultrasonic vibration from an ultrasonic horn, and bonds the bonding target part. A horn exchange notification device for a joining device, the heat flow sensor being provided at a position close to the joining target part of the anvil and detecting a heat flow from the joining target part when joining the joining target part, and the heat flow sensor And detecting a peak heat flow value from the detection output of the heat flow sensor, and the peak heat flow value detected by the peak value detection means deviates from a preset peak heat flow value setting range. In this case, it is characterized by comprising notifying means for notifying the replacement of the ultrasonic horn.

  According to the present invention, a workpiece including a bonding target portion is placed on an anvil, weight is applied to the bonding target portion, and ultrasonic vibration is applied from an ultrasonic horn to bond the bonding target portion. A heat flow sensor that is provided at a position near the joining target portion of the anvil and detects a heat flow from the joining target portion when joining the joining target portion; and a detection output of the heat flow sensor is monitored. A peak value detecting means for detecting a peak heat flow value from the detection output of the heat flow sensor, and if the peak heat flow value detected by the peak value detecting means is out of a preset peak heat flow value setting range, And a notification means for notifying the replacement of the sonic horn, so that the deterioration of the horn can be easily and reliably notified with a simple configuration. The effect say.

FIG. 1 is a diagram showing an outline of a first embodiment of an ultrasonic bonding apparatus according to the present invention. FIG. 2 is a cross-sectional view and a top view showing details of the heat flow sensor fixing structure used in the ultrasonic bonding apparatus shown in FIG. FIG. 3 is a top view showing the details of another configuration of the anvil used in the ultrasonic bonding apparatus shown in FIG. FIG. 4 is a front view of the anvil with the second member shown in FIG. 3 removed. FIG. 5 is a diagram for explaining a horn deterioration state of the ultrasonic bonding apparatus shown in FIG. FIG. 6 is a graph showing an example of the output of the heat flow sensor when the horn is normal and when the knurl is deteriorated. FIG. 7 is a flowchart showing an example of horn replacement notification processing in the ultrasonic bonding apparatus shown in FIG. FIG. 8 is a diagram showing an outline of Example 2 of the ultrasonic bonding apparatus according to the present invention.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings.

  FIG. 1 is a diagram showing an outline of a first embodiment of an ultrasonic bonding apparatus according to the present invention.

  In FIG. 1, the ultrasonic bonding apparatus 100 according to the first embodiment of the present invention places a workpiece 30 including a bonding target portion 33 on an anvil 20 fixed to a pedestal 10, and the bonding target portion 33 of the workpiece 30. A weight is applied from a weighting device (not shown), and ultrasonic vibration is applied from the head 41 at the tip of an ultrasonic horn (hereinafter simply referred to as a horn) 40, so that The work 31 and the work 32 are joined on the surface where the work 32 comes into contact.

  The horn 40 is connected to an ultrasonic vibrator (hereinafter simply referred to as a vibrator) 60 via a cone 50, and the ultrasonic vibration of the vibrator 60 is controlled by an ultrasonic oscillator 70. Here, the ultrasonic vibration applied from the head 41 of the horn 40 to the bonding target portion 33 of the workpiece 30 is a vibration in the lateral direction X parallel to the bonding target portion 33. The ultrasonic bonding using the ultrasonic vibration in the lateral direction X is suitable for, for example, metal-to-metal bonding, plastic welding bonding, particularly thin plastic sheet or film welding bonding.

  In the ultrasonic bonding apparatus 100 of the first embodiment, the heads 41 are provided at four locations around the tip of the horn 40 in order to facilitate horn replacement due to knurling deterioration of the head 41 of the horn 40, which will be described later. The horn 40 is rotated 90 degrees at a time so that the horn can be exchanged four times.

  In the ultrasonic bonding apparatus 100 according to the first embodiment, the heat flow sensor 83 monitors whether or not the bonding target portion 33 of the workpiece 30 is bonded, and detects knurl deterioration of the head 41 of the horn 40.

  The heat flow sensor 83 is a sensor that detects the flow rate and direction of heat energy, and has a much higher sensitivity to temperature changes than thermocouples that are widely used in conventional product development and evaluation. It is possible to detect the heat flow that is the direction of.

  As this heat flow sensor 83, a voltage signal corresponding to the heat energy passing through the unit area per unit time is output, and the polarity of the voltage signal corresponds to the direction in which the heat energy passes. A bismuth-tellurium heat flow sensor can be used.

  In the ultrasonic bonding apparatus 100 according to the first embodiment, the heat flow generated from the bonding target portion 33 when the workpiece 30 is bonded is the heat flow sensor fixing structure 80 shown in detail in FIG. 2 embedded in the anvil 20. Is monitored by a heat flow sensor 83 fixed by the

  As shown in FIG. 2A, the heat flow sensor fixing structure 80 includes a heat flow sensor 83 between a thin first high thermal conductivity material body 81 and a second high thermal conductivity material body 82 having a plate thickness. It has a structure that is fixed on both sides.

  The heat flow sensor fixing structure 80 is disposed at a location in the anvil 20 near the joining target portion 33 of the work 30 and has a thin first high thermal conductivity material body having a first step portion 81a at the periphery. 81, the heat flow sensor 83, and the second step extending between the first step 81a and the peripheral portion of the first high thermal conductivity material body 81 except for the first step portion 81a. The second high thermal conductivity material body 82 having a thickness 82a and the second stepped portion 82a of the second high thermal conductivity material body 82 are provided on the periphery of the first high thermal conductivity material body 81. The heat flow sensor 83 is screwed to the second stepped portion 82a of the second high thermal conductivity material body 82 with a screw 85, thereby making the heat flow sensor 83 a first high heat. Between the conductivity material 81 and the second high thermal conductivity material 82 Having the boss was structure.

  Here, between the heat insulating material body 84 and the heat flow sensor 83 and between the heat insulating material body 84 and the upright surface of the first step portion 81a of the first high thermal conductivity material body 81, FIG. As shown in FIG. This gap is provided in order to reduce the thermal diffusion to the heat insulating material body 84 as much as possible.

  Note that the first high thermal conductivity material body 81 and the second high thermal conductivity material body 82 can be formed using a high thermal conductivity material body such as copper, aluminum, or graphite, and the heat insulating material body 84 is a resin. It can be formed using a heat insulating material of the system.

  Further, as shown in FIG. 2B, the screws 85 are provided at the four corners of the heat flow sensor fixing structure 80, and the heat flow sensor 83 is insulated from the heat flow sensor 83 by the four screws 85 provided at the four corners. The first high thermal conductivity material body 81 and the second high thermal conductivity material body 82 are sandwiched and fixed via 84. The terminal 83a is for taking out a voltage signal output from the heat flow sensor 83.

According to such a configuration, the heat flow sensor 83 is sandwiched and fixed between the thin first high thermal conductivity material body 81 and the second high thermal conductivity material body 82 having the thickness, and the first Since the space between the high thermal conductivity material body 81 and the second high thermal conductivity material body 82 is insulated by the thermal insulation material body 84,
Damage due to pressurization from the outside of the heat flow sensor 83 can be prevented, and the heat flow from the first high thermal conductivity material body 81 side can be detected with high accuracy.

  The heat flow sensor fixing structure 80 configured as described above can increase the temperature difference between the front and back surfaces of the heat flow sensor 83 and increase the detection value of the heat flow rate Q (W / m 2) detected by the heat flow sensor 83. .

  That is, since the first high thermal conductivity material body 81 of the heat flow sensor fixing structure 80 has a small volume and a small thickness, the heat flow sensor 83 of the heat flow sensor 83 can be diffused without diffusing the heat generated in the bonding target portion 33 to the surroundings. Heat can be efficiently collected on the surface. In addition, since the second high thermal conductivity material body 82 has a large volume and a large thickness, the amount of heat that has passed through the heat flow sensor 83 is immediately radiated and diffused to the surroundings to prevent a temperature increase on the back side of the heat flow sensor 83. Works.

  FIG. 3 is a top view showing the details of another configuration of the anvil used in the ultrasonic bonding apparatus shown in FIG. FIG. 4 is a front view of the anvil 20 with the second member 22 shown in FIG. 3 removed.

  3 and 4, the anvil 20 in this case includes a first member 21 and a second member 22, and a knurled workpiece placement surface 21 a is provided on the upper surface of the first member 21. A work placement block 21b is detachably attached. Here, the workpiece placement block 21b is replaced when the knurled portion of the workpiece placement surface 21a is deteriorated.

  Further, a heat flow sensor 83 is attached to an attachment surface that is in the vicinity of the workpiece placement surface 21a of the first member 21 and is perpendicular to the workpiece placement surface 21a. Here, the heat flow sensor 83 is attached to the attachment surface of the first member 21 by holding the heat flow sensor 83 with the holding plate 24 and fixing the holding plate 24 to the attachment surface of the first member 21 with screws 25a and 25b. Is done.

  As the pressing plate 24 for pressing the heat flow sensor 33, a resin plate made of highly heat-insulating and heat-resistant material can be used. A slit 22a is formed in the lower part of the second member 22, and the output wiring of the heat flow sensor 83 is led out through the slit 22a.

  As shown in FIG. 4A, a knurl 41a is formed on the lower surface of the head 41 of the horn 40 used in the ultrasonic bonding apparatus 100 according to the first embodiment. It is known that by repeating the joining by the apparatus 100, it is worn as shown in FIG. 4B, and as a result, the joining property of the joining by the ultrasonic joining apparatus 100 is lowered.

  FIG. 6 is a graph showing an output example of the heat flow sensor 83 when the horn is normal and when the knurl is deteriorated. As shown in FIG. 6A, when the knurl of the head 41 of the horn 40 is in the initial state, the peak heat flow value detected by the heat flow sensor 83 is about 12 V, but when the knurl of the head 41 of the horn 40 is worn. As shown in FIG. 6B, the peak heat flow value detected by the heat flow sensor 83 is reduced to about 9 V, and thereby the bondability of bonding by the ultrasonic bonding apparatus 100 is lowered. In FIG. 6, a value obtained by amplifying the mV voltage output from the heat flow sensor 83 is used.

  Therefore, in the ultrasonic bonding apparatus 100 according to the first embodiment, when the ultrasonic bonding apparatus 100 performs bonding, the output of the heat flow sensor 83 is monitored, and the peak heat flow value detected by the heat flow sensor 83 has a preset threshold value. When the value is lower, the set amplitude% (hereinafter referred to as set amplitude value) of the ultrasonic vibration is shifted in the increasing direction, and the peak heat flow value detected by the heat flow sensor 83 is automatically controlled so as to return to the initial peak heat flow value. As a result, bonding failure is prevented from occurring. For example, when the peak heat flow value is small compared to the initial state, there is a correlation that the bonding energy is small and the bonding strength is also reduced. In this case, the set amplitude value is increased to increase the bonding energy, and the peak The heat flow value is shifted to the original value.

  If the set amplitude value exceeds the preset upper limit value due to the shift by the set amplitude value, the knurl 41a of the head 41 of the horn 40 is worn out and it is time to replace the horn 40. It is configured to notify the exchange.

  According to such a configuration, since the replacement of the horn 40 can be notified easily and reliably, it is possible to reliably prevent the deterioration of the bonding property by the ultrasonic bonding apparatus 100.

  Here, the shift of the set amplitude value is not performed for each joining (one shot) of the ultrasonic bonding apparatus 100, but for every arbitrary number of shots collected to some extent, for example, 100 shots every 100 shots. This is based on the average value of minutes.

  The shift amount of the set amplitude value is configured so that an arbitrary value can be set, and whether to shift the set amplitude value is determined in advance by determining a threshold value, and if the average value of the peak heat flow value falls below the threshold value, the shift is performed. I do.

  That is, for the average value of the peak heat flow value of the arbitrary number of shots that have been collected to some extent after the set amplitude value is shifted, the ratio of the set amplitude% of the increment and the average value of the increased peak heat flow value is calculated, and the data is used as the basis. Thus, the set amplitude value that becomes the initial peak heat flow value is determined. When it returns to the initial peak heat flow value (± several%), it is fixed at the set amplitude value and the joining is continued.

  Then, when the shifted set amplitude value exceeds the upper limit of the shiftable set amplitude value, an alarm is issued to notify the replacement of the horn 40.

  FIG. 7 is a flowchart showing an example of a horn replacement notification process in the ultrasonic bonding apparatus 100 shown in FIG.

  In FIG. 7, when the horn exchange notification process is started, the peak heat flow value is detected by the heat flow sensor 83 for each shot joining by the ultrasonic joining apparatus 100 (step 701). When the number of times of bonding by the ultrasonic bonding apparatus 100 reaches a predetermined number of times, for example, 100 shots, an average value of peak heat flow values of the predetermined number of shots is obtained, and it is checked whether the average value is below a preset threshold value ( Step 702).

  Here, if the average value of the peak heat flow values of the predetermined number of shots is not less than the preset threshold value (NO in step 702), the process returns to step 701 and the detection of the peak heat flow value is continued.

  If it is determined in step 702 that the average value of the peak heat flow value for the predetermined number of shots is below a preset threshold value (YES in step 702), the desired peak heat flow is determined based on the average value of the peak heat flow value for the predetermined number of shots. A correction value of the set amplitude value to be returned to the value is calculated (step 703). The calculation of the correction value of the set amplitude value to return to the desired peak heat flow value here is based on the average value of the set amplitude% of the increase and the average value of the increased peak heat flow value with respect to the average value of the peak heat flow value of the predetermined number of shots. The ratio is calculated, and based on the data, the set amplitude value that becomes the initial peak heat flow value is calculated.

  Then, the set amplitude value so far is shifted to the set amplitude value calculated in step 703 (step 704). Next, it is examined whether or not the peak heat flow value detected by the heat flow sensor 83 has returned to the initial peak heat flow value due to the shift of the set amplitude value (step 705). Here, when it is determined that the peak heat flow value has returned to the initial peak heat flow value (step 706), normal joining is possible, and thus the joining is continued at this set amplitude value (step 706), and this processing is performed. Exit.

  If it is determined in step 705 that the peak heat flow value detected by the heat flow sensor 83 does not return to the initial peak heat flow value (NO in step 705), has the shifted set amplitude value exceeded the upper limit that can be shifted? (Step 707), if it exceeds the shiftable upper limit value, it is determined that the replacement time of the horn 40 has been reached, horn replacement notification is performed (step 708), and this process is terminated. If it is determined in step 707 that the shifted set amplitude value does not exceed the shiftable upper limit value (in step 707), the process returns to step 703, and the correction value of the set amplitude value is recalculated.

  In the first embodiment, the case where the ultrasonic vibration applied from the horn 40 to the bonding target portion 33 of the workpiece 30 is the vibration in the lateral direction X parallel to the bonding target portion 33 is shown. Even when the ultrasonic vibration applied from the horn 40 to the joining target portion 33 of the workpiece 30 is the vibration in the vertical direction Y perpendicular to the joining target portion 33, the present invention can be similarly applied. it can.

  FIG. 8 is a diagram showing an outline of Example 2 of the ultrasonic bonding apparatus according to the present invention. In the ultrasonic bonding apparatus 200 shown in FIG. 6, parts having the same functions as those of the ultrasonic bonding apparatus 100 shown in FIG.

  As shown in FIG. 8, the ultrasonic bonding apparatus 200 shown in FIG. 8 places the workpiece 30 including the bonding target portion 33 on the anvil 20 fixed to the pedestal 10, and puts the workpiece 30 on the bonding target portion 33 of the workpiece 30. While applying weight from a weighting device (not shown) and applying ultrasonic vibration from the head 41 at the tip of the horn 40, the workpiece 31 is bonded to the workpiece 31 on the surface of the workpiece 30, that is, the surface where the workpiece 31 and the workpiece 32 contact each other. The workpiece 32 is joined.

  Here, in the ultrasonic bonding apparatus 200 according to the second embodiment, vibration in the vertical direction Y perpendicular to the bonding target portion 33 is applied from the head 41 of the horn 40. The ultrasonic bonding using the ultrasonic vibration in the longitudinal direction Y is suitable for, for example, melt bonding to a resin.

  Also in the ultrasonic bonding apparatus 200 of the second embodiment, the heat flow from the bonding target portion 33 of the workpiece 30 is caused by the heat flow sensor 83 fixed by the heat flow sensor fixing structure 80 shown in detail in FIG. 2 embedded in the anvil 20. Monitored.

  Other configurations are the same as those of the ultrasonic bonding apparatus 100 shown in FIG.

  The present invention is not limited to the above-described embodiments, and many modifications can be made by the ordinary creation ability of those skilled in the art within the scope of the technical idea of the present invention.

  In the ultrasonic bonding apparatus 200 of the second embodiment, the heat flow sensor 83 may be attached to the anvil 20 as shown in FIGS.

  The present invention is not limited to the above-described embodiments, and many modifications can be made by the ordinary creation ability of those skilled in the art within the scope of the technical idea of the present invention.

DESCRIPTION OF SYMBOLS 10 ... Base 20 ... Anvil 21 ... 1st member 21a ... Work mounting surface 21b ... Work mounting block 22 ... 2nd member 24 ... Holding plate 30 ... Work 40 ... Horn 41 ... Head 50 ... Cone 60 ... Vibrator DESCRIPTION OF SYMBOLS 70 ... Ultrasonic oscillator 80 ... Heat flow sensor fixed structure 81 ... 1st high heat conductivity material body 82 ... 2nd high heat conductivity material body 83 ... Heat flow sensor 84 ... Thermal insulation material body 100 ... Ultrasonic bonding apparatus 200 ... Ultrasonic bonding equipment

Claims (7)

A workpiece including a part to be joined is placed on the anvil, and an ultrasonic vibration is applied from an ultrasonic horn while applying a weight to the part to be joined, and an ultrasonic joining apparatus for joining the parts to be joined,
A heat flow sensor provided at a position close to the joining target portion of the anvil, and detecting a heat flow from the joining target portion upon joining the joining target portion;
Monitoring a detection output of the heat flow sensor, and detecting a peak heat flow value from the detection output of the heat flow sensor;
When the peak heat flow value detected by the peak value detection means is out of the preset range of the peak heat flow value, notification means for notifying the replacement of the ultrasonic horn;
An ultrasonic bonding apparatus comprising: A set amplitude for correcting the set amplitude value of the ultrasonic vibration so that the peak heat flow value returns to the initial peak heat flow value when the peak heat flow value detected by the peak value detecting means falls below a preset threshold value. Correction means;
Comprising
The notification means includes
When the set amplitude value corrected by the set amplitude correction means exceeds a preset upper limit value, the replacement of the ultrasonic horn is notified,
The ultrasonic bonding apparatus according to claim 1. The set amplitude correction means includes:
When the average value of the peak heat flow value related to the predetermined number of times of bonding is less than the threshold value, based on the ratio between the increment of the set amplitude value and the average value of the peak heat flow value increased by the increase of the set amplitude value. 3. The ultrasonic bonding apparatus according to claim 2, wherein a set amplitude value that returns to an initial peak heat flow value is determined, and the set amplitude value is corrected by the determined set amplitude value. When the peak heat flow value returns to the initial peak heat flow value by correcting the set amplitude value by the set amplitude correction means, the joining is continued,
If the peak heat flow value does not return to the initial peak heat flow value due to the correction of the set amplitude value by the set amplitude correction unit, the replacement of the ultrasonic horn by the notification unit is notified,
The ultrasonic bonding apparatus according to claim 2 or 3, wherein The ultrasonic horn is
The ultrasonic bonding apparatus according to any one of claims 1 to 4, wherein ultrasonic vibrations in a lateral direction parallel to the bonding target portions are applied. The ultrasonic horn is
The ultrasonic bonding apparatus according to claim 1, wherein ultrasonic vibration in a vertical direction perpendicular to the bonding target portion is applied. A horn exchange notification device for an ultrasonic bonding apparatus that places a workpiece including a bonding target part on an anvil, applies a weight to the bonding target part and applies ultrasonic vibration from an ultrasonic horn, and bonds the bonding target part. Because
A heat flow sensor provided at a position close to the joining target portion of the anvil, and detecting a heat flow from the joining target portion upon joining the joining target portion;
Monitoring a detection output of the heat flow sensor, and detecting a peak heat flow value from the detection output of the heat flow sensor;
When the peak heat flow value detected by the peak value detection means is out of the preset range of the peak heat flow value, notification means for notifying the replacement of the ultrasonic horn;
A horn replacement notification device for an ultrasonic bonding apparatus, comprising:

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