JP6890051B2 - Ultrasonic bonding device - Google Patents

Ultrasonic bonding device Download PDF

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JP6890051B2
JP6890051B2 JP2017126099A JP2017126099A JP6890051B2 JP 6890051 B2 JP6890051 B2 JP 6890051B2 JP 2017126099 A JP2017126099 A JP 2017126099A JP 2017126099 A JP2017126099 A JP 2017126099A JP 6890051 B2 JP6890051 B2 JP 6890051B2
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heat flow
flow sensor
work
coil spring
bonding
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隆司 関本
隆司 関本
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Nippon Avionics Co Ltd
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Description

本発明は、超音波接合装置に関し、詳しくは、超音波接合装置による接合対象部位の接合に際して接合対象部位からの熱流を熱流センサでモニタするようにした超音波接合装置に関する。 The present invention relates to an ultrasonic bonding apparatus, and more particularly to an ultrasonic bonding apparatus in which a heat flow sensor monitors a heat flow from a bonding target portion when bonding the bonding target portion by the ultrasonic bonding device.

超音波接合装置は、接合対象部位に加重と超音波振動を与えることにより接合対象部位の接合を行うものである。 The ultrasonic bonding device joins a bonding target portion by applying a load and ultrasonic vibration to the bonding target portion.

従来、超音波接合装置による接合対象部位の接合の良否を判定するために、接合対象部位の温度をモニタする超音波接合装置としては特許文献１に開示されたものが知られている。 Conventionally, as an ultrasonic bonding device that monitors the temperature of a bonding target portion in order to determine the quality of bonding of the bonding target portion by the ultrasonic bonding device, the one disclosed in Patent Document 1 is known.

特許文献１に開示された超音波接合装置は、超音波接合された電極タブの温度分布を測定するサーモカメラと、温度分布が測定される電極タブの未接合領域と超音波接合領域との温度差を利用して、当該電極タブの超音波接合領域を算出する算出部と、を有し、超音波接合された電極タブの温度分布から当該電極タブの超音波接合領域を算出して電極タブの接合状態を検査するように構成されている。 The ultrasonic bonding apparatus disclosed in Patent Document 1 includes a thermo camera that measures the temperature distribution of an ultrasonically bonded electrode tab, and the temperature between the unbonded region and the ultrasonically bonded region of the electrode tab where the temperature distribution is measured. It has a calculation unit that calculates the ultrasonic bonding region of the electrode tab using the difference, and calculates the ultrasonic bonding region of the electrode tab from the temperature distribution of the ultrasonically bonded electrode tab. It is configured to inspect the bonding condition of.

また、特許文献１には、サーモカメラに代えて熱電対からなる温度センサを用いて電極タブの一箇所の温度を測定することにより、電極タブの温度分布を離散的に測定して、簡易的に超音波接合の良否を判断することもできるという記載がある。 Further, in Patent Document 1, the temperature distribution of the electrode tab is measured discretely by measuring the temperature at one location of the electrode tab using a temperature sensor composed of a thermocouple instead of the thermo camera, which is simple. There is a description that it is possible to judge the quality of ultrasonic bonding.

しかし、サーモカメラによる接合対象部位の温度モニタは、コンピュータによる温度解析が必要となるので装置が高価、かつ複雑になるという問題があり、また、熱電対を用いた場合は、その配設箇所の選定が難しく、また、微小な温度変化を捉えることができないので、高精度な温度モニタはできないという問題があった。 However, the temperature monitor of the joint target part by the thermo camera has a problem that the device is expensive and complicated because the temperature analysis by the computer is required, and when a thermocouple is used, the arrangement part of the device is used. Since it is difficult to select and it is not possible to capture minute temperature changes, there is a problem that a highly accurate temperature monitor cannot be performed.

特開２００８−１４５２５２号公報Japanese Unexamined Patent Publication No. 2008-14252

そこで、本発明は、接合対象部位からの熱流を熱流センサでモニタすることにより接合対象部位の接合の可否を高精度にモニタすることを可能にした超音波接合装置を提供することを目的とする。 Therefore, an object of the present invention is to provide an ultrasonic bonding apparatus capable of monitoring the bonding availability of a bonding target site with high accuracy by monitoring the heat flow from the bonding target site with a heat flow sensor. ..

上記の目的を達成するため、請求項１の発明は、接合対象部位を含むワークをアンビル上に載置し、前記接合対象部位に加重を与えるとともに超音波ホーンから超音波振動を印加し、前記接合対象部位を接合する超音波接合装置であって、前記アンビルは、前記ワークを載置するワーク載置面を有するワーク載置ブロックが前記ワーク載置面と垂直な一側面を外部に露出させて収容される第１の部材と、前記ワーク載置ブロックの前記一側面に搭載される熱流センサと、前記熱流センサを囲むようにして前記第１の部材の側面に取り付けられる第２の部材と、前記第２の部材の前記熱流センサに対向する面に取り付けられるコイルばね固定冶具と、一端が前記コイルばね固定冶具に取り付けられ、他端が前記熱流センサに当接するコイルばねと、を具備することを特徴とする。 In order to achieve the above object, in the invention of claim 1, a work including a joint target portion is placed on an anvil, a weight is applied to the joint target portion, and ultrasonic vibration is applied from an ultrasonic horn. An ultrasonic joining device that joins parts to be joined. In the anvil, a work mounting block having a work mounting surface on which the work is mounted exposes one side surface perpendicular to the work mounting surface to the outside. A first member to be accommodated, a heat flow sensor mounted on the one side surface of the work mounting block, a second member attached to the side surface of the first member so as to surround the heat flow sensor, and the above. It is provided with a coil spring fixing jig attached to a surface of the second member facing the heat flow sensor, and a coil spring having one end attached to the coil spring fixing jig and the other end abutting on the heat flow sensor. It is a feature.

本発明によれば、接合対象部位を含むワークをアンビル上に載置し、前記接合対象部位に加重を与えるとともに超音波ホーンから超音波振動を印加し、前記接合対象部位を接合する超音波接合装置であって、前記アンビルは、前記ワークを載置するワーク載置面を有するワーク載置ブロックが前記ワーク載置面と垂直な一側面を外部に露出させて収容される第１の部材と、前記ワーク載置ブロックの前記一側面に搭載される熱流センサと、前記熱流センサを囲むようにして前記第１の部材の側面に取り付けられる第２の部材と、前記第２の部材の前記熱流センサに対向する面に取り付けられるコイルばね固定冶具と、一端が前記コイルばね固定冶具に取り付けられ、他端が前記熱流センサに当接するコイルばねと、を具備するように構成したので、簡単な構成により接合対象部位の接合の可否を高精度にモニタすることが可能になるという効果を奏する。 According to the present invention, a work including a bonding target portion is placed on an anvil, a load is applied to the bonding target portion, and ultrasonic vibration is applied from an ultrasonic horn to bond the bonding target portion. a equipment, the anvil is a first member of a work mount block having a workpiece placing surface for placing the workpiece is accommodated by exposing the workpiece placement surface perpendicular one side to the outside A heat flow sensor mounted on the one side surface of the work mounting block, a second member attached to the side surface of the first member so as to surround the heat flow sensor, and the heat flow sensor of the second member. A coil spring fixing jig attached to the surface facing the surface and a coil spring having one end attached to the coil spring fixing jig and the other end abutting on the heat flow sensor are provided. It has the effect of making it possible to monitor the bonding availability of the bonding target site with high accuracy.

図１は、本発明に係る超音波接合装置の実施例１の概略を示す図である。FIG. 1 is a diagram showing an outline of Example 1 of an ultrasonic bonding device according to the present invention. 図２は、図１に示した超音波接合装置で用いるコイルばねの取り付け構造の一例を示す断面図である。FIG. 2 is a cross-sectional view showing an example of a coil spring mounting structure used in the ultrasonic bonding device shown in FIG. 図３は、図１に示した超音波接合装置で用いるアンビルの詳細を示す上面図及びそのＡ-Ａ断面図である。FIG. 3 is a top view showing details of the anvil used in the ultrasonic bonding apparatus shown in FIG. 1 and a cross-sectional view taken along the line AA. 図４は、図２に示した第２の部材を外した状態のアンビルの正面図である。FIG. 4 is a front view of the anvil with the second member shown in FIG. 2 removed. 図５は、熱流センサをコイルばねで押えた場合の優位性を説明するためのグラフである。FIG. 5 is a graph for explaining the superiority when the heat flow sensor is pressed by the coil spring. 図６は、本発明に係る超音波接合装置の実施例２の概略を示す図である。FIG. 6 is a diagram showing an outline of Example 2 of the ultrasonic bonding device according to the present invention.

以下、本発明を実施するための実施例について、添付した図面を参照しながら詳細に説明する。 Hereinafter, examples for carrying out the present invention will be described in detail with reference to the attached drawings.

図１は、本発明に係る超音波接合装置の実施例１の概略を示す図である。 FIG. 1 is a diagram showing an outline of Example 1 of an ultrasonic bonding device according to the present invention.

図１において、本発明に係る実施例１の超音波接合装置１００は、台座１０に固定されたアンビル２０上に接合対象部位３３を含むワーク３０を載置し、このワーク３０の接合対象部位３３に図示しない加圧装置から加重を与えるとともに、超音波ホーン（以下、単にホーンという）４０のヘッド４１から超音波振動を印加することにより、ワーク３０の接合対象部位３３、すなわち、ワーク３１とワーク３２とが接する面でワーク３１とワーク３２とを接合するものである。 In FIG. 1, in the ultrasonic bonding apparatus 100 of the first embodiment according to the present invention, a work 30 including a bonding target portion 33 is placed on an anvil 20 fixed to a pedestal 10, and the bonding target portion 33 of the work 30 is placed. By applying a load from a pressurizing device (not shown) and applying ultrasonic vibration from the head 41 of the ultrasonic horn (hereinafter, simply referred to as a horn) 40, the bonding target portion 33 of the work 30, that is, the work 31 and the work The work 31 and the work 32 are joined at the surface in contact with the 32.

ホーン４０は、コーン５０を介して超音波振動子（以下、単に振動子という）６０に接続され、振動子６０は、超音波発振機７０によりその超音波振動が制御される。ここで、ワーク３０の接合対象部位３３に対してホーン４０のヘッド４１から印加される超音波振動は、接合対象部位３３に対して平行な横方向Ｘの振動である。この横方向Ｘの超音波振動を用いた超音波接合は、例えば、金属同士の接合、プラスチック溶着接合、特に、薄いプラスチックシートやフィルムの溶着接合等に適している。 The horn 40 is connected to an ultrasonic vibrator (hereinafter, simply referred to as a vibrator) 60 via a cone 50, and the ultrasonic vibration of the vibrator 60 is controlled by an ultrasonic oscillator 70. Here, the ultrasonic vibration applied from the head 41 of the horn 40 to the joining target portion 33 of the work 30 is a vibration in the lateral direction X parallel to the joining target portion 33. This ultrasonic bonding using ultrasonic vibration in the lateral direction X is suitable for, for example, metal-to-metal bonding, plastic welding bonding, particularly welding bonding of thin plastic sheets or films.

さて、この実施例１の超音波接合装置１００においては、ワーク３０の接合対象部位３３の接合状態の可否を熱流センサ８０によりモニタする。 In the ultrasonic bonding apparatus 100 of the first embodiment, the heat flow sensor 80 monitors whether or not the bonding target portion 33 of the work 30 is in a bonding state.

熱流センサ８０は、熱エネルギの流量と方向を検知するセンサで、従来の製品開発や評価に広く使用されている熱電対に比較して温度変化に対する感度が格段に高精度であり、放熱、吸熱の方向である熱の流れを検知することが可能である。 The heat flow sensor 80 is a sensor that detects the flow rate and direction of thermal energy, and has significantly higher sensitivity to temperature changes than thermocouples widely used in conventional product development and evaluation, and dissipates heat and absorbs heat. It is possible to detect the heat flow in the direction of.

この熱流センサ８０としては、単位時間当たり、単位面積を通過する熱エネルギに対応する電圧信号を出力し、その電圧信号の極性が熱エネルギの通過する方向に対応する周知の半導体式熱流センサ、例えば、ビスマス−テルル系熱流センサを用いることができる。 The heat flow sensor 80 is a well-known semiconductor heat flow sensor that outputs a voltage signal corresponding to the heat energy passing through a unit area per unit time, and the polarity of the voltage signal corresponds to the direction in which the heat energy passes, for example. , Bismus-Teruru heat flow sensor can be used.

ところで、熱流センサ８０を用いてワーク３０の接合対象部位３３の接合状態をモニタする場合、熱流センサ８０の取付位置が重要である。すなわち、ワーク３０の接合対象部位３３の接合状態を的確にモニタするためには、ワーク３０の接合対象部位３３からの熱流を的確に検知できる位置に熱流センサ８０を取り付ける必要がある。 By the way, when the heat flow sensor 80 is used to monitor the joining state of the joining target portion 33 of the work 30, the mounting position of the heat flow sensor 80 is important. That is, in order to accurately monitor the joining state of the joining target portion 33 of the work 30, it is necessary to attach the heat flow sensor 80 at a position where the heat flow from the joining target portion 33 of the work 30 can be accurately detected.

そこで、この実施例の超音波接合装置１００においては、図１に示すように、アンビル２０のワーク３０を載置するワーク載置面の近傍であって該ワーク載置面と垂直な取付面にコイルばね８１で押えて熱流センサ８０を取り付けるように構成されている。なお、この熱流センサ８０の取付位置が、接合対象部位３３からの熱流を的確に検知するために最適な位置であることが伝熱解析シミュレーション（ＦＥＭ解析）によって確認されている。 Therefore, in the ultrasonic bonding apparatus 100 of this embodiment, as shown in FIG. 1, the mounting surface in the vicinity of the work mounting surface on which the work 30 of the anvil 20 is mounted and perpendicular to the work mounting surface. It is configured to be pressed by a coil spring 81 to attach the heat flow sensor 80. It has been confirmed by heat transfer analysis simulation (FEM analysis) that the mounting position of the heat flow sensor 80 is the optimum position for accurately detecting the heat flow from the joint target portion 33.

図２は、図１に示した超音波接合装置１００で用いるコイルばね８１の取り付け構造の一例を示す断面図である。 FIG. 2 is a cross-sectional view showing an example of a mounting structure of a coil spring 81 used in the ultrasonic bonding device 100 shown in FIG.

この実施例においては、コイルばね８１は、図２（Ａ）に示すコイルばね固定冶具８２を用いて取り付けられる。 In this embodiment, the coil spring 81 is attached using the coil spring fixing jig 82 shown in FIG. 2 (A).

コイルばね固定冶具８２は、コイルばね８１の一部が固定される凹部８２ａを有し、コイルばね８１の一端がこの凹部８２ａに固定される。 The coil spring fixing jig 82 has a recess 82a to which a part of the coil spring 81 is fixed, and one end of the coil spring 81 is fixed to the recess 82a.

図２（Ｂ）は、図２（Ａ）に示したコイルばね固定冶具８２を用いたアンビル２０に対する熱流センサ８０の取付構造を示す断面図である。 FIG. 2B is a cross-sectional view showing a mounting structure of the heat flow sensor 80 to the anvil 20 using the coil spring fixing jig 82 shown in FIG. 2A.

さて、アンビル２０は、次に及び図４を参照して説明するように、熱流センサ８０の取付面を有する第１の部材２１と、熱流センサ８０の取付面を囲むようにして第１の部材２１に取り付けられ、第１の部材２１と同一の高さの上面を有する第２の部材２２を有している。 By the way, as described below and with reference to FIG. 4, the anvil 20 is attached to the first member 21 having the mounting surface of the heat flow sensor 80 and the first member 21 so as to surround the mounting surface of the heat flow sensor 80. It has a second member 22 that is attached and has an upper surface that is flush with the first member 21.

そこで、この実施例１においては、コイルばね固定冶具８２を第２の部材２２の熱流センサ８０の取付面に対向する面に螺子８３を用いて取り付け、このコイルばね固定冶具８２にコイルばね８１の一端を固定し、コイルばね８１の他端が第１の部材２１の熱流センサ８０の取付面に配置された熱流センサ８０に当接するようにして、熱流センサ８０を第１の部材２１の熱流センサ８０の取付面に固定されるように構成されている。 Therefore, in the first embodiment, the coil spring fixing jig 82 is attached to the surface of the second member 22 facing the attachment surface of the heat flow sensor 80 by using a screw 83, and the coil spring 81 is attached to the coil spring fixing jig 82. One end is fixed so that the other end of the coil spring 81 comes into contact with the heat flow sensor 80 arranged on the mounting surface of the heat flow sensor 80 of the first member 21, so that the heat flow sensor 80 is brought into contact with the heat flow sensor 80 of the first member 21. It is configured to be fixed to the mounting surface of 80.

ここでの熱流センサ８０に対するコイルばね８１による押圧力は、熱流センサ８０のサイズが１０ｍｍ角、コイルばね８１の外径が６ｍｍΦの場合、２ニュートン以上にするのが好ましい。 When the size of the heat flow sensor 80 is 10 mm square and the outer diameter of the coil spring 81 is 6 mmΦ, the pressing force of the coil spring 81 against the heat flow sensor 80 is preferably 2 Newtons or more.

このような構成によると、アンビル２０の微小な振動は、このコイルばね８１で吸収され、例えば、熱流センサ８０を板材で押えて固定するような場合に比較して熱流センサ８０を安定して第１の部材２１の熱流センサ８０の取付面に固定することができ、これによりワーク３０の接合対象部位３３からの熱流を安定して検出することができる。 According to such a configuration, the minute vibration of the anvil 20 is absorbed by the coil spring 81, and the heat flow sensor 80 is more stably compared to the case where the heat flow sensor 80 is pressed and fixed by a plate material, for example. The heat flow sensor 80 of the member 21 of 1 can be fixed to the mounting surface, whereby the heat flow from the joint target portion 33 of the work 30 can be stably detected.

図３は、図１に示した超音波接合装置１００で用いるアンビル２０の詳細を示すもので、図３（Ａ）は、その上面図、図３（Ｂ）は、そのＡ-Ａ断面図である。また、図４は、図３に示した第２の部材２２を外した状態のアンビル２０の正面図である。 FIG. 3 shows the details of the anvil 20 used in the ultrasonic bonding device 100 shown in FIG. 1, FIG. 3 (A) is a top view thereof, and FIG. 3 (B) is a cross-sectional view taken along the line AA. is there. Further, FIG. 4 is a front view of the anvil 20 with the second member 22 shown in FIG. 3 removed.

図３及び図４において、図１に示した超音波接合装置１００で用いるアンビル２０は、第１の部材２１と第２の部材２２とからなり、第１の部材２１の上面には、ローレット加工されたワーク載置面２１ａを有するワーク載置ブロック２１ｂが着脱自在に取り付けられている。ここで、ワーク載置ブロック２１ｂは、ワーク載置面２１ａのローレット加工部が劣化した場合に交換される。 In FIGS. 3 and 4, the anvil 20 used in the ultrasonic bonding device 100 shown in FIG. 1 is composed of a first member 21 and a second member 22, and the upper surface of the first member 21 is knurled. A work mounting block 21b having the work mounting surface 21a is detachably attached. Here, the work mounting block 21b is replaced when the knurled portion of the work mounting surface 21a deteriorates.

また、第１の部材２１のワーク載置面２１ａの近傍であって該ワーク載置面２１ａと垂直な取付面には、熱流センサ８０が取り付けられる。ここで、第１の部材２１の取付面に対する熱流センサ８０の取付は、コイルばね固定冶具８２を用いたコイルばね８１で押圧することにより行われる。 Further, the heat flow sensor 80 is mounted on the mounting surface of the first member 21 in the vicinity of the work mounting surface 21a and perpendicular to the work mounting surface 21a. Here, the heat flow sensor 80 is attached to the attachment surface of the first member 21 by pressing with a coil spring 81 using a coil spring fixing jig 82.

ここで、熱流センサ８０を、第１の部材２１のワーク載置面２１ａの近傍であって該ワーク載置面２１ａと垂直な取付面に取り付ける理由は、この箇所がアンビル２０を流れる熱流のＦＥＭ解析結果から接合対象部位３３からの熱流を的確に検知するための最適な位置であることが判明したことともに、ワーク３０の接合対象部位３３の接合に際して印加される加重の影響を受けないので、熱流センサ８０の破損の虞が低いからである。 Here, the reason why the heat flow sensor 80 is attached to the mounting surface in the vicinity of the work mounting surface 21a of the first member 21 and perpendicular to the work mounting surface 21a is that this portion is the FEM of the heat flow flowing through the anvil 20. From the analysis results, it was found that it is the optimum position for accurately detecting the heat flow from the joint target portion 33, and it is not affected by the load applied when the joint target portion 33 of the work 30 is joined. This is because the risk of damage to the heat flow sensor 80 is low.

また、熱流センサ８０を、コイルばね８１で押える理由は、アンビル２０の微小な振動をこのコイルばね８１で吸収し、ワーク３０の接合対象部位３３からの熱流を安定して検出することができるようにするためである。 Further, the reason why the heat flow sensor 80 is pressed by the coil spring 81 is that the minute vibration of the anvil 20 can be absorbed by the coil spring 81 so that the heat flow from the joint target portion 33 of the work 30 can be stably detected. To make it.

第１の部材２１は、一部を切欠いた断面Ｌ字状からなり、その底面が台座１０に固定される。第２の部材２２は、第１の部材２１の取付面を囲み、該取付面に取り付けられた熱流センサ８０を覆うようにして第１の部材２１の切り欠き部に取り付けられる。この第２の部材２２は、その上面が第１の部材２１の上面と面一となるように形成されており、この第２の部材２２の存在により、この超音波接合装置１００の用いたワーク３０の接合対象部位３３の接合作業を容易にしている。 The first member 21 has an L-shaped cross section cut out in part, and its bottom surface is fixed to the pedestal 10. The second member 22 is attached to the notch portion of the first member 21 so as to surround the attachment surface of the first member 21 and cover the heat flow sensor 80 attached to the attachment surface. The second member 22 is formed so that its upper surface is flush with the upper surface of the first member 21, and due to the presence of the second member 22, the work used by the ultrasonic bonding device 100 The bonding work of the bonding target portion 33 of 30 is facilitated.

なお、第２の部材２２の下部にはスリット２２ａが形成されており、熱流センサ８０の出力配線２３ａは、このスリット２２ａを通って外部に導出される。 A slit 22a is formed in the lower portion of the second member 22, and the output wiring 23a of the heat flow sensor 80 is led out to the outside through the slit 22a.

図５は、熱流センサ８０をコイルばね８１で押えた場合と、図示しない押さえ板で押えて螺子止めした場合とで熱流センサ８０の出力の相違を説明するグラフであり、図５（Ａ）は、熱流センサ８０をコイルばね８１で押えた場合の熱流センサ８０の出力波形を示し、図５（Ｂ）は、熱流センサ８０を抑え板で押えて螺子止めした場合の熱流センサ８０の出力波形を示す。 FIG. 5 is a graph for explaining the difference in the output of the heat flow sensor 80 between the case where the heat flow sensor 80 is pressed by the coil spring 81 and the case where the heat flow sensor 80 is pressed by a pressing plate (not shown) and screwed. The output waveform of the heat flow sensor 80 when the heat flow sensor 80 is pressed by the coil spring 81 is shown, and FIG. 5 (B) shows the output waveform of the heat flow sensor 80 when the heat flow sensor 80 is pressed by the holding plate and screwed. Shown.

図５（Ａ）と図５（Ｂ）の比較から明らかなように、熱流センサ８０をコイルばね８１で押えるように構成すると、熱流センサ８０を抑え板で押えて螺子止めした場合に比較してアンビル２０の微小な振動の影響を受けない安定した出力波形が得られることがわかる。 As is clear from the comparison between FIGS. 5A and 5B, when the heat flow sensor 80 is configured to be pressed by the coil spring 81, the heat flow sensor 80 is pressed by the holding plate and screwed as compared with the case where the heat flow sensor 80 is pressed by the holding plate. It can be seen that a stable output waveform that is not affected by the minute vibration of the anvil 20 can be obtained.

熱流センサ８０を抑え板で押えて螺子止めした場合に安定した出力波形が得られない１つの理由は、接合時の振動の影響で抑え板が共振し、板材界面で発熱が生じるからであると考えられる。 One reason that a stable output waveform cannot be obtained when the heat flow sensor 80 is pressed by the holding plate and screwed is that the holding plate resonates due to the influence of vibration at the time of joining, and heat is generated at the plate material interface. Conceivable.

また、熱流センサ８０を抑え板で押えて螺子止めした場合は、螺子止めのトルク管理がシビアで再現性が取りにくく、抑え板のわずかな傾きでも熱流センサ８０の出力値が変化してしまう。 Further, when the heat flow sensor 80 is pressed by the holding plate and screwed, the torque management of the screw fixing is severe and reproducibility is difficult to obtain, and the output value of the heat flow sensor 80 changes even if the holding plate is slightly tilted.

これに対して、熱流センサ８０をコイルばね８１で押えた場合は、コイルばね８１での発熱は殆ど確認できず、図５（Ａ）に示すように安定した出力波形が得られることが確認された。 On the other hand, when the heat flow sensor 80 is pressed by the coil spring 81, it is confirmed that heat generation by the coil spring 81 can hardly be confirmed and a stable output waveform can be obtained as shown in FIG. 5 (A). It was.

図６は、本発明に係る超音波接合装置の実施例２の概略を示す図である。なお、図６に示す超音波接合装置２００おいて、図１に示した超音波接合装置１００と同一の機能を有する部分には説明の便宜上同一の符号付してその詳細説明は省略する。 FIG. 6 is a diagram showing an outline of Example 2 of the ultrasonic bonding device according to the present invention. In the ultrasonic bonding device 200 shown in FIG. 6, parts having the same functions as the ultrasonic bonding device 100 shown in FIG. 1 are designated by the same reference numerals for convenience of explanation, and detailed description thereof will be omitted.

図６に示す超音波接合装置２００は、図６に示すように、台座１０に固定されたアンビル２０上に接合対象部位３３を含むワーク３０を載置し、このワーク３０の接合対象部位３３に図示しない加重装置から加重を与えるとともに、ホーン４０の先端のヘッド４１から超音波振動を印加することにより、ワーク３０の接合対象部位３３、すなわち、ワーク３１とワーク３２とが接する面でワーク３１とワーク３２とを接合する。 As shown in FIG. 6, the ultrasonic bonding apparatus 200 shown in FIG. 6 places a work 30 including a bonding target portion 33 on an anvil 20 fixed to a pedestal 10 and places the work 30 on the bonding target portion 33 of the work 30. By applying a load from a weighting device (not shown) and applying ultrasonic vibration from the head 41 at the tip of the horn 40, the work 31 and the work 31 are joined at the bonding target portion 33, that is, the surface where the work 31 and the work 32 are in contact with each other. It is joined to the work 32.

ここで、実施例２の超音波接合装置２００においては、ホーン４０の先端のヘッド４１から接合対象部位３３に対して垂直な縦方向Ｙの振動を印加する。この縦方向Ｙの超音波振動を用いた超音波接合は、例えば、樹脂に対する溶融接合等に適している。 Here, in the ultrasonic bonding apparatus 200 of the second embodiment, vibration in the vertical direction Y perpendicular to the bonding target portion 33 is applied from the head 41 at the tip of the horn 40. This ultrasonic bonding using ultrasonic vibration in the vertical direction Y is suitable for, for example, melt bonding to a resin.

この実施例２の超音波接合装置２００においても、アンビル２０のワーク３０を載置するワーク載置面の近傍であって該ワーク載置面と垂直な取付面にコイルばね８１で押えて熱流センサ８０を取り付け、この熱流センサ８０によりを用いてワーク３０の接合対象部位３３の接合状態をモニタする。 Also in the ultrasonic bonding apparatus 200 of the second embodiment, the heat flow sensor is pressed by the coil spring 81 on the mounting surface near the work mounting surface on which the work 30 of the anvil 20 is mounted and perpendicular to the work mounting surface. 80 is attached, and the bonding state of the bonding target portion 33 of the work 30 is monitored by using the heat flow sensor 80.

その他の構成は、図１に示した超音波接合装置１００と同様である。 Other configurations are the same as the ultrasonic bonding device 100 shown in FIG.

本発明は上述の実施形態に限定されるものではなく、本発明の技術的思想の範囲内であれば、当業者の通常の創作能力によって多くの変形が可能である。 The present invention is not limited to the above-described embodiment, and many modifications can be made by ordinary creative abilities of those skilled in the art within the scope of the technical idea of the present invention.

１０…台座
２０…アンビル
２１…第１の部材
２１ａ…ワーク載置面
２１ｂ…ワーク載置ブロック
２２…第２の部材
２４…押さえ板
４０…ホーン
４１…ヘッド
５０…コーン
６０…振動子
７０…超音波発振機
８０…熱流センサ
８１…コイルばね
８２…コイルばね固定冶具
１００…超音波接合装置
２００…超音波接合装置 10 ... Pedestal 20 ... Anvil 21 ... First member 21a ... Work mounting surface 21b ... Work mounting block 22 ... Second member 24 ... Holding plate 40 ... Horn 41 ... Head 50 ... Cone 60 ... Oscillator 70 ... Super Sonic oscillator 80 ... Heat flow sensor 81 ... Coil spring 82 ... Coil spring fixing jig 100 ... Ultrasonic bonding device 200 ... Ultrasonic bonding device

Claims (1)

接合対象部位を含むワークをアンビル上に載置し、前記接合対象部位に加重を与えるとともに超音波ホーンから超音波振動を印加し、前記接合対象部位を接合する超音波接合装置であって、
前記アンビルは、
前記ワークを載置するワーク載置面を有するワーク載置ブロックが前記ワーク載置面と垂直な一側面を外部に露出させて収容される第１の部材と、
前記ワーク載置ブロックの前記一側面に搭載される熱流センサと、
前記熱流センサを囲むようにして前記第１の部材の側面に取り付けられる第２の部材と、
前記第２の部材の前記熱流センサに対向する面に取り付けられるコイルばね固定冶具と、
一端が前記コイルばね固定冶具に取り付けられ、他端が前記熱流センサに当接するコイルばねと、
を具備することを特徴とする超音波接合装置。
An ultrasonic bonding device that places a work including a bonding target part on an anvil, applies a load to the bonding target part, and applies ultrasonic vibration from an ultrasonic horn to bond the bonding target part.
The anvil
A first member in which a work mounting block having a work mounting surface on which the work is placed is accommodated by exposing one side surface perpendicular to the work mounting surface to the outside.
A heat flow sensor mounted on the one side surface of the work mounting block, and
A second member attached to the side surface of the first member so as to surround the heat flow sensor, and
A coil spring fixing jig attached to the surface of the second member facing the heat flow sensor, and
A coil spring with one end attached to the coil spring fixing jig and the other end abutting on the heat flow sensor.
An ultrasonic bonding device comprising.
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