JP6802903B2 - Substrate processing equipment, its display method, and semiconductor equipment manufacturing method - Google Patents

Description

The present invention relates to a substrate processing apparatus for processing a substrate and a display method thereof, and for example, to grasp the production status of a semiconductor manufacturing apparatus for forming a film on a substrate.

In the field of semiconductor manufacturing, a substrate container (for example, FOUP) containing a wafer to be processed (hereinafter, also referred to as a substrate) is put into an apparatus, and a film forming process or the like is performed on the wafer under specified conditions. .. For example, a processing command (hereinafter, also referred to as a process job) including a film forming process is issued by an operator from a customer host computer or an operation unit. The wafer processing status is displayed on the screen of the operation unit together with the screen image of the semiconductor manufacturing apparatus. For example, the production status is displayed for each processing room. When the film forming process is completed, it is stored in the storage unit as production information. Accumulations are registered in the order of completion of processing and displayed in a list format.

For example, in Patent Document 1, the processing status of the substrate is displayed on the operation screen for each processing chamber together with the image of the semiconductor manufacturing apparatus viewed from above. Further, in Patent Document 2, the progress status of the process job currently being executed is displayed, and the contents of the process recipe executed by the process job and the production history information are displayed on the operation screen.

However, it is unknown when each reserved process job starts executing and when it is scheduled to end. As a result, it is difficult for the operator to predict the time when the device will be in a specific state, wasteful time will be generated in the setup of the device, and the device setup work will be delayed.

Japanese Patent No. 2000-077288 Japanese Unexamined Patent Publication No. 2011-0773435

An object of the present invention is to provide a configuration capable of displaying a job execution schedule in chronological order.

According to one aspect of the present invention, one axis is the reservation status of various jobs executed by the device including the job currently executed by the device, and the other axis is an operation including a two-dimensional space having a predetermined monitoring period. A display unit having a screen and various information including the start time and scheduled end time of the job being executed on the device, or the scheduled start time and scheduled end time of the job reserved on the device are acquired and acquired. The scheduled execution time of the job is calculated from the scheduled start time and scheduled end time of the currently executed job and / or the scheduled start time and scheduled end time of the reserved job, and the job is currently executed. Provided is a configuration including a display control unit configured to display a chart on the display unit as an image showing a job and a scheduled execution time of the reserved job.

According to the above configuration, the execution plan of the unprocessed job can be grasped by displaying the chart of the job to be executed.

This is an example of a cross-sectional view showing a substrate processing apparatus preferably used in one embodiment of the present invention. This is an example of a vertical cross-sectional view showing a substrate processing apparatus preferably used in one embodiment of the present invention. This is an example of a vertical cross-sectional view showing a processing furnace of a substrate processing apparatus preferably used in one embodiment of the present invention. It is a figure explaining the functional structure of the controller preferably used for one Embodiment of this invention. It is a figure which shows the processing flow of the chart display preferably used for one Embodiment of this invention. It is a figure which shows one Example displayed in the processing flow of FIG. It is a figure which shows another form of the figure which shows the Example of FIG. FIG. 5 is a diagram when a recovery condition wait occurs in the currently executing recipe displayed in the processing flow of FIG. It is a figure which shows one Example which displays the detail of the recovery condition waiting icon displayed in FIG. It is a figure which shows the processing flow of the chart display preferably used for one Embodiment of this invention. It is a figure which shows one Example displayed in the processing flow of FIG. It is a figure explaining the icon which shows the difference of the recipe type which concerns on embodiment of this invention.

(Outline of Substrate Processing Device) Next, an embodiment of the present invention will be described with reference to FIGS. 1 and 2. In the embodiment to which the present invention is applied, the substrate processing apparatus is configured as, for example, a substrate processing apparatus that implements the processing apparatus in the method for manufacturing a semiconductor device (IC). In the following description, a case where a vertical device (hereinafter, simply referred to as a processing device) that performs oxidation, diffusion processing, CVD processing, or the like is applied to the substrate as the substrate processing device will be described.

As shown in FIGS. 1 and 2, the substrate processing apparatus 10 includes two adjacent processing modules as a processing furnace 202, which will be described later. The processing module is a vertical processing module that collectively processes several tens of wafers 200 as substrates.

Below the processing furnace 202, transfer chambers 6A and 6B as preparation chambers are arranged. On the front side of the transfer chambers 6A and 6B, a transfer chamber 8 having a transfer machine 125 for transferring the wafer 200 as a substrate is arranged adjacent to the transfer chambers 6A and 6B. In the present embodiment, the processing furnace 202 described later will be provided above the transport chambers 6A and 6B, respectively.

On the front side of the transfer chamber 8, a storage chamber 9 (pod transfer space) for accommodating a pod (FOUP) 110 as a storage container for accommodating a plurality of wafers 200 is provided. A load port 22 as an I / O port is installed on the entire surface of the storage chamber 9, and the pod 110 is carried in and out of the processing device 2 via the load port 22.

Gate valves 90A and 90B as isolation portions are installed on the boundary wall (adjacent surface) between the transfer chambers 6A and 6B and the transfer chamber 8. Pressure detectors are installed in the transfer chamber 8 and the transfer chambers 6A and 6B, respectively, and the pressure in the transfer chamber 8 is set to be lower than the pressure in the transfer chambers 6A and 6B. ing. In addition, oxygen concentration detectors are installed in the transfer chamber 8 and the transport chambers 6A and 6B, respectively, and the oxygen concentration in the transfer chamber 8A and the transport chambers 6A and 6B is higher than the oxygen concentration in the atmosphere. Is also kept low. Preferably, it is maintained at 30 ppm or less.

A clean unit (not shown) that supplies clean air into the transfer chamber 8 is installed on the ceiling of the transfer chamber 8, and for example, an inert gas is circulated in the transfer chamber 8 as clean air. It is configured to let you. By circulating and purging the inside of the transfer chamber 8 with an inert gas, the inside of the transfer chamber 8 can be made into a clean atmosphere.

With such a configuration, it is possible to prevent particles and the like from the transfer chambers 6A and 6B from being mixed into the processing furnace 202 (not shown) in the transfer chamber 8 and in the transfer chamber 8 and the transfer chambers 6A and 6B. It is possible to prevent the formation of a natural oxide film on the wafer 200.

A plurality of pod openers 21 for opening and closing the lid of the pod 110, for example, three, are arranged on the boundary wall between the storage chamber 9 and the transfer chamber 8 behind the storage chamber 9. When the pod opener 21 opens the lid of the pod 110, the wafer 200 in the pod 110 is carried in and out of the transfer chamber 8.

As shown in FIG. 2, the substrate processing apparatus 10 accommodating a plurality of wafers 200 made of silicon or the like and using the pod 110 includes a housing 111 used as the substrate processing apparatus main body.

A front maintenance port (not shown) as an opening provided for maintenance is opened in the front front part of the front wall of the housing 111, and front maintenance doors for opening and closing the front maintenance port are installed respectively. Has been done. Further, a pod carry-in / carry-out outlet is provided on the front wall so as to communicate with the inside and outside of the housing 111. The pod carry-in / carry-out port may be configured to be opened / closed by a front shutter (not shown).

A load port 22 used as a loading / unloading section is installed at the pod loading / unloading outlet, and the load port 22 is configured so that the pod 110 is placed and aligned. The pod 110 is carried into the load port 22 by an in-process transfer device, and is also carried out from the load port 22.

Storage shelves (pod shelves) 105 are installed in a matrix on the front rear side of the housing 111 over the top, bottom, left, and right around the pod loading / unloading outlet. The pod shelf 105 is provided with a mounting portion 140 as a storage portion for mounting the pod. The storage unit is composed of the mounting unit 140 and a horizontal moving mechanism (storage shelf horizontal moving mechanism) that horizontally moves the mounting unit 140 between a standby position where the pod 110 is stored and a delivery position where the pod 110 is delivered. Will be done. A plurality of independent mounting portions 140 arranged on the same straight line in the horizontal direction constitute one stage of the pod shelf 105, and the pod shelves are installed in a plurality of stages in the vertical direction. Each mounting portion 140 can be moved horizontally independently of the vertically or horizontally adjacent mounting portions 140 and any other mounting portion 140. The pod transfer device 130 is configured to transfer the pod 110 between the load port 22, the pod shelf 105, and the pod opener 121.

A pod shelf (accommodation shelf) 105 is installed in a matrix on the front side of the sub-housing 119 in the housing 111. Similar to the pod shelf 105 on the front rear side of the housing 111, the mounting portion 140 as a storage portion for mounting the pods of each pod shelf 105 is horizontally movable, and is placed vertically or horizontally next to each other. It is possible to move horizontally independently without synchronizing with the unit 140. The pod shelf 105 is configured to hold one pod 110 on each of the plurality of mounting portions 140 in a state of being mounted.

On the front wall 119a of the sub-housing 119, a pair of wafer loading / unloading outlets 120 for loading / unloading the wafer 200 into the sub-housing 119 are provided in two vertical stages arranged vertically. A pair of pod openers 21 are installed at each of the wafer loading / unloading outlets 120. In this embodiment, the pod openers 21 are installed in two upper and lower stages, but two left and right pod openers may be installed in the horizontal direction. The pod opener 21 includes a mounting table 122 on which the pod 110 is placed, and a cap attachment / detachment mechanism 123 for attaching / detaching the cap of the pod 110 used as a sealing member. The pod opener 21 is configured to open and close the wafer loading / unloading port of the pod 110 by attaching / detaching the cap of the pod 110 mounted on the mounting table 122 by the cap attachment / detachment mechanism 123.

The sub-housing 119 constitutes a transfer chamber 8 that is fluidly isolated from the installation space of the pod transfer device 130 and the pod shelf 105. A wafer transfer mechanism 125 is installed in the front region of the transfer chamber 8, and the wafer transfer mechanism 125 has a wafer transfer device 125a and a wafer transfer device 125a capable of rotating or linearly moving the wafer 200 in the horizontal direction. It is composed of a wafer transfer device elevator 125b for raising and lowering. By the continuous operation of the wafer transfer device elevator 125b and the wafer transfer device 125a, the tweezers (board holder) 125c of the wafer transfer device 125a is used as a mounting portion of the wafer 200 with respect to the boat (board holder) 217. The wafer 200 is configured to be loaded (charged) and unloaded (discharged).

In the rear region of the transfer chamber 8, a transport chamber 6 is configured as a standby unit for accommodating and waiting the boat 217 via a gate valve 90. Above the transfer chamber 6, a processing furnace 202 that constitutes the processing chamber inside is provided. The lower end of the processing furnace 202 is configured to be opened and closed by the furnace opening shutter 147.

Boat 217 is moved up and down by boat elevator 115 (not shown) and introduced into the processing furnace. A seal cap 219 as a lid is horizontally installed on an arm (not shown) as a connector connected to the elevator 115 of the boat elevator 115, and the lid 219 vertically supports and processes the boat 217. It is configured so that the lower end of the furnace 202 can be closed. The boat 217 includes a plurality of holding members, and is configured to hold the plurality of wafers 200 horizontally with their centers aligned in the vertical direction.

Next, the operation of the substrate processing apparatus 10 will be described. An example of performing substrate processing as one step of a manufacturing process of a semiconductor device (device) using the above-mentioned substrate processing apparatus 10 will be described. In the present embodiment, when the reserved process job execution processing start time is reached, the controller 121 controls the operation of each part constituting the board processing device 10 to start the board processing. Here, the process job constitutes three steps of pre-processing, main processing, and post-processing. First, as a pretreatment, the transfer process of the wafer 200 is performed by the controller 121. In this embodiment, the transfer of the wafer 200 to the boat 217 is applicable. Hereinafter, the preprocessing will be mainly described.

When the pod 110 is supplied to the load port 22, the pod 110 on the load port 22 is carried into the inside of the housing 111 by the pod carry-in device from the pod carry-in / carry-out outlet. The carried-in pod 110 is automatically transported to the designated mounting portion 140 of the pod shelf 105 by the pod transfer device 130, delivered, temporarily stored, and then transferred from the pod shelf 105 to one of the pod openers 21. It is transported and delivered and transferred to the mounting table 122, or directly transported to the pod opener 21 and transferred to the mounting table 122.

The opening side end face of the pod 110 mounted on the mounting table 122 is pressed against the opening edge of the wafer loading / unloading outlet 120 on the front wall 119a of the sub-housing 119, and the cap is removed by the cap attachment / detachment mechanism 123. The wafer loading / unloading port is opened. When the pod 110 is opened by the pod opener 21, the wafer 200 is picked up from the pod 110 by the tweezers 125c of the wafer transfer device 125a through the wafer loading / unloading port, and the gate valve 90 is moved to the transfer chamber 6 behind the transfer chamber 8. It is carried in via and loaded (charged) on the boat 217. At this time, charging may be performed after aligning the wafers with a notch matching device (not shown). The wafer transfer device 125a that has delivered the wafer 200 to the boat 217 returns to the pod 110, and loads the next wafer 200 into the boat 217.

During the loading work of the wafer into the boat 217 by the wafer transfer mechanism 125 in one (upper or lower) pod opener 21, another pod 110 from the pod shelf 105 is placed in the other (lower or upper) pod opener 21. It is transported and transferred by the pod transfer device 130, and the opening work of the pod 110 by the pod opener 21 is simultaneously carried out.

When a predetermined number of wafers 200 are loaded into the boat 217, the pretreatment is completed and the main processing (here, the process recipe) is executed. The process recipe executed in the main process of this process job is a recipe for processing the substrate and is controlled by the controller 121. When this process recipe is started, the lower end of the processing furnace 202, which was closed by the furnace opening shutter 147, is opened by the furnace opening shutter 147. Subsequently, the boat 217 holding the wafer 200 group is carried (loaded) into the processing furnace 202 by raising the seal cap 219 by the boat elevator 115.

After loading, arbitrary processing is performed on the wafer 200 in the processing furnace 202. After the treatment, the wafer 200 and the pod 110 are unloaded to the outside of the housing in the reverse procedure described above. At this point, the process recipe (main process) ends.

(Processing furnace of substrate processing apparatus) As shown in FIG. 3, the processing furnace 202 has a heater 207 as a heating means (heating mechanism). The heater 207 has a cylindrical shape and is vertically installed by being supported by a heater base (not shown) as a holding plate. The heater 207 also functions as an activation mechanism (excitation portion) for activating (exciting) the processing gas with heat.

Inside the heater 207, a reaction tube 203 that constitutes a reaction vessel (processing vessel) is arranged concentrically with the heater 207. The reaction tube 203 is made of a heat-resistant material such as quartz (SiO2) or silicon carbide (SiC). The reaction tube 203 is formed in the shape of a ceiling with the lower end open and the upper end closed by a flat wall body. Inside the reaction tube 203, a cylindrical portion 209, a nozzle arrangement chamber 222 partitioned between the tubular portion 209 and the reaction tube 203, and a gas supply port formed in the tubular portion 209 are used. It includes a gas supply slit 235, a first gas exhaust port 236 formed in the tubular portion 209, and a second gas exhaust port 237 formed in the tubular portion 209 and formed below the first gas exhaust port 236. .. The tubular portion 209 is formed in the shape of a ceiling in which the lower end portion is open and the upper end portion is closed by a flat wall body. Further, the tubular portion 209 is provided so as to surround the wafer 200 in the immediate vicinity of the wafer 200. A processing chamber 201 is formed inside the tubular portion 209 of the reaction tube 203. The processing chamber 201 is configured to be capable of processing the wafer 200 as a substrate. Further, the processing chamber 201 is configured to accommodate a boat 217 as a substrate holder that can hold the wafers 200 in a horizontal posture and in a state of being arranged in multiple stages in the vertical direction.

The lower end of the reaction tube 203 is supported by a cylindrical manifold 226. The manifold 226 is made of, for example, a metal such as nickel alloy or stainless steel, or a heat resistant material such as quartz or SiC. A flange is formed at the upper end of the manifold 226, and the lower end of the reaction tube 203 is installed and supported on the flange. An airtight member 220 such as an O-ring is interposed between the flange and the lower end of the reaction tube 203 to keep the inside of the reaction tube 203 airtight.

A seal cap 219 is airtightly attached to the opening at the lower end of the manifold 226 via an airtight member 220 such as an O-ring, so that the opening side at the lower end of the reaction tube 203, that is, the opening of the manifold 226 is airtight. It is designed to be closed. The seal cap 219 is made of a metal such as a nickel alloy or stainless steel, and is formed in a disk shape. The seal cap 219 may be configured to cover the outside with a heat-resistant material such as quartz (SiO2) or silicon carbide (SiC).

A boat support 218 that supports the boat 217 is provided on the seal cap 219. The boat support 218 is made of a heat-resistant material such as quartz or SiC, functions as a heat insulating portion, and serves as a support for supporting the boat. The boat 217 is erected on the boat support 218. The boat 217 is made of a heat resistant material such as quartz or SiC. The boat 217 has a bottom plate fixed to a boat support (not shown) and a top plate arranged above the bottom plate, and has a configuration in which a plurality of columns are erected between the bottom plate and the top plate. There is. A plurality of wafers 200 are held in the boat 217. The plurality of wafers 200 are loaded in multiple stages in the tube axis direction of the reaction tube 203 in a state where they maintain a horizontal posture while being spaced apart from each other and are centered on each other, and are supported by the columns of the boat 217.

A boat rotation mechanism 267 for rotating the boat is provided on the side of the seal cap 219 opposite to the processing chamber 201. The rotation shaft 265 of the boat rotation mechanism 267 is connected to the boat support 218 through the seal cap, and the boat rotation mechanism 267 rotates the boat 217 via the boat support 218 to rotate the wafer 200. ..

The seal cap 219 is vertically raised and lowered by a boat elevator 115 as an elevating mechanism provided outside the reaction tube 203, whereby the boat 217 can be carried in and out of the processing chamber 201.

In the manifold 226, nozzle support portions 350a to 350d for supporting the nozzles 340a to 340d as gas nozzles for supplying the processing gas into the processing chamber 201 are installed so as to penetrate the manifold 226. Here, four nozzle support portions 350a to 350d are installed. The nozzle support portions 350a to 350d are made of a material such as nickel alloy or stainless steel. Gas supply pipes 310a to 310c for supplying gas into the processing chamber 201 are connected to one end of the nozzle support portions 350a to 350c on the reaction tube 203 side, respectively. Further, a gas supply pipe 310d that supplies gas to the gap S formed between the reaction pipe 203 and the cylinder portion 209 is connected to one end of the nozzle support portion 350d on the reaction pipe 203 side. Further, nozzles 340a to 340d are connected to the other ends of the nozzle support portions 350a to 350d, respectively. The nozzles 340a to 340d are made of a heat-resistant material such as quartz or SiC.

The gas supply pipe 310a is connected to the first processing gas supply source 360a for supplying the first processing gas, the mass flow controller (MFC) 320a which is a flow rate controller (flow control unit), and the valve 330a which is an on-off valve in order from the upstream direction. Are provided respectively. The gas supply pipe 310b is provided with a second processing gas supply source 360b, an MFC 320b, and a valve 330b, which supply the second processing gas, in order from the upstream direction. The gas supply pipe 310c is provided with a third processing gas supply source 360c, an MFC 320c, and a valve 330c, which supply the third processing gas, in order from the upstream direction. The gas supply pipe 310d is provided with an inert gas supply source 360d, an MFC 320d, and a valve 330d, which supply the inert gas, in order from the upstream direction. Gas supply pipes 310e and 310f for supplying the inert gas are connected to the downstream side of the gas supply pipes 310a and 310b with respect to the valves 330a and 330b, respectively. The gas supply pipes 310e and 310f are provided with MFC 320e and 320f and valves 330e and 330f, respectively, in order from the upstream direction.

The first processing gas supply system is mainly composed of the gas supply pipe 310a, the MFC320a, and the valve 330a. The first processing gas supply source 360a, the nozzle support portion 350a, and the nozzle 340a may be included in the first processing gas supply system. Further, the second processing gas supply system is mainly composed of the gas supply pipe 310b, the MFC320b, and the valve 330b. The second treatment gas supply source 360b, the nozzle support portion 350b, and the nozzle 340b may be included in the second treatment gas supply system. Further, the third processing gas supply system is mainly composed of the gas supply pipe 310c, the MFC320c, and the valve 330c. The third processing gas supply source 360c, the nozzle support portion 350c, and the nozzle 340c may be included in the third processing gas supply system. Further, the inert gas supply system is mainly composed of the gas supply pipe 310d, the MFC320d, and the valve 330d. The inert gas supply source 360d, the nozzle support 350d, and the nozzle 340d may be included in the inert gas supply system.

An exhaust port 230 is formed in the reaction tube 203. The exhaust port 230 is formed below the second gas exhaust port 237 and is connected to the exhaust pipe 231. A vacuum pump 246 as a vacuum exhaust device is connected to the exhaust pipe 231 via a pressure sensor 245 as a pressure detector for detecting the pressure in the processing chamber 201 and an APC (Auto Pressure Controller) valve 244 as a pressure adjusting unit. It is configured so that the pressure in the processing chamber 201 can be evacuated to a predetermined pressure. The exhaust pipe 231 on the downstream side of the vacuum pump 246 is connected to an exhaust gas treatment device (not shown) or the like. The APC valve 244 can open and close the valve to stop vacuum exhaust and vacuum exhaust in the processing chamber 201, and further adjust the valve opening degree to adjust the conductance so that the pressure in the processing chamber 201 can be adjusted. It is an on-off valve. The exhaust pipe 231 and the APC valve 244 and the pressure sensor 245 mainly constitute an exhaust system that functions as an exhaust unit. The vacuum pump 246 may be included in the exhaust system.

A temperature sensor (not shown) as a temperature detector is installed in the reaction tube 203, and by adjusting the power supply to the heater 207 based on the temperature information detected by the temperature sensor, the inside of the processing chamber 201 It is configured so that the temperature has a desired temperature distribution.

In the above processing furnace 202, in a state where a plurality of wafers 200 to be batch processed are loaded on the boat 217 in multiple stages, the boat 217 is inserted into the processing chamber 201 while being supported by the boat support 218, and the heater 207 is inserted. The wafer 200 inserted in the processing chamber 201 is heated to a predetermined temperature.

(Controller Configuration) As shown in FIG. 4, the controller 121, which is a control unit (control means), has a CPU (Central Processing Unit) 121a, a RAM (Random Access Memory) 121b, and a storage unit as execution units for executing various programs. It is configured as a computer provided with a storage device 121c and an I / O port 121d. The RAM 121b, the storage device 121c, and the I / O port 121d, which are configured as a memory area (work area) in which the programs and data read by the CPU 121a are temporarily held, are connected to the CPU 121a via the internal bus 121e. It is configured so that data can be exchanged. Further, an input / output device 122 as a display unit configured as, for example, a touch panel is connected to the controller 121.

The storage device 121c is composed of, for example, a flash memory, an HDD (Hard Disk Drive), or the like. In the storage device 121c, a control program for controlling the operation of the board processing device, a process recipe in which the board processing procedure and conditions, and the like are described are readablely stored. The process recipe is a combination of the controller 121 for executing each procedure in the substrate processing step described later so that a predetermined result can be obtained, and the maintenance recipe does not put the wafer 200 into the apparatus. In the state, it is a recipe that allows the controller 121 to execute each procedure and maintain, for example, parts, and functions as a program. In addition, the maintenance recipe may also be executed as this process. Further, the storage device 121c stores device data generated by operating each component constituting the device when a job is executed. Time data is added to these device data by a time stamp function as a time measuring unit of the controller 121.

Here, the device data is the data collected when the job is executed as described above. For example, data related to substrate processing (for example, set value, measured value) such as processing temperature, processing pressure, and flow rate of processing gas when the substrate processing apparatus 10 processes the wafer 200, and quality of the manufactured product substrate (for example, production). Substrate such as data on the film thickness and the cumulative value of the film thickness, and data on the components (reaction tube, heater, valve, MFC, etc.) of the substrate processing device 1 (for example, set value, measured value), etc. This is data generated by operating each component when the processing apparatus processes the wafer 200.

The measured values at specific intervals collected during the recipe execution, for example, the measured value data from the start to the end of the recipe and the statistical data of each step in the recipe may be referred to as process data, but this process data. Is also included in the device data. The statistic data includes a maximum value, a minimum value, an average value, and the like. In addition, event data indicating device events indicating the start and end of the recipe, and event data indicating device events when the process recipe is not executed (for example, when the board is not loaded in the device) (for example, maintenance history). Data indicating) is also included in the device data. In addition, the device data also includes data indicating an event (occurrence / recovery) in which an alarm (abnormality) and an alert (warning) have occurred.

Further, the storage device 121c stores a chart display program, a screen transition program, and the like according to the present embodiment. The CPU 121a is configured to execute these programs in response to input of operation commands from the input / output device 122 and the like. In this embodiment, the CPU 121a functions as a display control unit. Further, the storage device 121c stores various screen files including screen files for displaying charts in the present embodiment such as a schedule screen and a production information screen.

When the term program is used in the present specification, it may include only a process recipe (maintenance recipe) alone, a control program alone, or both of them.

The I / O port 121d is connected to the above-mentioned MFC 320a to 320f, valves 330a to 330f, pressure sensor 245, APC valve 244, vacuum pump 246, heater 207, temperature sensor, boat rotation mechanism 267, boat elevator 115 and the like. ..

The CPU 121a is configured to read and execute a control program or the like from the storage device 121c and read a process recipe (maintenance recipe) from the storage device 121c in response to an input of an operation command from the input / output device 122 or the like. The CPU 121a adjusts the flow rate of various gases by the MFCs 320a to 320f, opens and closes the valves 330a to 330f, opens and closes the APC valve 244, and pressure sensor so as to follow the contents of the process recipe read through the I / O port 121d. Pressure adjustment operation by APC valve 244 based on 245, start and stop of vacuum pump 246, temperature adjustment operation of heater 207 based on temperature sensor, rotation and rotation speed adjustment operation of boat 217 by boat rotation mechanism 267, boat by boat elevator 115 It is configured to control the elevating operation of 217 and the like.

Next, a substrate processing step corresponding to the main processing of the process job will be described with reference to FIG. In the present embodiment, the substrate processing step is performed by the controller 121 executing the process recipe. Further, the process recipe is a recipe for processing the substrate executed in this main process, and is controlled by the controller 121. Hereinafter, the controller 121 controls the operation of each part constituting the substrate processing device 10 to perform a predetermined process on the wafer 200.

(Substrate processing step) A boat 217 on which a predetermined number of wafers 200 are placed is inserted into the reaction tube 203, and the reaction tube 203 is airtightly closed by the seal cap 219. In the airtightly closed reaction tube 203, the wafer 200 is heated and the processing gas is supplied into the reaction tube 203, so that the wafer 200 is subjected to a predetermined process.

As a predetermined treatment, for example, an NH3 gas as a first treatment gas, an HCDS gas as a second treatment gas, and an N2 gas as a third treatment gas are alternately supplied to form a SiN film on the wafer 200.

First, HCDS gas is supplied into the processing chamber 201 from the gas supply pipe 310b of the second processing gas supply system through the gas supply hole 234b of the nozzle 340b and the gas supply slit 235. Specifically, by opening the valves 330b and 330f, the supply of the HCDS gas from the gas supply pipe 310b into the processing chamber 201 is started together with the carrier gas. At this time, the opening degree of the APC valve 244 is adjusted to maintain the pressure in the processing chamber 201 at a predetermined pressure. After the predetermined time has elapsed, the valve 330b is closed and the supply of HCDS gas is stopped.

The HCDS gas supplied into the processing chamber 201 is supplied to the wafer 200, flows in parallel on the wafer 200, then flows through the gap S from the upper part to the lower part through the first gas exhaust port 236, and the second gas. It is exhausted from the exhaust pipe 231 via the exhaust port 237 and the exhaust port 230.

While supplying HCDS gas into the processing chamber 201, the valves 330e of the inert gas supply pipe connected to the gas supply pipe 310a and the valves 330c and 330d of the gas supply pipes 310c and 310d are opened to inactivate N2 and the like. By flowing the gas, it is possible to prevent the HCDS gas from wrapping around in the gas supply pipes 310a, 310c, 310d.

After closing the valve 330b and stopping the supply of HCDS gas into the processing chamber 201, the inside of the processing chamber 201 is exhausted to eliminate the HCDS gas, reaction products, etc. remaining in the processing chamber 201. At this time, when inert gases such as N2 are supplied from the gas supply pipes 310a, 310b, 310c, 310d to the inside of the processing chamber 201 and the gap S, respectively, and purged, the residual gas in the processing chamber 201 and the gap S is removed. The effect can be further enhanced.

Next, NH3 gas is supplied from the gas supply pipe 310a of the first processing gas supply system into the processing chamber 201 via the gas supply hole 234a of the nozzle 340a and the gas supply slit 235. Specifically, by opening the valves 330a and 330e, the supply of the NH3 gas from the gas supply pipe 310a into the processing chamber 201 is started together with the carrier gas. At this time, the opening degree of the APC valve 244 is adjusted to maintain the pressure in the processing chamber 201 at a predetermined pressure. After the predetermined time has elapsed, the valve 330a is closed and the supply of NH3 gas is stopped.

The NH3 gas supplied into the processing chamber 201 is supplied to the wafer 200, flows in parallel on the wafer 200, then flows through the gap S from the upper part to the lower part through the first gas exhaust port 236, and the second gas. It is exhausted from the exhaust pipe 231 via the exhaust port 237 and the exhaust port 230.

While the NH3 gas is being supplied into the processing chamber 201, the gas is supplied when the valves 330f and the valves 330c and 330d of the inert gas supply pipe connected to the gas supply pipe 310b are opened to allow an inert gas such as N2 to flow. It is possible to prevent NH3 gas from wrapping around in the tubes 310b, 310c, 310d.

After closing the valve 330a and stopping the supply of NH3 gas into the processing chamber 201, the inside of the processing chamber 201 is exhausted to eliminate the NH3 gas, reaction products, etc. remaining in the processing chamber 201. At this time, when inert gases such as N2 are supplied from the gas supply pipes 310a, 310b, 310c, 310d to the inside of the processing chamber 201 and the gap S, respectively, and purged, the residual gas in the processing chamber 201 and the gap S is removed. The effect can be further enhanced.

When the processing of the wafer 200 is completed, the boat 217 is carried out from the reaction tube 203 by the reverse procedure of the above operation.

In the above-described embodiment, the case where the first treated gas and the second treated gas are alternately supplied has been described, but the present invention also applies to the case where the first treated gas and the second treated gas are supplied at the same time. be able to.

(Example 1) FIG. 5 is a processing flow showing a chart display program for displaying a job schedule according to the present embodiment.

When the controller 121 is started, the chart display program is started, and the controller 121 first acquires the current time. Next, the storage unit 121c is searched to see if there is a job scheduled to be executed by the device. If there is no job, it will be terminated or the waiting state will be retained. In any case, when the update button described later is pressed, the program is restarted and the current time is acquired.

When the job is searched, the controller 121 acquires the job information. At least acquire not only job information (name, recipe name, scheduled start time, scheduled end time, etc.) but also recipe information (name, type, processing room, process data, etc.) executed by the job.

Next, it is determined whether the job is reserved or the job is currently running. Specifically, the acquired current time is compared with the scheduled start time of the job, and whether the current time has passed the scheduled start time or the device data indicating the start of the job (time data indicating the job execution start time) Judge by the presence or absence.

When a job is reserved, from the job information, the pre-processing start time of the pre-processing, the pre-processing end time, the pre-processing scheduled time, the main processing start time, the main processing end time, the main processing scheduled time, and later. The scheduled post-processing time is calculated from the post-processing start time and post-processing end time, and the calculated pre-processing scheduled time, main processing scheduled time, and post-processing scheduled time are added to obtain the job execution scheduled time. calculate. The scheduled pre-processing time, the scheduled main processing time, and the scheduled post-processing time may be identifiable, for example, color-coded. Further, for example, when all the jobs are reserved, the scheduled preprocessing time of the first job to be executed is calculated so as to be from the current time to the preprocessing end time.

When the job is currently being executed, the controller 121 confirms which of the pre-processing, the main processing, and the post-processing is being executed. Specifically, the controller 121 has the current time between the scheduled start time and the scheduled end time of the pre-processing, the scheduled start time and the scheduled end time of the main processing, and the scheduled start time and the scheduled end time of the post-processing. For example, it is determined from the acquired device data whether or not there is time data indicating each of the pre-processing start, the main processing start, and the post-processing start. For example, if there is time data for starting preprocessing, it is determined that preprocessing is in progress.

When it is determined that the preprocessing is in progress, the controller 121 then compares the current time with the scheduled end time of the preprocessing, and if the current time has passed the scheduled end time, the job start time to the current time is selected. Calculated as the pre-processing execution time, and if the current time is before the scheduled end time, the pre-processing execution time is calculated from the job start time to the pre-processing scheduled end time.

Then, the controller 121 adds the pre-processing execution time, the main processing scheduled time, and the post-processing scheduled time, respectively, and calculates the job execution scheduled time. It should be noted that the jobs currently being executed are calculated in the same manner when the main processing is in progress and when the post-processing is in progress. Therefore, although details are omitted, when the current time is in the main processing, the main processing execution time calculated by comparing the current time and the scheduled end time is added to the pre-processing execution time and the post-processing scheduled time, respectively. Is calculated as the scheduled execution time of.

Next, it is determined whether or not a job recovery condition wait has occurred. For example, in the confirmation of the recovery condition waiting occurrence in the preprocessing, the controller 121 determines that the recovery condition waiting has occurred if an alarm requiring a recovery operation is occurring from the acquired device data. Acquired as recovery judgment waiting information.

When the calculation of the scheduled execution time of one job (chart calculation processing) is completed, the controller 121 also performs the chart calculation processing for the next job, calculates the scheduled job execution time for all the searched jobs, and calculates the scheduled job execution time. Acquires the scheduled job execution time as chart processing result information. Here, the execution time or scheduled execution time of the pre-processing, main processing, and post-processing of each job is also acquired as chart processing result information.

Then, the controller 121 creates a schedule screen file (for example, shown in FIG. 6) based on various device data such as the acquired current time, job information, recipe information, chart processing result information, recovery condition waiting information, and the job. Is configured to display each chart. Further, the controller 121 is configured to display a line icon corresponding to the current time on the schedule screen.

As described above, according to the chart display program of the present embodiment, when the processing start time and the processing end time are stored in the job information, first, the processing start time and the processing end time of the first job or the currently executed job are started. The scheduled end time of the first job is calculated by calculating the scheduled execution time of the job. The scheduled execution time of the reserved job can be calculated by reflecting the scheduled end time of the first job in the job scheduled to be executed next and repeating it for the number of searched jobs.

Further, when the controller 121 acquires the recovery condition waiting information for the currently executed job, as shown in FIG. 8, the controller 121 displays an icon indicating that the recovery condition waiting has occurred in a predetermined space on the schedule screen. It is configured. Further, for example, the controller 121 is configured to display the details of the factors waiting for the recovery condition on the display unit when the factor button described later displayed in a predetermined area of the schedule screen is pressed.

FIG. 6 shows an embodiment of a schedule screen displayed on the operation screen of the input / output device 122 when the controller 121 executes the chart display program. In the schedule screen 500 shown in FIG. 6, the vertical axis represents the item number cell 501 indicating the order of reservation of various jobs executed by the device including the job currently executed by the device, and the horizontal axis represents the job name cell 502. It includes a PM cell 503, job information including a recipe name or a scheduled end time cell 504, and a two-dimensional space having a date and time 505 indicating a predetermined monitoring period. Here, PM is an abbreviation PM of a processing module (Processing Module).

Further, in the two-dimensional space of the schedule screen 500, from the line 506 indicating the current time, the currently executed job 507 displayed by the icon indicating the job execution time or the scheduled execution time, and the scheduled start time. The reserved job 508 displayed by the icon indicating the scheduled end time is displayed, and the currently executed job 507 and the reserved job 508 are displayed in a chart. The recipe name (process recipe 1) is displayed in the recipe name or the scheduled end time cell 504.

Further, in the two-dimensional space of the schedule screen 500, the pre-processing step 508a, the main processing step 508b, and the post-processing step 508c of the reserved job 508 are displayed, and each is displayed in a predetermined color in each step. Has been done. Similarly, for the job 507 currently being executed, although it is not clear from the figure, the pre-processing step, the main processing step, and the post-processing step are displayed independently, and each has a predetermined color. It is displayed in.

FIG. 7 is a diagram showing a time when the recipe name or the scheduled end time cell 504 is pressed to switch to the scheduled end time on the schedule screen shown in FIG.

FIG. 8 is a display example of the icon 510 indicating that a recovery condition wait has occurred on the schedule screen. It can be seen that the recipe 507 currently being executed has different display colors at the current time 506. Some trouble has occurred in the pre-processing (or main processing), and the next main processing (or post-processing) continues to wait for recovery processing from the trouble. When the recovery process is performed, the icon 510 will not be displayed. If the factor button shown in FIG. 9 is pressed while the icon 510 is displayed, the detailed factor in which the icon 510 is displayed is displayed.

FIG. 9 is a factor detail screen 600 displayed on the display unit 122 when the factor button 511 on the schedule screen is pressed. The factor detail screen 600 is a screen when condition A is pressed (selected) among the factors waiting for recovery conditions. Condition A includes four conditions of "EFEM", "maintenance", "PM1", and "PM2". "EFEM", "PM1", and "PM2" are waiting for the maintenance status of EFEM as the storage chamber 9, the processing module 1 as the processing furnace 202, and the processing module 2 as the processing furnace 202, and "maintenance" is the schedule due to maintenance. It is paused. Further, when the recovery condition wait occurs, the factor button 511 may be displayed in different colors on the schedule screen.

On the lower side of the factor detail screen 600, the cause of "EFEM" (waiting for maintenance status release) and the countermeasure for the factor are described. When you press the search cell, a screen for selecting four conditions, "EFEM", "Maintenance", "PM1", and "PM2", is displayed. You can change it by selecting other conditions other than "EFEM". .. Although not clearly shown in FIG. 8, the cells of the condition in which the recovery condition wait has occurred are displayed in different colors. When the OK button at the bottom is pressed, the display of the factor detail screen 600 is canceled and the screen returns to the schedule screen 500.

Further, when the update button 509 displayed on the schedule screen 500 is pressed, the chart display is updated. That is, the chart display program shown in FIG. 5 is restarted, and a new current time is acquired. Then, the processing flow shown in FIG. 5 is executed from this current time, and the schedule screen shown in FIG. 6 is updated.

Specifically, when the controller 121 detects that the update button 509 is pressed, the processing flow shown in FIG. 5 is executed, the new current time, job information, and recipe information are updated, and the currently executed job is updated accordingly. Scheduled end time and scheduled end time of the reserved job are recalculated, and based on the calculated scheduled start time and scheduled end time, the currently executed job execution time, scheduled execution time, and reservation The scheduled execution time of the job is calculated, and the schedule screen shown in FIG. 6 is updated and displayed.

As shown in FIG. 12, the icon is displayed in the item number cell 501 so as to clearly display the difference between the production job (process job) and the maintenance job (cleaning job in FIG. 12). There is. Further, for example, in the item number cell 501, it is identified whether the recipe executed by the job is a process recipe (recipe for processing the board) or a maintenance recipe (recipe for maintaining components such as a cleaning recipe). May be configured to display an icon for.

(Example 2) FIG. 10 is a processing flow showing a chart display program of executed jobs in this embodiment, and FIG. 11 is displayed on an operation screen of the input / output device 122 by executing the chart display program. An embodiment of the production information screen is shown.

When the button to switch to the production information screen is pressed, the chart display program of the executed job is started. First, the controller 121 acquires the current time. Next, the inside of the storage unit 121c is searched, and it is confirmed whether there is a job (executed job) executed by the device. If there are no executed jobs, it will be terminated. Further, when an update button (not shown) is pressed, the program may be restarted and started by acquiring the current time.

When the executed job is searched, the controller 121 acquires the information of the executed job. At least acquire not only job information (name, recipe name, scheduled start time, scheduled end time, etc.) but also recipe information (name, type, processing room, process data, production information, etc.) executed by the job. In addition, device data including production information collected when the job is executed and stored in the storage unit 121c is also acquired.

Further, the controller 121 includes a preprocessing start time of job information, a preprocessing execution time from the preprocessing end time, a main processing start time, a main processing execution time from the main processing end time, a postprocessing start time, and a postprocessing end time. The processing execution time is calculated, and the calculated execution time is added to calculate the execution time of the executed job. Then, the execution time is calculated for all the executed jobs. The execution time, pre-processing execution time, main processing execution time, and post-processing execution time of all these executed jobs are acquired as chart processing result information.

Next, the controller 121 creates a production information screen file (shown in FIG. 11) based on various device data including chart processing result information such as the acquired current time, job information, recipe information, and execution time of the executed job. Then, each executed job is configured to be displayed in a chart.

The production information screen 700 shown in FIG. 11 includes an item number cell 701 indicating the order of various jobs executed by the device on the vertical axis, a job name cell 702, a PM cell 703, and a recipe name cell 704 on the horizontal axis. It includes job information and a two-dimensional space with a date and time of 705 indicating a predetermined monitoring period. Here, as in FIG. 5, PM is an abbreviation PM of a processing module (Processing Module).

Further, in the two-dimensional space of the production information screen 700, the executed executed job 706 displayed by the icon indicating the execution time of the job is displayed in a chart, and the executed job 706 is referred to as the preprocessing step 706a. The main processing step 706b and the post-processing step 706c are provided, and each is displayed in a predetermined color in each step.

Further, the controller 121 is configured to display the abnormality icon 707 in the item number cell 701 of the executed job in which the abnormality data has occurred when the acquired device data includes the abnormality data indicating that the abnormality has occurred. .. In addition, when a trouble occurs in the job being executed on the schedule screen shown in FIG. 6, an abnormality icon may be provided in the item number cell 501 in the same manner.

As shown in FIG. 12, an icon is displayed in the item number cell 701 so that the difference between the production job (process job) and the maintenance job (cleaning job in FIG. 12) is clearly displayed. You may.

According to this embodiment, one or more of the effects (1) to (7) shown below are exhibited.

(1) According to the present embodiment, by displaying the chart, it is possible to easily recognize the progress of the job selected from the group consisting of reservation, preprocessing, main processing, and postprocessing. You can recognize the processing order of all jobs reserved with. (2) According to the present embodiment, by displaying the chart, the start time and the scheduled end time of all the reserved jobs can be recognized, so that the job execution plan can be made, and as a result, the setup work can be performed. It can be done efficiently. (3) According to the present embodiment, since the factor information that the job waits for the recovery condition is held for each job, the job for which the recovery condition wait has occurred can be grasped and the factor can be recognized. (4) According to the present embodiment, by displaying the chart, it is possible not only to grasp the result of job execution results such as the frequency of use and the interval of use for each processing module, but also to recognize the relationship with the results with other processing modules. it can. (5) According to the present embodiment, by displaying the chart, the relationship between the job in which the trouble occurred and the job executed before and after the trouble can be grasped, so that troubleshooting becomes easy. (6) According to the present embodiment, the production job and the maintenance job can be distinguished at a glance, and it can be determined whether the regular maintenance job or the like is normally executed. (7) According to the present embodiment, the processing start time and the processing end time are stored in the job information, and when the start time of the first job is determined, the scheduled job execution time can be calculated from the processing start time and the processing end time. Therefore, the scheduled end time of the job is calculated. The scheduled execution time of the reserved job can be calculated by reflecting the scheduled end time of this job in the job scheduled to be executed at the time and repeating it.

The control unit 121 in the embodiment of the present invention is not limited to the case where it is configured as a dedicated computer, and may be configured as a general-purpose computer. For example, the present embodiment is obtained by preparing an external storage device (for example, a semiconductor memory such as a USB memory) 123 in which the above-mentioned program is stored, and installing the program on a general-purpose computer using the external storage device 123. Controller 121 can be configured. However, the means for supplying the program to the computer is not limited to the case of supplying the program via the external storage device 123. For example, a communication means such as the Internet or a dedicated line may be used to supply the program without going through the external storage device 123. The storage device 121c and the external storage device 123 are configured as a computer-readable recording medium. Hereinafter, these are collectively referred to simply as a recording medium. When the term recording medium is used in the present specification, it may include only the storage device 121c alone, it may include only the external storage device 123 alone, or it may include both of them.

The substrate processing apparatus 1 in the embodiment of the present invention can be applied not only to a semiconductor manufacturing apparatus for manufacturing a semiconductor but also to an apparatus for processing a glass substrate such as an LCD (Liquid Crystal Display) apparatus. Needless to say, it can also be applied to various substrate processing devices such as an exposure device, a lithography device, a coating device, and a processing device using plasma.

The progress status of various recipes executed by the job can be displayed on the screen, and it can be applied to the board processing device that manages the progress of the job on the screen.

10 ... Substrate processing equipment, 200 ... Wafer,

Claims (13)

A display unit having an operation screen including a reservation status of various jobs executed on the device including a job currently executed on the device on one axis and a two-dimensional space with the other axis as a predetermined monitoring period, and the device. Various information including the start time and the scheduled end time of the job being executed, or the scheduled start time and the scheduled end time of the job reserved by the device is acquired, and the acquired start of the currently executed job is acquired. The scheduled execution time of the job is calculated from the scheduled time and the scheduled end time, and / or the scheduled start time and the scheduled end time of the reserved job, and the currently executed job and the reserved job A display control unit configured to display a chart on the display unit as an image showing a scheduled execution time is provided.
The display control unit is a substrate processing device configured to display an icon indicating the recovery condition wait on the display unit when the acquired various information includes information indicating the recovery condition wait. The substrate processing apparatus according to claim 1, wherein the display control unit is configured to acquire a current time, and the display control unit is configured to display a line indicating the current time on the display unit. The substrate processing apparatus according to claim 1, wherein the display control unit displays the factor waiting for the recovery condition when the press of the factor button provided on the display unit is detected. When the display control unit detects that the update button provided on the display unit is pressed, the display control unit recalculates the scheduled end time of the currently executed job and the scheduled start time and the scheduled end time of the reserved job. The board process according to claim 1, wherein the currently executed job and the reserved job are displayed on the display unit based on the calculated start scheduled time and end scheduled time. apparatus. The substrate processing device according to claim 1, wherein the display control unit updates the current time and displays it on the display unit when it detects that the update button provided on the display unit is pressed. The display control unit displays, in the item number cell provided in the display unit, an icon for identifying whether the recipe executed by the job is a recipe for processing a substrate or a recipe for maintaining components. The substrate processing apparatus according to claim 1, which is configured to be displayed. A display unit having an operation screen including the order in which jobs are executed on one axis and a two-dimensional space with the other axis as a predetermined monitoring period, and a pre-processing step, a main processing step, and a post-processing step executed by the device. The execution time of each of the storage unit that stores various information including the start time and end time of the job including the above, the pre-processing step, the main processing step, and the post-processing step acquired from the storage unit is calculated. while distinguishably display the job step by step, and a display control unit configured to chart to be displayed on the display unit as an image indicating an execution time of the job that was executed,
The display control unit is a substrate processing device configured to display an icon indicating the recovery condition wait on the display unit when the acquired various information includes information indicating the recovery condition wait. 7. The seventh aspect of the present invention, wherein the display control unit is configured to display the item number cells provided in the display unit in different colors according to the presence or absence of data indicating an abnormality that has occurred during the execution of the job. Board processing equipment. The display control unit displays, in the item number cell provided in the display unit, an icon for identifying whether the recipe executed by the job is a recipe for processing a substrate or a recipe for maintaining components. The substrate processing apparatus according to claim 7, which is configured to be displayed. A method of displaying a board processing device having an operation screen including a reservation status of various jobs executed by the device including a job currently executed by the device on one axis and a two-dimensional space with the other axis as a predetermined monitoring period. And
The process of acquiring various information including the start time and scheduled end time of the job being executed by the device, or the scheduled start time and end time of the job reserved by the device, and
A process of calculating the scheduled execution time of the job from the acquired start time and scheduled end time of the currently executed job and / or the scheduled start time and scheduled end time of the reserved job.
A process of displaying a chart as an image showing the scheduled execution time of the currently executed job and the reserved job, and
A display method including a step of displaying an icon indicating the recovery condition wait on the operation screen when the acquired various information includes information indicating the recovery condition wait. It is a display method of a substrate processing apparatus having an operation screen including a two-dimensional space in which the order in which jobs are executed on one axis and a predetermined monitoring period on the other axis.
A process of storing various information including the start time and end time of the job including the pre-processing step, the main processing step, and the post-processing step executed by the apparatus, and
A step of calculating the execution time of each of the stored pre-processing step, main processing step, and post-processing step, and
While distinguishably displayed for each step of the job, a step of the chart displayed as an image indicating an execution time of the job that was executed,
A display method including a step of displaying an icon indicating the recovery condition wait on the operation screen when the various information includes information indicating the recovery condition wait. The process of acquiring various information including the start time and scheduled end time of the job being executed by the device, or the scheduled start time and end time of the job reserved by the device, and
A process of calculating the scheduled execution time of the job from the acquired start time and scheduled end time of the currently executed job and / or the scheduled start time and scheduled end time of the reserved job.
The reservation status of various jobs executed on the device including the job currently executed on the device on one axis, and the progress status of the job are displayed on the operation screen including the two-dimensional space with the other axis as the predetermined monitoring period. It is a manufacturing method of a semiconductor device having a process of
In the process of displaying the progress of the job,
A process of displaying a chart as an image showing the scheduled execution time of the currently executed job and the reserved job, and
A method for manufacturing a semiconductor device, comprising a step of displaying an icon indicating the recovery condition waiting on the operation screen when the acquired various information includes information indicating recovery condition waiting. A process of storing various information including the start time and end time of the job including the pre-processing step, the main processing step, and the post-processing step executed by the apparatus, and
A step of calculating the execution time of each of the stored pre-processing step, main processing step, and post-processing step, and
A method for manufacturing a semiconductor device, which comprises a step of displaying the progress of the job on an operation screen including a two-dimensional space in which the job is executed on one axis and a predetermined monitoring period on the other axis. hand,
A process of displaying the job in an identifiable manner for each step and displaying a chart as an image showing the execution time of the executed job.
A method for manufacturing a semiconductor device, comprising a step of displaying an icon indicating waiting for recovery conditions on the operation screen when the various information includes information indicating waiting for recovery conditions.