CN110462785A - Substrate board treatment and its display methods - Google Patents

Substrate board treatment and its display methods Download PDF

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Publication number
CN110462785A
CN110462785A CN201780088759.1A CN201780088759A CN110462785A CN 110462785 A CN110462785 A CN 110462785A CN 201780088759 A CN201780088759 A CN 201780088759A CN 110462785 A CN110462785 A CN 110462785A
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China
Prior art keywords
task
predetermined instant
execution
substrate board
board treatment
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Granted
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CN201780088759.1A
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Chinese (zh)
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CN110462785B (en
Inventor
守田修
山冈雄治
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Kokuyo Kyokai Co Ltd
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Kokuyo Kyokai Co Ltd
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Publication of CN110462785A publication Critical patent/CN110462785A/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

The purpose of the present invention is to provide the scheduled structures of execution that one kind can show task in temporal sequence.The structure includes display unit, has the operation screen comprising two-dimensional space, which is set as an axis subscription status of the various tasks of the device execution including being currently executing comprising device for task, during another axis is set as scheduled monitoring;And display control section, at the beginning of it obtains being carrying out comprising device for task and terminates the beginning predetermined instant for the task that predetermined instant or device are reserved and terminate the various information of predetermined instant, at the beginning of being currently executing according to acquired for task and terminate predetermined instant and/or the reservation task beginnings predetermined instant and end predetermined instant calculate execution predetermined time of the task, and make the display unit chart be shown as indicating described in the image of execution predetermined time of the task of task and the reservation that is currently executing.

Description

Substrate board treatment and its display methods
Technical field
The present invention relates to the substrate board treatment handled substrate and its display methods, for example, being related to grasping to base Plate carries out the device and its display methods of the production status of the semiconductor manufacturing apparatus of film process.
Background technique
In field of semiconductor manufacture, the substrate reception device (example of wafer to be processed (after, also referred to as substrate) will have been stored Such as, FOUP) it is put into device, film process etc. are implemented to wafer with specified condition.For example, by customer's master computer or behaviour The operator for making portion issues the instruction of the processing such as film process (after, also referred to as processing task).Also, by the processing shape of wafer The picture image of condition and semiconductor manufacturing apparatus is display together on the picture of operation portion, for example, showing for each process chamber Production status.When film process are completed, as production information savings in storage unit.According to the completion sequence of processing to accumulation It is registered, and carries out guide look and show.
For example, in patent document 1, for each process chamber by the treatment situation of substrate and semiconductor system viewed from above Image obtained from device is made to display together in operation screen.In addition, in patent document 2, showing and working as on operation screen Development situation of preceding processing task in execution etc. or display are by handling the content of the treatment formulations of task execution, producing resume Information.
But, it is not known that manage when task starts to execute everywhere in reservation, what is when terminated is predetermined.Operator is difficult as a result, At the time of being in particular state with prediction meanss, the arrangement meeting generation time waste of device is related to prolonging for device setting operation Late.
Existing technical literature
Patent document
Patent document 1: patent 2000-077288 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2011-077435 bulletin
Summary of the invention
Subject to be solved by the invention
The purpose of the present invention is to provide a kind of scheduled structures of execution that task can be shown with time series.
A mode according to the present invention, provides a kind of structure, has: display unit, has the behaviour comprising two-dimensional space Make picture, which is set as an axis various of the device execution including being currently executing comprising device for task The subscription status of business, during another axis is set as predetermined monitoring;And display control section, acquirement are carrying out comprising device Task at the beginning of and terminate predetermined instant or device reservation task beginning predetermined instant and terminate predetermined Various information including moment, according to the acquired task being currently executing at the beginning of and terminate pre- timing The beginning predetermined instant and end predetermined instant for the task carved and/or reserved are pre- come the execution for calculating the task It fixes time, the display unit chart is made to be shown as indicating holding for the task of the task and reservation that are currently executing The image of row predetermined time.
Invention effect
According to above structure, is shown by carrying out chart to the task of predetermined execution, will appreciate that untreated task Executive plan.
Detailed description of the invention
Fig. 1 is to indicate to properly use in an example of the cross-sectional view of the substrate board treatment of an embodiment of the present invention.
Fig. 2 is to indicate to properly use in an example of the longitudinal section of the substrate board treatment of an embodiment of the present invention.
Fig. 3 is to indicate to properly use in the longitudinal section of the treatment furnace of the substrate board treatment of an embodiment of the present invention An example.
Fig. 4 is for illustrating to properly use in the functional structure of the controller of an embodiment of the present invention.
Fig. 5 indicates the process flow shown in the chart of an embodiment of the present invention that properly uses.
Fig. 6 indicates the embodiment shown by the process flow of Fig. 5.
Fig. 7 is for indicating the mode different from the figure of embodiment for indicating Fig. 6.
Fig. 8 is that the waiting of recovery condition is produced in the current formula in execution that the process flow by Fig. 5 is shown When figure.
Fig. 9 indicates that an embodiment, the embodiment show the recovery condition Waiting Graph target detailed content shown in fig. 8.
Figure 10 indicates the process flow shown in the chart of an embodiment of the present invention that properly uses.
Figure 11 indicates the embodiment shown by the process flow of Figure 10.
Figure 12 is for illustrating icon, the difference of the formula classification of the icon representation embodiment of the present invention.
Specific embodiment
(summary of substrate board treatment) next according to Fig. 1, Fig. 2, embodiments of the present invention will be described.It is answering With in embodiments of the present invention, as an example, substrate board treatment is structured to execute semiconductor device (IC) manufacture The substrate board treatment of processing in method.In addition, in the following description, for applying as substrate board treatment to base The case where plate aoxidized, longitudinal type device (hereinafter, being simply referred as processing unit) of DIFFUSION TREATMENT or CVD processing etc. is chatted It states.
As shown in Figure 1 and Figure 2, substrate board treatment 10 has two adjacent processing moulds as aftermentioned treatment furnace 202 Block.The processing module is that tens of wafers 200 as substrate are carried out with the longitudinal type processing module of batch processing.
Conveying chamber 6A, 6B as preparation room are configured in the lower section for the treatment of furnace 202.In the face side of conveying chamber 6A, 6B It is adjacently configured with transfer chamber 8 with conveying chamber 6A, 6B, which has the transmission for transmitting the wafer 200 as substrate Machine 125.In addition, in the present embodiment, to the knot for being respectively provided with aftermentioned treatment furnace 202 above conveying chamber 6A, 6B Structure is illustrated.
Being provided with the receiving room 9 for storing feeder (FOUP) 110 in the face side of transfer chamber 8, (feeder conveying is empty Between), wherein feeder 110 is as the accommodating container for storing multiple wafers 200.It is provided as in the entire surface of receiving room 9 The load port 22 of the port I/O, via load port 22 to carrying-in/carrying-out feeder 110 inside and outside processing unit 2.
Gate valve 90A, 90B of isolation part are provided as in the boundary wall (adjacent surface) of conveying chamber 6A, 6B and transfer chamber 8. Pressure detector is respectively set in transfer chamber 8 and in conveying chamber 6A, 6B, the pressure in transfer chamber 8 is set as than conveying Pressure in room 6A, 6B is low.In addition, oxygen concentration detector is respectively set in transfer chamber 8 and in conveying chamber 6A, 6B, maintain It is lower than the oxygen concentration in atmosphere with the oxygen concentration in conveying chamber 6A, 6B in transfer chamber 8A.It is preferred that being maintained 30ppm or less.
The ceiling portion of transfer chamber 8 is provided with the cleaning unit (not shown) of the supplying clean air into transfer chamber 8, as Clean air, such as recycle inert gas in transfer chamber 8.Circulating purification is carried out by inert gas in transfer chamber 8, by This, can make in transfer chamber 8 for peace and quiet atmosphere.
Through this structure, the particle etc. of conveying chamber 6A, 6B in transfer chamber 8 are able to suppress and is mixed into processing (not shown) Furnace 202 is able to suppress in transfer chamber 8 and forms natural oxide film on wafer 200 in conveying chamber 6A, 6B.
Boundary wall at the rear of receiving room 9 and receiving room 9 and transfer chamber 8 is configured with more such as 3 for biography The feeder opener 21 for sending the lid of box 110 to be opened and closed.Feeder opener 21 opens the lid of feeder 110, thus to biography Send the wafer 200 inside and outside room 8 in carrying-in/carrying-out feeder 110.
As shown in Fig. 2, having stored the multiple wafers 200 being made of silicon etc., and filled using the processing substrate of feeder 110 Setting 10 has the framework 111 used as substrate board treatment main body.
The opening portion being arranged in order to be safeguarded is opened up in front of the front of the face wall of framework 111, i.e., just Mouth (not shown) is safeguarded in face, and is mounted with the front maintenance window that the front maintenance mouth is opened and closed respectively.In addition, in front Wall has opened up feeder carrying-in/carrying-out mouth in a manner of making to be connected to inside and outside framework 111.It is configured to (not scheme by front apron Show) it is opened and closed feeder carrying-in/carrying-out mouth.
The load port 22 used as carrying-in/carrying-out portion, 22 structure of load port are provided in feeder carrying-in/carrying-out mouth Position alignment is carried out as feeder 110 is placed.Feeder 110 is moved to load port 22 by in-process conveying device On, furthermore moved out from load port 22.
Front rear side being arranged up and down throughout the periphery of feeder carrying-in/carrying-out mouth of framework 111 rectangularly Accepting rack (feeder frame) 105.Placement section 140 is arranged in feeder frame 105, as the incorporating section for placing feeder.It receives Portion is received by the placement section 140, the position of readiness and the handover position of handover feeder 110 that make placement section 140 in storage feeder 110 The horizontal mobile mechanism (accepting rack horizontal mobile mechanism) moved horizontally between setting is constituted.Pass through same straight line in the horizontal direction Multiple independent placement sections 140 of upper arrangement and the level-one for constituting feeder frame 105, be provided in vertical direction it is multistage should Feeder frame.Can make each placement section 140 not with upper and lower or adjacent left and right placement section 140 and other which placement sections 140 It synchronizes and independently moves horizontally.Also, feeder conveying device 130 is configured in load port 22, feeder frame 105, passes Send conveying feeder 110 between box opener 121.
In the face side of sub- framework 119 throughout up and down rectangularly provided with the (storage of feeder frame in framework 111 Frame) 105.In the same manner as the feeder frame 105 of the front rear side of framework 111, the conduct of each feeder frame 105 is passed for placing Sending the placement section 140 of the incorporating section of box can move horizontally, can not be synchronous and only with placement section 140 upper and lower or that left and right is adjacent On the spot move horizontally.Feeder frame 105 is configured to keep in the state that multiple placement sections 140 respectively place feeder 110 Feeder 110.
A pair of wafer carrying-in/carrying-out that vertically two-stage arranges up and down has been opened up in the face wall 119a of sub- framework 119 Mouth 120, the wafer carrying-in/carrying-out mouth 120 are used for carrying-in/carrying-out wafer 200 in sub- framework 119, and in the wafer of the superior and the subordinate Carrying-in/carrying-out mouth 120 is respectively provided with a pair of of feeder opener 21.In the present embodiment, feeder opener 21 is set as Upper and lower two-stage, but can also left and right settings two in the horizontal direction.Feeder opener 21, which includes, places feeder 110 Mounting table 122, the capping charging crane 123 loaded and unloaded for the capping to the feeder 110 used as a seal part. Feeder opener 21 loads and unloads the capping for the feeder 110 for being placed on mounting table 122 by covering charging crane 123, The wafer entrance of feeder 110 is opened and closed as a result,.
Sub- framework 119 is constituted to be completely cut off on fluid with the installation space of feeder conveying device 130 and feeder frame 105 Transfer chamber 8.The front area of transfer chamber 8 is provided with wafer transfer mechanism 125, wafer transfer mechanism 125 is transmitted by wafer Device 125a and wafer handler elevator 125b is constituted, and the wafer handler 125a can make wafer 200 in level It rotates or translates on direction, the wafer handler elevator 125b is for going up and down wafer handler 125a.Their structures As the continuous action for passing through wafer handler elevator 125b and wafer handler 125a, by wafer handler 125a Placement section of tweezers (substrate keeping body) 125c as wafer 200, for cassette (substrate holder) 217 load (loading) and It removes stage makeup and costume (unloading) wafer 200.
The conveying chamber 6 as standby unit is constituted in the posterior region of transfer chamber 8, which stores via gate valve 90 Cassette 217 and wait it.The top of conveying chamber 6 is provided with the treatment furnace 202 in Inner Constitution process chamber.Treatment furnace 202 lower end is configured to be opened and closed by fire door baffle 147.
Cassette 217 go up and down being directed in treatment furnace by boat elevator 115 (not shown).As with crystalline substance The arm (not shown) for the connector that the lifting platform of boat elevator 115 is connected horizontally is mounted with the sealing cover as lid 219, lid 219 vertically supports cassette 217, is capable of the lower end of Seal treatment furnace 202.Cassette 217 has multiple holdings Component horizontally keeps wafer in the state of being arranged at multiple 200 centers of wafer in vertical direction in alignment respectively 200。
Next, being illustrated to the movement of substrate board treatment 10.Manufacturing process as semiconductor device (equipment) A process, for use aforesaid substrate processing unit 10 carry out processing substrate example be illustrated.In present embodiment In, when the execution for becoming reserved processing task handles the time started, the control of controller 121 constitutes substrate board treatment 10 The movement in each portion start processing substrate.Here, processing task constitutes pretreatment, main process task, post-processes these three steps.It is first First, the transport process of wafer 200 is carried out by controller 121 as pretreatment.In the present embodiment, wafer 200 is defeated It is sent to cassette 217 and is equivalent to pretreatment.Hereinafter, mainly illustrating to pre-process.
When feeder 110 is supplied to load port 22, device is moved in for the biography on load port 22 by feeder The inside for sending box 110 to be moved to framework 111 from feeder carrying-in/carrying-out mouth.The biography that will be moved in by feeder conveying device 130 Box 110 is sent to be automatically transported to the specified placement section 140 of feeder frame 105 to be joined, after temporary safe-keeping, from transmission The feeder opener 21 that box frame 105 is transported to a side joins and is transmitted to mounting table 122, or is delivered directly to transmission Box opener 21 and be transmitted to mounting table 122.
The opening side end face for the feeder 110 being placed on mounting table 122 is pressed into the face wall 119a of sub- framework 119 Wafer carrying-in/carrying-out mouth 120 opening edge portion, and the capping of feeder 110 is removed by capping charging crane 123, Wafer entrance is opened.When opening feeder 110 by feeder opener 21, pass through wafer handler 125a's Tweezers 125c picks up wafer 200 from feeder 110 by wafer entrance, and moves in after transfer chamber 8 via gate valve 90 Side conveying chamber 6 and load (loading) into cassette 217.At this point it is possible to be had adjusted by notch alignment device (not shown) It is loaded after wafer.The wafer handler 125a for having joined brilliant former 200 to cassette 217 returns to feeder 110, will be next A wafer 200 is loaded into cassette 217.
It is filled in the wafer transfer mechanism 125 of the feeder opener 21 by a side (higher level or junior) to cassette 217 It fills out in the filling operation of brilliant original, other feeder 110 is conveyed from feeder frame 105 by feeder conveying device 130 and is transmitted To the feeder opener 21 of another party (junior or higher level), beating for box 110 is transmitted by feeder opener 21 simultaneously Open operation.
Pre-processing when the wafer 200 of preassigned the piece number is loaded into cassette 217 terminates, and executes main process task (herein For treatment formulations).The treatment formulations that the main process task of task executes through this process are the formulas for handling substrate, by controller 121 are controlled.When starting the treatment formulations, the lower end for the treatment furnace 202 closed by fire door baffle 147 passes through furnace Mouth baffle 147 is opened.Then, increase the sealing cover 219 for the cassette 217 for maintaining sets of wafers by boat elevator 115, Thus it moves in (loading) to treatment furnace 202.
After the loading, wafer 200 is implemented arbitrarily to handle by treatment furnace 202.After treatment, according to it is general with it is above-mentioned Wafer 200 and feeder 110 are moved out the outside that (unloading) arrives framework by opposite sequence.Here, treatment formulations (main process task) are tied Beam.
(treatment furnace of substrate board treatment) is as shown in figure 3, treatment furnace 202 has as heating unit (heating mechanism) Heater 207.Heater 207 is cylindrical shape, is supported by the heater pedestal (not shown) as holding plate and is hung down Directly install.Heater 207 also functions the activation mechanism (excitation portion) of processing gas activation (excitation) as by heat.
It has been arranged in the inside of heater 207 and has constituted reaction vessel (process container) with 207 concentric circles of heater Reaction tube 203.Reaction tube 203 is constituted such as the heat proof material by quartzy (SiO2) or silicon carbide (SiC).The formation of reaction tube 203 For lower end opening, the closed shape for having ceiling of wall body that upper end passes through flat condition.Have in the inside of reaction tube 203 Standby: the canister portion 209 for being formed as cylindrical shape, is formed in the nozzle disposed chamber 222 marked off between canister portion 209 and reaction tube 203 The gas as gas supply port of canister portion 209 supplies gap 235, the first gas exhaust outlet 236 for being formed in canister portion 209, shape At in canister portion 209 and in the second gas exhaust outlet 237 of the lower section of first gas exhaust outlet 236 formation.Under canister portion 209 is formed as End is opened, the closed shape for having ceiling of wall body that upper end passes through flat condition.In addition, canister portion 209 is set as close to crystalline substance Justify 200 and surrounds wafer 200.Process chamber 201 is formed in the inside of the canister portion 209 of reaction tube 203.Process chamber 201 is configured to Wafer 200 as substrate can be handled.In addition, process chamber 201 can store the cassette as substrate holder 217, which can be with flat-hand position and be arranged wafer 200 multistagely in vertical direction in the state of protects Hold brilliant original 200.
The lower end of reaction tube 203 is supported by cylindric manifold 226.Manifold 226 is such as nickel alloy or stainless steel Metal is constituted, or is made of heat proof materials such as quartz or SiC.Flange is formd in the upper end of manifold 226, on the flange It is arranged and supports the lower end of reaction tube 203.There are the airtight portions such as o-ring between the flange and the lower end of reaction tube 203 Part 220 and make in reaction tube 203 become airtight conditions.
Sealing cover 219 is hermetic mounted with via the airtight members such as o-ring 220 in the opening portion of the lower end of manifold 226, Hermetic block the opening portion side of the lower end of reaction tube 203, the i.e. opening portion of manifold 226.Sealing cover 219 is for example by nickel alloy Or the metals such as stainless steel are constituted, and are formed as discoid.Sealing cover 219 is also configured to through quartzy (SiO2) or silicon carbide (SiC) etc. heat proof materials cover its outside.
The cassette supporting station 218 for supporting cassette 217 is provided on sealing cover 219.Cassette supporting station 218 is as follows Supporting mass: it is constituted such as the heat proof material by quartz or SiC, is functioned as insulation part and support cassette.Cassette 217 is vertical It is located on cassette supporting station 218.Cassette 217 is constituted such as the heat proof material by quartz or SiC.Cassette 217, which has, to be fixed on not The bottom plate of the cassette supporting station of diagram and the top plate for the side of being disposed on, have and have set up multiple pillars between bottom plate and top plate Structure.Multiple wafers 200 are maintained in cassette 217.By more wafers 200. while being separated from each other certain interval It keeps loading multistagely in the state of flat-hand position and the alignment of mutual center along the tube axial direction of reaction tube 203, and by cassette 217 Pillar supported.
The cassette rotating mechanism 267 for rotating cassette is provided in the side opposite with process chamber 201 of sealing cover 219. The rotary shaft 265 of cassette rotating mechanism 267 is connect through sealing cover with cassette supporting station 218, passes through cassette rotating mechanism 267, cassette 217 is rotated via cassette supporting station 218, thus rotates wafer 200.
Sealing cover 219 passes through the boat elevator 115 as elevating mechanism being arranged in outside reaction tube 203 in Vertical Square Lifting upwards, thus, it is possible to carrying-in/carrying-out cassette 217 in process chamber 201.
It is provided with by way of through manifold 226 in manifold 226 and is supported for the nozzle of bearing nozzles 340a~340d Portion 350a~350d, nozzle 340a~340d are as the gas nozzle for supplying processing gas into process chamber 201.Here, setting 4 nozzle supporting part 350a~350d are set.Nozzle supporting part 350a~350d is for example by the materials structure such as nickel alloy or stainless steel At.It has been separately connected in one end of 203 side of reaction tube of nozzle supporting part 350a~350c for supplying gas into process chamber 201 Gas supply pipe 310a~310c of body.In addition, one end of 203 side of reaction tube of nozzle supporting part 350d be connected to for It is formed in the gas supply pipe 310d of the gap S supply gas between reaction tube 203 and canister portion 209.In addition, in nozzle supporting part The other end of 350a~350d has been separately connected nozzle 340a~340d.Nozzle 340a~340d is for example resistance to by quartz or SiC etc. Hot material is constituted.
It is successively respectively provided with since updrift side at the first of the first processing gas of supply in gas supply pipe 310a Process gases supply source 360a, mass flow controller (MFC) 320a as flow controller (flow control portion) and conduct The valve 330a of open and close valve.Supply second processing gas is successively respectively provided with since updrift side in gas supply pipe 310b Second processing gas supply source 360b, MFC320b and valve 330b.Gas supply pipe 310c since updrift side according to Secondary third processing gas supply source 360c, MFC320c and valve 330c for being respectively provided with supply third processing gas.In gas Body supply pipe 310d since updrift side successively be respectively provided with supply inert gas inert gas supply source 360d, MFC320d and valve 330d.Confession has been separately connected in the downstream side of valve 330a, 330b of gas supply pipe 310a, 310b To gas supply pipe 310e, 310f connection of inert gas.Successively divide since updrift side in gas supply pipe 310e, 310f It She Zhiliao not MFC320e, 320f and valve 330e, 330f.
First treating-gas supply system is mainly made of gas supply pipe 310a, MFC320a, valve 330a.It can examine Consider and the first processing gas supply source 360a, nozzle supporting part 350a, nozzle 340a are included in the first treating-gas supply system In.In addition, second processing gas supply system is mainly made of gas supply pipe 310b, MFC320b, valve 330b.It can examine Consider and second processing gas supply source 360b, nozzle supporting part 350b, nozzle 340b are included in second processing gas supply system In.Third treating-gas supply system is mainly made of gas supply pipe 310c, MFC320c, valve 330c.It is contemplated that by the Three processing gas supply source 360c, nozzle supporting part 350c, nozzle 340c are included in third treating-gas supply system.This Outside, inert gas feed system is mainly made of gas supply pipe 310d, MFC320d, valve 330d.It is contemplated that by indifferent gas Body supply source 360d, nozzle supporting part 350d, nozzle 340d are included in inert gas feed system.
Exhaust outlet 230 is formed in reaction tube 203.Exhaust outlet 230 is formed in 237 lower section of second gas exhaust outlet, with row Tracheae 231 connects.Exhaust pipe 231 is constituted are as follows: is passed via the pressure of the pressure detector as the pressure in detection processing room 201 Sensor 245 and APC (AutoPressure Controller automatic pressure controller) valve 224 as pressure adjustment unit It is connected to the vacuum pump 246 as vacuum pumping hardware, is able to carry out vacuum evacuation so that the pressure in process chamber 201 becomes pre- Fixed pressure.The exhaust pipe 231 in the downstream side of vacuum pump 246 and exhaust gas treatment device (not shown) etc. are connect.In addition, APC valve Door 244 is following open and close valve: being opened and closed to valve and thus allows for vacuum evacuation in process chamber 201 and vacuum evacuation stops Only, and can control valve opening come adjust conductance to carry out in process chamber 201 pressure adjustment.Function is played as exhaust portion The exhaust system of energy is mainly made of exhaust pipe 231, APC valve 244, pressure sensor 245.Furthermore it is possible to by vacuum pump 246 Included in exhaust system.
The temperature sensor (not shown) as temperature detector is provided in reaction tube 203, according to by temperature sensing The temperature information that device detects adjusts supplying electric power to heater 207, thus becomes the temperature in process chamber 201 and wishes The Temperature Distribution of prestige.
In above treatment furnace 202, it is being loaded with the more wafers 200 of batch processing multistagely for cassette 217 Under state, cassette 217 is supported by cassette supporting station 218 and is inserted into process chamber 201, heater 207 will be inserted into process chamber 201 wafer 200 is heated to predetermined temperature.
(controller architecture) is as shown in figure 4, the controller 121 as control unit (control unit) is configured to have as use In CPU (Central Processing Unit central processing unit) 121a, the RAM for the enforcement division for executing various programs (Random Access Memory random access memory) 121b, storage device 121c, I/O port 121d as storage unit Computer.It is configured to temporarily hold by the memory area (working region) of the CPU121a program read or data etc. RAM121b, storage device 121c, I/O port 121d can carry out data exchange with CPU121a via internal bus 121e.This Outside, the input/output unit 122 of display unit is connected to controller 121, which is for example configured to touch panel etc..
Storage device 121c is for example made of flash memory, HDD (Hard Disk Drive hard disk drive) etc..In It can be read in storage device 121c and be stored with the control program for the movement of control base board processing unit, describe at substrate The treatment formulations etc. of the step of reason and condition etc..Treatment formulations are aftermentioned processing substrate process is executed with controller 121 each Step, can obtain predetermined result mode be combined after treatment formulations, in addition, maintenance formula be not by wafer 200 In the state of being put into device, so that controller 121 is executed each step, such as the formula of component can be maintained, is played as program Function.In addition, maintenance formula is also performed as main process task sometimes.In addition, storing in storage device 121c by holding Row task acts each component of constituent apparatus and the device data that generate.By controller 121 as timing unit Timestamp function attached time data to these device data.
Here, the data that device data are collected when being execution task as described above.For example, being that substrate board treatment 10 is handled The data relevant to processing substrate such as the flow for the treatment of temperature, processing pressure, processing gas when wafer 200 are (for example, setting Value, measured value), it is related to quality (for example, the film thickness and the accumulated value of the film thickness of film forming etc.) of the product substrate that produces Data, data relevant to structure member (reaction tube, heater, valve, the MFC etc.) of substrate board treatment 1 are (for example, set Definite value, measured value) etc. substrate board treatments act each structure member when handling wafer 200 and the number that generates According to.
In addition, the measured value of specific interval collected in formula implementation procedure, such as until the formula start and ending Actual measurement Value Data, each step in formula statistic data also sometimes referred to as handle data, which also includes In device data.In addition, including maximum value, minimum value, average value etc. in statistic data.In addition, indicate formula start or (for example, substrate does not put into the idle running of device when the event data of the device event of end, expression are not carried out treatment formulations When) device event event data (for example, indicate maintenance resume data) be also contained in device data.In addition, indicating The data for producing the item (generate and restore) of alarm (exception) and alarm (warning) are also contained in device data.
In addition, the chart for being stored with present embodiment in storage device 121c shows program, picture migrator etc.. CPU121a is configured to the input etc. according to the operational order from input/output unit 122, executes these programs.In this implementation CPU121a is functioned as display control section in mode.In addition, various picture files are stored in storage device 121c, The various picture files are shown comprising the chart in the present embodiments such as timetable picture, production information picture uses picture file.
In addition, existing only includes that treatment formulations (match by maintenance when having used the referred to as term of program in the present specification Side) monomer the case where, only include the case where controlling program monomer or the case where include their both sides.
The port I/O 121d and above-mentioned MFC320a~320f, valve 330a~330f, pressure sensor 245, APC valve 244, vacuum pump 246, heater 207, temperature sensor, cassette rotating mechanism 267, boat elevator 115 etc. connect.
CPU121a is configured to read control program etc. from storage device 121c to execute, and according to from input and output Input of the operational order of device 122 etc. (is safeguarded and is formulated) from storage device 121c readout process formula.CPU121a be configured to In the way of the content of the treatment formulations read via the port I/O 121d, to MFC320a~320f various gases carried out Flow adjustment movement, the on-off action of valve 330a~330f, APC valve 244 on-off action and be based on pressure sensor 245 carried out by APC valve 244 pressure adjustment movement, the starting of vacuum pump 246 and stopping, heater 207 be based on temperature sensing The rotation and rotational speed regulation movement, boat elevator for the cassette 217 that the temperature adjustment movement of device, cassette rotating mechanism 267 carry out The lifting action etc. of 115 cassettes 217 carried out is controlled.
Next, illustrating the processing substrate process for being equivalent to the main process task of processing task using Fig. 3.In present embodiment In, controller 121 carries out processing substrate process by executing treatment formulations.In addition, treatment formulations are held in the main process task The capable formula for being handled substrate, is controlled by controller 121.Hereinafter, controller 121 is to for constituting The movement in each portion of substrate board treatment 10, which is controlled, carries out predetermined process to wafer 200.
The cassette 217 for the wafer 200 that placed predetermined the piece number is inserted into reaction tube 203 by (processing substrate process), is led to Cross the hermetic capping pipe 203 of sealing cover 219.In hermetically closed reaction tube 203, wafer 200 is heated, And processing gas is supplied into reaction tube 203, scheduled processing is carried out to wafer 200.
As scheduled processing, for example, alternative supply as the NH3 gas of the first processing gas, as second processing gas HCDS gas, the N2 gas as third processing gas, form SiN film on wafer 200 as a result,.
Firstly, from the gas supply pipe 310b of second processing gas supply system via the gas supplying holes of nozzle 340b 234b, gas supply gap 235 supply HCDS gas into process chamber 201.Specifically, by opening valve 330b, 330f, Start to supply HCDS gas into process chamber 201 from gas supply pipe 310b together with carrier gas.At this point, adjustment APC valve 244 Pressure in process chamber 201 is maintained scheduled pressure by aperture.If have passed through the predetermined time, valve 330b is closed, is stopped The supply of HCDS gas.
The HCDS gas being fed into process chamber 201 is supplied to wafer 200, after being flowed in parallel on wafer 200, warp Cross first gas exhaust outlet 236 gap S flow from the top down, via second gas exhaust outlet 237, exhaust outlet 230 from Exhaust pipe 231 is discharged.
In addition, during supplying HCDS gas into process chamber 201, when open connect with gas supply pipe 310a it is lazy The valve 330e of property gas supply pipe and valve 330c, 330d of gas supply pipe 310c, 310d and make the inert gas flows such as N2 When dynamic, it can prevent in HCDS gas backstreaming to gas supply pipe 310a, 310c, 310d.
Valve 330b is being closed, is being stopped after supplying HCDS gas into process chamber 201, to being exhausted in process chamber 201, Exclude remaining HCDS gas and reaction product etc. in process chamber 201.At this point, when from gas supply pipe 310a, 310b, 310c, 310d when being cleaned, can be further increased into process chamber 201 with gap S supply N2 etc. inert gases respectively It excludes in process chamber 201 and the effect of the residual gas of gap S.
Next, from the gas supply pipe 310a of the first treating-gas supply system via the gas supplying holes of nozzle 340a 234a, gas supply gap 235 supply NH3 gas into process chamber 201.Specifically, by opening valve 330a, 330e, Start to supply NH3 gas into process chamber 201 from gas supply pipe 310a together with carrier gas.At this point, adjustment APC valve 244 Pressure in process chamber 201 is maintained scheduled pressure by aperture.If have passed through the predetermined time, valve 330a is closed, is stopped The supply of NH3 gas.
The NH3 gas being fed into process chamber 201 is supplied to wafer 200, on wafer 200 after PARALLEL FLOW, passes through First gas exhaust outlet 236 gap S flow from the top down, via second gas exhaust outlet 237, exhaust outlet 230 from row Tracheae 231 is discharged.
In addition, during supplying NH3 gas into process chamber 201, when open connect with gas supply pipe 310b it is lazy Property gas supply pipe valve 330f and valve 330c, 330d and when making the inert gas flows such as N2, can prevent NH3 gas from returning It flows in gas supply pipe 310b, 310c, 310d.
Valve 330a is being closed, is being stopped after supplying NH3 gas into process chamber 201, to being exhausted in process chamber 201, Exclude remaining NH3 gas and reaction product etc. in process chamber 201.At this point, when from gas supply pipe 310a, 310b, 310c, 310d when being cleaned, can be further increased into process chamber 201 with gap S supply N2 etc. inert gases respectively It excludes in process chamber 201 and the effect of the residual gas of gap S.
When the processing of wafer 200 is completed, by the step opposite with above-mentioned movement, cassette is moved out out of reaction tube 203 217。
In the above-described embodiment, it is carried out to the case where being alternately supply the first processing gas and second processing gas Illustrate, present invention may also apply to supply the first processing gas and second processing gas simultaneously.
(embodiment 1) Fig. 5 is the process flow for indicating chart display program of present embodiment, wherein the chart is shown Program is used to show the timetable of task.
When starter controller 121, starts chart and show program, at the time of controller 121 obtains current first.It connects down Come, retrieved in storage unit 121c, is confirmed whether there is the scheduled task executed by device.If there is no task, Then terminate or keep standby mode.In any case when pressing aftermentioned more new button, restart program, current from acquirement Moment starts.
When retrieving task, controller 121 obtains the information of task.Not only obtain mission bit stream (title, formula name Claim, start predetermined instant, terminate predetermined instant etc.), also at least formula information (title, classification, processing performed by acquirement task Room, processing data etc.).
Next, determining to be subscribed to task or be currently executing task.Specifically, by the current time of acquirement Be compared with the beginning predetermined instant of task, whether beginning predetermined instant have passed through according to current time, furthermore according to whether there is or not Device data that expression task starts (data at the time of indicating task execution start time) are determined.
When being subscribed to task, task based access control information is according to pretreated pretreatment start time and pretreatment finish time The pretreatment predetermined time is calculated, the pre- timing of main process task is calculated according to the main process task start time of main process task and main process task finish time Between, the post-processing predetermined time is calculated according to the post-processing start time of post-processing and post-processing finish time, and will be calculated Pre-process predetermined time, main process task predetermined time, the execution predetermined time for post-processing predetermined time progress phase Calais calculating task. In addition, in order to carry out respective identification, such as the color display pretreatment predetermined time, the pre- timing of main process task can be distinguished Between, post-processing the predetermined time.In addition, for example when whole tasks are in reservation, at the end of from current time to pretreatment Mode until quarter calculates the pretreatment predetermined time for most starting executing for task.
When being currently executing task, controller 121, which confirms, is carrying out pretreatment, main process task, which in post-processing A processing.Specifically, such as device data based on acquirement of controller 121, according to whether there is or not expression pretreatments to start, main process task Start, at the time of post-processing starts data come determine current time be equivalent to pretreated beginnings predetermined instant and terminate it is pre- periodically Between quarter, main process task starts predetermined instant and terminates between predetermined instant, the beginning predetermined instant of post-processing and terminates predetermined Which between moment.For example, data are then determined as in pretreatment at the time of beginning if there is pretreatment.
When being determined as in pretreatment, then, controller 121 carries out current time and pretreated end predetermined instant Compare, in the case where current time, which have passed through, terminates predetermined instant, will be calculated until current time is carved at the beginning of task Pretreatment will be carved at the beginning of task at current time in the case where terminating before predetermined instant for the pretreatment execution time End predetermined instant until be calculated as pretreatment execute the time.
Then, which is executed time and main process task predetermined time, post-processing predetermined time progress phase by controller 121 Calais is calculated as the execution predetermined time of task.In addition, being situation in main process task in being currently executing for task and being In the case where in post-processing, it is carried out similarly calculating respectively.Therefore detailed description will be omitted is the feelings in main process task at current time Under condition, pretreatment execution time and post-processing predetermined time is added, current time is compared with end predetermined instant and is counted The main process task of calculating executes the time to be calculated as the execution predetermined time of task.
Next, determining whether task generates the waiting of recovery condition.For example, when being confirmed whether to generate recovery in pretreatment When condition waits, controller 121 is according to the device data of acquirement to produce the state for the alarm for needing to carry out recovery operation When be judged to producing recovery condition waiting, and obtain for restore determine outstanding message.
At the end of the calculating (schematic calculation processing) of the execution predetermined time of a task, controller 121 is for next A task similarly carries out schematic calculation processing, for the whole task computation task execution predetermined times retrieved, obtains The task execution predetermined time is as chart processing result information.Here, also obtaining each task as chart processing result information Pretreatment, main process task, post-processing the execution time or execute the predetermined time.
Then, controller 121 is believed according to acquired current time, mission bit stream, formula information, chart processing result Breath restores the various device data such as condition outstanding message, generates (for example, shown in fig. 6) timetable picture file, to task point Not carry out chart show.In addition, controller 121 is configured to the line chart mark that the display in timetable picture is equivalent to current time.
In this way, chart according to the present embodiment shows program, when possess in mission bit stream processing start time and When processing terminate moment, firstly, according to the processing start time and processing of the task of beginning or being currently executing for task The execution predetermined time of finish time calculating task calculates the end predetermined instant of the task of beginning.By the task of the beginning Terminate predetermined instant and be reflected to the making a reservation for next execution of the task, by repeating the behaviour according to the quantity of retrieving for task Make to calculate the execution predetermined time of reserved task.
In addition, controller 121 is when achieving recovery condition outstanding message for being currently executing of the task, such as Fig. 8 It is shown, it shows in the predetermined space of timetable picture for indicating to produce the icon of recovery condition waiting.In addition, for example, When having pressed the aftermentioned reason button shown in the presumptive area of timetable picture, controller 121 is shown in display unit Show the detailed content for having carried out the reason of recovery condition waits.
Fig. 6 is indicated and by the execution chart display program of controller 121 in the operation screen of input/output unit 122 One embodiment of the timetable picture of display.Timetable picture 500 shown in fig. 6 includes two-dimensional space, which will indulge Axis is set as the project of the reservation sequence of the various tasks of the device execution including the indicating to be currently executing comprising device of the task Horizontal axis is set as comprising task names cell 502, PM cell 503, recipe name or is terminated predetermined by numbered cell lattice 501 The date-time 505 during mission bit stream and the scheduled monitoring of expression including time quantum lattice 504.Here, PM is processing The abbreviation PM of module (Processing Module).
In addition, in the two-dimensional space of timetable picture 500, it is shown that indicate the line 506 at current time, by indicating to appoint Execution time of business or execute the icon of predetermined time and show the task 507 being currently executing, by indicating from the beginning of Predetermined instant to the icon for terminating predetermined instant and the task 508 of reservation that shows, chart show that is be currently executing appoints The task 508 of business 507 and reservation.In addition, in recipe name or terminating to show recipe name in predetermined time cell 504 (treatment formulations 1).
In addition, shown in the two-dimensional space of timetable picture 500 the pre-treatment step 508a of the task 508 of reservation, Main process task step 508b and post-processing step 508c is shown by the color predetermined in each step respectively.Though in addition, It does not illustrate clearly so, but the task 507 for being currently executing is same, independently shows pre-treatment step, main place Step and post-processing step are managed, is shown respectively by pre-determined color.
Fig. 7 indicates in timetable picture shown in Fig. 6, press recipe name or terminate predetermined time cell 504 from And when being switched to the end predetermined time.
Fig. 8 is that the expression on timetable picture produces the display example for the icon 510 that recovery condition waits.It knows currently just Display color is distinguished for boundary with current time 506 in the formula 507 of execution.Certain events are generated in pretreatment (or main process task) Barrier, next main process task (or post-processing) wait the state of the recovery processing of failure to continue.When performing recovery processing, do not show Diagram mark 510.In addition, if pressing reason button shown in Fig. 9, carrying out showing the icon 510 when showing the icon 510 Detailed reason display.
Fig. 9 is drawn in detail the reason of display unit 122 is shown when having pressed the reason button 511 on timetable picture Face 600.Reason detailed picture 600 is the picture pressed when (selection) restores the condition A in condition waiting reason.Condition A packet Containing " EFEM " " maintenance " " PM1 " " PM2 " this four conditions." EFEM " " PM1 " " PM2 " is as the EFEM of receiving room 9, as place Manage furnace 202 processing module 1, as treatment furnace 202 processing module 2 maintenance status releasing wait, " maintenance " be due to dimension During timetable caused by protecting temporarily ceases.In addition, when producing the waiting of recovery condition face can be distinguished on timetable picture Show to color reason button 511.
It describes the producing cause (maintenance status releasing wait) of " EFEM " in the downside of reason detailed picture 600 and is directed to The countermeasure of the reason.When pressing retrieval unit lattice, display is for selecting " EFEM " " maintenance " " PM1 " " PM2 " this four Therefore the picture of condition can be changed by the other conditions other than selection " EFEM ".Although in addition, not having in Fig. 8 It explicitly indicates that, but show the cell for generating the condition that recovery condition waits with being to discriminate between color.It is pressed when by the OK of depression When button, the display of reason detailed picture 600 is released, returns to timetable picture 500.
In addition, carrying out the update that chart is shown when having pressed the more new button 509 shown in timetable picture 500. That is, restarting chart shown in fig. 5 shows program, it is new to obtain current time.Then, it is held since the current time Process flow shown in fig. 5 go to update timetable picture shown in fig. 6.
Specifically, controller 121 executes process flow shown in fig. 5 when detecting to have pressed more new button 509, New current time, mission bit stream, formula information are updated, calculates to accompanying this end of being currently executing for task again The beginning predetermined instant and end predetermined instant of predetermined instant and the task of reservation, according to calculated beginning predetermined instant And terminate predetermined instant, calculate executing the time and executing predetermined time and reservation for the task of being currently executing for task The execution predetermined time, update and show timetable picture shown in fig. 6.
As shown in figure 12, it is configured to show icon in project number cell 501, appoints so that clearly showing that production is used The difference of task (clean up task in Figure 12) is used in business (processing task) with maintenance.Also, such as in project number cell 501 Show that formula performed by task for identification is treatment formulations (formula of processing substrate) or maintenance formula (cleaning formula etc. Maintain structure member formula) icon.
(embodiment 2) Figure 10 is the process flow that the expression of the present embodiment has executed the chart display program of task, Figure 11 It indicates to show program by execution chart, the one of the production information picture shown in the operation screen of input/output unit 122 Embodiment.
When having pressed the button for being switched to production information picture, the chart for starting to have executed task shows program.Firstly, Controller 121 obtains current time.Then, it is retrieved in storage unit 121c, be confirmed whether to have executed there are device appoints It is engaged in (having executed task).Terminate if there is no task has been executed then.In addition, when having pressed more new button (not shown), weight New startup program, since obtaining current time.
When retrieve executed task when, controller 121 obtain this executed the information of task.Not only obtain mission bit stream (title, recipe name start predetermined instant, terminate predetermined instant etc.), also at least formula information (name performed by acquirement task Title, classification, process chamber, processing data, production information etc.).In addition, also obtaining comprising being collected into and being stored in when execution task The device data of production information in storage portion 121c.
In addition, controller 121 calculates pretreatment according to the pretreatment start time and pretreatment finish time of mission bit stream The time is executed, main process task is calculated according to main process task start time and main process task finish time and executes the time, is started according to post-processing Moment and post-processing finish time calculate post-processing and execute the time, these calculated execution times have been carried out the calculating of phase Calais The execution time of execution task.Then, the time is executed for whole task computations of execution.Obtain these whole execution The execution time of task, pretreatment execute the time, main process task executes the time, post-processing executes the time as chart processing result Information.
Next, controller 121 according to comprising acquired current time, mission bit stream, formula information, executed task The execution charts processing result information such as time various device data, generate (shown in Figure 11) production information picture file, Chart shows the task of execution respectively.
Production information picture 700 shown in Figure 11 includes two-dimensional space, which is set as the longitudinal axis to have indicated device Horizontal axis is set as mono- comprising task names cell 702, PM by the project number cell 701 of the sequence of the various tasks executed The date-time 705 during mission bit stream and the scheduled monitoring of expression including first lattice 703, recipe name cell 704.In This, as Fig. 5, PM is the abbreviation PM of processing module (Processing Module).
In addition, chart shows the execution time by indicating task in the two-dimensional space of production information picture 700 Icon and the task of execution 706 executed shown have executed task 706 with pre-treatment step 706a, main process task step 706b, post-processing step 706c are shown by color pre-determined in each step respectively.
In addition, controller 121 is producing when in the device data in acquirement comprising indicating to produce abnormal abnormal data It has given birth to and has shown abnormal icon 707 in the project number cell 701 for having executed task of abnormal data.In addition, when shown in Fig. 6 Timetable picture on can also similarly be set in project number cell 501 when producing failure in task in commission Set abnormal icon.
In addition, as shown in figure 12, being configured to show icon in project number cell 701, so that clearly showing The difference of task (clean up task in Figure 12) is used in production with task (processing task) with maintenance.
According to the present embodiment, the more than one effect in (1) as shown below~(7) is obtained.
(1) according to the present embodiment, shown by carrying out chart, can simply identify from reservation, in pretreatment, it is main The development situation of being selected in the group being constituted in processing, in post-processing for task, and can identify the whole tasks reserved Processing sequence.(2) according to the present embodiment, it is shown by carrying out chart, at the beginning of capable of identifying the whole tasks reserved Phase and end predetermined period, therefore the executive plan of task can be formulated, it as a result can more efficiently be configured operation. (3) according to the present embodiment, the reason of task is waited as recovery condition information is possessed as unit of task, therefore will appreciate that The task of recovery condition waiting is produced, and can identify its reason.(4) according to the present embodiment, it is shown by carrying out chart, The utilization frequency of each processing module can not only be grasped and using task executions real results such as intervals as a result, can also identify With the relationship of the real result of other processing modules.(5) according to the present embodiment, it is shown by carrying out chart, will appreciate that production The relationship for the task that the task and front and back for having given birth to failure execute, therefore, troubleshooting becomes easy.(6) according to the present embodiment, Production task and maintenance task can be identified at a glance, be can determine and whether are normally performed regularly maintenance task Deng.(7) according to the present embodiment, make to possess in mission bit stream processing start time and processing terminate moment, when determining out It, can be according to the pre- timing of execution of processing start time and processing terminate moment calculating task when at the beginning of the task of head Between, therefore it is capable of the end predetermined instant of calculating task.The end predetermined instant of the task is reflected to and makes a reservation for next execution Task, the execution predetermined time of reserved task can be calculated by repeating the operation.
The control unit 121 of embodiment of the present invention is not limited to the case where being configured to dedicated computer, is configured to lead to Use computer.For example, can prepare to store the external memory of above procedure (for example, the semiconductor storages such as USB storage Device etc.) 123, using the external memory 123 to installation procedures such as general purpose computers, thus, it is possible to constitute present embodiment Controller 121.Wherein, for the means of computer supply program being not limited to be supplied via external memory 123 Situation.It is, for example, possible to use the communication units such as internet or special circuit, do not supply program via external memory 123. Storage device 121c and external memory 123 are configured to computer-readable recording medium.Hereinafter, simply by them It is referred to as recording medium.When having used term as recording medium in the present specification, exist only comprising storage device 121c The case where monomer, only the case where including 123 monomer of external memory, or the case where include their both sides.
In addition, the substrate board treatment 1 in embodiments of the present invention is applied not only to the semiconductors manufacture of manufacture semiconductor Device, additionally it is possible to for being carried out to glass substrate as LCD (Liquid Crystal Display liquid crystal display) device The device of processing.Alternatively, exposure device, lithographic equipment, apparatus for coating, the place for having used plasma can also be applied to certainly Manage the various substrate board treatments such as device.
Industrial application
The development situation that various formulas performed by task can be shown in picture can be applied to carry out on picture The substrate board treatment of the progress management of task.
Symbol description
10 ... substrate board treatments
200 ... wafers.

Claims (12)

1. a kind of substrate board treatment comprising:
Display unit, has the operation screen comprising two-dimensional space, and an axis is set as current comprising device by the two-dimensional space The subscription status for the various tasks that device including being carrying out for task executes, is set as the scheduled monitoring phase for another axis Between;And
Display control section, at the beginning of consisting of obtaining and being carrying out comprising device for task and terminate predetermined instant or The task of person's device reservation starts predetermined instant and terminates the various information including predetermined instant, according to acquired current At the beginning of the task being carrying out and terminates the task of predetermined instant and/or reservation and start to make a reservation for Moment and terminate predetermined instant and calculate the execution predetermined time of the task, and makes the display unit chart be shown as indicating The image of the execution predetermined time of the task of the task and reservation that are currently executing.
2. substrate board treatment according to claim 1, which is characterized in that
Also, the display control section is configured to obtain current time, and the display control section is configured to keep the display unit aobvious Show the line for indicating the current time.
3. substrate board treatment according to claim 1, which is characterized in that
Also, it is described when the information in the various information that the acquisition unit obtains comprising indicating the waiting of recovery condition Display control section makes the display unit show the icon waited for indicating the recovery condition.
4. substrate board treatment according to claim 3, which is characterized in that
The display control section is configured to show described extensive when detecting the pressing of button the reason of the display unit is arranged The reason of multiple condition waits.
5. substrate board treatment according to claim 1, which is characterized in that
The display control section is configured to detecting in the pressing of the more new button of display unit setting, recalculates and work as Before the beginning predetermined instant of the task for terminating predetermined instant and reservation of the task that is carrying out and terminate pre- Timing is carved, and according to the calculated beginning predetermined instant and the end predetermined instant, shows that the display unit currently The task of the task and reservation that are carrying out.
6. substrate board treatment according to claim 1, which is characterized in that
The display control section is configured to detecting in the pressing of the more new button of display unit setting, work as described in update The preceding moment shows the display unit.
7. substrate board treatment according to claim 1, which is characterized in that
The display control section is configured to show in the project number cell that the display unit is arranged in described for identification The formula that task has executed is the icon for handling the formula of formula or maintenance structure member of substrate.
8. a kind of substrate board treatment comprising:
Display unit, has the operation screen comprising two-dimensional space, and the two-dimensional space is set as an axis to execute the task Sequence, during another axis is set as scheduled monitoring;
Storage unit, storage include the various information at the beginning of task and including finish time, and the task includes dress Set the pre-treatment step executed, main process task step and post-processing step;And
Display control section, consist of calculate obtained from the storage unit the pre-treatment step, the main process task step with And the post-processing step respective execution time, the task is identifiably shown for each step, while being made described aobvious The portion chart of showing is shown as the image of the execution time for the task for indicating to have executed.
9. substrate board treatment according to claim 8, which is characterized in that
The display control section is configured to according to described device data based on whether there is or not indicate to generate in the formula implementation procedure Abnormal data, be shown in the project number cell of the display unit setting with distinguishing color.
10. substrate board treatment according to claim 8, which is characterized in that
The display control section is configured to show in the project number cell that the display unit is arranged in described for identification The formula that task has executed is the icon for handling the formula of formula or maintenance structure member of substrate.
11. a kind of display methods of substrate board treatment, the substrate board treatment has the operation screen comprising two-dimensional space, One axis is set as the various tasks of the device execution including being currently executing comprising device for task by the two-dimensional space Subscription status, during another axis is set as scheduled monitoring, which is characterized in that
The display methods includes
At the beginning of obtaining being carrying out comprising device for task and terminate the task of predetermined instant or device reservation Start predetermined instant and terminate predetermined instant including various information the step of;
At the beginning of according to the task of acquirement being currently executing and terminate predetermined instant and/or reservation The beginning predetermined instant of the task and the step of terminate execution predetermined time of the predetermined instant to calculate the task;And
Chart is shown as indicating the figure of the execution predetermined time of the task of the task and reservation that are currently executing The step of picture.
12. a kind of display methods of substrate board treatment, the substrate board treatment has the operation screen comprising two-dimensional space, One axis is set as executing the sequence of the task by the two-dimensional space, special during another axis is set as scheduled monitoring Sign is,
The display methods includes
Storage include task at the beginning of and finish time including various information the step of, the task comprising device Pre-treatment step, main process task step and the post-processing step of execution;
Calculate the pre-treatment step, the main process task step and the post-processing step respective execution time of storage Step;And
The task is identifiably shown for each step, while chart is shown as indicating the execution of the task executed The image of time.
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JP2004119451A (en) * 2002-09-24 2004-04-15 Dainippon Screen Mfg Co Ltd Substrate treatment apparatus and method for its scheduling
WO2012035965A1 (en) * 2010-09-17 2012-03-22 株式会社日立国際電気 Substrate processing system and display method of substrate processing device
CN105474356A (en) * 2013-08-15 2016-04-06 株式会社思可林集团 Substrate processing device, substrate processing method, and substrate processing system

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JPH097912A (en) * 1995-04-18 1997-01-10 Nippondenso Co Ltd Manufacturing controller for semiconductor substrate
JP2004119451A (en) * 2002-09-24 2004-04-15 Dainippon Screen Mfg Co Ltd Substrate treatment apparatus and method for its scheduling
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CN105474356A (en) * 2013-08-15 2016-04-06 株式会社思可林集团 Substrate processing device, substrate processing method, and substrate processing system

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