JP2012064881A - Substrate processing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the difference of representative value data not caused by actual device state, processing state, or the like.SOLUTION: A group management device in the substrate processing system has a communication unit which receives monitor data from a substrate processing device, a storage unit which stores the monitor data so as to be read, a representative value data generation unit which generates representative value data based on monitor data conforming to the data extraction conditions when a predetermined event is detected and stores representative value data in the storage unit together with time data, and a representative value data processing unit which processes the representative value data to be displayed in a display unit.

Description

  The present invention relates to a substrate processing system including a substrate processing apparatus and a group management apparatus connected to the substrate processing apparatus.

  Inside the substrate processing apparatus that executes the substrate processing process (batch processing) based on the recipe, monitor data indicating the progress of the substrate processing process and the operating state of the substrate processing apparatus (for example, time series data such as temperature, gas flow rate, pressure, etc.) ) Occur in large numbers. In the substrate processing system, a group management device (upper management device) has been used in order to manage the progress of the substrate processing process and the operating state of the substrate processing apparatus group in an integrated and efficient manner based on the monitor data. The group management device is connected to the substrate processing device group, for example, a storage unit that stores monitor data received from each substrate processing device, and displays data based on a part of the monitor data among the monitor data stored in the storage unit A display unit.

  According to the above configuration, for example, by displaying data on a plurality of substrates and batches that have undergone substrate processing steps based on the same recipe on the display unit, it is possible to perform a state comparison of substrates and batches between the same recipes. it can. For a part of the monitor data to be displayed, for example, monitor data for a predetermined period divided every fixed time such as one hour unit is used. Based on the monitor data, representative value data including, for example, an average value, a maximum value, a minimum value, and the like is generated and displayed on the display unit.

  However, the predetermined period is divided regardless of events occurring in the substrate processing apparatus, for example, the start and end of execution of the recipe, the start and end of execution of each step included in the recipe, and so on. Even if the result is equivalent, different representative value data is generated from time to time, and it may appear as if the result is different. That is, for example, as shown in FIG. 10, the representative value data relating to the temperature is generated including only the monitor data at the temperature maintaining step at which the temperature is substantially constant and the monitor data in the middle of the temperature increasing step. In some cases, a difference that does not depend on the actual apparatus state, processing state, or the like occurs in the representative value data, and it may be difficult to compare the states of the substrates and batches between the same recipes.

  Accordingly, an object of the present invention is to provide a substrate processing system that reduces the difference in representative value data that does not depend on the actual apparatus state, processing state, etc., and makes it easier to compare the state of substrates and batches between the same recipe. There is.

According to one aspect of the present invention, there is provided a substrate processing system including a substrate processing apparatus that executes a recipe while generating a plurality of events, and a group management apparatus connected to the substrate processing apparatus, wherein the group management An apparatus includes: a communication unit that receives monitor data indicating a progress status of the recipe or an operating state of the substrate processing apparatus from the substrate processing apparatus; and a storage unit that stores the monitor data received by the communication unit in a readable manner. When a predetermined event is detected, the monitor that matches the data extraction condition among the monitor data stored in the storage unit while referring to a data extraction condition that defines a section for extracting the monitor data Read data from the storage unit, generate representative value data based on the read monitor data, and generate the representative value data and the representative value data A representative value data generating unit that stores the related time data in the storage unit; and a representative value data processing unit that processes the representative value data stored in the storage unit and displays the data on the display unit. A substrate processing system is provided.

  According to the present invention, there is provided a substrate processing system that reduces the difference in representative value data that does not depend on the actual apparatus state, processing state, etc., and makes it easier to compare the state of substrates and batches between the same recipes. .

It is a block block diagram of the substrate processing system which concerns on 1st Embodiment of this invention. It is explanatory drawing of the production | generation method of the representative value data which concerns on 1st Embodiment of this invention, Comprising: (a) is a time series graph which illustrates temperature monitor data, (b) is a table which illustrates representative value data. It is. It is a graph which illustrates the candlestick chart obtained by processing the representative value data concerning a 1st embodiment of the present invention. It is explanatory drawing of the bar chart obtained by processing the representative value data which concern on 1st Embodiment of this invention. It is reading explanatory drawing of the candlestick chart obtained by processing the representative value data which concern on 1st Embodiment of this invention. It is a schematic diagram which illustrates the internal operation | movement of the group management apparatus which concerns on 1st Embodiment of this invention. 1 is a perspective view of a substrate processing apparatus according to a first embodiment of the present invention. 1 is a side perspective view of a substrate processing apparatus according to a first embodiment of the present invention. It is a longitudinal cross-sectional view of the processing furnace of the substrate processing apparatus which concerns on 1st Embodiment of this invention. It is explanatory drawing of the production | generation method of the representative value data which concerns on a reference example, Comprising: The time series graph which illustrates the monitor data of the temperature which divided the area at a different timing sequentially from the top, the table which illustrates representative value data, and an average value It is a time series graph which illustrates data, (a) and (b) are data or a graph of a different board processed by the same recipe, respectively.

<First Embodiment of the Present Invention>
The first embodiment of the present invention will be described below.

(1) Configuration of Substrate Processing Apparatus Next, the configuration of the substrate processing apparatus 100 according to the present embodiment will be described with reference to FIGS. FIG. 7 is a perspective view of the substrate processing apparatus 100 according to the present embodiment. FIG. 8 is a side perspective view of the substrate processing apparatus 100 according to the present embodiment. Note that the substrate processing apparatus 100 according to the present embodiment is configured as a vertical apparatus that performs film formation processing, oxidation processing, diffusion processing, and the like on a substrate such as a wafer.

  As shown in FIGS. 7 and 8, the substrate processing apparatus 100 according to the present embodiment includes a casing 111 configured as a pressure vessel. A front maintenance port 103 is provided in front of the front wall 111a of the casing 111 as an opening provided for maintenance. The front maintenance port 103 is provided with a front maintenance door 104 that opens and closes the front maintenance port 103.

In order to transfer the wafer 200 as a substrate made of silicon (Si) or the like into or out of the housing 111, a pod 110 as a wafer carrier (substrate container) that stores a plurality of wafers 200 is used. A pod loading / unloading port (substrate container loading / unloading port) 112 is opened on the front wall 111 a of the housing 111 so as to communicate between the inside and the outside of the housing 111. The pod loading / unloading port 112 is opened and closed by a front shutter (substrate container loading / unloading port opening / closing mechanism) 113. A load port (substrate container delivery table) 114 is installed on the lower front side of the pod loading / unloading port 112. The pod 110 is transported by an in-process transport device (not shown), and is placed on the load port 114 and aligned.

  A pod transfer device (substrate container transfer device) 118 is installed near the load port 114 in the housing 111. A rotary pod shelf (substrate container mounting shelf) 105 is installed at a further depth of the pod transfer device 118 in the casing 111 and above a substantially central portion of the casing 111 in the front-rear direction. Below the rotary pod shelf 105, a pair of pod openers (substrate container lid opening / closing mechanisms) 121 are respectively installed in the upper and lower stages.

  The pod transfer device 118 includes a pod elevator (substrate container lifting mechanism) 118a that can be moved up and down while holding the pod 110, and a pod transfer mechanism (substrate container transfer mechanism) 118b as a transfer mechanism. The pod transfer device 118 is configured to transfer the pods 110 between the load port 114, the rotary pod shelf 105, and the pod opener 121 by continuous operation of the pod elevator 118a and the pod transfer mechanism 118b. .

  A plurality of pods 110 are stored on the rotary pod shelf 105. The rotary pod shelf 105 includes a support column 116 that is erected vertically and intermittently rotates in a horizontal plane, and a plurality of shelf plates (substrate container mounting table) that are radially supported by the support column 116 at each of the upper, middle, and lower positions. 117). The plurality of shelf plates 117 are configured to hold a plurality of pods 110 in a state where they are mounted.

  A sub-housing 119 is provided at a lower portion in the housing 111 where the pod opener 121 is disposed, extending from a substantially central portion in the front-rear direction in the housing 111 to the rear end. A pair of wafer loading / unloading ports (substrate loading / unloading ports) 120 that transfer the wafer 200 into and out of the sub-casing 119 are provided on the front wall 119a of the sub-casing 119 so as to be arranged vertically in two stages. Yes. The pod opener 121 is installed at each of the upper and lower wafer loading / unloading ports 120.

  Each pod opener 121 includes a pair of mounting bases 122 on which the pod 110 is mounted, and a cap attaching / detaching mechanism (lid attaching / detaching mechanism) 123 that attaches / detaches a cap (cover) of the pod 110. The pod opener 121 is configured to open and close the wafer loading / unloading port of the pod 110 by attaching / detaching the cap of the pod 110 placed on the placing table 122 by the cap attaching / detaching mechanism 123.

  In the sub casing 119, a transfer chamber 124 that is fluidly isolated from a space in which the pod transfer device 118, the rotary pod shelf 105, and the like are installed is configured. A wafer transfer mechanism (substrate transfer mechanism) 125 is installed in the front region of the transfer chamber 124. The wafer transfer mechanism 125 includes a wafer transfer device (substrate transfer device) 125a that can rotate or linearly move the wafer 200 in the horizontal direction, and a wafer transfer device elevator (substrate transfer device) that moves the wafer transfer device 125a up and down. Elevating mechanism) 125b. As shown in FIG. 7, the wafer transfer apparatus elevator 125 b is installed between the right end of the front area of the transfer chamber 124 and the right end of the casing 111 of the sub casing 119. The wafer transfer device 125 a includes a tweezer (substrate holding body) 125 c as a mounting portion for the wafer 200. A notch alignment device (not shown) as a substrate alignment device for aligning the circumferential position of the wafer 200 is installed on the opposite side of the wafer transfer device elevator 125b across the wafer transfer device 125a. . The wafer 200 is loaded (charged) and unloaded (discharged) from a boat 217 described later by the continuous operation of the wafer transfer device elevator 125b and the wafer transfer device 125a.

  In the rear region of the transfer chamber 124, a standby unit 126 that houses and waits for the boat 217 is configured. A processing furnace 202 for processing the wafer 200 is provided above the standby unit 126. The lower end portion of the processing furnace 202 is configured to be opened and closed by a furnace port shutter (furnace port opening / closing mechanism) 147. The configuration of the processing furnace 202 will be described later.

  As shown in FIG. 7, a boat elevator (substrate holder lifting mechanism) 115 for raising and lowering the boat 217 is installed between the right end portion of the standby portion 126 and the right end portion of the casing 111 of the sub-housing 119. ing. An arm 128 as a connecting tool is connected to the elevator platform of the boat elevator 115. A seal cap 219 as a furnace port lid is horizontally installed on the arm 128. The seal cap 219 is configured to support the boat 217 vertically and to close the lower end portion of the processing furnace 202.

  The boat (substrate holder) 217 includes a plurality of holding members. The boat 217 is configured to hold a plurality of (for example, about 50 to 125) wafers 200 horizontally in a state where the centers are aligned in the vertical direction.

  As shown in FIG. 7, clean air 133, which is a cleaned atmosphere or an inert gas, is supplied to the left end of the transfer chamber 124 on the side opposite to the wafer transfer device elevator 125b side and the boat elevator 115 side. A clean unit 134 composed of a supply fan and a dustproof filter is installed. The clean air 133 blown out from the clean unit 134 flows around the notch aligner, the wafer transfer device 125a, and the boat 217 in the standby unit 126, and is then sucked by a duct (not shown) and exhausted to the outside of the casing 111. Or is circulated to the primary side (supply side) which is the suction side of the clean unit 134 and is blown out again into the transfer chamber 124.

(2) Operation of Substrate Processing Apparatus Next, the operation of the substrate processing apparatus 100 according to the present embodiment will be described with reference to FIGS. The following operations are performed based on, for example, a transport recipe. The transfer recipe is used for transferring the wafer 200 in the substrate processing apparatus 100, and is applied to the substrate processing step in combination with a process recipe for performing substrate processing, for example.

  As shown in FIGS. 7 and 8, when the pod 110 is placed on the load port 114, the pod loading / unloading port 112 is opened by the front shutter 113. The pod 110 on the load port 114 is carried into the housing 111 from the pod carry-in / out port 112 by the pod carrying device 118.

  The pod 110 carried into the housing 111 is automatically transported and temporarily stored on the shelf plate 117 of the rotary pod shelf 105 by the pod transport device 118, and then one of the pods 110 from the shelf plate 117. It is transferred onto the mounting table 122 of the pod opener 121. The pod 110 carried into the housing 111 may be directly transferred onto the mounting table 122 of the pod opener 121 by the pod transfer device 118. The wafer loading / unloading port 120 of the pod opener 121 is closed by a cap attaching / detaching mechanism 123, and clean air 133 is circulated and filled in the transfer chamber 124. For example, when the transfer chamber 124 is filled with clean air 133 such as an inert gas, the oxygen concentration in the transfer chamber 124 becomes, for example, 20 ppm or less, and the oxygen concentration in the casing 111 that is in an atmospheric atmosphere. Is set to be much lower.

The pod 110 mounted on the mounting table 122 is pressed against the opening edge of the wafer loading / unloading port 120 provided on the front wall 119a of the sub housing 119 at the opening side end surface, and the cap of the pod 110 is capped. It is removed by the attaching / detaching mechanism 123 and the wafer loading / unloading opening is opened. After that, the wafer 200 is picked up from the pod 110 through the wafer loading / unloading port by the tweezer 125c of the wafer transfer device 125a and is positioned in the circumferential direction by the notch alignment device, and then located behind the transfer chamber 124. It is carried into the standby unit 126 and loaded (charged) into the boat 217. The wafer transfer device 125 a loaded with the wafer 200 in the boat 217 returns to the pod 110 and loads the next wafer 200 into the boat 217.

  While the wafers 200 are loaded from one (upper or lower) pod opener 121 to the boat 217 by the wafer transfer mechanism 125, the other (lower or upper) pod opener 121 is placed on the mounting table 122. The pod 110 is transferred from the rotary pod shelf 105 by the pod transfer device 118 and transferred, and the pod opener 121 opens the pod 110 simultaneously with the loading operation of the wafer 200.

  When a predetermined number of wafers 200 are loaded into the boat 217, the lower end of the processing furnace 202 closed by the furnace port shutter 147 is opened. Subsequently, the boat 217 holding the group of wafers 200 is loaded into the processing furnace 202 (boat loading) when the seal cap 219 is lifted by the boat elevator 115.

  After loading, arbitrary processing is performed on the wafer 200 in the processing furnace 202. After the processing, the boat 217 storing the processed wafers 200 is unloaded from the processing furnace 202 by a procedure almost opposite to the above-described procedure except for the wafer alignment by the notch aligning device. The stored pod 110 is carried out of the casing 111.

(3) Configuration of Processing Furnace Next, the configuration of the processing furnace 202 according to the present embodiment will be described with reference to FIG. FIG. 9 is a longitudinal sectional view of the processing furnace 202 of the substrate processing apparatus 100 according to the present embodiment.

As shown in FIG. 9, the processing furnace 202 includes a process tube 203 as a reaction tube. The process tube 203 includes an inner tube 204 as an internal reaction tube and an outer tube 205 as an external reaction tube provided on the outside thereof. The inner tube 204 is made of a heat-resistant material such as quartz (SiO ₂ ) or silicon carbide (SiC), and is formed in a cylindrical shape having upper and lower ends opened. A processing chamber 201 for processing a wafer 200 as a substrate is formed in a hollow cylindrical portion in the inner tube 204. The processing chamber 201 is configured to accommodate a boat 217 described later. The outer tube 205 is provided concentrically with the inner tube 204. The outer tube 205 has an inner diameter larger than the outer diameter of the inner tube 204, is formed in a cylindrical shape with the upper end closed and the lower end opened. The outer tube 205 is made of a heat resistant material such as quartz or silicon carbide.

  A heater 206 as a heating mechanism is provided outside the process tube 203 so as to surround the side wall surface of the process tube 203. The heater 206 has a cylindrical shape and is vertically installed by being supported by a heater base 251 as a holding plate.

  A temperature sensor 263 is installed in the process tube 203 as a temperature detector. A temperature controller 237 is electrically connected to the heater 206 and the temperature sensor 263. Based on the temperature information detected by the temperature sensor 263, the temperature control unit 237 adjusts the power supply to the heater 206 so that the temperature in the processing chamber 201 becomes a desired temperature distribution at a desired timing. It is configured.

  A manifold 209 is provided below the outer tube 205 so as to be concentric with the outer tube 205. The manifold 209 is made of, for example, stainless steel and is formed in a cylindrical shape with an upper end and a lower end opened. The manifold 209 is engaged with the lower end portion of the inner tube 204 and the lower end portion of the outer tube 205, and is provided so as to support them. An O-ring 220a as a seal member is provided between the manifold 209 and the outer tube 205. By supporting the manifold 209 on the heater base 251, the process tube 203 is installed vertically. A reaction vessel is formed by the process tube 203 and the manifold 209.

  Below the manifold 209, a seal cap 219 is provided as a furnace port lid that can airtightly close the lower end opening of the manifold 209. The seal cap 219 is brought into contact with the lower end of the manifold 209 from the lower side in the vertical direction. The seal cap 219 is made of a metal such as stainless steel and has a disk shape. On the upper surface of the seal cap 219, an O-ring 220b is provided as a seal member that comes into contact with the lower end of the manifold 209. The seal cap 219 is configured to be lifted and lowered in the vertical direction by a boat elevator 115 as a substrate holder lifting mechanism vertically installed outside the process tube 203. By moving the seal cap 219 up and down, the boat 217 can be transferred into and out of the processing chamber 201.

  A rotation mechanism 254 for rotating the boat 217 is installed near the center of the seal cap 219 and on the side opposite to the processing chamber 201. The rotation shaft 255 of the rotation mechanism 254 passes through the seal cap 219 and supports the boat 217 from below. The rotation mechanism 254 is configured to rotate the wafer 200 by rotating the boat 217.

  A conveyance control unit 238 is electrically connected to the boat elevator 115 and the rotation mechanism 254. The conveyance control unit 238 is configured to control the rotation mechanism 254 and the boat elevator 115 so as to perform a desired operation at a desired timing. The transfer control unit 238 is also electrically connected to the pod elevator 118a, the pod transfer mechanism 118b, the pod opener 121, the wafer transfer device 125a, the wafer transfer device elevator 125b, and the like. These are controlled so as to perform a desired operation. The boat elevator 115, the rotation mechanism 254, the pod elevator 118a, the pod transfer mechanism 118b, the pod opener 121, the wafer transfer device 125a, and the wafer transfer device elevator 125b mainly constitute a transfer system according to this embodiment.

  A boat 217 as a substrate holder is configured to hold a plurality of wafers 200 in a multi-stage by aligning the wafers 200 in a horizontal posture with their centers aligned. The boat 217 is made of a heat resistant material such as quartz or silicon carbide. In the lower part of the boat 217, a plurality of heat insulating plates 216 as a disk-shaped heat insulating member made of a heat resistant material such as quartz or silicon carbide are arranged in multiple stages in a horizontal posture. It is configured to be difficult to be transmitted to the manifold 209 side.

A nozzle 230 as a gas introduction unit is connected to the seal cap 219 so as to communicate with the inside of the processing chamber 201. The downstream end of the gas supply pipe 232 is connected to the upstream end of the nozzle 230. Connected to the gas supply pipe 232 are one or more gas supply sources such as processing gas and inert gas (not shown), an MFC (mass flow controller) 241 as a gas flow controller, and a plurality of valves (not shown) in order from the upstream side. Has been. A gas flow rate control unit 235 is electrically connected to the MFC 241. The gas flow rate control unit 235 is configured to control the MFC 241 so that the flow rate of the gas supplied into the processing chamber 201 becomes a desired flow rate at a desired timing. The gas supply system according to this embodiment is mainly configured by the nozzle 230, the gas supply pipe 232, a plurality of valves (not shown), the MFC 241, and the gas supply source.

  An upstream end of an exhaust pipe 231 that exhausts the atmosphere in the processing chamber 201 is connected to the manifold 209. The exhaust pipe 231 is disposed at the lower end portion of the cylindrical space 250 formed by the gap between the inner tube 204 and the outer tube 205 and communicates with the cylindrical space 250. On the downstream side of the exhaust pipe 231, a pressure sensor 245 as a pressure detector, an APC (Auto Pressure Controller) 242 as a pressure adjusting device, and a vacuum pump 246 as a vacuum exhaust device are sequentially connected from the upstream side. The APC 242 is an on-off valve that can open and close the valve to stop evacuation and evacuation in the processing chamber 201, and further adjust the valve opening to adjust the pressure. A pressure controller 236 is electrically connected to the APC 242 and the pressure sensor 245. The pressure control unit 236 is configured to control the APC 242 based on the pressure value detected by the pressure sensor 245 so that the pressure in the processing chamber 201 becomes a desired pressure at a desired timing. The gas exhaust system according to the present embodiment is mainly configured by the exhaust pipe 231, the pressure sensor 245, the APC 242, and the vacuum pump 246.

  The gas flow rate control unit 235, the pressure control unit 236, the temperature control unit 237, and the transfer control unit 238 are electrically connected to a display device control unit 239 that controls the entire substrate processing apparatus 100 (hereinafter referred to as a gas flow rate control unit). 235, the pressure control unit 236, and the temperature control unit 237 are also called I / O control units). The gas flow rate control unit 235, the pressure control unit 236, the temperature control unit 237, the transfer control unit 238, and the display device control unit 239 form a part of the configuration of the substrate processing apparatus controller 240. The configuration and operation of the substrate processing apparatus controller 240 will be described later.

(4) Operation of Processing Furnace Next, a substrate processing process using the processing furnace 202 according to the above configuration, which is performed as one process of the semiconductor device manufacturing process, will be described. Such a substrate processing step is repeatedly executed based on a process recipe for performing a predetermined process on the wafer 200. In addition, a process recipe may include a plurality of steps. In the present embodiment, as an example of a substrate processing process based on a process recipe including a plurality of steps, a CVD (Chemical Vapor) is used.
A film forming process for forming a thin film on the wafer 200 by the Deposition method will be described. In the following description, the operation of each part constituting the substrate processing apparatus 100 is controlled by the substrate processing apparatus controller 240.

(Board loading step)
First, a substrate carry-in step is performed. That is, a plurality of wafers 200 are loaded into the boat 217 (wafer charge), and the boat 217 holding the plurality of wafers 200 is lifted by the boat elevator 115 and loaded into the processing chamber 201 (boat loading). In this state, the seal cap 219 seals the lower end of the manifold 209 via the O-ring 220b.

(Film formation process (process recipe execution period) S21 to S25)
Subsequently, the steps from S21 to S25 in FIGS. 3 and 4 are performed, and the film formation process is performed on the wafer 200. Each step from S21 to S25 is a process recipe in the present embodiment. The process recipe may include the above-described substrate carry-in step and a substrate carry-out step described later.

(Decompression step S21)
First, the processing chamber 201 is evacuated by the vacuum pump 246 so that the processing chamber 201 has a desired pressure (degree of vacuum). At this time, the valve opening degree of the APC 242 is feedback-controlled based on the pressure value measured by the pressure sensor 245.

(Temperature raising step S22)
Next, the inside of the processing chamber 201 is heated by the heater 206 so that the inside of the processing chamber 201 has a desired temperature. At this time, the energization amount to the heater 206 is feedback controlled based on the temperature value detected by the temperature sensor 263. Subsequently, the boat 217 and the wafers 200 are rotated by the rotation mechanism 254.

(Film formation step S23)
When the temperature in the processing chamber 201 is stabilized, a valve (not shown) provided in the gas supply pipe 232 is opened, and the processing gas is supplied from the gas supply source into the processing chamber 201 while controlling the flow rate by the MFC 241. The processing gas rises in the processing chamber 201, flows out from the upper end opening of the inner tube 204 into the cylindrical space 250, and is exhausted from the exhaust pipe 231. The processing gas contacts the surface of the wafer 200 when passing through the processing chamber 201, and a thin film is deposited (deposited) on the surface of the wafer 200 by a thermal CVD reaction. When the preset processing time has elapsed, the supply of the processing gas into the processing chamber 201 is stopped.

(Cooling step S24)
When the supply of the processing gas is stopped, the power supply to the heater 206 is stopped, and the boat 217 and the wafer 200 are lowered to a predetermined temperature.

(Normal pressure recovery step S25)
An inert gas is supplied from a gas supply source, the inside of the processing chamber 201 is replaced with an inert gas, and the pressure in the processing chamber 201 is returned to normal pressure. Thus, the film forming process based on the process recipe is completed.

(Substrate unloading step)
Thereafter, a substrate unloading step is performed. That is, the boat cap 115 lowers the seal cap 219 to open the lower end of the manifold 209 and unloads the boat 217 holding the processed wafer 200 from the lower end of the manifold 209 to the outside of the process tube 203 (boat unloading). ) The processed wafer 200 is taken out from the boat 217 and stored in the pod 110 (wafer discharge). Thus, the film forming process based on the process recipe is completed.

(5) Configuration of Substrate Processing Apparatus Controller Next, the configuration of the substrate processing apparatus controller 240 according to the present embodiment will be described with reference to FIG. FIG. 1 is a block configuration diagram of a substrate processing system including a substrate processing apparatus 100 and a group management apparatus 500 according to this embodiment.

  The substrate processing apparatus controller 240 includes a display device control unit (operation unit) 239 as a main control unit. The display device controller 239 is connected to a data display unit 240a such as a display and an input unit 240b such as a keyboard. The display device control unit 239 receives an input (operation command input, etc.) from the input unit 240b by the operator, and displays a status display screen, an operation input reception screen, etc. of the substrate processing apparatus 100 on the data display unit 240a. It is configured.

The substrate processing apparatus controller 240 controls the processing control unit 239a connected to the display control unit 239 so as to exchange data, and the processing furnace 202 connected to the processing control unit 239a so as to exchange data. And the above-described I / O control unit (gas flow rate control unit 235, pressure control unit 236, temperature control unit 237). The process control unit 239a controls the operation of the process furnace 202 via the I / O control unit and collects (reads out) monitor data indicating the state (temperature, gas flow rate, pressure, etc.) of the process furnace 202. It is configured.

  The substrate processing apparatus controller 240 includes a transport control unit 238 connected to the display device control unit 239 so as to exchange data, and a mechanical mechanism I / O 238a connected to the transport control unit 238 so as to exchange data. And. The mechanical mechanism I / O 238a includes components (for example, a boat elevator 115, a rotation mechanism 254, a pod elevator 118a, a pod transfer mechanism 118b, a pod opener 121, a wafer transfer device 125a, and a wafer transfer device elevator). 125b etc.) are connected. The transport control unit 238 controls the operation of each unit constituting the substrate processing apparatus 100 via the mechanical mechanism I / O 238a and also the state (for example, position, open / closed state, and operation) of each unit constituting the substrate processing apparatus 100. Monitor data indicating whether the data is in a wait state or the like) is collected (read out).

  In addition, the substrate processing apparatus controller 240 includes a data holding unit 239 e connected to the display device control unit 239. The data holding unit 239e includes a program for realizing various functions in the substrate processing apparatus controller 240, substrate processing process setting data (recipe data) executed in the processing furnace 202, and an I / O control unit (gas The flow rate control unit 235, the pressure control unit 236, the temperature control unit 237) and various data read from the transfer control unit 238 are held (stored).

  In addition, the substrate processing apparatus controller 240 includes a communication control unit 239 b connected to the display device control unit 239. The communication control unit 239b is a monitor showing the state (temperature, gas flow rate, pressure, etc.) of the processing furnace 202 read out via the I / O control unit (gas flow rate control unit 235, pressure control unit 236, temperature control unit 237). Data is configured to be received via the processing control unit 239a and the display device control unit 239 and transmitted to the group management device 500. The communication control unit 239b also displays monitor data indicating the state (position, open / closed state, operating / waiting state, etc.) of each part of the substrate processing apparatus 100 read out via the mechanical mechanism I / O 238a. Is received via the transport control unit 238 and the display device control unit 239, and can be transmitted to the group management device 500.

(6) Configuration of Group Management Apparatus Next, the configuration of the group management apparatus 500 according to the present embodiment configured to exchange data with the substrate processing apparatus 100 described above will be described mainly with reference to FIG. .

  As shown in FIG. 1, the group management device 500 is a control unit 501 configured as a central processing unit (CPU), a memory (not shown) having a shared memory 502 area therein, and a storage device such as an HDD. The storage unit 503 is configured, a data display unit 505 as a display unit such as a display device, an input unit 506 such as a keyboard, and a communication control unit 504 as a communication unit. The above-described memory, storage unit 503, data display unit 505, input unit 506, and communication control unit 504 are configured to exchange data with the control unit 501 via an internal bus or the like. The control unit 501 has a clock function (not shown).

The group management apparatus 500 according to the present embodiment uses representative values such as a maximum value, a minimum value, and an average value in order to facilitate handling of an enormous amount of monitor data received by the communication control unit 504 from the substrate processing apparatus 100. In addition, it is configured to process and reference data. That is, the monitor data is read according to a predetermined data extraction condition 503p, and representative value data is generated based on the read monitor data. The generated representative value data is processed into a predetermined graph and displayed on the data display unit 505.

  In particular, in the group management apparatus 500 according to the present embodiment, the difference in the representative value data that does not depend on the actual apparatus state or processing state is reduced, and the state comparison of the substrate or batch between the same recipes can be performed more easily. be able to.

(Communication control unit)
The communication control unit 504 serving as a communication unit is connected to the communication control unit 239b of the substrate processing apparatus controller 240 via the network 400, and also includes an I / O control unit (a gas flow rate control unit 235, a pressure control unit 236, Temperature controller 237) and mechanical mechanism I / O 238a. The communication control unit 504 is configured to receive monitor data from the substrate processing apparatus 100 and pass it to the shared memory 502.

  The communication control unit 504 receives the monitor data periodically at a predetermined interval (for example, every 0.1 second), or when each event occurs, for example, at the timing when the recipe or step ends. Or is received each time monitor data is generated.

  Further, as will be described later, the communication control unit 504 receives a predetermined event defined by the data extraction condition 503p stored in the storage unit 503 so as to be readable, from the substrate processing apparatus 100, and will be described later. An “event detection notification” is transmitted to 511. Note that communication between the communication control unit 504 and the representative value data generation unit 511 is performed via the shared memory 502, for example. That is, communication is performed by the representative value data generation unit 511 reading the “event detection notification” written in the shared memory 502 by the communication control unit 504 at a predetermined timing.

  The monitor data passed to the shared memory 502 includes a data ID for specifying the monitor data, device specifying information (device name, etc.) for specifying the substrate processing apparatus 100 that is the source of the monitor data, and a substrate when the monitor data is generated. Recipe specifying information for specifying a recipe executed by the processing apparatus 100, event specifying information for specifying an event occurring in the substrate processing apparatus 100 when the monitor data is collected, and time information (time) indicating the generation time of the monitor data And (data).

(Memory part)
The storage unit 503 stores a representative value data generation program, a representative value data processing program, and a database program. The representative value data generation program is read from the storage unit 503 to the above-described memory (not shown) and executed by the control unit 501, thereby realizing a representative value data generation unit 511 described later in the group management apparatus 500. It is configured as follows. The representative value data processing program is read from the storage unit 503 to the above-described memory (not shown) and executed by the control unit 501, thereby realizing a representative value data processing unit 512 described later in the group management apparatus 500. It is configured as follows. The database program is configured to realize a database 503d described later in the storage unit 503 by being read from the storage unit 503 to the above-described memory (not shown) and executed by the control unit 501. The storage unit 503 stores a data extraction condition 503p, which will be described later, in a readable manner.

The database 503d as a storage unit associates monitor data received by the communication control unit 504 and stored in the shared memory 502 with the above-described data ID, device identification information, recipe identification information, event identification information, and time data, respectively. It is configured to store in a readable manner. The database 503d is configured to store representative value data generated by a representative value data generation unit 511, which will be described later, in a readable manner.

  The data extraction condition 503p defines a condition for a section in which monitor data that is the basis of representative value data is extracted. As a section for extracting monitor data, for example, there is a section associated with the occurrence of a predetermined event in the substrate processing apparatus 100. Here, the event refers to an event that occurs in the substrate processing apparatus 100, an operation of each part of the substrate processing apparatus 100, and the like. Also included are events that occur in chronological order due to recipe execution, such as on / off, error occurrence, various operations by an operator, and events that do not necessarily depend on recipe execution.

  An example of an extraction condition in which the monitor data extraction interval is associated with the occurrence of a predetermined event may be a condition for extracting monitor data generated during a period between predetermined events. The period between the predetermined events is, for example, a period from the start to the end of execution of a predetermined recipe or step, a period from the start of loading of the wafer 200 to the end of unloading, that is, the wafer to the boat 217 in the substrate loading step described above. There is a period from the start of loading 200 to the end of removal of the wafer 200 from the boat 217 in the substrate unloading step. In addition to this, a certain period of time is extracted from the occurrence of a predetermined event (for example, 10 seconds are extracted from the opening of the valve), or it is periodically extracted from the occurrence of a predetermined event (for example, the heater 206 The extraction condition is set so that the data is extracted every 10 minutes from the start of energization), during a period from when a predetermined event occurs until a predetermined number of monitor data is obtained, or during a period until the monitor data reaches a predetermined value. be able to. Moreover, you may combine multiple setting of the area quoted above.

  As the data extraction condition 503p, for example, a data collection plan (DCP: Data Collection Plan) based on the SEMI standard can be used. This facilitates collective setting and centralized management of monitor data collection and extraction, and makes it easier to set monitor data extraction associated with the occurrence of a predetermined event.

  The data extraction condition 503p is read into a memory area managed by the representative value data generation program when the representative value data generation program is started, and can be referred to by the representative value data generation unit 511 at any time. Yes.

(Representative value data generator)
When the representative value data generation unit 511 receives the “event detection notification” from the communication control unit 504, the representative value data generation unit 511 refers to the data extraction condition 503p in which the monitor data extraction condition is defined in advance, and the monitor data stored in the database 503d. Among them, monitor data that conforms to the data extraction condition 503p is read from the database 503d, representative value data is generated based on the read monitor data, and is read into the database 503a realized in the storage unit 503 together with time data described later. It is configured to store as possible. The representative value data includes, for example, “representative value name” information indicating the name of the representative value, “representative value calculation condition” information indicating the calculation condition of the representative value such as average / maximum / minimum, and the section in which the representative value is extracted. “Representative value extraction section” information, “Representative value extraction date / time” information indicating the start date / time and end date / time of the representative value extraction section, “Representative value” information indicating the representative value itself, “ Representative value generation date / time information, “representative value calculation time” information indicating the time required for representative value calculation, “data score” information indicating the number of data points used in the representative value calculation, and the like are included.

FIG. 2 shows a specific method for generating representative value data by the representative value data generating unit 511. 2A is a time series graph illustrating temperature monitor data, and FIG. 2B is a table illustrating representative value data. More specifically, the time series graph of FIG. 2A is an example of temperature monitor data obtained by performing a film forming process based on a process recipe including the steps from S21 to S25 described above. For convenience of explanation, the monitor data is shown as a graph. The horizontal axis of FIG. 2A is time, and the vertical axis is the temperature (° C.) in the processing chamber 201. The representative value data generation unit 511 reads monitor data from the database 503d according to the monitor data extraction condition defined by the data extraction condition 503p, for example, for each period from the start to the end of each step from S21 to S25. It is configured as follows. In addition, the representative value data generation unit 511 retrieves or calculates a start value, an end value, a maximum value, a minimum value, an average value, and the like for each monitor data read for each execution period of each step, and thereby displays representative value data. Is configured to generate Time data indicating the generation time of the base monitor data is added to the generated representative value data, and for example, a representative value data table as illustrated in FIG. 2B is created and stored in the database 503d. It is configured to be stored so as to be readable.

  In this way, monitor data is extracted in association with the occurrence of a predetermined event while referring to the data extraction condition 503p. Therefore, for example, monitor data based on the same recipe is extracted from approximately the same section each time. It will be. Therefore, if the processing results are the same, the monitor data extracted is substantially equivalent, and the representative value data generated therefrom is also substantially equivalent. In other words, a difference that does not depend on the actual apparatus state, processing state, or the like due to a difference in extraction interval or the like hardly occurs in the representative value data.

  In addition, since the representative value data includes the opening price, the closing price, the maximum value, the minimum value, the average value, and the like, more information can be obtained from the representative value data, and the processing state of the wafer 200 and the batch can be obtained. In addition, it becomes easier to compare the device status and the like.

  The representative value data generation unit 511 is configured to transmit a “representative value data generation notification” to the representative value data processing unit 512 when the storage of the representative value data and the time data in the database 503d is completed. Note that the communication between the representative value data generation unit 511 and the representative value data processing unit 512 is performed via the shared memory 502, for example. That is, the “representative value data generation notification” written in the shared memory 502 by the representative value data generation unit 511 is read by the representative value data processing unit 512 at a predetermined timing.

(Representative value data processing section)
The representative value data processing unit 512 reads the representative value data notified by the “representative value data generation notification” and the time data added to the representative value data from the database 503d, processes them so that they can be displayed, and displays the data. The unit 505 is configured to be displayed. Specifically, the opening price, the closing price, the maximum value, and the minimum value included in the representative value data are each processed into a candlestick chart or a bar chart visually associated with the time data, and displayed on the data display unit 505. It is configured.

  FIG. 3 shows a specific example of a candlestick chart obtained by processing the representative value data by the representative value data processing unit 512. FIG. 3 is a candlestick chart processed from the representative value data illustrated in FIG. The horizontal axis in FIG. 3 is time, and the vertical axis is the temperature (° C.) in the processing chamber 201. The bottom side or the top side of the candle portion (substance) of each candle bar indicates the opening price or the closing price of the monitor data that is the basis. When the candle portion is white, the bottom indicates the opening price and the top indicates the closing price, indicating that the temperature has increased. In the case of black painting, the bottom side is the closing price and the top side is the opening price, indicating that the temperature has dropped. The positions of the left and right sides of the candle portion of the paper indicate the time when the monitor data start and end prices occurred, and the candle portion width is the length of the period during which the monitor data was extracted (here Corresponds to the length of the execution period of each step. In addition, the maximum value in each period is represented by an upper whiskers protruding from the upper side of the candle portion, and the position of the upper whiskers corresponds to the time when the maximum value occurs. The minimum value is indicated by a lower shadow at the position of the occurrence time.

  Further, instead of the above candle chart, as shown in FIG. 4B, a bar chart that connects the maximum value and the minimum value with a line segment and has bars indicating the opening price and the closing price on the left and right of the line segment, respectively. It can also be. In the bar chart according to the present embodiment, the position and the overall width of each end portion of the opening price bar and the closing price bar are made to correspond to the position of the time at which the monitor data is extracted and the length of the period, respectively. Further, as shown in FIGS. 4C and 4D, a bar chart in which the display positions of the maximum value and the minimum value correspond to the positions of the times at which they occur and are connected by bent line segments between them may be used. . Alternatively, as shown in FIG. 4E, the maximum value and the minimum value may be connected by a rectangle.

  In this way, as in this embodiment described above, more information can be visualized by displaying a candlestick chart or a bar chart including the opening price, closing price, maximum value, minimum value, time data, etc. Therefore, it is possible to more easily grasp the processing state and apparatus state of the wafers 200 and batches.

  The representative value data processing unit 512 receives the “representative value data generation notification” from the representative value data generation unit 511 as the processing / display timing of the representative value data, or “representative data” by the operator from the input unit 506. The representative value data may be processed and displayed at the timing when the “value data display request” is received. Further, when the latest representative value data notified by the “representative value data generation notification” is read, other representative value data in the past in the same recipe or step may be read. Each of the past representative value data read out is processed in the same manner as described above to create a chart, and the same is obtained by arranging a plurality of data on the data display unit 505 together with the chart based on the latest representative value data, or displaying them in a superimposed manner. Thus, wafer 200 comparison and batch comparison between recipes and steps are further facilitated.

  In addition, the representative value data processing unit 512 may be configured to add the created chart to the representative value data and store it in the database 503d. With this configuration, it is not necessary to repeatedly process past representative value data, and the efficiency of data re-reading / re-displaying can be improved.

  FIG. 5 illustrates a case where a plurality of candlestick charts are displayed side by side on the data display unit 505. The horizontal axis of FIG. 5 is time, and a specific time in a period of several days is shown. The vertical axis in FIG. 5 is the temperature (° C.) in the processing chamber 201. The plurality of candlestick charts are each processed from a plurality of representative value data for several days in the same recipe, specifically, the process recipe including S21 to S25 described above. It becomes. In the example of FIG. 5, points different from other charts are recognized in some charts, which suggests that some abnormality may have occurred in the processing state of the substrate processing apparatus 100 and the wafer 200. For example, in the region indicated by the symbol M1, the maximum value of the temperature in the temperature raising step S22 increases, and it is suspected that the degree of overshoot that settles to a predetermined value after the temperature has once exceeded is large. Further, in the area of reference M2, there is a space in the recipe execution interval. In the area of M3, the recipe starts from a low temperature, and it can be read that there was a temperature drop when the apparatus was on standby. In the region indicated by the symbol M4, the heating step S22 takes a long time.

  As described above, by arranging a plurality of candlestick charts or the like so as to be displayed side by side, it becomes easier to compare the state of wafers 200 and batches between the same recipe and step, and can be made daily, monthly or yearly. It becomes easier to grasp the data transition over a long period of time.

(7) Operation of Group Management Device Next, the operation of the group management device 500 according to the present embodiment will be described with reference to FIG. FIG. 6 is a schematic view illustrating the internal operation of the group management apparatus 500 according to this embodiment. Such an operation is performed as one step of the manufacturing process of the semiconductor device.

  The representative value data generation program, the representative value data processing program, and the database program are read from the storage unit 503 to the above-described memory (not shown) and executed by the control unit 501, whereby the representative value data generation unit 511, The representative value data processing unit 512 and the database 503d are activated. In addition, the monitor data extraction condition defined in the data extraction condition 503p is read into the memory area managed by the representative value data generation program.

  The communication control unit 504 of the group management apparatus 500 receives the monitor data from the substrate processing apparatus 100 and stores it in the shared memory 502. Next, the database 503d implemented in the storage unit 503 stores the monitor data stored in the shared memory 502 in a readable manner. When the communication control unit 504 receives a predetermined event defined by the data extraction condition 503p, for example, a predetermined recipe or the completion of execution of a step from the substrate processing apparatus 100, the communication control unit 504 notifies the representative value data generation unit 511 of “event Send detection notification.

  When the representative value data generation unit 511 receives the “event detection notification” from the communication control unit 504, the representative value data generation unit 511 refers to the data extraction condition 503p read from the storage unit 503 in advance, and extracts data from the stored monitor data. Monitor data matching the condition 503p is read from the database 503d. Further, the representative value data generation unit 511 generates representative value data based on the read monitor data, and combines the generated representative value data and time data related thereto with the database realized in the storage unit 503. The data is stored in a readable manner in 503d. When the data is stored in the database 503d, the representative value data generation unit 511 transmits a “representative value data generation notification” to the representative value data processing unit 512.

  The representative value data processing unit 512 reads the representative value data and time data stored by the representative value data generation unit 511 from the database 503d and processes them so that they can be displayed. That is, the representative value data is processed into a candlestick chart or a bar chart representing the opening price, the closing price, the maximum value, the minimum value, the time data, and the like, and the processed chart is displayed on the data display unit 505 of the group management device 500. .

(8) Effects according to the present embodiment According to the present embodiment, the following one or more effects are achieved.

(A) According to the present embodiment, the representative value data generation unit 511 is configured to read monitor data that conforms to the data extraction condition 503p from the database 503d and generate representative value data. In the data extraction condition 503p, an extraction condition is defined in advance so as to extract monitor data in a section associated with the occurrence of a predetermined event. Accordingly, for example, if the result is equivalent based on the same recipe, substantially equivalent monitor data is extracted from within the substantially same section each time. Therefore, also for the generated representative value data, it is possible to reduce a difference that does not depend on an actual apparatus state, a processing state, or the like, which is caused by a difference in extraction interval or the like. Therefore, it becomes easier to compare the states of the wafers 200 and batches between the same recipes and the same steps, and the burden of monitoring work can be reduced and the efficiency can be improved. Further, since it becomes easy to notice a minute change in the apparatus state that can be a sign of apparatus abnormality, it becomes easy to avoid apparatus troubles and substrate processing defects.

(B) Moreover, according to this embodiment, it is comprised so that monitor data may be extracted for every execution period of a predetermined recipe or step. Thereby, when the apparatus is abnormal, it is possible to specify from which recipe or step the representative value data indicating the abnormal value is generated, and it is possible to easily specify the recipe or step in which the abnormality has occurred. Therefore, the apparatus abnormality can be dealt with more efficiently and quickly, and the failure time of the apparatus can be reduced.

(C) Further, according to the present embodiment, the representative value data generation unit 511 is configured to generate representative value data including a start price, an end price, a maximum value, a minimum value, and the like. As a result, more information can be obtained from the representative value data, and it becomes easier to grasp the processing state, apparatus state, etc. of the wafer 200 and batch.

(D) According to the present embodiment, the representative value data processing unit 512 is configured to process the representative value data into a candlestick chart or a bar chart and display the processed data on the data display unit 505. As a result, it becomes easier to visually grasp more data, and it becomes easier to grasp the processing state and apparatus state of the wafer 200 and batch.

(E) Further, according to the present embodiment, the end values, the maximum value, and the minimum value display position of the above chart represent time data. This makes it possible to grasp the data transition within a predetermined period.

(F) Further, according to the present embodiment, the data display unit 505 is configured to be able to display a plurality of candlestick charts and bar charts arranged side by side or superimposed. This makes it easier to compare the state of the wafers 200 and batches between the same recipe and between the same steps, and makes it easier to grasp the long-term data transition.

<Second Embodiment of the Present Invention>
Subsequently, a second embodiment of the present invention will be described.

  The substrate processing apparatus according to the present embodiment has a substrate processing apparatus controller having the same configuration as the substrate processing apparatus controller 240 according to the above-described embodiment shown in FIG. The substrate processing apparatus controller according to the present embodiment is configured to have the functions of the representative value data generation unit 511, the representative value data processing unit 512, and the database 503d according to the first embodiment. Further, the substrate processing apparatus controller according to the present embodiment has a condition corresponding to the data extraction condition 503p in the first embodiment, and is configured to extract monitor data while referring to these conditions.

  In addition, the data display unit included in the substrate processing apparatus controller according to the present embodiment is configured to display various charts obtained by processing the representative value data.

  In the present embodiment, the substrate processing apparatus controller according to the present embodiment provides the same effects as those of the group management apparatus 500 described above.

<Other Embodiments of the Present Invention>
The present invention is not limited to the case where the substrate processing apparatus 100 and the group management apparatus 500 are arranged on the same floor (in the same clean room). For example, the substrate processing apparatus 100 is arranged in a clean room, and the group management apparatus 500 is arranged in an office (a floor different from the clean room) so that the progress of the recipe and the state of the substrate processing apparatus 100 can be monitored remotely. May be. Or you may arrange | position some structures with which the group management apparatus 500 is provided, for example, only the data display part 505 and the input part 506 in an office.

The present invention includes a CVD (Chemical Vapor Deposition) method, an ALD (Atomic Layer Deposition) method, and a PVD (Physical).
It can be applied to film forming processes for forming various films such as oxide film, nitride film, metal film, etc. by Vapor Deposition), and other substrate processing such as diffusion processing, annealing processing, oxidation processing, nitriding processing, lithography processing, etc. It can also be applied to. Further, the present invention can be applied not only during the substrate processing but also when cleaning or conditioning in the processing furnace 202 is performed. Alternatively, the present invention can be applied to monitoring a predetermined state of the apparatus. Further, the present invention can be applied to other substrate processing apparatuses such as an annealing processing apparatus, an oxidation processing apparatus, a nitriding processing apparatus, an exposure apparatus, a coating apparatus, a drying apparatus, and a heating apparatus in addition to a thin film forming apparatus.

  The present invention can be applied not only to a semiconductor manufacturing apparatus that processes a semiconductor wafer such as the substrate processing apparatus according to the present embodiment, but also to a substrate processing apparatus such as an LCD (Liquid Crystal Display) manufacturing apparatus that processes a glass substrate. .

  As mentioned above, although embodiment of this invention was described concretely, this invention is not limited to the above-mentioned embodiment, It can change variously in the range which does not deviate from the summary.

<Preferred embodiment of the present invention>
Hereinafter, desirable aspects of the present invention will be additionally described.

One embodiment of the present invention provides:
A substrate processing system including a substrate processing apparatus that executes a recipe while generating a plurality of events, and a group management apparatus connected to the substrate processing apparatus,
The group management device includes:
A communication unit that receives monitor data indicating the progress of the recipe or the operating state of the substrate processing apparatus from the substrate processing apparatus;
A storage unit readable for storing the monitor data received by the communication unit;
When a predetermined event is detected, the monitor data that matches the data extraction condition among the monitor data stored in the storage unit while referring to a data extraction condition that defines a section for extracting the monitor data Representative value is generated from the storage unit, representative value data is generated based on the read monitor data, and the generated representative value data and time data related to the representative value data are stored in the storage unit together A data generator,
A substrate processing system comprising: a representative value data processing unit that processes the representative value data stored in the storage unit and displays the data on a display unit.

Preferably,
The representative value data includes at least one of a start value, an end value, a maximum value, a minimum value, and an average value in the section of the monitor data.

Preferably,
The representative value data processing unit processes the representative value data into at least one of a candlestick chart and a bar chart and displays the processed data on the display unit.

More preferably,
The candlestick chart has a beard representing a maximum value and a minimum value.

Preferably,
The display unit is configured to display a plurality of at least one of a candlestick chart and a bar chart.

Preferably,
A period between predetermined events is defined in the section in which the monitor data is extracted.

Preferably,
The section for extracting the monitor data includes a period from the start of execution of a predetermined recipe to the end of execution, a period from the start of execution of a predetermined step included in the predetermined recipe to the end of execution, and from the start of carrying in the substrate. At least one of the period until the end of unloading is specified.

Another aspect of the present invention is:
A group management apparatus connected to a substrate processing apparatus that executes a recipe while generating a plurality of events,
A communication unit that receives monitor data indicating the progress of the recipe or the operating state of the substrate processing apparatus from the substrate processing apparatus;
A storage unit readable for storing the monitor data received by the communication unit;
When a predetermined event is detected, the monitor data that matches the data extraction condition among the monitor data stored in the storage unit is referred to while referring to a data extraction condition that defines a section for extracting the monitor data. Representative value data that is read from the storage unit, generates representative value data based on the read monitor data, and stores the generated representative value data and time data related to the representative value data together in the storage unit A generator,
A group management apparatus comprising: a representative value data processing unit that processes the representative value data stored in the storage unit and displays the processed data on a display unit.

Still another aspect of the present invention provides:
A substrate processing apparatus that executes a recipe while generating a plurality of events,
A storage unit for readable storage of monitor data indicating the progress of the recipe or the operating state of the substrate processing apparatus;
When a predetermined event is detected, the monitor data that matches the data extraction condition among the monitor data stored in the storage unit is referred to while referring to a data extraction condition that defines a section for extracting the monitor data. Representative value data that is read from the storage unit, generates representative value data based on the read monitor data, and stores the generated representative value data and time data related to the representative value data together in the storage unit A generator,
A substrate processing apparatus comprising: a representative value data processing unit that processes the representative value data stored in the storage unit and displays the data on a display unit.

100 substrate processing device 500 group management device 503d database (storage unit)
503p Data extraction condition 504 Communication control unit (communication unit)
505 Data display part (display part)
511 Representative value data generation unit 512 Representative value data processing unit

Claims (1)

A substrate processing system including a substrate processing apparatus that executes a recipe while generating a plurality of events, and a group management apparatus connected to the substrate processing apparatus,
The group management device includes:
A communication unit that receives monitor data indicating the progress of the recipe or the operating state of the substrate processing apparatus from the substrate processing apparatus;
A storage unit readable for storing the monitor data received by the communication unit;
When a predetermined event is detected, the monitor data that matches the data extraction condition among the monitor data stored in the storage unit while referring to a data extraction condition that defines a section for extracting the monitor data Representative value is generated from the storage unit, representative value data is generated based on the read monitor data, and the generated representative value data and time data related to the representative value data are stored in the storage unit together A data generator,
A substrate processing system, comprising: a representative value data processing unit that processes the representative value data stored in the storage unit and displays the data on a display unit.

Images