JP6802689B2 - 析出硬化型銅合金及びその製造方法 - Google Patents
析出硬化型銅合金及びその製造方法 Download PDFInfo
- Publication number
- JP6802689B2 JP6802689B2 JP2016220996A JP2016220996A JP6802689B2 JP 6802689 B2 JP6802689 B2 JP 6802689B2 JP 2016220996 A JP2016220996 A JP 2016220996A JP 2016220996 A JP2016220996 A JP 2016220996A JP 6802689 B2 JP6802689 B2 JP 6802689B2
- Authority
- JP
- Japan
- Prior art keywords
- copper alloy
- heat treatment
- precipitation hardening
- alloy
- hardness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000881 Cu alloy Inorganic materials 0.000 title claims description 29
- 238000004881 precipitation hardening Methods 0.000 title claims description 17
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 238000010438 heat treatment Methods 0.000 claims description 35
- 230000032683 aging Effects 0.000 claims description 26
- 238000010791 quenching Methods 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 210000001787 dendrite Anatomy 0.000 claims description 13
- 230000000171 quenching effect Effects 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 11
- 229910052710 silicon Inorganic materials 0.000 claims description 11
- 229910052804 chromium Inorganic materials 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 6
- 239000002244 precipitate Substances 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 description 22
- 239000000956 alloy Substances 0.000 description 22
- 238000001816 cooling Methods 0.000 description 17
- 239000000243 solution Substances 0.000 description 14
- 229910052751 metal Inorganic materials 0.000 description 13
- 239000002184 metal Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 10
- UREBDLICKHMUKA-CXSFZGCWSA-N dexamethasone Chemical compound C1CC2=CC(=O)C=C[C@]2(C)[C@]2(F)[C@@H]1[C@@H]1C[C@@H](C)[C@@](C(=O)CO)(O)[C@@]1(C)C[C@@H]2O UREBDLICKHMUKA-CXSFZGCWSA-N 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 6
- 238000010583 slow cooling Methods 0.000 description 6
- 238000007711 solidification Methods 0.000 description 6
- 230000008023 solidification Effects 0.000 description 6
- 238000005266 casting Methods 0.000 description 5
- 229910052735 hafnium Inorganic materials 0.000 description 5
- 238000001556 precipitation Methods 0.000 description 5
- 229910052726 zirconium Inorganic materials 0.000 description 5
- 229910017813 Cu—Cr Inorganic materials 0.000 description 4
- 238000005275 alloying Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001112 coagulating effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007712 rapid solidification Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Description
ln(y)=−0.32×ln(x)+3.9 (式1)
つまり、測定したDASから式1により各試料の冷却速度も推定できる。
2 断熱材
3 溶湯
Claims (2)
- 質量%で、Niを6.5〜8.8%、Siを1.5〜2.5%、Crを0.3〜1.3%、Ni/Si比を3.3 〜4.8で残部をCu及び不可避的不純物とした成分組成を有する析出硬化型銅合金であって、
平均二次デンドライトアーム間隔を20μm以下のデンドライト晶に、Cu母相の<110>方向に伸長した析出物を分散させて200Hv以上の硬さとしたことを特徴とする析出硬化型銅合金。 - 質量%で、Niを6.5〜8.8%、Siを1.5〜2.5%、Crを0.3〜1.3%、Ni/Si比を3.3〜4.8で残部をCu及び不可避的不純物とした成分組成を有する析出硬化型銅合金の製造方法であって、
平均二次デンドライトアーム間隔を20μm以下となるように急冷凝固後、続いて、400〜500℃の温度範囲内の温度で保持する時効熱処理によって200Hv以上の硬さを与えることを特徴とする析出硬化型銅合金の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016220996A JP6802689B2 (ja) | 2016-11-11 | 2016-11-11 | 析出硬化型銅合金及びその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016220996A JP6802689B2 (ja) | 2016-11-11 | 2016-11-11 | 析出硬化型銅合金及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018076580A JP2018076580A (ja) | 2018-05-17 |
JP6802689B2 true JP6802689B2 (ja) | 2020-12-16 |
Family
ID=62148830
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016220996A Active JP6802689B2 (ja) | 2016-11-11 | 2016-11-11 | 析出硬化型銅合金及びその製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6802689B2 (ja) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DK186080A (da) * | 1979-04-30 | 1980-10-31 | Delta Enfield Metals | Udfaeldningshaerdelige kobberlegeringer |
US5028391A (en) * | 1989-04-28 | 1991-07-02 | Amoco Metal Manufacturing Inc. | Copper-nickel-silicon-chromium alloy |
JP2008223069A (ja) * | 2007-03-12 | 2008-09-25 | Miyoshi Gokin Kogyo Kk | 高強度高導電性銅合金及びその製造方法 |
JP2009235557A (ja) * | 2008-03-07 | 2009-10-15 | Miyoshi Gokin Kogyo Kk | 高強度高電導性銅合金及びその製造方法 |
-
2016
- 2016-11-11 JP JP2016220996A patent/JP6802689B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2018076580A (ja) | 2018-05-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5367999B2 (ja) | 電子材料用Cu−Ni−Si系合金 | |
JP4937815B2 (ja) | 電子材料用Cu−Ni−Si−Co系銅合金及びその製造方法 | |
KR101161597B1 (ko) | 전자 재료용 Cu-Ni-Si-Co계 구리합금 및 그 제조 방법 | |
KR101211984B1 (ko) | 전자 재료용 Cu-Ni-Si 계 합금 | |
JP3699701B2 (ja) | 易加工高力高導電性銅合金 | |
JP5320642B2 (ja) | 銅合金の製造方法及び銅合金 | |
KR101297485B1 (ko) | 전자 재료용 Cu-Ni-Si-Co-Cr계 합금 | |
JP5654571B2 (ja) | 電子材料用Cu−Ni−Si系合金 | |
JP5225787B2 (ja) | 電子材料用Cu−Ni−Si系合金板又は条 | |
JP2008081762A (ja) | 電子材料用Cu−Cr系銅合金 | |
JP5520533B2 (ja) | 銅合金材およびその製造方法 | |
JP2006265731A (ja) | 銅合金 | |
JP2010059543A (ja) | 銅合金材料 | |
JP2021523977A (ja) | 曲げ加工性に優れたCu−Co−Si−Fe−P系銅合金及びその製造方法 | |
CN111212923B (zh) | 铸造用模具材料及铜合金原材料 | |
JP2007107062A (ja) | 電子材料用Cu−Ni−Si系銅合金 | |
JP6821290B2 (ja) | 電子部品用Cu−Ni−Co−Si合金 | |
JP6730784B2 (ja) | 電子部品用Cu−Ni−Co−Si合金 | |
JP5952726B2 (ja) | 銅合金 | |
JP6802689B2 (ja) | 析出硬化型銅合金及びその製造方法 | |
JP6246174B2 (ja) | 電子部品用Cu−Co−Ni−Si合金 | |
JP6246173B2 (ja) | 電子部品用Cu−Co−Ni−Si合金 | |
JP2011190469A (ja) | 銅合金材、及びその製造方法 | |
JP4341453B2 (ja) | 熱伝導性に優れたアルミニウム合金鋳物及びその製造方法 | |
KR20170059435A (ko) | 주조용 몰드재 및 Cu-Cr-Zr 합금 소재 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190116 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20190919 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20191004 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20191114 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200526 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200713 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20201110 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20201127 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6802689 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |