JP6802249B2 - 回路基板支持構造、及びこれを備える光照射装置 - Google Patents
回路基板支持構造、及びこれを備える光照射装置 Download PDFInfo
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- 238000001816 cooling Methods 0.000 claims description 2
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- 239000002184 metal Substances 0.000 description 5
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- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
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- 238000005219 brazing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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- 230000007774 longterm Effects 0.000 description 1
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- 239000003507 refrigerant Substances 0.000 description 1
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- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
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- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
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- H—ELECTRICITY
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- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L33/00
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- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
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- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
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- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
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- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/064—Fluid cooling, e.g. by integral pipes
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- H05K2201/066—Heatsink mounted on the surface of the PCB
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/209—Auto-mechanical connection between a component and a PCB or between two PCBs
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- Condensed Matter Physics & Semiconductors (AREA)
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- Thermal Sciences (AREA)
- Inorganic Chemistry (AREA)
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- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Description
図1は、本発明の第1の実施形態に係る回路基板支持構造10を備える光照射装置1の概略構成を説明する図であり、図1(a)は正面図であり、図1(b)は図1(a)のA−A線における断面図であり、図1(c)は図1(a)のB−B線における断面図であり、図1(d)は図1(c)のC部拡大図である。
図3は、本発明の第2の実施形態に係る回路基板支持構造20を備える光照射装置2の概略構成を説明する図であり、図3(a)は正面図であり、図3(b)は図3(a)のD−D線における断面図であり、図3(c)は図3(a)のE−E線における断面図であり、図3(d)は図3(c)のF部拡大図である。また、図4は、本実施形態の回転操作部材300Aの構成を説明する斜視図である。
図5は、本発明の第3の実施形態に係る回路基板支持構造30を備える光照射装置3の概略構成を説明する図であり、図5(a)は正面図であり、図5(b)は図5(a)のG−G線における断面図であり、図5(c)は図5(a)のH−H線における断面図であり、図5(d)は図5(c)のI部拡大図であり、図5(e)は図5(b)のJ部拡大図である。また、図6は、本実施形態の回転操作部材300Bが凹部210Bに取り付けられる様子を示す平面図である。また、図7は、本実施形態の回転操作部材300Bの構成を説明する斜視図である。
10、20、30:回路基板支持構造
100:LEDモジュール
105:基板
110:LED素子
120:貫通孔
200、200B:ヒートシンク
210、210B:凹部
212:拡径部
214:螺合部
215B:溝部
216B:底面
217B:小径部
218B:大径部
219B:段差部
300、300A、300B:回転操作部材
310、310A、310B:頭部
311A:基部
312、312A、312B:基準面
313A:突出部
314、314A、314B:工具穴
320、320A:胴部
320B:円筒面
325B:突出部
327B:凹部
400:圧縮ばね
Ax:回転軸
Claims (9)
- 基台上に回路基板を支持する回路基板支持構造であって、
前記基台は、
前記回路基板の載置面に形成された凹部と、
前記凹部に回転可能に収容され、回転操作によって前記載置面に垂直な方向に進退する回転操作部材と、を有し、
前記回路基板は、前記凹部に対応する位置に形成された貫通孔を有し、
前記回転操作部材は、
前記載置面に略平行な基準面と、前記貫通孔から露出するように前記回転操作部材の回転軸上に形成された操作部と、を有し、
前記操作部への前記回転操作によって、前記基準面が前記載置面と略同一面上に位置するか又は前記載置面よりも窪む第1の状態と、前記基準面が前記載置面よりも突出する第2の状態との間を移動し、
前記回転操作部材が前記第1の状態から前記第2の状態に移動するときに、前記基準面が前記回路基板に当接し、前記回路基板に垂直方向の応力を付与する
ことを特徴とする回路基板支持構造。 - 前記操作部が、前記基準面と略同一面上に形成されていることを特徴とする請求項1に記載の回路基板支持構造。
- 前記回転操作部材は、前記基準面及び前記操作部が形成された頭部と、前記凹部と係合又は螺合する胴部と、を有することを特徴とする請求項1又は請求項2に記載の回路基板支持構造。
- 前記頭部は、前記回転操作部材の回転軸に沿って前記基準面から突出するように形成された突出部を有し、
前記突出部が、前記貫通孔と嵌合する
ことを特徴とする請求項3に記載の回路基板支持構造。 - 前記操作部が、前記突出部の先端に形成されていることを特徴とする請求項4に記載の回路基板支持構造。
- 前記回転操作部材が、前記第2の状態のときに、前記回路基板を前記基準面と垂直な方向に付勢する圧縮バネを有することを特徴とする請求項1から請求項5のいずれか一項に記載の回路基板支持構造。
- 前記基台が、前記回路基板を冷却するヒートシンクであることを特徴とする請求項1から請求項6いずれか一項に記載の回路基板支持構造。
- 請求項1から請求項7のいずれか一項に記載の回路基板支持構造と、
前記回路基板上に配置される複数の発光素子と、
を備えることを特徴とする光照射装置。 - 前記発光素子から出射される光が、紫外域の波長の光であることを特徴とする請求項8に記載の光照射装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018248769A JP6802249B2 (ja) | 2018-12-29 | 2018-12-29 | 回路基板支持構造、及びこれを備える光照射装置 |
KR1020190106586A KR20200083164A (ko) | 2018-12-29 | 2019-08-29 | 회로 기판 지지 구조 및 이것을 구비한 광 조사장치 |
US16/579,267 US11191162B2 (en) | 2018-12-29 | 2019-09-23 | Circuit board supporting structure and light emitting device having the same |
CN201910899849.XA CN111375534A (zh) | 2018-12-29 | 2019-09-23 | 电路基板支撑构造、以及具有其的光照射装置 |
TW108140926A TWI829801B (zh) | 2018-12-29 | 2019-11-12 | 電路基板支撐構造、以及具有其的光照射裝置 |
DE102019135113.8A DE102019135113A1 (de) | 2018-12-29 | 2019-12-19 | Leiterplatten-haltestruktur und lichtemittierende vorrichtung mit derselben |
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JP2018248769A JP6802249B2 (ja) | 2018-12-29 | 2018-12-29 | 回路基板支持構造、及びこれを備える光照射装置 |
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Publication Number | Publication Date |
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JP2020109719A JP2020109719A (ja) | 2020-07-16 |
JP6802249B2 true JP6802249B2 (ja) | 2020-12-16 |
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US (1) | US11191162B2 (ja) |
JP (1) | JP6802249B2 (ja) |
KR (1) | KR20200083164A (ja) |
CN (1) | CN111375534A (ja) |
DE (1) | DE102019135113A1 (ja) |
TW (1) | TWI829801B (ja) |
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JP5940113B2 (ja) | 2013-06-22 | 2016-06-29 | Hoya Candeo Optronics株式会社 | 光照射装置 |
JP6093749B2 (ja) * | 2014-12-24 | 2017-03-08 | Hoya Candeo Optronics株式会社 | 光照射装置 |
DE102018214770B3 (de) * | 2018-08-30 | 2020-01-16 | Würth Elektronik eiSos Gmbh & Co. KG | Verfahren zum beabstandeten Verbinden von Leiterplatten sowie Montageeinheit und Montagebaugruppe |
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JP2020109719A (ja) | 2020-07-16 |
TWI829801B (zh) | 2024-01-21 |
US20200214133A1 (en) | 2020-07-02 |
US11191162B2 (en) | 2021-11-30 |
CN111375534A (zh) | 2020-07-07 |
DE102019135113A1 (de) | 2020-07-02 |
TW202027213A (zh) | 2020-07-16 |
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