JP6785427B2 - 太陽電池素子および太陽電池モジュール - Google Patents
太陽電池素子および太陽電池モジュール Download PDFInfo
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- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 139
- 239000000758 substrate Substances 0.000 claims description 120
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 100
- 229910052710 silicon Inorganic materials 0.000 claims description 100
- 239000010703 silicon Substances 0.000 claims description 100
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 58
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 58
- 229910052698 phosphorus Inorganic materials 0.000 claims description 41
- 239000012535 impurity Substances 0.000 claims description 28
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 24
- 239000002019 doping agent Substances 0.000 claims description 24
- 239000011574 phosphorus Substances 0.000 claims description 24
- 125000004437 phosphorous atom Chemical group 0.000 claims description 17
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 11
- 238000009792 diffusion process Methods 0.000 claims description 10
- 239000013078 crystal Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 230000006798 recombination Effects 0.000 description 22
- 238000005215 recombination Methods 0.000 description 22
- 239000010408 film Substances 0.000 description 17
- 238000006243 chemical reaction Methods 0.000 description 16
- 230000007547 defect Effects 0.000 description 16
- 239000000969 carrier Substances 0.000 description 14
- 239000007789 gas Substances 0.000 description 14
- 239000000853 adhesive Substances 0.000 description 10
- 230000001070 adhesive effect Effects 0.000 description 10
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000010409 thin film Substances 0.000 description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 229910021419 crystalline silicon Inorganic materials 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000031700 light absorption Effects 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000002313 adhesive film Substances 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000002542 deteriorative effect Effects 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005685 electric field effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Description
本実施の形態に係る太陽電池モジュールの平面構成の一例について、図1を用いて説明する。
太陽電池モジュール100の主たる構成要素である太陽電池素子1の構造について説明する。
図6は、実施の形態の変形例に係る太陽電池素子1Aの積層構造を表す模式断面図である。同図に示すように、本変形例に係る太陽電池素子1Aは、実施の形態に係る太陽電池素子1と比較して、シリコン基板10の表面(第1主面)にリンの拡散領域10aが存在している点が構成として異なる。つまり、本変形例に係る太陽電池素子1Aにおいて、シリコン基板10は、第1主面において、リンを不純物として含む拡散領域10aを有する。ただし、拡散領域10aにおけるリン原子濃度は、Pドープシリコン酸化物層20におけるリン原子濃度よりも低い。また、拡散領域10aのリン原子濃度は、例えば、5×1016/cm3以上かつ5×1020/cm3以下であり、シリコン基板10本体のn型ドーパント濃度よりも高い。また、拡散領域10aのシリコン基板10表面からの深さは、例えば、1.5μm以下である。この構成によれば、非晶質シリコン層30とシリコン基板10との間にPドープシリコン酸化物層20が介在しているので、シリコン基板10の第1主面側において、キャリアの再結合を抑制するとともに、非晶質シリコン層30のエピタキシャル成長を抑制することが可能となる。よって、開放電圧の向上を実現できる。なお、リンの拡散領域は、シリコン基板10の第2主面に存在していてもよい。
次に、上述した特徴的なPドープシリコン酸化物層20を有する太陽電池素子1の製造方法について説明する。
本実施の形態に係る太陽電池素子1は、第一導電型(n型)である結晶系のシリコン基板10と、シリコン基板10の第1主面上に形成された、リンを不純物として含むPドープシリコン酸化物層20と、Pドープシリコン酸化物層20の上に形成された非晶質シリコン層30とを備える。
以上、本発明に係る太陽電池素子1および太陽電池モジュール100について、上記実施の形態に基づいて説明したが、本発明は、上記の実施の形態に限定されるものではない。
10 シリコン基板
20 Pドープシリコン酸化物層(第1シリコン酸化物層)
30 非晶質シリコン層(第1非晶質シリコン層)
31 誘電体層(第1真性非晶質シリコン層)
32 n型非晶質シリコン層(第1導電型非晶質シリコン層)
60 非晶質シリコン層(第2非晶質シリコン層)
61 誘電体層(第2真性非晶質シリコン層)
62 p型非晶質シリコン層(第2導電型非晶質シリコン層)
100 太陽電池モジュール
170A 表面充填部材
170B 裏面充填部材
180A 表面保護部材
180B 裏面保護部材
Claims (7)
- 結晶系のシリコン基板と、
前記シリコン基板の第1主面上に形成された、リンを不純物として含む第1シリコン酸化物層と、
前記第1シリコン酸化物層の上に形成された第1非晶質シリコン層とを備え、
前記第1非晶質シリコン層は、
前記第1シリコン酸化物層の上に形成された、実質的に真性な第1真性非晶質シリコン層と、
前記第1真性非晶質シリコン層の上に形成された、第一導電型のドーパントを含む第1導電型非晶質シリコン層とを備え、
前記第1非晶質シリコン層、前記第1シリコン酸化物層、および前記シリコン基板の積層体における厚み方向のリン原子濃度プロファイルは、前記第1シリコン酸化物層において極大値を有する
太陽電池素子。 - 前記第1シリコン酸化物層において、
リン原子濃度は、1×1019/cm3以上かつ5×1020/cm3以下であり、
酸素原子濃度は、1×1021/cm3以上かつ2×1022/cm3以下である
請求項1に記載の太陽電池素子。 - 前記第1シリコン酸化物層において、
リン原子濃度は、5×1019/cm3以上かつ1×1020/cm3以下であり、
酸素原子濃度は、2×1021/cm3以上かつ5×1021/cm3以下である
請求項1に記載の太陽電池素子。 - 前記シリコン基板は、前記第1主面において、前記シリコン基板の本体よりもリン原子濃度が高い拡散領域を有する
請求項1〜3のいずれか1項に記載の太陽電池素子。 - さらに、
前記シリコン基板の前記第1主面と背向する第2主面上に形成された第2非晶質シリコン層を備える
請求項1〜4のいずれか1項に記載の太陽電池素子。 - 前記第2非晶質シリコン層は、
前記シリコン基板の上に形成された、実質的に真性な第2真性非晶質シリコン層と、
前記第2真性非晶質シリコン層の上に形成された、第二導電型のドーパントを含む第2導電型非晶質シリコン層とを備える
請求項5に記載の太陽電池素子。 - 2次元状に配置された、請求項1〜6のいずれか1項に記載の複数の太陽電池素子と、
前記複数の太陽電池素子の表面側に配置された表面保護部材と、
前記複数の太陽電池素子の裏面側に配置された裏面保護部材と、
前記複数の太陽電池素子と前記表面保護部材との間に配置された表面充填部材と、
前記複数の太陽電池素子と前記裏面保護部材との間に配置された裏面充填部材とを備える
太陽電池モジュール。
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