JP6776416B2 - Imaging unit and imaging device - Google Patents

Description

The present invention relates to an image pickup unit having an image pickup device.

An imaging device such as a digital video camera or a digital still camera includes an imaging unit having an imaging element. In recent years, the ISO sensitivity of an image sensor has been increased, and a clearer image can be generated even when an image is taken in a scene with a small amount of light such as a night view. However, as the ISO sensitivity of the image sensor increases, so does the sensitivity to weak noise, which has not been a problem in the past. As a result, the image sensor is affected by noise, and the problem that the image is distorted has become apparent.

Patent Document 1 describes an imaging unit that reduces magnetic field noise reaching the imaging chip by canceling each other's magnetic field noise radiated from the power supply pattern and ground pattern of the mounting board due to the operation of the processing circuit of the imaging chip. It is disclosed.

JP-A-2017-103517

However, the magnetic field noise that reaches the image sensor is not limited to that caused by the operation of the image sensor itself. For example, in some digital single-lens reflex cameras and the like, a coil for driving a lens is provided inside a lens barrel that can be attached to and detached from the camera body. Some cameras are provided with a coil for driving the sensor inside the camera body. Magnetic field noise is also generated from inductor elements such as these coils. In addition, magnetic field noise may fly to the image sensor from the outside.

As described above, the image pickup device is exposed to the magnetic field noise due to various factors, and it is difficult to prevent the magnetic field noise from reaching the image pickup unit having the image pickup device.

An object of the present invention is to improve the quality of an image.

The imaging unit of the present invention includes an imaging element having an analog circuit including an analog ground wiring and a wiring plate on which the imaging element is mounted. The wiring plate is connected to the analog ground wiring and viewed from the side. It is characterized by having a first ground wiring forming a closed loop with the analog ground wiring, and a second ground wiring connected to the first ground wiring only by a first via conductor.

According to the present invention, the quality of the image is improved.

The schematic diagram of the camera which is an example of the image pickup apparatus which concerns on 1st Embodiment. The schematic diagram of the camera which is an example of the image pickup apparatus which concerns on 1st Embodiment. The circuit diagram which shows an example of the structure of the image pickup element which concerns on 1st Embodiment. FIG. 6 is a schematic view of the imaging unit according to the first embodiment in a plan view. Sectional drawing of the image pickup unit which concerns on 1st Embodiment. (A) is a plan view of the conductor layer of the wiring board according to the first embodiment. (B) is a plan view of the conductor layer of the wiring board according to the first embodiment. Sectional drawing of the image pickup unit which concerns on 2nd Embodiment. Sectional drawing of the image pickup unit which concerns on 3rd Embodiment. Sectional drawing of the image pickup unit which concerns on 4th Embodiment. Sectional drawing of the image pickup unit which concerns on 5th Embodiment. (A) is a plan view of the conductor layer of the wiring board according to the fifth embodiment. (B) is a schematic view of the image sensor in a plan view. Sectional drawing of the image pickup unit which concerns on 6th Embodiment. Sectional drawing of the image pickup unit which concerns on 7th Embodiment. The plan view of the conductor layer of the wiring board which concerns on 7th Embodiment. Sectional drawing of the image pickup unit which concerns on 8th Embodiment. The plan view of the conductor layer of the wiring board which concerns on 8th Embodiment. Sectional drawing of the image pickup unit which concerns on 9th Embodiment. The plan view of the conductor layer of the wiring board which concerns on 9th Embodiment. FIG. 5 is a cross-sectional view of the imaging unit according to the tenth embodiment. FIG. 5 is a cross-sectional view of the imaging unit according to the tenth embodiment. The plan view of the conductor layer of the wiring board which concerns on 10th Embodiment.

Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.
[First Embodiment]
1 and 2 are schematic views of a camera 100 which is an example of the image pickup apparatus according to the first embodiment. FIG. 1 is a diagram schematically showing the front surface of the camera 100, and FIG. 2 is a diagram schematically showing a cross section of the camera 100. The camera 100 is a digital camera such as a digital still camera or a digital video camera. The camera 100 may be a camera in which a lens and a camera body are integrated, but in the first embodiment, it is a digital single-lens camera, and includes a camera body 101 and a lens barrel 200 that can be attached to and detached from the camera body 101.

The camera body 101 includes an outer case 102 which is a housing. The outer case 102 has a mount 111 to which the lens barrel 200 can be attached and detached. Inside the outer case 102, an image pickup unit 400 including an image pickup element 300 having a light receiving surface 301 and a wiring board 500 on which the image pickup element 300 is mounted is arranged. The direction perpendicular to the light receiving surface 301 is the Z direction.

The image pickup unit 400 is held by the metal frame 103. Inside the metal frame 103, a plurality of coils 104 that mechanically drive the image pickup unit 400, which is an example of the inductor element, are arranged. Each coil 104 generates a Lorentz force to drive the image pickup unit 400 in the direction opposite to the direction of camera shake. The image sensor 300 is an image pickup chip such as a CMOS image sensor or a CCD image sensor, and is formed in a rectangular shape, specifically, a rectangular shape when viewed in the Z direction perpendicular to the light receiving surface 301 of the image sensor 300. There is. The direction parallel to the light receiving surface 301 of the image sensor 300, the long side direction of the image sensor 300 is the X direction, and the short side direction is the Y direction. In the first embodiment, the Y direction is the first direction and the Z direction is the second direction. The image sensor 300 photoelectrically converts the light image formed on the light receiving surface 301 and outputs a pixel signal to the wiring board 500.

The lens barrel 200 is an optical system that is supported by the lens housing 201 and the lens housing 201 and forms an optical image on the light receiving surface 301 of the image pickup element 300 when the lens barrel 200 is mounted on the outer case 102. 202 and. Further, the lens barrel 200 is arranged inside the lens housing 201, and includes a coil 203 that mechanically drives the optical system 202, which is an example of an inductor element. The optical system 202 has a lens 211 arranged on the light incident side of the lens housing 201 and a lens 212 arranged on the light emitting side. The lens housing 201 is provided with a ring mount 204. The lens 212 is supported by the ring mount 204. The coil 203 is arranged so as not to block the optical path from the optical system 202 to the light receiving surface 301 of the image sensor 300, that is, located on the outer periphery of the image sensor 300 when viewed from the front as shown in FIG.

The coils 104 and 203 operate by supplying an alternating current having a frequency in the kHz band, that is, a frequency of 1 [kHz] or more and less than 1 [MHz]. The coils 104 and 203 generate magnetic flux around them when an alternating current is supplied. This magnetic flux becomes magnetic field noise for the image sensor 300. The direction of the magnetic flux is indicated by a broken arrow in FIG. 2, but since it is an alternating magnetic field generated by an alternating current, the direction of the broken arrow and the opposite direction are alternately switched.

FIG. 3 is a circuit diagram showing an example of the configuration of the image pickup device 300 according to the first embodiment. The image pickup device 300 shown in FIG. 3 has an analog circuit 370 and a digital circuit 380. The analog circuit 370 includes a pixel array 310, a vertical scanning circuit 302, and a peripheral circuit 303. The digital circuit 380 has a signal processing circuit 304. Hereinafter, a case where the pixel array 310, the vertical scanning circuit 302, the peripheral circuit 303, and the signal processing circuit 304 are arranged in the same plane will be described as an example, but the present invention is not limited thereto. A laminated structure may be adopted in which the pixel array 310, the vertical scanning circuit 302, the peripheral circuit 303, and the signal processing circuit 304 are arranged on separate surfaces different in the Z direction.

The analog circuit 370 has an analog power supply wiring 320 and an analog ground wiring 330. The digital circuit 380 has a digital power supply wiring 340 and a digital ground wiring 350. Inside the image sensor 300, the analog power supply wiring 320 and the digital power supply wiring 340 are separated, and the analog ground wiring 330 and the digital ground wiring 350 are separated. Although not shown, the analog power supply wiring 320 and the analog ground wiring 330 overlap each other, and the digital power supply wiring 340 and the digital ground wiring 350 overlap each other when viewed in a direction perpendicular to the light receiving surface 301 of the image sensor 300. The analog power supply wiring 320 is connected to a plurality of analog power supply electrodes 321. The analog ground wiring 330 is connected to a plurality of analog ground electrodes 331. The digital power supply wiring 340 is connected to a plurality of digital power supply electrodes 341. The digital ground wiring 350 is connected to a plurality of digital ground electrodes 351. Note that FIG. 3 shows only one analog power supply electrode 321 and one analog ground electrode 331, digital power supply electrode 341, and digital ground electrode 351.

The pixel array 310 includes a plurality of pixels 311 arranged in a two-dimensional matrix, that is, in the row direction and the column direction. The row direction is the horizontal direction, that is, the horizontal direction in FIG. The column direction is the vertical direction, that is, the vertical direction in FIG. Each pixel 311 outputs a pixel signal as an analog signal according to the amount of received light. Each pixel 311 includes a photoelectric conversion unit and an amplification unit that outputs a signal based on the electric charge generated by the photoelectric conversion unit. FIG. 3 shows a pixel array 310 having 2 rows and 4 columns for the sake of simplification of the drawing, but the number of rows and columns of the pixel array 310 is not limited to this.

The vertical scanning circuit 302 performs drive control such as a pixel 311 reset operation, a storage operation, and a signal reading operation in units of rows. The peripheral circuit 303 includes a differential amplification circuit that removes noise such as random noise, and outputs a pixel signal from which noise has been removed as an analog signal. The signal processing circuit 304 processes the pixel signal and converts it into a digital signal under the control of the vertical scanning circuit 302 and the peripheral circuit 303, and outputs the digital signal from the signal electrode 361 to the wiring board 500 of FIG.

FIG. 4 is a schematic view of the imaging unit 400 according to the first embodiment in a plan view. FIG. 5 is a cross-sectional view of the imaging unit 400 along the line AA of FIG. FIG. 5 shows a schematic view of the cross section of the imaging unit 400 as a side view. Further, FIG. 5 schematically shows the ground wiring. The image pickup unit 400 includes an image pickup element 300, a wiring board 500, a frame 602, and a cover glass 603. The wiring board 500 is a printed wiring board in the first embodiment. The wiring board 500 has a conductor portion and an insulator portion. The conductor portion is made of a conductive metal material such as copper or gold. The insulating portion is made of an insulating material having electrical insulating properties, for example, an epoxy resin.

The wiring board 500 is a laminated substrate containing a plurality of, for example, eight conductor layers 1 to 8 arranged at intervals in the Z direction, which is the thickness direction of the wiring board 500. An insulator layer is arranged between two adjacent conductor layers 1 to 8. A conductor pattern is arranged in each of the conductor layers 1 to 8. The wiring board 500 has two main surfaces 501 and 502. The image sensor 300 is mounted on the main surface 501 on the side of the conductor layer 1 in the wiring board 500.

The plurality of conductor layers 1 to 8 are laminated in the order of the conductor layer 1, the conductor layer 2, the conductor layer 3, the conductor layer 4, the conductor layer 5, the conductor layer 6, the conductor layer 7, and the conductor layer 8 from the side of the image sensor 300. Is arranged. The conductor layers 1 and 8 are surface layers, that is, outer layers, and the conductor layers 2 to 7 are inner layers. A circuit component 601 such as a capacitor is mounted on the main surface 502 on the side of the conductor layer 8. The number of conductor layers is not limited to eight, and may be two or more. However, considering the arrangement of wiring and the like, the number of conductor layers is preferably 3 or more, and more preferably 4 or more. Further, a solder resist (not shown) may be provided on the conductor layers 1 and 8.

The image pickup device 300 is arranged on the main surface 501 and is connected to the wiring board 500 by wire bonding. That is, the wiring of the image sensor 300 and the wiring of the wiring board 500 are electrically connected by a plurality of wires 610 which are a plurality of metal members shown in FIG. The image sensor 300 is mounted on the wiring board 500 by wire bonding, but is not limited to this, and may be mounted on the wiring board by flip chip bonding. In this case, the image sensor and the wiring board are connected by a plurality of metal members such as a plurality of solder balls.

The magnetic field noise generated from the inductor elements such as the coils 104 and 203 in FIG. 2 reaches the imaging unit 400. Assuming that the magnetic flux density is B, the area of the closed loop formed by the wiring is S, and the magnetic flux (magnetic field noise) interlinking the closed loop is Φ, it is expressed as Φ = B × S. That is, the magnetic flux Φ is proportional to the area S of the closed loop. When the magnetic flux Φ interlinks the closed loop, an induced electromotive force V corresponding to the time change of the magnetic flux Φ is generated in the closed loop of the wiring. This follows Faraday Lenz's law. The relationship between the induced electromotive force V and the change ΔΦ of the magnetic flux Φ in the minute time Δt is represented by V = −ΔΦ / Δt. Since ΔΦ is proportional to the area S of the closed loop, the induced electromotive force V generated in the closed loop is also proportional to the area S of the closed loop. According to Ohm's law, the relationship between the induced electromotive force V generated in the closed loop, the impedance R of the closed loop, and the induced current I flowing through the closed loop is represented by I = V / R. Since the induced current I is inversely proportional to the impedance R, the smaller the impedance R, the easier it is for the induced current I to flow. When the magnetic flux Φ is directed in the opposite direction by 180 degrees, the directions of the induced electromotive force V and the current I are opposite. Further, even when the magnetic flux Φ reaches the closed loop plane in the oblique direction, the induced electromotive force V is generated by the component of the magnetic flux Φ in the direction perpendicular to the loop surface.

The closed loop in the image pickup unit 400 has different resistance to magnetic field noise depending on the type of circuit to be connected. Specifically, in the image pickup unit 400, the closed loop of the analog circuit ground (hereinafter, also referred to as “analog ground”) is more resistant to magnetic field noise than the closed loop of the digital circuit ground (hereinafter, also referred to as “digital ground”). And low tolerance. In particular, the wiring related to the pixel array 310 directly affects the pixel signal, and therefore has low resistance to magnetic field noise. Further, the lower the impedance of the wiring, the easier it is for the induced current to flow, and the lower the resistance to magnetic field noise. When a voltage distribution occurs in a closed loop of the analog ground due to the induced electromotive force, the pixel signal, which is an analog signal, fluctuates depending on the distribution of the ground potential. The present inventors have found that in order to prevent pattern noise from occurring in the output image of the image sensor 300, that is, to increase the resistance of the image sensor 400 to magnetic field noise, the closed loop area of the analog ground should be reduced. It was.

As shown in FIG. 3, the analog circuit 370 of the image sensor 300 includes a pixel array 310 and an analog ground wiring 330 electrically connected to the pixel array 310. As shown in FIG. 5, the wiring board 500 of the imaging unit 400 according to the first embodiment has a ground wiring portion 570 that serves as a ground. The ground wiring unit 570 includes a ground wiring 571 which is a first ground wiring and a ground wiring 572 which is a second ground wiring.

The ground wiring 571 is connected to a plurality of ground electrodes 531. FIG. 5 shows a pair of ground electrodes 531 ₁ and 531 ₂ arranged apart from each other in the X direction among the plurality of ground electrodes 531. The analog ground wiring 330 is connected to a plurality of analog ground electrodes 331. FIG. 5 shows a pair of analog ground electrodes 331 ₁ and 331 ₂ arranged apart from each other in the X direction among the plurality of analog ground electrodes 331. The plurality of analog ground electrodes 331 and the plurality of ground electrodes 531 are electrically connected by a plurality of wires 611. The plurality of wires 611 are included in the plurality of wires 610 of FIG. In FIG. 5, among a plurality of wires 611, the wire 611 ₁ that electrically connects the analog ground electrode 331 ₁ and the ground electrode 531 ₁ and the analog ground electrode 331 ₂ and the ground electrode 531 ₂ are electrically connected. The wire 611 ₂ and the like are shown in the figure.

When the image pickup unit 400 is viewed from the side, that is, when the image pickup unit 400 is viewed in the Y direction, the image pickup unit 400 is formed with an analog ground closed loop L1 straddling the image pickup element 300 and the wiring board 500. In FIG. 5, the closed loop L1 is shown by a chain double-dashed line.

The closed loop L1 mainly includes the analog ground wiring 330 of the image sensor 300 and the ground wiring 571 of the wiring board 500. More specifically, the closed loop L1 includes an analog ground wire 330, a pair of analog ground electrodes 331 ₁ , 331 ₂ , a pair of wires 611 ₁ , 611 ₂ , a pair of ground electrodes 531 ₁ , 531 ₂ , and a ground wire 571. I'm out.

The ground wiring 572 is a portion other than the ground wiring 571 when viewed in the Y direction, that is, a portion that does not contribute to the formation of the closed loop L1 of the analog ground. For example, the ground wiring 572 includes a portion that forms a closed loop of the digital ground together with the digital ground wiring 350 (FIG. 3) of the image sensor 300 when viewed in the Y direction, and a portion that does not contribute to the formation of any of the closed loops.

Here, the area of the closed loop L1 of the analog ground when viewed in the Y direction, that is, the area of the portion surrounded by the alternate long and short dash line in FIG. 5 is defined as S1. The ground wiring 571 is arranged closer to the image sensor 300 than the central C1 in the Z direction of the wiring board 500. The center C1 is the center between the two main surfaces 501 and 502, and is illustrated by the alternate long and short dash line in FIG. Since the entire ground wiring 571 is arranged closer to the image sensor 300 than the central C1 in the Z direction of the wiring board 500, the area S1 of the closed loop L1 of the analog ground can be reduced. Since the induced electromotive force generated in the closed loop L1 is proportional to the area S1 of the closed loop L1, the induced electromotive force generated in the closed loop L1 can be reduced by reducing the area S1. Therefore, it is possible to reduce the potential fluctuation of the analog ground, and thereby it is possible to prevent pattern noise from occurring in the output image of the image sensor 300. That is, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

In the first embodiment, the ground wiring 571 is composed of only one conductor pattern 505, which is the first conductor pattern. The conductor pattern 505 is arranged on the conductor layer 1 which is the surface layer on the side where the image pickup device 300 is mounted on the wiring board 500. Since the conductor pattern 505 is arranged on the conductor layer 1, the area S1 of the closed loop L1 can be made as small as possible, and the image generated by the image pickup element 300 can be effectively suppressed from being disturbed. The quality of the image is further improved.

The ground wiring 572 has a plurality of conductor patterns 506 which are a plurality of second conductor patterns arranged at intervals from each other, and a plurality of via conductors 508 which are a plurality of third via conductors. The conductor pattern 506 is arranged in the conductor layers 2 to 8. The plurality of conductor patterns 506 are electrically connected by the plurality of via conductors 508.

FIG. 6A is a plan view of the first conductor layer of the wiring board 500 according to the first embodiment, that is, the conductor layer 1 which is the surface layer. FIG. 6B is a plan view of the second conductor layer of the wiring board 500 according to the first embodiment, that is, the conductor layer 2 which is an inner layer. As shown in FIG. 6A, the power supply electrode 521 electrically connected to the analog power supply electrode 321 of FIG. 3 by wire bonding is arranged in the conductor layer 1. The power electrode 521 is a via conductor (not shown) and is electrically connected to a conductor pattern (not shown) arranged in any of the conductor layers 2 to 8.

As shown in FIG. 6A, the ground electrode 531 electrically connected to the analog ground electrode 331 of FIG. 3 by wire bonding is arranged in the conductor layer 1. The ground electrode 531 is integrally formed with the conductor pattern 505.

As shown in FIG. 6A, an electrode 541 electrically connected to the digital power supply electrode 341 or the signal electrode 361 of FIG. 3 by wire bonding is arranged in the conductor layer 1. The electrode 541 is a via conductor (not shown) and is electrically connected to a conductor pattern (not shown) arranged in any of the conductor layers 2-8.

As shown in FIG. 6A, the ground electrode 551 electrically connected to the digital ground electrode 351 of FIG. 3 by wire bonding is arranged in the conductor layer 1. The ground electrode 551 is a via conductor (not shown) and is electrically connected to the conductor pattern 506 of the ground wiring 572 arranged in any of the conductor layers 2 to 8. As shown in FIG. 6A, the conductor pattern 505 is a solid pattern in which the outer shape when viewed in the Z direction is a quadrangular shape or a square corner portion is R-shaped. As shown in FIG. 6B, the conductor pattern 506 is a solid pattern in which the outer shape when viewed in the Z direction is a quadrangular shape or a square corner portion is R-shaped.

The ground of the analog circuit and the ground of the digital circuit of the image sensor 300 are preferably shared, and in the wiring board 500 of FIG. 5, the ground wiring 571 and the ground wiring 572 are electrically connected. The ground wiring 571 is arranged closer to the image sensor 300 than the ground wiring 572. The ground wiring 571 and the ground wiring 572 are electrically connected by only one via conductor 511, which is the first via conductor arranged at one place, so that the closed loop L1 of the analog ground does not extend to the ground wiring 572. ing. That is, the analog ground and the digital ground are connected only by the via conductor 511. In FIG. 5, the via conductor 511 is shown by hatching different from the ground wirings 571 and 572.

The ground wiring 571 is electrically connected to the analog ground wiring 330 of the image sensor 300, and the ground wiring 572 is electrically connected to the digital ground wiring 350 (FIG. 3) of the image sensor 300. The ground wiring 571 and the ground wiring 572 are electrically connected only by the via conductor 511. Since the ground wiring 571 and the ground wiring 572 are electrically connected by only one via conductor 511, the closed loop L1 of the analog ground does not extend to the ground wiring 572, and the area S1 can be reduced. As a result, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved. By electrically connecting the digital ground wiring 350 of the image sensor 300 to the ground wiring 572, the voltage fluctuation of the analog signal can be made smaller than when it is electrically connected to the ground wiring 571. As a result, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

In the first embodiment, the via conductor 511 is arranged so as to penetrate the conductor pattern 506 of the conductor layer 2 as shown in FIG. 6B, and is arranged with the conductor pattern 505 of the conductor layer 1 as shown in FIG. The conductor pattern 506 of the conductor layer 3 is electrically connected.

The conductor pattern 505 of the conductor layer 1 and the conductor pattern 506 of the conductor layer 3 electrically connected by the via conductor 511 have the same structure as the planar antenna, and receive an external electromagnetic wave to fluctuate the potential in the wiring. May occur. In particular, when the via conductor 511 is located at the center or end of the conductor pattern 505 of the conductor layer 1 and the conductor pattern 506 of the conductor layer 3 when viewed in the Z direction, it is strongly affected by electromagnetic waves of a specific frequency. Therefore, the via conductor 511 is viewed in the Z direction, that is, in a plan view, at least at the center and ends of the conductor pattern 505 of the conductor layer 1, and in the first embodiment, the conductor pattern 505 of the conductor layer 1 and the conductor of the conductor layer 3. It is arranged so as to avoid the center and the end of the pattern 506. As a result, it is possible to effectively suppress the distortion of the image generated by the image sensor 300, and the quality of the generated image is further improved.

[Second Embodiment]
The imaging unit according to the second embodiment will be described. In the first embodiment, the case where the wiring board on which the semiconductor element is mounted is a printed wiring board has been described, but in the second embodiment, the case where the wiring board on which the semiconductor element is mounted is a ceramic package will be described. FIG. 7 is a cross-sectional view of the imaging unit 400A according to the second embodiment. FIG. 7 is a schematic view of the cross section of the imaging unit 400A at the position corresponding to the line AA shown in FIG. 4 as a side view. In the image pickup unit 400A of the second embodiment, the same components as those of the image pickup unit 400 of the first embodiment are designated by the same reference numerals and description thereof will be omitted.

As shown in FIG. 7, the image pickup unit 400A includes an image pickup element 300, a wiring board 500A, and a cover glass 603. The wiring board 500A is a ceramic package having a frame to which the cover glass 603 is attached. The wiring board 500A has a conductor portion and an insulator portion. The conductor portion is made of a conductive metal material such as copper or gold. The insulator portion is made of an insulating material having electrical insulation, for example, ceramic.

The wiring board 500A is a laminated substrate including a plurality of, for example, five conductor layers 1A, 2A, 3A, 4A, and 5A arranged at intervals in the Z direction, which is the thickness direction of the wiring board 500A. An insulator layer is arranged between two adjacent conductor layers 1A to 5A. A conductor pattern is arranged in each of the conductor layers 1A to 5A. The wiring board 500A has two main surfaces 501A and 502A. The image sensor 300 is mounted on the main surface 501A on the side of the conductor layer 1A in the wiring board 500A.

The plurality of conductor layers 1A to 5A are arranged in the order of the conductor layer 1A, the conductor layer 2A, the conductor layer 3A, the conductor layer 4A, and the conductor layer 5A from the side of the image sensor 300. The conductor layers 1A and 5A are surface layers, that is, outer layers, and the conductor layers 2A to 4A are inner layers. The number of conductor layers is not limited to 5, but may be 2 or more. However, considering the arrangement of wiring and the like, the number of conductor layers is preferably 3 or more, and more preferably 4 or more.

The image pickup device 300 is arranged on the main surface 501A and is connected to the wiring board 500A by wire bonding. The image sensor 300 is mounted on the wiring board 500A by wire bonding, but is not limited to this, and may be mounted on the wiring board by flip chip bonding. In this case, the image sensor and the wiring board are connected by a plurality of metal members such as a plurality of solder balls.

As shown in FIG. 3, the image pickup device 300 has an analog circuit 370. The analog circuit 370 includes a pixel array 310 and an analog ground wiring 330 electrically connected to the pixel array 310. Further, the image sensor 300 has a digital circuit 380. The digital circuit 380 has a digital ground wiring 350. As shown in FIG. 7, the wiring board 500A has a ground wiring portion 570A which is a ground. The ground wiring unit 570A includes a ground wiring 571A which is a first ground wiring and a ground wiring 572A which is a second ground wiring.

The ground wiring 571A is connected to a plurality of ground electrodes 531. The plurality of ground electrodes 531 are arranged in the conductor layer 1A. FIG. 7 shows a pair of ground electrodes 531 ₁ and 531 ₂ arranged apart from each other in the X direction among the plurality of ground electrodes 531. The analog ground wiring 330 is connected to a plurality of analog ground electrodes 331. FIG. 7 shows a pair of analog ground electrodes 331 ₁ and 331 ₂ arranged apart from each other in the X direction among the plurality of analog ground electrodes 331. The plurality of analog ground electrodes 331 and the plurality of ground electrodes 531 are electrically connected by a plurality of wires 611. The plurality of wires 611 are included in the plurality of wires 610 of FIG. In FIG. 7, among the plurality of wires 611, the wire 611 ₁ that electrically connects the analog ground electrode 331 ₁ and the ground electrode 531 ₁ and the analog ground electrode 331 ₂ and the ground electrode 531 ₂ are electrically connected. The wire 611 ₂ and the like are shown in the figure.

When the image pickup unit 400A is viewed from the side, that is, when the image pickup unit 400A is viewed in the Y direction, the image pickup unit 400A is formed with an analog ground closed loop L2 straddling the image pickup element 300 and the wiring board 500A. In FIG. 7, the closed loop L2 is shown by a chain double-dashed line.

The closed loop L2 mainly includes the analog ground wiring 330 of the image sensor 300 and the ground wiring 571A of the wiring board 500A. More specifically, the closed loop L2 includes an analog ground wire 330, a pair of analog ground electrodes 331 ₁ , 331 ₂ , a pair of wires 611 ₁ , 611 ₂ , a pair of ground electrodes 531 ₁ , 531 ₂ and a ground wire 571A. I'm out.

The ground wiring 572A is a portion other than the ground wiring 571A when viewed in the Y direction, that is, a portion that does not contribute to the formation of the closed loop L2 of the analog ground. For example, the ground wiring 572A includes a portion that forms a closed loop of the digital ground together with the digital ground wiring 350 (FIG. 3) of the image sensor 300 when viewed in the Y direction, and a portion that does not contribute to the formation of any of the closed loops.

Here, the area of the closed loop L2 of the analog ground when viewed in the Y direction, that is, the area of the portion surrounded by the alternate long and short dash line in FIG. 7 is defined as S2. The ground wiring 571A is arranged closer to the image sensor 300 than the central C2 in the Z direction of the wiring board 500A. The center C2 is the center between the two main surfaces 501A and 502A, and is illustrated by the alternate long and short dash line in FIG. Since the entire ground wiring 571A is arranged closer to the image sensor 300 than the central C2 in the Z direction of the wiring board 500A, the area S2 of the closed loop L2 of the analog ground can be reduced. Since the induced electromotive force generated in the closed loop L2 is proportional to the area S2 of the closed loop L2, the induced electromotive force generated in the closed loop L2 can be reduced by reducing the area S2. Therefore, it is possible to reduce the potential fluctuation of the analog ground, and thereby it is possible to prevent pattern noise from occurring in the output image of the image sensor 300. That is, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

The ground wiring 571A includes one conductor pattern 505A, which is the first conductor pattern. The conductor pattern 505A is arranged in the conductor layer 2A. Further, the ground wiring 571A includes a via conductor 513A ₁ that connects the ground electrode 531 ₁ and the conductor pattern 505A, and a via conductor 513A ₂ that connects the ground electrode 531 ₂ and the conductor pattern 505A. The ground wiring 572A has a plurality of conductor patterns 506A which are a plurality of second conductor patterns arranged at intervals from each other, and a plurality of via conductors 508A which are a plurality of third via conductors. The conductor pattern 506A is arranged in the conductor layers 3A to 5A. The plurality of conductor patterns 506A are electrically connected by the plurality of via conductors 508A.

The ground of the analog circuit and the ground of the digital circuit of the image sensor 300 are preferably shared, and in the wiring board 500A, the ground wiring 571A and the ground wiring 572A are electrically connected. The ground wiring 571A is arranged closer to the image sensor 300 than the ground wiring 572A. The ground wiring 571A and the ground wiring 572A are electrically connected by only one via conductor 511A, which is the first via conductor arranged at one place, so that the closed loop L2 of the analog ground does not extend to the ground wiring 572A. There is. That is, the analog ground and the digital ground are connected only by the via conductor 511A. In FIG. 7, the via conductor 511A is shown by hatching different from the ground wirings 571A and 572A.

The ground wiring 571A is electrically connected to the analog ground wiring 330 of the image sensor 300, and the ground wiring 572A is electrically connected to the digital ground wiring 350 (FIG. 3) of the image sensor 300. The ground wiring 571A and the ground wiring 572A are electrically connected by only one via conductor 511A. Since the ground wiring 571A and the ground wiring 572A are electrically connected by only one via conductor 511A, the closed loop L2 of the analog ground does not extend to the ground wiring 572A, and the area S2 can be reduced. As a result, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

In the second embodiment, the via conductor 511A is arranged so as to penetrate the conductor pattern 506A of the conductor layer 3A, and electrically connects the conductor pattern 505A of the conductor layer 2A and the conductor pattern 506A of the conductor layer 4A. ..

The via conductor 511A is viewed in the Z direction, that is, in a plan view, at least at the center and ends of the conductor pattern 505A of the conductor layer 2A, and in the second embodiment, the conductor pattern 505A of the conductor layer 2A and the conductor pattern 506A of the conductor layer 4A. It is arranged so as to avoid the center and the end of the. As a result, it is possible to effectively suppress the distortion of the image generated by the image sensor 300, and the quality of the generated image is further improved.

[Third Embodiment]
The imaging unit according to the third embodiment will be described. FIG. 8 is a cross-sectional view of the imaging unit 400B according to the third embodiment. FIG. 8 shows a schematic view of the cross section of the imaging unit 400B at the position corresponding to the line AA shown in FIG. 4 as a side view. In the image pickup unit 400B of the third embodiment, the same components as those of the image pickup unit 400 of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 8, the image pickup unit 400B includes an image pickup element 300, a wiring board 500B, a frame 602, and a cover glass 603. The wiring board 500B is a printed wiring board in the third embodiment. The wiring board 500B has a conductor portion and an insulator portion. The conductor portion is made of a conductive metal material such as copper or gold. The insulating portion is made of an insulating material having electrical insulating properties, for example, an epoxy resin.

The wiring board 500B is a laminated substrate including a plurality of, for example, eight conductor layers 1B to 8B, which are arranged at intervals in the Z direction, which is the thickness direction of the wiring board 500B. An insulator layer is arranged between two adjacent conductor layers 1B to 8B. A conductor pattern is arranged in each of the conductor layers 1B to 8B. The wiring board 500B has two main surfaces 501B and 502B. The image sensor 300 is mounted on the main surface 501B on the side of the conductor layer 1B in the wiring board 500B.

The plurality of conductor layers 1B to 8B are laminated in the order of the conductor layer 1B, the conductor layer 2B, the conductor layer 3B, the conductor layer 4B, the conductor layer 5B, the conductor layer 6B, the conductor layer 7B, and the conductor layer 8B from the side of the image pickup element 300. Is arranged. The conductor layers 1B and 8B are surface layers, that is, outer layers, and the conductor layers 2B to 7B are inner layers. A circuit component 601 such as a capacitor is mounted on the main surface 502B on the side of the conductor layer 8B. The number of conductor layers is not limited to eight, and may be two or more. However, considering the arrangement of wiring and the like, the number of conductor layers is preferably 3 or more, and more preferably 4 or more. Further, a solder resist (not shown) may be provided on the conductor layers 1B and 8B.

The image sensor 300 is arranged on the main surface 501B and is connected to the wiring board 500B by wire bonding. The image sensor 300 is mounted on the wiring board 500B by wire bonding, but is not limited to this, and may be mounted on the wiring board by flip chip bonding. In this case, the image sensor and the wiring board are connected by a plurality of metal members such as a plurality of solder balls.

As shown in FIG. 3, the image pickup device 300 has an analog circuit 370. The analog circuit 370 includes a pixel array 310 and an analog ground wiring 330 electrically connected to the pixel array 310. Further, the image sensor 300 has a digital circuit 380. The digital circuit 380 has a digital ground wiring 350. As shown in FIG. 8, the wiring board 500B has a ground wiring portion 570B which is a ground. The ground wiring unit 570B includes a ground wiring 571B which is a first ground wiring and a ground wiring 572B which is a second ground wiring.

The ground wiring 571B is connected to a plurality of ground electrodes 531. The plurality of ground electrodes 531 are arranged on the conductor layer 1B. FIG. 8 shows a pair of ground electrodes 531 ₁ and 531 ₂ arranged apart from each other in the X direction among the plurality of ground electrodes 531. The analog ground wiring 330 is connected to a plurality of analog ground electrodes 331. FIG. 8 shows a pair of analog ground electrodes 331 ₁ and 331 ₂ arranged apart from each other in the X direction among the plurality of analog ground electrodes 331. The plurality of analog ground electrodes 331 and the plurality of ground electrodes 531 are electrically connected by a plurality of wires 611. The plurality of wires 611 are included in the plurality of wires 610 of FIG. In FIG. 8, among the plurality of wires 611, the wire 611 ₁ that electrically connects the analog ground electrode 331 ₁ and the ground electrode 531 ₁ and the analog ground electrode 331 ₂ and the ground electrode 531 ₂ are electrically connected. The wire 611 ₂ and the like are shown in the figure.

When the image pickup unit 400B is viewed from the side, that is, when the image pickup unit 400B is viewed in the Y direction, the image pickup unit 400B is formed with an analog ground closed loop L3 straddling the image pickup element 300 and the wiring board 500B. In FIG. 8, the closed loop L3 is shown by a chain double-dashed line.

The closed loop L3 mainly includes the analog ground wiring 330 of the image sensor 300 and the ground wiring 571B of the wiring board 500B. More specifically, the closed loop L3 includes an analog ground wire 330, a pair of analog ground electrodes 331 ₁ , 331 ₂ , a pair of wires 611 ₁ , 611 ₂ , a pair of ground electrodes 531 ₁ , 531 ₂ and a ground wire 571B. I'm out.

The ground wiring 572B is a portion other than the ground wiring 571B when viewed in the Y direction, that is, a portion that does not contribute to the formation of the closed loop L3 of the analog ground. For example, the ground wiring 572B includes a portion that forms a closed loop of the digital ground together with the digital ground wiring 350 (FIG. 3) of the image sensor 300 when viewed in the Y direction, and a portion that does not contribute to the formation of any of the closed loops.

Here, the area of the closed loop L3 of the analog ground when viewed in the Y direction, that is, the area of the portion surrounded by the alternate long and short dash line in FIG. 8 is defined as S3. The ground wiring 571B is arranged closer to the image sensor 300 than the central C3 in the Z direction of the wiring board 500B. The center C3 is the center between the two main surfaces 501B and 502B, and is illustrated by the alternate long and short dash line in FIG. Since the entire ground wiring 571B is arranged closer to the image sensor 300 than the central C3 in the Z direction of the wiring board 500B, the area S3 of the closed loop L3 of the analog ground can be reduced. Since the induced electromotive force generated in the closed loop L3 is proportional to the area S3 of the closed loop L3, the induced electromotive force generated in the closed loop L3 can be reduced by reducing the area S3. Therefore, it is possible to reduce the potential fluctuation of the analog ground, and thereby it is possible to prevent pattern noise from occurring in the output image of the image sensor 300. That is, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

The ground wiring 571B is composed of only one conductor pattern 505B, which is the first conductor pattern. The conductor pattern 505B is arranged on the conductor layer 1B, which is the surface layer on the side where the image pickup device 300 is mounted on the wiring board 500B. The ground electrode 531 is integrally formed with the conductor pattern 505B. Since the conductor pattern 505B is arranged on the conductor layer 1B, the area S3 of the closed loop L3 can be made as small as possible, and the image generated by the image pickup device 300 can be effectively suppressed from being disturbed. The quality of the image is further improved.

The ground wiring 572B has a plurality of conductor patterns 506B which are a plurality of second conductor patterns arranged at intervals from each other, and a plurality of via conductors 508B which are a plurality of third via conductors. The conductor pattern 506B is arranged in the conductor layers 1B to 8B. The plurality of conductor patterns 506B are electrically connected by the plurality of via conductors 508B. The conductor pattern 506B of the conductor layer 1B is arranged at a position not included in the closed loop L3, that is, a position not in contact with the conductor pattern 505B. That is, in the conductor layer 1B, the conductor pattern 505B and the conductor pattern 506B are arranged apart from each other. The conductor pattern 506B of the conductor layer 1B may be integrally formed with a ground electrode (not shown) connected to the digital ground electrode 351 shown in FIG. 3 by wire bonding.

The ground of the analog circuit and the ground of the digital circuit of the image sensor 300 are preferably shared, and in the wiring board 500B, the ground wiring 571B and the ground wiring 572B are electrically connected. The ground wiring 571B and the ground wiring 572B are electrically connected by only one via conductor 511B, which is the first via conductor arranged at one place, so that the closed loop of the analog ground does not spread to the ground wiring 572B. There is. That is, the analog ground and the digital ground are connected only by the via conductor 511B. In FIG. 8, the via conductor 511B is shown by hatching different from the ground wirings 571B and 572B.

The ground wiring 571B is electrically connected to the analog ground wiring 330 of the image sensor 300, and the ground wiring 572B is electrically connected to the digital ground wiring 350 (FIG. 3) of the image sensor 300. The ground wiring 571B and the ground wiring 572B are electrically connected by only one via conductor 511B. Since the ground wiring 571B and the ground wiring 572B are electrically connected by only one via conductor 511B, the closed loop L3 of the analog ground does not extend to the ground wiring 572B, and the area S3 can be reduced. As a result, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

In the third embodiment, the via conductor 511B is arranged so as to penetrate the conductor pattern 506B of the conductor layer 2B, and electrically connects the conductor pattern 505B of the conductor layer 1B and the conductor pattern 506B of the conductor layer 3B. ..

The via conductor 511B is at least the center and end of the conductor pattern 505B of the conductor layer 1B, and in the third embodiment, the center and end of the conductor pattern 505B of the conductor layer 1B and the conductor pattern 506B of the conductor layer 3B when viewed in the Z direction. It is arranged avoiding. As a result, it is possible to effectively suppress the distortion of the image generated by the image sensor 300, and the quality of the generated image is further improved.

[Fourth Embodiment]
The imaging unit according to the fourth embodiment will be described. FIG. 9 is a cross-sectional view of the imaging unit 400C according to the fourth embodiment. FIG. 9 is a schematic view of the cross section of the imaging unit 400C at the position corresponding to the line AA shown in FIG. 4 as a side view. In the image pickup unit 400C of the fourth embodiment, the same components as those of the image pickup unit 400 of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 9, the image pickup unit 400C includes an image pickup element 300, a wiring board 500C, a frame 602, and a cover glass 603. The wiring board 500C is a printed wiring board in the fourth embodiment. The wiring board 500C has a conductor portion and an insulator portion. The conductor portion is made of a conductive metal material such as copper or gold. The insulating portion is made of an insulating material having electrical insulating properties, for example, an epoxy resin.

The wiring board 500C is a laminated substrate including a plurality of, for example, eight conductor layers 1C to 8C, which are arranged at intervals in the Z direction, which is the thickness direction of the wiring board 500C. An insulator layer is arranged between two adjacent conductor layers 1C to 8C. A conductor pattern is arranged in each of the conductor layers 1C to 8C. The wiring board 500C has two main surfaces 501C and 502C. The image sensor 300 is mounted on the main surface 501C on the side of the conductor layer 1C in the wiring board 500C.

The plurality of conductor layers 1C to 8C are laminated in the order of conductor layer 1C, conductor layer 2C, conductor layer 3C, conductor layer 4C, conductor layer 5C, conductor layer 6C, conductor layer 7C, and conductor layer 8C from the side of the image pickup element 300. Is arranged. The conductor layers 1C and 8C are surface layers, that is, outer layers, and the conductor layers 2C to 7C are inner layers. A circuit component 601 such as a capacitor is mounted on the main surface 502C on the side of the conductor layer 8C. The number of conductor layers is not limited to eight, and may be two or more. However, considering the arrangement of wiring and the like, the number of conductor layers is preferably 3 or more, and more preferably 4 or more. Further, a solder resist (not shown) may be provided on the conductor layers 1C and 8C.

The image sensor 300 is arranged on the main surface 501C and is connected to the wiring board 500C by wire bonding. The image sensor 300 is mounted on the wiring board 500C by wire bonding, but is not limited to this, and may be mounted on the wiring board by flip chip bonding. In this case, the image sensor and the wiring board are connected by a plurality of metal members such as a plurality of solder balls.

As shown in FIG. 3, the image pickup device 300 has an analog circuit 370. The analog circuit 370 includes a pixel array 310 and an analog ground wiring 330 electrically connected to the pixel array 310. Further, the image sensor 300 has a digital circuit 380. The digital circuit 380 has a digital ground wiring 350. As shown in FIG. 9, the wiring board 500C has a ground wiring portion 570C which is a ground. The ground wiring unit 570C includes a ground wiring 571C which is a first ground wiring and a ground wiring 572C which is a second ground wiring.

The ground wiring 571C is connected to a plurality of ground electrodes 531. The plurality of ground electrodes 531 are arranged in the conductor layer 1C. FIG. 9 shows a pair of ground electrodes 531 ₁ and 531 ₂ arranged apart from each other in the X direction among the plurality of ground electrodes 531. The analog ground wiring 330 is connected to a plurality of analog ground electrodes 331. FIG. 9 shows a pair of analog ground electrodes 331 ₁ and 331 ₂ arranged apart from each other in the X direction among the plurality of analog ground electrodes 331. The plurality of analog ground electrodes 331 and the plurality of ground electrodes 531 are electrically connected by a plurality of wires 611. The plurality of wires 611 are included in the plurality of wires 610 of FIG. In FIG. 9, among the plurality of wires 611, the wire 611 ₁ that electrically connects the analog ground electrode 331 ₁ and the ground electrode 531 ₁ and the analog ground electrode 331 ₂ and the ground electrode 531 ₂ are electrically connected. The wire 611 ₂ and the like are shown in the figure.

When the image pickup unit 400C is viewed from the side, that is, when the image pickup unit 400C is viewed in the Y direction, the image pickup unit 400C is formed with an analog ground closed loop L4 straddling the image pickup device 300 and the wiring board 500C. In FIG. 9, the closed loop L4 is shown by a chain double-dashed line.

The closed loop L4 mainly includes the analog ground wiring 330 of the image sensor 300 and the ground wiring 571C of the wiring board 500C. More specifically, the closed loop L4 comprises an analog ground wire 330, a pair of analog ground electrodes 331 ₁ , 331 ₂ , a pair of wires 611 ₁ , 611 ₂ , and a pair of ground electrodes 531 ₁ , 531 ₂ and a ground wire 571C. Includes.

The ground wiring 572C is a portion other than the ground wiring 571C when viewed in the Y direction, that is, a portion that does not contribute to the formation of the closed loop L4 of the analog ground. For example, the ground wiring 572C includes a portion that forms a closed loop of the digital ground together with the digital ground wiring 350 (FIG. 3) of the image sensor 300 when viewed in the Y direction, and a portion that does not contribute to the formation of any closed loop.

Let S4 be the area of the closed loop L4 of the analog ground when viewed in the Y direction, that is, the area of the portion surrounded by the alternate long and short dash line in FIG. The ground wiring 571C is arranged closer to the image sensor 300 than the central C4 in the Z direction of the wiring board 500C. The center C4 is the center between the two main surfaces 501C and 502C, and is illustrated by a alternate long and short dash line in FIG. Since the entire ground wiring 571C is arranged closer to the image sensor 300 than the central C4 in the Z direction of the wiring board 500C, the area S4 of the closed loop L4 of the analog ground can be reduced. Since the induced electromotive force generated in the closed loop L4 is proportional to the area S4 of the closed loop L4, the induced electromotive force generated in the closed loop L4 can be reduced by reducing the area S4. Therefore, it is possible to reduce the potential fluctuation of the analog ground, and thereby it is possible to prevent pattern noise from occurring in the output image of the image sensor 300. That is, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

In the fourth embodiment, the ground wiring 571C is composed of a plurality of conductor patterns 505C which are a plurality of first conductor patterns arranged at intervals from each other and a plurality of second via conductors connecting the plurality of conductor patterns 505C. Includes a plurality of via conductors 513C. In FIG. 9, three conductor patterns 505C are illustrated as a plurality of conductor patterns 505C. At least one of the plurality of conductor patterns 505C is arranged on the conductor layer 1C, which is the surface layer on the side where the image pickup device 300 is mounted on the wiring board 500C. The ground electrode 531 is integrally formed with the conductor pattern 505C of the conductor layer 1C. The remaining two conductor patterns 505C are arranged in the conductor layers 2C and 3C. Since the plurality of conductor patterns 505C are connected by the plurality of via conductors 513C, the induced current covers the entire plurality of conductor patterns 505C at frequencies in the kHz band, that is, at frequencies of 1 [kHz] or more and less than 1 [MHz]. It flows. As a result, fluctuations in the ground potential of the analog ground are effectively suppressed, and pattern noise is effectively suppressed, that is, the image generated by the image sensor 300 is distorted, and the generated image can be effectively suppressed. Quality is further improved.

As shown in FIG. 9, the closed loop L4 is the largest closed loop of the analog ground closed loops. Therefore, when viewed in the Y direction, the closed loop L4 includes a part of the conductor pattern 505C of the conductor layer 1C and a part of the conductor pattern 505C of the conductor layer 3C in the ground wiring 571C. Further, when viewed in the Y direction, the closed loop L4 has the two most distant via conductors 513C ₁ , 513C among the plurality of via conductors 513C connecting the conductor pattern 505C of the conductor layer 1C and the conductor pattern 505C of the conductor layer 3C. Includes ₂ .

The ground wiring 572C has a plurality of conductor patterns 506C which are a plurality of second conductor patterns arranged at intervals from each other, and a plurality of via conductors 508C which are a plurality of third via conductors. The conductor pattern 506C is arranged in the conductor layers 4C to 8C. The plurality of conductor patterns 506C are electrically connected by the plurality of via conductors 508C.

The ground of the analog circuit and the ground of the digital circuit of the image sensor 300 are preferably shared, and in the wiring board 500C, the ground wiring 571C and the ground wiring 572C are electrically connected. The ground wiring 571C is arranged closer to the image sensor 300 than the ground wiring 572C. The ground wiring 571C and the ground wiring 572C are electrically connected by only one via conductor 511C, which is the first via conductor arranged at one place, so that the closed loop of the analog ground does not spread to the ground wiring 572C. There is. That is, the analog ground and the digital ground are connected only by the via conductor 511C. In FIG. 9, the via conductor 511C is shown by hatching different from the ground wirings 571C and 572C.

The ground wiring 571C is electrically connected to the analog ground wiring 330 of the image sensor 300, and the ground wiring 572C is electrically connected to the digital ground wiring 350 (FIG. 3) of the image sensor 300. The ground wiring 571C and the ground wiring 572C are electrically connected by only one via conductor 511C. Since the ground wiring 571C and the ground wiring 572C are electrically connected by only one via conductor 511C, the closed loop L4 of the analog ground does not extend to the ground wiring 572C, and the area S4 can be reduced. As a result, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

In the fourth embodiment, the via conductor 511C is arranged so as to penetrate the conductor pattern 506C of the conductor layer 4C, and electrically connects the conductor pattern 505C of the conductor layer 3C and the conductor pattern 506C of the conductor layer 5C. ..

The via conductor 511C is at least the center and end of the conductor pattern 505C of the conductor layer 3C, and in the fourth embodiment, the center and end of the conductor pattern 505C of the conductor layer 3C and the conductor pattern 506C of the conductor layer 5C when viewed in the Z direction. It is arranged avoiding. As a result, it is possible to effectively suppress the distortion of the image generated by the image sensor 300, and the quality of the generated image is further improved.

[Fifth Embodiment]
The imaging unit according to the fifth embodiment will be described. In the first to fourth embodiments, a case where the first ground wiring and the second ground wiring are connected by only one first via conductor has been described. In the fifth embodiment, a case where the first ground wiring and the second ground wiring are connected only by a plurality of first via conductors will be described. FIG. 10 is a cross-sectional view of the imaging unit 400D according to the fifth embodiment. FIG. 11A is a plan view of the second conductor layer of the wiring board according to the fifth embodiment. FIG. 11B is a schematic view of the image sensor 300 in a plan view. FIG. 10 is a schematic view of the cross section of the imaging unit 400D along the line AA shown in FIG. 11A as a side view. In the image pickup unit 400D of the fifth embodiment, the same components as those of the image pickup unit 400 of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 10, the image pickup unit 400D includes an image pickup element 300, a wiring board 500D, a frame 602, and a cover glass 603. The wiring board 500D is a printed wiring board in the fifth embodiment. The wiring board 500D has a conductor portion and an insulator portion. The conductor portion is made of a conductive metal material such as copper or gold. The insulating portion is made of an insulating material having electrical insulating properties, for example, an epoxy resin.

The wiring board 500D is a laminated substrate including a plurality of, for example, eight conductor layers 1D to 8D, which are arranged at intervals in the Z direction, which is the thickness direction of the wiring board 500D. An insulator layer is arranged between two adjacent conductor layers 1D to 8D. A conductor pattern is arranged in each of the conductor layers 1D to 8D. The wiring board 500D has two main surfaces 501D and 502D. The image sensor 300 is mounted on the main surface 501D on the side of the conductor layer 1D in the wiring board 500D.

The plurality of conductor layers 1D to 8D are laminated in the order of the conductor layer 1D, the conductor layer 2D, the conductor layer 3D, the conductor layer 4D, the conductor layer 5D, the conductor layer 6D, the conductor layer 7D, and the conductor layer 8D from the side of the image pickup element 300. Is arranged. The conductor layers 1D and 8D are surface layers, that is, outer layers, and the conductor layers 2D to 7D are inner layers. A circuit component 601 such as a capacitor is mounted on the main surface 502D on the side of the conductor layer 8D. The number of conductor layers is not limited to eight, and may be two or more. However, considering the arrangement of wiring and the like, the number of conductor layers is preferably 3 or more, and more preferably 4 or more. Further, solder resists (not shown) may be provided on the conductor layers 1D and 8D.

The image sensor 300 is arranged on the main surface 501D and is connected to the wiring board 500D by wire bonding. The image sensor 300 is mounted on the wiring board 500D by wire bonding, but is not limited to this, and may be mounted on the wiring board by flip chip bonding. In this case, the image sensor and the wiring board are connected by a plurality of metal members such as a plurality of solder balls.

As shown in FIG. 3, the image pickup device 300 has an analog circuit 370. The analog circuit 370 includes a pixel array 310 and an analog ground wiring 330 electrically connected to the pixel array 310. Further, the image sensor 300 has a digital circuit 380. The digital circuit 380 has a digital ground wiring 350. As shown in FIG. 10, the wiring board 500D has a ground wiring portion 570D which is a ground. The ground wiring unit 570D includes a ground wiring 571D which is a first ground wiring and a ground wiring 572D which is a second ground wiring.

The ground wiring 571D is connected to a plurality of ground electrodes 531. The plurality of ground electrodes 531 are arranged in the conductor layer 1D. FIG. 10 shows a pair of ground electrodes 531 ₁ and 531 ₂ arranged apart from each other in the X direction among the plurality of ground electrodes 531. The analog ground wiring 330 is connected to a plurality of analog ground electrodes 331. FIG. 10 shows a pair of analog ground electrodes 331 ₁ and 331 ₂ arranged apart from each other in the X direction among the plurality of analog ground electrodes 331. The plurality of analog ground electrodes 331 and the plurality of ground electrodes 531 are electrically connected by a plurality of wires 611. The plurality of wires 611 are included in the plurality of wires 610 of FIG. In FIG. 10, among a plurality of wires 611, the wire 611 ₁ that electrically connects the analog ground electrode 331 ₁ and the ground electrode 531 ₁ and the analog ground electrode 331 ₂ and the ground electrode 531 ₂ are electrically connected. The wire 611 ₂ and the like are shown in the figure.

When the image pickup unit 400D is viewed from the side, that is, when the image pickup unit 400D is viewed in the Y direction, the image pickup unit 400D is formed with an analog ground closed loop L51 straddling the image pickup device 300 and the wiring board 500D. In FIG. 10, the closed loop L51 is shown by a chain double-dashed line.

The closed loop L51 mainly includes the analog ground wiring 330 of the image sensor 300 and the ground wiring 571D of the wiring board 500D. More specifically, the closed loop L51 includes an analog ground wire 330, a pair of analog ground electrodes 331 ₁ , 331 ₂ , a pair of wires 611 ₁ , 611 ₂ , a pair of ground electrodes 531 ₁ , 531 ₂ and a ground wire 571D. I'm out.

Let S51 be the area of the closed loop L51 of the analog ground when viewed in the Y direction. The ground wiring 571D is arranged closer to the image sensor 300 than the central C5 in the Z direction of the wiring board 500D. The center C5 is the center between the two main surfaces 501D and 502D, and is illustrated by the alternate long and short dash line in FIG. Since the entire ground wiring 571D is arranged closer to the image sensor 300 than the central C5 in the Z direction of the wiring board 500D, the area S51 of the closed loop L51 of the analog ground can be reduced. Since the induced electromotive force generated in the closed loop L51 is proportional to the area S51 of the closed loop L51, the induced electromotive force generated in the closed loop L51 can be reduced by reducing the area S51. Therefore, it is possible to reduce the potential fluctuation of the analog ground, and thereby it is possible to prevent pattern noise from occurring in the output image of the image sensor 300. That is, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

In the fifth embodiment, the ground wiring 571D is composed of only one conductor pattern 505D, which is the first conductor pattern. The conductor pattern 505D is arranged on the conductor layer 1D, which is the surface layer on the side where the image pickup device 300 is mounted on the wiring board 500D. The ground electrode 531 is integrally formed with the conductor pattern 505D. Since the conductor pattern 505D is arranged in the conductor layer 1D, the area S51 of the closed loop L51 can be made as small as possible, and the image generated by the image sensor 300 can be effectively suppressed from being disturbed. The quality of the image is further improved.

The ground wiring 572D has a plurality of conductor patterns 506D which are a plurality of second conductor patterns arranged at intervals from each other, and a plurality of via conductors 508D which are a plurality of third via conductors. The conductor pattern 506D is arranged in the conductor layers 2D to 8D. The plurality of conductor patterns 506D are electrically connected by the plurality of via conductors 508D.

The ground of the analog circuit and the ground of the digital circuit of the image sensor 300 are preferably shared, and in the wiring board 500D, the ground wiring 571D and the ground wiring 572D are electrically connected. The ground wiring 571D is arranged closer to the image sensor 300 than the ground wiring 572D. The ground wiring 571D and the ground wiring 572D are electrically connected only by a plurality of via conductors 511D, which are a plurality of first via conductors arranged at intervals from each other. In the fifth embodiment, the plurality of via conductors 511D are composed of two via conductors 511D ₁ and 511D ₂ . In FIG. 10, the via conductor 511D is shown by hatching different from the ground wirings 571D and 572D.

The ground wiring 571D is electrically connected to the analog ground wiring 330 of the image sensor 300, and the ground wiring 572D is electrically connected to the digital ground wiring 350 (FIG. 3) of the image sensor 300. The ground wiring 571D and the ground wiring 572D are electrically connected only by a plurality of via conductors 511D. In this way, the ground between the analog circuit and the digital circuit of the image sensor 300 is shared by the wiring board 500D.

Here, by connecting the ground wiring 571D and the ground wiring 572D with a plurality of via conductors 511D, a closed loop L52 that partially overlaps with the closed loop L51 is formed when viewed in the Y direction. In FIG. 10, the closed loop L52 is shown by a dotted line. Closed loop L52 includes analog ground wire 330, a pair of analog ground electrodes ₃₃₁ 1, 331 _2, a pair of wires ₆₁₁ 1, 611 _2, a pair of ground electrodes ₅₃₁ 1, 531 _2, and the ground wiring 571D. Further, the closed loop L52 includes the two most distant via conductors 511D ₁ , 511D ₂ of the plurality of via conductors 511D, and the ground wiring 572D. That is, the closed loop L52 is a closed loop larger than the closed loop L51 in which the closed loop L51 and the closed loop L50 formed on the ground wiring 572D are connected by a plurality of via conductors 511D.

The present inventors consider that even if the number of via conductors 511D is plural, if the distance between the plurality of via conductors 511D is narrow, the formed closed loop is divided into a closed loop L51 and a closed loop L50. I found that I could do it. Here, let D1 be the distance between the two most distant via conductors 511D ₁ and 511D ₂ among the plurality of via conductors 511D. The distance D1, as shown in FIG. 11 (a), and a portion opposite to the side facing the via conductors 511D ₂ in the via conductors 511D _1, the side facing the via conductors 511D ₁ in via conductors 511D ₂ is It is the linear distance from the opposite part.

The narrower the distance D1, the smaller the impedance of the portion between the via conductors 511D ₁ and 511D ₂ in the conductor pattern 505D. As the distance D1 becomes narrower, the impedance of this portion becomes relatively smaller than the total impedance of the impedance of the via conductors 511D ₁ and 511D _{2 and} the impedance of the portion of the closed loop L50 formed in the ground wiring 572D. Therefore, most of the induced current that loops through the analog ground wiring 330 can be regarded as flowing through the closed loop L51. On the contrary, the wider the distance D1, the larger the impedance of the portion between the via conductors 511D ₁ and 511D _{2 in} the conductor pattern 505D. The wider the distance D1, the closer the impedance of this portion is to the total impedance of the impedance of the via conductors 511D ₁ and 511D _{2 and} the impedance of the portion of the closed loop L50 formed in the ground wiring 572D. As a result, the induced current can be easily divided by the via conductors 511D ₁ and 511D ₂ .

第５実施形態では、複数のヴィア導体５１１Ｄが、図１１（ａ）に示すように２つのヴィア導体５１１Ｄ_１，５１１Ｄ_２のみであるため、この２つのヴィア導体５１１Ｄ_１，５１１Ｄ_２の距離Ｄ１が、上記の式を満たせばよい。 As shown in FIG. 11B, the outer shape of the image sensor 300 is rectangular when viewed in the Z direction. When the image sensor 300 is viewed in the Z direction, that is, when viewed in a plan view, the length of the long side 300X, which is the first side of the image sensor 300, is X1, and the length of the short side 300Y, which is the second side intersecting the long side. Let Y1 be. The present inventors have found that, of the plurality of via conductors 511D, the distance D1 of the two most distant via conductors 511D ₁ , 511D ₂ may be arranged so as to satisfy the following equation.

In the fifth embodiment, since the plurality of via conductors 511D are only two via conductors 511D ₁ , 511D ₂ as shown in FIG. 11A, the distance D1 of the _two via conductors 511D ₁ , 511D ₂ is set. , The above equation may be satisfied.

If the distance D1 satisfies the above equation, the plurality of via conductors 511D are arranged in a narrow range. Due to the arrangement of the plurality of via conductors 511D in a narrow range, the induced current flowing through the closed loop L52 is much smaller than the induced current flowing through the closed loop L51 even if the closed loop L52 apparently larger than the closed loop L51 is formed. .. Therefore, since the plurality of via conductors 511D are arranged in a narrow range, the closed loop of the analog ground can be regarded as the closed loop L51.

Further, the distance D1 is more preferable because the plurality of via conductors 511D are arranged in a narrower range if the following equation is satisfied.

As described above, according to the fifth embodiment, since the entire ground wiring 571D is arranged closer to the image sensor 300 than the central C5 as shown in FIG. 10, the area of the closed loop L51 can be reduced. By reducing the area of the closed loop L51, the potential fluctuation of the analog ground can be reduced, and thereby it is possible to prevent pattern noise from occurring in the output image of the image sensor 300. That is, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

Here, the distance between the two most distant via conductors 508D ₁ and 508D ₂ among the plurality of via conductors 508D in the ground wiring 572D is defined as D3. Distance D3 is the side facing the via conductors 508D ₂ in via conductors 508D ₁ is a linear distance between the opposite side portions and opposite side portions, the side facing the via conductors 508D ₁ in via conductors 508D ₂ .. In the fifth embodiment, the distance D1 is narrower than the distance D3. As a result, since the plurality of via conductors 511D are arranged in a narrow range, the induced current is more likely to flow in the closed loop L51 than in the closed loop L52. Therefore, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

In the fifth embodiment, the via conductor 511D is arranged so as to penetrate the conductor pattern 506D of the conductor layer 2D, and electrically connects the conductor pattern 505D of the conductor layer 1D and the conductor pattern 506D of the conductor layer 3D. .. Therefore, also in the fifth embodiment, as in the first to fourth embodiments, each via conductor 511D is at least one of the conductor pattern 505D of the conductor layer 2D and the conductor pattern 506D of the conductor layer 3D when viewed in the Z direction. It may be arranged so as to avoid the center and the end of the. As a result, it is possible to effectively suppress the distortion of the image generated by the image sensor 300, and the quality of the generated image is further improved.

[Sixth Embodiment]
The imaging unit according to the sixth embodiment will be described. FIG. 12 is a cross-sectional view of the imaging unit 400H according to the sixth embodiment. FIG. 12 shows a schematic view of the cross section of the imaging unit 400H at the position corresponding to the line AA shown in FIG. 4 as a side view. In the image pickup unit 400H of the sixth embodiment, the same components as those of the image pickup unit 400 of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 12, the image pickup unit 400H includes an image pickup element 300, a wiring board 500H, a frame 602, and a cover glass 603. The wiring board 500H is a printed wiring board in the sixth embodiment. The wiring board 500H has a conductor portion and an insulator portion. The conductor portion is made of a conductive metal material such as copper or gold. The insulating portion is made of an insulating material having electrical insulating properties, for example, an epoxy resin.

The wiring board 500H is a laminated substrate including a plurality of, for example, eight conductor layers 1H to 8H, which are arranged at intervals in the Z direction, which is the thickness direction of the wiring board 500H. An insulator layer is arranged between two adjacent conductor layers 1H to 8H. A conductor pattern is arranged in each of the conductor layers 1H to 8H. The wiring board 500H has two main surfaces 501H and 502H. The image sensor 300 is mounted on the main surface 501H on the side of the conductor layer 1H in the wiring board 500H.

The plurality of conductor layers 1H to 8H are laminated in the order of conductor layer 1H, conductor layer 2H, conductor layer 3H, conductor layer 4H, conductor layer 5H, conductor layer 6H, conductor layer 7H, and conductor layer 8H from the side of the image sensor 300. Is arranged. The conductor layers 1H and 8H are surface layers, that is, outer layers, and the conductor layers 2H to 7H are inner layers. A circuit component 601 such as a capacitor is mounted on the main surface 502H on the side of the conductor layer 8H. The number of conductor layers is not limited to eight, and may be two or more. However, considering the arrangement of wiring and the like, the number of conductor layers is preferably 3 or more, and more preferably 4 or more. Further, solder resists (not shown) may be provided on the conductor layers 1H and 8H.

The image pickup device 300 is arranged on the main surface 501H and is connected to the wiring board 500H by wire bonding. The image sensor 300 is mounted on the wiring board 500H by wire bonding, but is not limited to this, and may be mounted on the wiring board by flip chip bonding. In this case, the image sensor and the wiring board are connected by a plurality of metal members such as a plurality of solder balls.

As shown in FIG. 3, the image pickup device 300 has an analog circuit 370. The analog circuit 370 includes a pixel array 310 and an analog ground wiring 330 electrically connected to the pixel array 310. Further, the image sensor 300 has a digital circuit 380. The digital circuit 380 has a digital ground wiring 350. As shown in FIG. 12, the wiring board 500H has a ground wiring portion 570H which is a ground. The ground wiring unit 570H includes a ground wiring 571H which is a first ground wiring and a ground wiring 572H which is a second ground wiring.

The ground wiring 571H is connected to a plurality of ground electrodes 531. The plurality of ground electrodes 531 are arranged in the conductor layer 1H. FIG. 12 shows a pair of ground electrodes 531 ₁ and 531 ₂ arranged apart from each other in the X direction among the plurality of ground electrodes 531. The analog ground wiring 330 is connected to a plurality of analog ground electrodes 331. FIG. 12 shows a pair of analog ground electrodes 331 ₁ and 331 ₂ arranged apart from each other in the X direction among the plurality of analog ground electrodes 331. The plurality of analog ground electrodes 331 and the plurality of ground electrodes 531 are electrically connected by a plurality of wires 611. The plurality of wires 611 are included in the plurality of wires 610 of FIG. In FIG. 12, among the plurality of wires 611, the wire 611 ₁ that electrically connects the analog ground electrode 331 ₁ and the ground electrode 531 ₁ and the analog ground electrode 331 ₂ and the ground electrode 531 ₂ are electrically connected. The wire 611 ₂ and the like are shown in the figure.

When the image pickup unit 400H is viewed from the side, that is, when the image pickup unit 400H is viewed in the Y direction, the image pickup unit 400H is formed with an analog ground closed loop L9 straddling the image pickup device 300 and the wiring board 500H. In FIG. 12, the closed loop L9 is shown by a chain double-dashed line.

The closed loop L9 mainly includes the analog ground wiring 330 of the image sensor 300 and the ground wiring 571H of the wiring board 500H. More specifically, the closed loop L9 comprises an analog ground wiring 330, a pair of analog ground electrodes 331 ₁ , 331 ₂ , a pair of wires 611 ₁ , 611 ₂ , and a pair of ground electrodes 531 ₁ , 531 ₂ and a ground wiring 571H. Includes.

Let S9 be the area of the closed loop L9 of the analog ground when viewed in the Y direction, that is, the area of the portion surrounded by the alternate long and short dash line in FIG. The ground wiring 571H is arranged closer to the image sensor 300 than the central C9 in the Z direction of the wiring board 500H. The central C9 is the center between the two main surfaces 501H and 502H, and is illustrated by a alternate long and short dash line in FIG. Since the entire ground wiring 571H is arranged closer to the image sensor 300 than the central C9 in the Z direction of the wiring board 500H, the area S9 of the closed loop L9 of the analog ground can be reduced. Since the induced electromotive force generated in the closed loop L9 is proportional to the area S9 of the closed loop L9, the induced electromotive force generated in the closed loop L9 can be reduced by reducing the area S9. Therefore, it is possible to reduce the potential fluctuation of the analog ground, and thereby it is possible to prevent pattern noise from occurring in the output image of the image sensor 300. That is, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

In the sixth embodiment, the ground wiring 571H is composed of a plurality of conductor patterns 505H, which are a plurality of first conductor patterns arranged at intervals from each other, and a plurality of second via conductors connecting the plurality of conductor patterns 505H. Includes a plurality of via conductors 513H. FIG. 12 illustrates the three conductor patterns 505H. At least one of the plurality of conductor patterns 505H is arranged on the conductor layer 1H, which is the surface layer on the side where the image pickup device 300 is mounted on the wiring board 500H. The remaining two conductor patterns 505H are arranged in the conductor layers 2H and 3H. Since the plurality of conductor patterns 505H are connected by the plurality of via conductors 513H, the induced current covers the entire plurality of conductor patterns 505H at frequencies in the kHz band, that is, at frequencies of 1 [kHz] or more and less than 1 [MHz]. It flows. As a result, fluctuations in the ground potential of the analog ground are effectively suppressed, and pattern noise is effectively suppressed, that is, the image generated by the image sensor 300 is distorted, and the generated image can be effectively suppressed. Quality is further improved.

As shown in FIG. 12, the closed loop L9 is the largest closed loop of the analog ground closed loops. Therefore, when viewed in the Y direction, the closed loop L9 includes a part of the conductor pattern 505H of the conductor layer 1H and a part of the conductor pattern 505H of the conductor layer 3H in the ground wiring 571H. Further, when viewed in the Y direction, the closed loop L9 is the two most distant via conductors 513H ₁ , 513H among the plurality of via conductors 513H connecting the conductor pattern 505H of the conductor layer 1H and the conductor pattern 505H of the conductor layer 3H. ₂ is included.

The ground wiring 572H has a plurality of conductor patterns 506H which are a plurality of second conductor patterns arranged at intervals from each other, and a plurality of via conductors 508H which are a plurality of third via conductors. The conductor pattern 506H is arranged in the conductor layers 4H to 8H. The plurality of conductor patterns 506H are electrically connected by the plurality of via conductors 508H.

The ground of the analog circuit and the ground of the digital circuit of the image sensor 300 are preferably shared, and in the wiring board 500H, the ground wiring 571H and the ground wiring 572H are electrically connected. The ground wiring 571H is arranged closer to the image sensor 300 than the ground wiring 572H. In the sixth embodiment, the ground wiring 571H and the ground wiring 572H are electrically connected only by a plurality of via conductors 511H, which are a plurality of first via conductors. That is, the analog ground and the digital ground are connected only by a plurality of via conductors 511H. In FIG. 12, the via conductor 511H is shown by hatching different from the ground wirings 571H and 572H.

The ground wiring 571H is electrically connected to the analog ground wiring 330 of the image sensor 300, and the ground wiring 572H is electrically connected to the digital ground wiring 350 (FIG. 3) of the image sensor 300. The ground wiring 571H and the ground wiring 572H are electrically connected only by a plurality of via conductors 511H. In this way, the ground between the analog circuit and the digital circuit of the image sensor 300 is shared by the wiring board 500H.

Let D1 be the distance between the two most distant via conductors 511H ₁ and 511H ₂ among the plurality of via conductors 511H. The distance D1 is, the side facing the via conductors 511h ₂ In the via conductor 511h ₁ is a linear distance between the opposite side portions and opposite side portions, the side facing the via conductors 511h ₁ in the via conductor 511h ₂ ..

第６実施形態では、複数のヴィア導体５１１Ｈが２つのヴィア導体５１１Ｈ_１，５１１Ｈ_２のみであるため、この２つのヴィア導体５１１Ｈ_１，５１１Ｈ_２の距離Ｄ１が、上記の式を満たせばよい。 Similar to the fifth embodiment, as shown in FIG. 11B, the length of the long side 300X, which is the first side of the image sensor 300 when the image sensor 300 is viewed in the Z direction, that is, when viewed in a plan view. Is X1, and the length of the short side 300Y, which is the second side intersecting the long side, is Y1. As described in the fifth embodiment, the distance D1 of the two most distant via conductors 511H ₁ , 511H ₂ among the plurality of via conductors 511H may be arranged so as to satisfy the following equation.

In the sixth embodiment, since a plurality of via conductors 511h is only two via conductors 511h _1, 511h _2, the two via conductors 511h _1, 511h ₂ distance D1 may satisfy the above equation.

If the distance D1 satisfies the above equation, the plurality of via conductors 511H are arranged in a narrow range. Due to the arrangement of the plurality of via conductors 511H in a narrow range, the induced current flowing through the large closed loop is much smaller than the induced current flowing through the closed loop L9, even if a closed loop apparently larger than the closed loop L9 is formed. .. Therefore, since the plurality of via conductors 511H are arranged in a narrow range, the closed loop of the analog ground can be regarded as the closed loop L9.

Further, the distance D1 is more preferable because the plurality of via conductors 511H are arranged in a narrower range if the following equation is satisfied.

As described above, according to the sixth embodiment, since the entire ground wiring 571H is arranged closer to the image sensor 300 than the central C9 as shown in FIG. 12, the area of the closed loop L9 can be reduced. By reducing the area of the closed loop L9, the potential fluctuation of the analog ground can be reduced, and thereby it is possible to prevent pattern noise from occurring in the output image of the image sensor 300. That is, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

Here, the distance between the two most distant via conductors 513H ₁ and 513H ₂ among the plurality of via conductors 513H in the ground wiring 571H is defined as D2. Further, the distance between the two most distant via conductors 508H ₁ and 508H ₂ among the plurality of via conductors 508H in the ground wiring 572H is defined as D3. The distance D2 is the side facing the via conductors 513H ₂ in the via conductor 513H ₁ is a linear distance between the opposite side portions and opposite side portions, the side facing the via conductors 513H ₁ in the via conductor 513H ₂ .. Distance D3 is the side facing the via conductors 508H ₂ in the via conductor 508H ₁ is a linear distance between the opposite side portions and opposite side portions, the side facing the via conductors 508H ₁ in the via conductor 508H ₂ .. In the sixth embodiment, the distance D1 is narrower than the distance D2 and the distance D3. As a result, since the plurality of via conductors 511H are arranged in a narrow range, the induced current is more likely to flow in the closed loop L9 than in the large closed loop via the plurality of via conductors 511H. Therefore, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved. In FIG. 12, the distance D2 and the distance D3 are the same, but may be different.

In the sixth embodiment, the via conductor 511H is arranged so as to penetrate the conductor pattern 506H of the conductor layer 4H, and electrically connects the conductor pattern 505H of the conductor layer 3H and the conductor pattern 506H of the conductor layer 5H. .. Therefore, also in the sixth embodiment, as in the first to fourth embodiments, each via conductor 511H is at least one of the conductor pattern 505H of the conductor layer 3H and the conductor pattern 506H of the conductor layer 5H when viewed in the Z direction. It may be arranged so as to avoid the center and the end of the. As a result, it is possible to effectively suppress the distortion of the image generated by the image sensor 300, and the quality of the generated image is further improved.

[7th Embodiment]
The imaging unit according to the seventh embodiment will be described. In the fifth embodiment described above, as shown in FIG. 10, the case where the number of via conductors 511D electrically connecting the ground wiring 571D and the ground wiring 572D is two has been described, but the present invention is limited to this. It may be three or more. FIG. 13 is a cross-sectional view of the imaging unit 400I according to the seventh embodiment. FIG. 14 is a plan view of the second conductor layer of the wiring board according to the seventh embodiment. FIG. 13 shows a schematic view of the cross section of the imaging unit 400I along the line AA shown in FIG. 14 as a side view. In the image pickup unit 400I of the seventh embodiment, the same components as those of the image pickup unit 400 of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 13, the image pickup unit 400I includes an image pickup element 300, a wiring board 500I, a frame 602, and a cover glass 603. The wiring board 500I is a printed wiring board in the seventh embodiment. The wiring board 500I has a conductor portion and an insulator portion. The conductor portion is made of a conductive metal material such as copper or gold. The insulating portion is made of an insulating material having electrical insulating properties, for example, an epoxy resin.

The wiring board 500I is a laminated substrate including a plurality of, for example, eight conductor layers 1I to 8I, which are arranged at intervals in the Z direction, which is the thickness direction of the wiring board 500I. An insulator layer is arranged between two adjacent conductor layers 1I to 8I. A conductor pattern is arranged in each of the conductor layers 1I to 8I. The wiring board 500I has two main surfaces 501I and 502I. The image sensor 300 is mounted on the main surface 501I on the side of the conductor layer 1I in the wiring board 500I.

The plurality of conductor layers 1I to 8I are laminated in the order of conductor layer 1I, conductor layer 2I, conductor layer 3I, conductor layer 4I, conductor layer 5I, conductor layer 6I, conductor layer 7I, and conductor layer 8I from the side of the image sensor 300. Is arranged. The conductor layers 1I and 8I are surface layers, that is, outer layers, and the conductor layers 2I to 7I are inner layers. Circuit components 601 such as capacitors are mounted on the main surface 502I on the side of the conductor layer 8I. The number of conductor layers is not limited to eight, and may be two or more. However, considering the arrangement of wiring and the like, the number of conductor layers is preferably 3 or more, and more preferably 4 or more. Further, a solder resist (not shown) may be provided on the conductor layers 1I and 8I.

The image pickup device 300 is arranged on the main surface 501I and is connected to the wiring board 500I by wire bonding. The image sensor 300 is mounted on the wiring board 500I by wire bonding, but the present invention is not limited to this, and the image sensor 300 may be mounted on the wiring board by flip chip bonding. In this case, the image sensor and the wiring board are connected by a plurality of metal members such as a plurality of solder balls.

As shown in FIG. 3, the image pickup device 300 has an analog circuit 370. The analog circuit 370 includes a pixel array 310 and an analog ground wiring 330 electrically connected to the pixel array 310. Further, the image sensor 300 has a digital circuit 380. The digital circuit 380 has a digital ground wiring 350. As shown in FIG. 13, the wiring board 500I has a ground wiring portion 570I which is a ground. The ground wiring unit 570I includes a ground wiring 571I which is a first ground wiring and a ground wiring 572I which is a second ground wiring.

The ground wiring 571I is connected to a plurality of ground electrodes 531. The plurality of ground electrodes 531 are arranged in the conductor layer 1I. FIG. 13 illustrates a pair of ground electrodes 531 ₁ and 531 ₂ arranged apart from each other in the X direction among the plurality of ground electrodes 531. The analog ground wiring 330 is connected to a plurality of analog ground electrodes 331. FIG. 13 illustrates a pair of analog ground electrodes 331 ₁ and 331 ₂ arranged apart from each other in the X direction among the plurality of analog ground electrodes 331. The plurality of analog ground electrodes 331 and the plurality of ground electrodes 531 are electrically connected by a plurality of wires 611. The plurality of wires 611 are included in the plurality of wires 610 of FIG. In FIG. 13, among the plurality of wires 611, the wire 611 ₁ that electrically connects the analog ground electrode 331 ₁ and the ground electrode 531 ₁ and the analog ground electrode 331 ₂ and the ground electrode 531 ₂ are electrically connected. The wire 611 ₂ and the like are shown in the figure.

When the image pickup unit 400I is viewed from the side, that is, when the image pickup unit 400I is viewed in the Y direction, the image pickup unit 400I is formed with an analog ground closed loop L10 straddling the image pickup device 300 and the wiring board 500I. In FIG. 13, the closed loop L10 is shown by a chain double-dashed line.

The closed loop L10 mainly includes the analog ground wiring 330 of the image sensor 300 and the ground wiring 571I of the wiring board 500I. More specifically, the closed loop L10 includes an analog ground wire 330, a pair of analog ground electrodes 331 ₁ , 331 ₂ , a pair of wires 611 ₁ , 611 ₂ , a pair of ground electrodes 531 ₁ , 531 ₂ and a ground wire 571 I. I'm out.

Let S10 be the area of the closed loop L10 of the analog ground when viewed in the Y direction. The ground wiring 571I is arranged closer to the image sensor 300 than the central C10 in the Z direction of the wiring board 500I. The center C10 is the center between the two main surfaces 501I and 502I, and is illustrated by a alternate long and short dash line in FIG. Since the entire ground wiring 571I is arranged closer to the image sensor 300 than the central C10 in the Z direction of the wiring board 500I, the area S10 of the closed loop L10 of the analog ground can be reduced. Since the induced electromotive force generated in the closed loop L10 is proportional to the area S10 of the closed loop L10, the induced electromotive force generated in the closed loop L10 can be reduced by reducing the area S10. Therefore, it is possible to reduce the potential fluctuation of the analog ground, and thereby it is possible to prevent pattern noise from occurring in the output image of the image sensor 300. That is, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

In the seventh embodiment, the ground wiring 571I is composed of only one conductor pattern 505I, which is the first conductor pattern. The conductor pattern 505I is arranged on the conductor layer 1I, which is the surface layer on the side where the image sensor 300 is mounted on the wiring board 500I. The ground electrode 531 is integrally formed with the conductor pattern 505I. Since the conductor pattern 505I is arranged in the conductor layer 1I, the area S10 of the closed loop L10 can be made as small as possible, and the image generated by the image sensor 300 can be effectively suppressed from being disturbed. The quality of the image is further improved.

The ground wiring 572I has a plurality of conductor patterns 506I which are a plurality of second conductor patterns arranged at intervals from each other, and a plurality of via conductors 508I which are a plurality of third via conductors. The conductor pattern 506I is arranged in the conductor layers 2I to 8I. The plurality of conductor patterns 506I are electrically connected by the plurality of via conductors 508I.

The ground of the analog circuit of the image sensor 300 and the ground of the digital circuit are preferably shared, and in the wiring board 500I, the ground wiring 571I and the ground wiring 572I are electrically connected. The ground wiring 571I is arranged closer to the image sensor 300 than the ground wiring 572I. In the seventh embodiment, the ground wiring 571I and the ground wiring 572I are electrically connected only by a plurality of via conductors 511I, which are a plurality of first via conductors. That is, the analog ground and the digital ground are connected only by a plurality of via conductors 511I. In FIG. 13, the via conductor 511I is shown by hatching different from the ground wirings 571I and 572I.

The ground wiring 571I is electrically connected to the analog ground wiring 330 of the image sensor 300, and the ground wiring 572I is electrically connected to the digital ground wiring 350 (FIG. 3) of the image sensor 300. The ground wiring 571I and the ground wiring 572I are electrically connected only by a plurality of via conductors 511I. In this way, the ground between the analog circuit and the digital circuit of the image sensor 300 is shared by the wiring board 500I.

Here, as shown in FIG. 14, the distance between the two most distant via conductors 511I ₁ and 511I ₂ among the plurality of via conductors 511I is defined as D1. The distance D1 is, the side facing the via conductors 511i ₂ in the via conductor 511i ₁ is a linear distance between the opposite side portions and opposite side portions, the side facing the via conductors 511i ₁ in the via conductor 511i ₂ ..

第７実施形態では、図１４に示すように、３行３列に配置された９つのヴィア導体５１１Ｉがあるため、これら９つのヴィア導体５１１Ｉのうち対角に位置する２つのヴィア導体５１１Ｉ_１，５１１Ｉ_２の距離Ｄ１が、上記の式を満たせばよい。 Similar to the fifth embodiment, as shown in FIG. 11B, the length of the long side 300X, which is the first side of the image sensor 300 when the image sensor 300 is viewed in the Z direction, that is, when viewed in a plan view. Is X1, and the length of the short side 300Y, which is the second side intersecting the long side, is Y1. As described in the fifth embodiment, the distance D1 of the two most distant via conductors 511I ₁ and 511I ₂ among the plurality of via conductors 511I may be arranged so as to satisfy the following equation.

In the seventh embodiment, as shown in FIG. 14, since there are nine via conductors 511I arranged in three rows and three columns, two via conductors 511I ₁ , which are diagonally located among these nine via conductors 511I, The distance D1 of 511I ₂ may satisfy the above equation.

If the distance D1 satisfies the above equation, the plurality of via conductors 511I are arranged in a narrow range. Due to the arrangement of the plurality of via conductors 511I in a narrow range, the induced current flowing through the large closed loop is much smaller than the induced current flowing through the closed loop L10, even if a closed loop apparently larger than the closed loop L10 is formed. .. Therefore, since the plurality of via conductors 511I are arranged in a narrow range, the closed loop of the analog ground can be regarded as the closed loop L10.

Further, the distance D1 is more preferable because the plurality of via conductors 511I are arranged in a narrower range if the following equation is satisfied.

As described above, according to the seventh embodiment, since the entire ground wiring 571I is arranged closer to the image sensor 300 than the central C10 as shown in FIG. 13, the area of the closed loop L10 can be reduced. By reducing the area of the closed loop L10, the potential fluctuation of the analog ground can be reduced, and thereby it is possible to prevent pattern noise from occurring in the output image of the image sensor 300. That is, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

Here, the distance between the two most distant via conductors 508I ₁ and 508I ₂ among the plurality of via conductors 508I in the ground wiring 572I is defined as D3. Distance D3 is the side facing the via conductors 508I ₂ in the via conductor 508I ₁ is a linear distance between the opposite side portions and opposite side portions, the side facing the via conductors 508I ₁ in the via conductor 508I ₂ .. In the seventh embodiment, the distance D1 is narrower than the distance D3. As a result, since the plurality of via conductors 511I are arranged in a narrow range, the induced current is more likely to flow in the closed loop L10 than in the large closed loop through the plurality of via conductors 511I. Therefore, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

In the seventh embodiment, the plurality of via conductors 511I are arranged through one hole formed in the conductor pattern 506I of the conductor layer 2I, as shown in FIG. Then, as shown in FIG. 13, the plurality of via conductors 511I electrically connect the conductor pattern 505I of the conductor layer 1I and the conductor pattern 506I of the conductor layer 3I.

As shown in FIG. 14, the wiring board 500I of FIG. 13 has a conductor pattern 512I arranged in an opening formed in the conductor pattern 506I in a non-contact state with the conductor pattern 506I of the conductor layer 2I. The conductor pattern 512I is an example of the third conductor pattern. The conductor pattern 512I is arranged in the conductor layer 2I and connects a plurality of via conductors 511I. As a result, the intermediate portions in the Z direction of the plurality of via conductors 511I are electrically connected by the conductor pattern 512I.

In the seventh embodiment, the plurality of via conductors 511I are arranged so as to penetrate the conductor pattern 506I of the conductor layer 2I, and electrically connect the conductor pattern 505I of the conductor layer 1I and the conductor pattern 506I of the conductor layer 3I. ing.

The plurality of via conductors 511I are at least the center and end of the conductor pattern 505I of the conductor layer 1I, and in the seventh embodiment, the center and the center of the conductor pattern 505I of the conductor layer 1I and the conductor pattern 506I of the conductor layer 3I when viewed in the Z direction. It is placed away from the edges. As a result, it is possible to effectively suppress the distortion of the image generated by the image sensor 300, and the quality of the generated image is further improved.

The ground wiring 571I in the seventh embodiment may be configured in the same manner as the ground wiring 571H in FIG. 12 described in the sixth embodiment. At that time, as in the sixth embodiment, the distance D1 may be narrower than the distance D2 in FIG.

[8th Embodiment]
The imaging unit according to the eighth embodiment will be described. In the eighth embodiment, a case where a plurality of conductor patterns of the second ground wiring are arranged in any of the conductor layers will be described. FIG. 15 is a cross-sectional view of the imaging unit 400E according to the eighth embodiment. FIG. 16 is a plan view of the second conductor layer and the third conductor layer of the wiring board according to the eighth embodiment. FIG. 15 shows a schematic view of the cross section of the imaging unit 400E along the line AA shown in FIG. 16 as a side view. In the image pickup unit 400E of the eighth embodiment, the same components as those of the image pickup unit 400 of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 15, the image pickup unit 400E includes an image pickup element 300, a wiring board 500E, a frame 602, and a cover glass 603. The wiring board 500E is a printed wiring board in the eighth embodiment. The wiring board 500E has a conductor portion and an insulator portion. The conductor portion is made of a conductive metal material such as copper or gold. The insulating portion is made of an insulating material having electrical insulating properties, for example, an epoxy resin.

The wiring board 500E is a laminated substrate including a plurality of, for example, eight conductor layers 1E to 8E, which are arranged at intervals in the Z direction, which is the thickness direction of the wiring board 500E. An insulator layer is arranged between two adjacent conductor layers 1E to 8E. A conductor pattern is arranged in each of the conductor layers 1E to 8E. The wiring board 500E has two main surfaces 501E and 502E. The image sensor 300 is mounted on the main surface 501E on the side of the conductor layer 1E in the wiring board 500E.

The plurality of conductor layers 1E to 8E are laminated in the order of conductor layer 1E, conductor layer 2E, conductor layer 3E, conductor layer 4E, conductor layer 5E, conductor layer 6E, conductor layer 7E, and conductor layer 8E from the side of the image sensor 300. Is arranged. The conductor layers 1E and 8E are surface layers, that is, outer layers, and the conductor layers 2E to 7E are inner layers. A circuit component 601 such as a capacitor is mounted on the main surface 502E on the side of the conductor layer 8E. The number of conductor layers is not limited to eight, and may be two or more. However, considering the arrangement of wiring and the like, the number of conductor layers is preferably 3 or more, and more preferably 4 or more. Further, solder resists (not shown) may be provided on the conductor layers 1E and 8E.

The image pickup device 300 is arranged on the main surface 501E and is connected to the wiring board 500E by wire bonding. The image sensor 300 is mounted on the wiring board 500E by wire bonding, but is not limited to this, and may be mounted on the wiring board by flip chip bonding. In this case, the image sensor and the wiring board are connected by a plurality of metal members such as a plurality of solder balls.

As shown in FIG. 3, the image pickup device 300 has an analog circuit 370. The analog circuit 370 includes a pixel array 310 and an analog ground wiring 330 electrically connected to the pixel array 310. Further, the image sensor 300 has a digital circuit 380. The digital circuit 380 has a digital ground wiring 350. As shown in FIG. 15, the wiring board 500E has a ground wiring portion 570E which is a ground. The ground wiring unit 570E includes a ground wiring 571E which is a first ground wiring and a ground wiring 572E which is a second ground wiring.

The ground wiring 571E is connected to a plurality of ground electrodes 531. The plurality of ground electrodes 531 are arranged in the conductor layer 1E. FIG. 15 shows a pair of ground electrodes 531 ₁ and 531 ₂ arranged apart from each other in the X direction among the plurality of ground electrodes 531. The analog ground wiring 330 is connected to a plurality of analog ground electrodes 331. FIG. 15 shows a pair of analog ground electrodes 331 ₁ and 331 ₂ arranged apart from each other in the X direction among the plurality of analog ground electrodes 331. The plurality of analog ground electrodes 331 and the plurality of ground electrodes 531 are electrically connected by a plurality of wires 611. The plurality of wires 611 are included in the plurality of wires 610 of FIG. In FIG. 15, among a plurality of wires 611, the wire 611 ₁ that electrically connects the analog ground electrode 331 ₁ and the ground electrode 531 ₁ and the analog ground electrode 331 ₂ and the ground electrode 531 ₂ are electrically connected. The wire 611 ₂ and the like are shown in the figure.

When the image pickup unit 400E is viewed from the side, that is, when the image pickup unit 400E is viewed in the Y direction, the image pickup unit 400E is formed with an analog ground closed loop L6 straddling the image pickup device 300 and the wiring board 500E. In FIG. 15, the closed loop L6 is shown by a chain double-dashed line.

The closed loop L6 mainly includes the analog ground wiring 330 of the image sensor 300 and the ground wiring 571E of the wiring board 500E. More specifically, the closed loop L6 includes an analog ground wire 330, a pair of analog ground electrodes 331 ₁ , 331 ₂ , a pair of wires 611 ₁ , 611 ₂ , a pair of ground electrodes 531 ₁ , 531 ₂ and a ground wire 571E. I'm out.

The ground wiring 572E is a portion other than the ground wiring 571E when viewed in the Y direction, that is, a portion that does not contribute to the formation of the closed loop L6 of the analog ground. For example, the ground wiring 572E includes a portion that forms a closed loop of the digital ground together with the digital ground wiring 350 (FIG. 3) of the image sensor 300 when viewed in the Y direction, and a portion that does not contribute to the formation of any of the closed loops.

Here, the area of the closed loop L6 of the analog ground when viewed in the Y direction, that is, the area of the portion surrounded by the alternate long and short dash line in FIG. 15 is defined as S6. The ground wiring 571E is arranged closer to the image sensor 300 than the central C6 in the Z direction of the wiring board 500E. The center C6 is the center between the two main surfaces 501E and 502E, and is illustrated by the alternate long and short dash line in FIG. Since the entire ground wiring 571E is arranged closer to the image sensor 300 than the central C6 in the Z direction of the wiring board 500E, the area S6 of the closed loop L6 of the analog ground can be reduced. Since the induced electromotive force generated in the closed loop L6 is proportional to the area S6 of the closed loop L6, the induced electromotive force generated in the closed loop L6 can be reduced by reducing the area S6. Therefore, it is possible to reduce the potential fluctuation of the analog ground, and thereby it is possible to prevent pattern noise from occurring in the output image of the image sensor 300. That is, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

The ground wiring 571E is composed of only one conductor pattern 505E, which is the first conductor pattern. The conductor pattern 505E is arranged on the conductor layer 1E, which is the surface layer on the side where the image pickup device 300 is mounted on the wiring board 500E. The ground electrode 531 is integrally formed with the conductor pattern 505E. Since the conductor pattern 505E is arranged on the conductor layer 1E, the area S6 of the closed loop L6 can be made as small as possible, and the image generated by the image sensor 300 can be effectively suppressed from being disturbed. The quality of the image is further improved.

The ground of the analog circuit and the ground of the digital circuit of the image sensor 300 are preferably shared, and in the wiring board 500E, the ground wiring 571E and the ground wiring 572E are electrically connected. The ground wiring 571E is arranged closer to the image sensor 300 than the ground wiring 572E. The ground wiring 571E and the ground wiring 572E are electrically connected by only one via conductor 511E, which is the first via conductor arranged at one place, so that the closed loop of the analog ground does not extend to the ground wiring 572E. There is. That is, the analog ground and the digital ground are connected only by the via conductor 511E. In FIG. 15, the via conductor 511E is shown by hatching different from the ground wirings 571E and 572E.

The ground wiring 571E is electrically connected to the analog ground wiring 330 of the image sensor 300, and the ground wiring 572E is electrically connected to the digital ground wiring 350 (FIG. 3) of the image sensor 300. The ground wiring 571E and the ground wiring 572E are electrically connected by only one via conductor 511E. Since the ground wiring 571E and the ground wiring 572E are electrically connected by only one via conductor 511E, the closed loop L6 of the analog ground does not extend to the ground wiring 572E, and the area S6 can be reduced. As a result, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

The via conductor 511E is arranged so as to avoid at least the center and the end of the conductor pattern 505E of the conductor layer 1E when viewed in the Z direction. As a result, it is possible to effectively suppress the distortion of the image generated by the image sensor 300, and the quality of the generated image is further improved.

The ground wiring 572E has a plurality of conductor patterns 506E which are a plurality of second conductor patterns arranged at intervals from each other, and a plurality of via conductors 508E which are a plurality of third via conductors. The conductor pattern 506E is arranged in the conductor layers 2E to 8E. The plurality of conductor patterns 506E are electrically connected by the plurality of via conductors 508E.

A plurality of conductor patterns 506E are arranged in each of the conductor layers 2E and 3E, and two conductor patterns 506E are arranged in FIG. 16, and one conductor pattern 506E which is a solid pattern is arranged in each of the conductor layers 4E to 8E. That is, as shown in FIG. 16, in the conductor layers 2E and 3E, the two conductor patterns 506E are not connected to each other. Therefore, the two conductor patterns 506E in each of the conductor layers 2E and 3E are electrically connected by the plurality of via conductors 508E and the conductor patterns 506E arranged in the other conductor layers 4E to 8E. As described above, the plurality of conductor patterns 506E included in the ground wiring 572E need only be electrically connected by the plurality of via conductors 508E, and the number of conductor patterns 506E arranged in each conductor layer is limited to a single number. There may be more than one.

[9th Embodiment]
The imaging unit according to the ninth embodiment will be described. FIG. 17 is a cross-sectional view of the imaging unit 400F according to the ninth embodiment. FIG. 18 is a plan view of the second conductor layer of the wiring board according to the ninth embodiment. FIG. 17 shows a schematic view of the cross section of the image pickup unit 400F along the line AA shown in FIG. 18 as a side view. In the image pickup unit 400F of the ninth embodiment, the same components as those of the image pickup unit 400 of the first embodiment are designated by the same reference numerals, and the description thereof will be omitted.

As shown in FIG. 17, the image pickup unit 400F includes an image pickup element 300, a wiring board 500F, a frame 602, and a cover glass 603. The wiring board 500F is a printed wiring board in the ninth embodiment. The wiring board 500F has a conductor portion and an insulator portion. The conductor portion is made of a conductive metal material such as copper or gold. The insulating portion is made of an insulating material having electrical insulating properties, for example, an epoxy resin.

The wiring board 500F is a laminated substrate including a plurality of, for example, eight conductor layers 1F to 8F, which are arranged at intervals in the Z direction, which is the thickness direction of the wiring board 500F. An insulator layer is arranged between two adjacent conductor layers 1F to 8F. A conductor pattern is arranged on each of the conductor layers 1F to 8F. The wiring board 500F has two main surfaces 501F and 502F. The image sensor 300 is mounted on the main surface 501F on the side of the conductor layer 1F in the wiring board 500F.

The plurality of conductor layers 1F to 8F are laminated in the order of conductor layer 1F, conductor layer 2F, conductor layer 3F, conductor layer 4F, conductor layer 5F, conductor layer 6F, conductor layer 7F, and conductor layer 8F from the side of the image sensor 300. Is arranged. The conductor layers 1F and 8F are surface layers, that is, outer layers, and the conductor layers 2F to 7F are inner layers. Circuit components 601 such as capacitors are mounted on the main surface 502F on the side of the conductor layer 8F. The number of conductor layers is not limited to eight, and may be two or more. However, considering the arrangement of wiring and the like, the number of conductor layers is preferably 3 or more, and more preferably 4 or more. Further, solder resists (not shown) may be provided on the conductor layers 1F and 8F.

The image sensor 300 is arranged on the main surface 501F and is connected to the wiring board 500F by wire bonding. The image sensor 300 is mounted on the wiring board 500F by wire bonding, but is not limited to this, and may be mounted on the wiring board by flip chip bonding. In this case, the image sensor and the wiring board are connected by a plurality of metal members such as a plurality of solder balls.

As shown in FIG. 3, the image pickup device 300 has an analog circuit 370. The analog circuit 370 includes a pixel array 310 and an analog ground wiring 330 electrically connected to the pixel array 310. Further, the image sensor 300 has a digital circuit 380. The digital circuit 380 has a digital ground wiring 350. As shown in FIG. 17, the wiring board 500F has a ground wiring portion 570F which is a ground. The ground wiring unit 570F includes a ground wiring 571F which is a first ground wiring and a ground wiring 572F which is a second ground wiring.

The ground wiring 571F is connected to a plurality of ground electrodes 531. The plurality of ground electrodes 531 are arranged on the conductor layer 1F. FIG. 17 shows a pair of ground electrodes 531 ₁ and 531 ₂ arranged apart from each other in the X direction among the plurality of ground electrodes 531. The analog ground wiring 330 is connected to a plurality of analog ground electrodes 331. FIG. 17 shows a pair of analog ground electrodes 331 ₁ and 331 ₂ arranged apart from each other in the X direction among the plurality of analog ground electrodes 331. The plurality of analog ground electrodes 331 and the plurality of ground electrodes 531 are electrically connected by a plurality of wires 611. The plurality of wires 611 are included in the plurality of wires 610 of FIG. In FIG. 17, among the plurality of wires 611, the wire 611 ₁ that electrically connects the analog ground electrode 331 ₁ and the ground electrode 531 ₁ and the analog ground electrode 331 ₂ and the ground electrode 531 ₂ are electrically connected. The wire 611 ₂ and the like are shown in the figure.

When the image sensor 400F is viewed from the side, that is, when the image sensor 400F is viewed in the Y direction, the image sensor 400F is formed with an analog ground closed loop L7 straddling the image sensor 300 and the wiring board 500F. In FIG. 17, the closed loop L7 is shown by a chain double-dashed line.

The closed loop L7 mainly includes the analog ground wiring 330 of the image sensor 300 and the ground wiring 571F of the wiring board 500F. More specifically, the closed loop L7 includes an analog ground wire 330, a pair of analog ground electrodes 331 ₁ , 331 ₂ , a pair of wires 611 ₁ , 611 ₂ , a pair of ground electrodes 531 ₁ , 531 ₂ and a ground wire 571F. I'm out.

The ground wiring 572F is a portion other than the ground wiring 571F when viewed in the Y direction, that is, a portion that does not contribute to the formation of the closed loop L7 of the analog ground. For example, the ground wiring 572F includes a portion that forms a closed loop of the digital ground together with the digital ground wiring 350 (FIG. 3) of the image sensor 300 when viewed in the Y direction, and a portion that does not contribute to the formation of any of the closed loops.

Here, the area of the closed loop L7 of the analog ground when viewed in the Y direction, that is, the area of the portion surrounded by the alternate long and short dash line in FIG. 17 is defined as S7. The ground wiring 571F is arranged closer to the image sensor 300 than the central C7 in the Z direction of the wiring board 500F. The center C7 is the center between the two main surfaces 501F and 502F, and is illustrated by a alternate long and short dash line in FIG. Since the entire ground wiring 571F is arranged closer to the image sensor 300 than the central C7 in the Z direction of the wiring board 500F, the area S7 of the closed loop L7 of the analog ground can be reduced. Since the induced electromotive force generated in the closed loop L7 is proportional to the area S7 of the closed loop L7, the induced electromotive force generated in the closed loop L7 can be reduced by reducing the area S7. Therefore, it is possible to reduce the potential fluctuation of the analog ground, and thereby it is possible to prevent pattern noise from occurring in the output image of the image sensor 300. That is, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

The ground wiring 571F is composed of only one conductor pattern 505F, which is the first conductor pattern. The conductor pattern 505F is arranged on the conductor layer 1F, which is the surface layer on the side where the image pickup device 300 is mounted on the wiring board 500F. The ground electrode 531 is integrally formed with the conductor pattern 505F. Since the conductor pattern 505F is arranged on the conductor layer 1F, the area S7 of the closed loop L7 can be made as small as possible, and the image generated by the image sensor 300 can be effectively suppressed from being disturbed. The quality of the image is further improved.

The ground of the analog circuit and the ground of the digital circuit of the image sensor 300 are preferably shared, and in the wiring board 500F, the ground wiring 571F and the ground wiring 572F are electrically connected. The ground wiring 571F is arranged closer to the image sensor 300 than the ground wiring 572F. The ground wiring 571F and the ground wiring 572F are electrically connected by only one via conductor 511F, which is the first via conductor arranged at one place, so that the closed loop of the analog ground does not spread to the ground wiring 572F. There is. That is, the analog ground and the digital ground are connected only by the via conductor 511F. In FIG. 17, the via conductor 511F is shown by hatching different from the ground wirings 571F and 572F.

The ground wiring 571F is electrically connected to the analog ground wiring 330 of the image sensor 300, and the ground wiring 572F is electrically connected to the digital ground wiring 350 (FIG. 3) of the image sensor 300. The ground wiring 571F and the ground wiring 572F are electrically connected by only one via conductor 511F. Since the ground wiring 571F and the ground wiring 572F are electrically connected by only one via conductor 511F, the closed loop of the analog ground does not extend to the ground wiring 572F, and the area S7 can be reduced. As a result, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

The via conductor 511F is arranged so as to avoid at least the center and the end of the conductor pattern 505F of the conductor layer 1F when viewed in the Z direction. As a result, it is possible to effectively suppress the distortion of the image generated by the image sensor 300, and the quality of the generated image is further improved.

The ground wiring 572F has a plurality of conductor patterns 506F which are a plurality of second conductor patterns arranged at intervals from each other, and a plurality of via conductors 508F which are a plurality of third via conductors. The conductor pattern 506F is arranged in the conductor layers 2F to 8F. The plurality of conductor patterns 506F are electrically connected by the plurality of via conductors 508F.

One conductor pattern 506F is arranged in the conductor layer 2F, a plurality of conductor patterns 506F are arranged in the conductor layer 3F, and one conductor pattern 506F which is a solid pattern is arranged in the conductor layers 4F to 8F. As shown in FIG. 18, the conductor pattern 506F arranged on the conductor layer 2F does not have to be a solid pattern. That is, the shape of each conductor pattern 506F is not limited to the solid pattern, and may be arbitrary.

[10th Embodiment]
The imaging unit according to the tenth embodiment will be described. 19 and 20 are cross-sectional views of the imaging unit 400G according to the tenth embodiment. FIG. 21 is a plan view of the first conductor layer of the wiring board according to the tenth embodiment. FIG. 19 shows a schematic view of the cross section of the imaging unit 400G along the line A1-A1 shown in FIG. 21 as a side view. FIG. 20 shows a schematic view of the cross section of the imaging unit 400G along the line A2-A2 shown in FIG. 21 as a side view. In the tenth embodiment, the same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIGS. 19 and 20, the image pickup unit 400G includes an image pickup element 300, a wiring board 500G, a frame 602, and a cover glass 603. The wiring board 500G is a printed wiring board in the tenth embodiment. The wiring board 500G has a conductor portion and an insulator portion. The conductor portion is made of a conductive metal material such as copper or gold. The insulating portion is made of an insulating material having electrical insulating properties, for example, an epoxy resin.

The wiring board 500G is a laminated substrate including a plurality of, for example, eight conductor layers 1G to 8G, which are arranged at intervals in the Z direction, which is the thickness direction of the wiring board 500G. An insulator layer is arranged between two adjacent conductor layers 1G to 8G. A conductor pattern is arranged in each conductor layer 1G to 8G. The wiring board 500G has two main surfaces 501G and 502G. The image sensor 300 is mounted on the main surface 501G on the side of the conductor layer 1G in the wiring board 500G.

The plurality of conductor layers 1G to 8G are laminated in the order of conductor layer 1G, conductor layer 2G, conductor layer 3G, conductor layer 4G, conductor layer 5G, conductor layer 6G, conductor layer 7G, and conductor layer 8G from the side of the image pickup element 300. Is arranged. The conductor layers 1G and 8G are surface layers, that is, outer layers, and the conductor layers 2G to 7G are inner layers. A circuit component 601 such as a capacitor is mounted on the main surface 502G on the side of the conductor layer 8G. The number of conductor layers is not limited to eight, and may be two or more. However, considering the arrangement of wiring and the like, the number of conductor layers is preferably 3 or more, and more preferably 4 or more. Further, a solder resist (not shown) may be provided on the conductor layers 1G and 8G.

The image sensor 300 is arranged on the main surface 501G and is connected to the wiring board 500G by wire bonding. The image sensor 300 is mounted on the wiring board 500G by wire bonding, but is not limited to this, and may be mounted on the wiring board by flip chip bonding. In this case, the image sensor and the wiring board are connected by a plurality of metal members such as a plurality of solder balls.

As shown in FIG. 3, the image pickup device 300 has an analog circuit 370. The analog circuit 370 includes a pixel array 310 and an analog ground wiring 330 shown in FIG. 19 that is electrically connected to the pixel array 310. Further, the image sensor 300 has a digital circuit 380. The digital circuit 380 has a digital ground wiring 350. Further, the analog circuit 370 has an analog power supply wiring 320 shown in FIG. 20 electrically connected to the pixel array 310. The digital circuit 380 has a digital power supply wiring 340. As shown in FIG. 19, the wiring board 500G has a ground wiring portion 570G which is a ground. The ground wiring unit 570G includes a ground wiring 571G which is a first ground wiring and a ground wiring 572G which is a second ground wiring.

The ground wiring 571G is connected to a plurality of ground electrodes 531. The plurality of ground electrodes 531 are arranged in the conductor layer 1G. FIG. 19 shows a pair of ground electrodes 531 ₁ and 531 ₂ arranged apart from each other in the X direction among the plurality of ground electrodes 531. The analog ground wiring 330 is connected to a plurality of analog ground electrodes 331. FIG. 19 shows a pair of analog ground electrodes 331 ₁ and 331 ₂ arranged apart from each other in the X direction among the plurality of analog ground electrodes 331. The plurality of analog ground electrodes 331 and the plurality of ground electrodes 531 are electrically connected by a plurality of wires 611. The plurality of wires 611 are included in the plurality of wires 610 of FIG. In FIG. 19, among a plurality of wires 611, the wire 611 ₁ that electrically connects the analog ground electrode 331 ₁ and the ground electrode 531 ₁ and the analog ground electrode 331 ₂ and the ground electrode 531 ₂ are electrically connected. The wire 611 ₂ and the like are shown in the figure.

When the image pickup unit 400G is viewed from the side, that is, when the image pickup unit 400G is viewed in the Y direction, an analog ground closed loop is formed in the image pickup unit 400G so as to straddle the image pickup device 300 and the wiring board 500G.

The ground wiring 572G is a portion other than the ground wiring 571G when viewed in the Y direction, that is, a portion that does not contribute to the formation of the closed loop of the analog ground. For example, the ground wiring 572G includes a portion that forms a closed loop of the digital ground together with the digital ground wiring 350 (FIG. 3) of the image sensor 300 when viewed in the Y direction, and a portion that does not contribute to the formation of any of the closed loops.

As shown in FIG. 19, the ground wiring 571G is arranged closer to the image sensor 300 than the central C8 in the Z direction of the wiring board 500G. The center C8 is the center between the two main surfaces 501G and 502G, and is illustrated by a alternate long and short dash line in FIG. Since the entire ground wiring 571G is arranged closer to the image sensor 300 than the central C8 in the Z direction of the wiring board 500G, the area of the closed loop of the analog ground can be reduced. Since the induced electromotive force generated in the closed loop is proportional to the area of the closed loop, the induced electromotive force generated in the closed loop can be reduced by reducing the area of the closed loop. Therefore, it is possible to reduce the potential fluctuation of the analog ground, and thereby it is possible to prevent pattern noise from occurring in the output image of the image sensor 300. That is, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

The ground wiring 571G is composed of only one conductor pattern 505G, which is the first conductor pattern. The conductor pattern 505G is arranged on the conductor layer 1G, which is the surface layer on the side where the image pickup device 300 is mounted on the wiring board 500G. As a result, the area of the closed loop can be made as small as possible, the image generated by the image sensor 300 can be effectively suppressed from being disturbed, and the quality of the generated image is further improved.

The ground wiring 572G has a plurality of conductor patterns 506G which are a plurality of second conductor patterns arranged at intervals from each other, and a plurality of via conductors 508G which are a plurality of third via conductors. The conductor pattern 506G is arranged in the conductor layers 2G to 8G. The plurality of conductor patterns 506G are electrically connected by a plurality of via conductors 508G.

The ground of the analog circuit and the ground of the digital circuit of the image sensor 300 are preferably shared, and in the wiring board 500G, the ground wiring 571G and the ground wiring 572G are electrically connected. The ground wiring 571G is arranged closer to the image sensor 300 than the ground wiring 572G. In the tenth embodiment, the ground wiring 571G and the ground wiring 572G are electrically connected by only one via conductor 511G, which is the first via conductor arranged at one place. That is, the analog ground and the digital ground are connected only by the via conductor 511G. In FIG. 19, the via conductor 511G is shown by hatching different from the ground wirings 571G and 572G.

As described in the first embodiment, the closed loop in the image pickup unit 400G has different resistance to magnetic field noise depending on the type of circuit to be connected. Specifically, in the imaging unit 400G, the closed loop of the power supply of the analog circuit (hereinafter referred to as "analog power supply") is more resistant to magnetic field noise than the closed loop of the power supply of the digital circuit (hereinafter referred to as "digital power supply"). Is low. That is, next to the closed loop of the analog ground, the closed loop of the analog power supply is susceptible to magnetic field noise. In particular, the wiring related to the pixel array 310 in FIG. 3 has a low resistance to magnetic field noise because it directly affects the pixel signal. Further, the lower the impedance of the wiring, the easier it is for the induced current to flow, and the lower the resistance to magnetic field noise. When a voltage distribution occurs in the closed loop of the analog power supply due to the induced electromotive force, the pixel signal fluctuates depending on the distribution of the power supply potential.

As shown in FIG. 20, the wiring board 500G includes a power supply wiring 581G. The power supply wiring 581G is connected to a plurality of power supply electrodes 521. FIG. 20 shows a pair of power supply electrodes 521 ₁ and 521 ₂ arranged apart from each other in the X direction among the plurality of power supply electrodes 521. The analog power supply wiring 320 is connected to a plurality of analog power supply electrodes 321. Figure 20, among the plurality of analog power supply electrodes 321, are shown in the X direction to be spaced a pair of analog power electrodes ₃₂₁ 1, 321 _2. The plurality of analog power supply electrodes 321 and the plurality of power supply electrodes 521 are electrically connected by a plurality of wires 612. The plurality of wires 612 are included in the plurality of wires 610 of FIG. In FIG. 20, among the plurality of wires 612, the wire 612 ₁ that electrically connects the analog power supply electrode 321 ₁ and the power supply electrode 521 ₁ and the analog power supply electrode 321 ₂ and the power supply electrode 521 ₂ are electrically connected. The wire 612 ₂ and the like are shown in the figure.

When the image pickup unit 400G is viewed from the side, that is, when the image pickup unit 400G is viewed in the Y direction, the image pickup unit 400G is formed with a closed loop L80 of an analog power supply straddling the image pickup device 300 and the wiring board 500G. In FIG. 20, the closed loop L80 is shown by a chain double-dashed line.

Here, the area of the closed loop L80 of the analog power supply when viewed in the Y direction, that is, the area of the portion surrounded by the alternate long and short dash line in FIG. 20 is defined as S80. The power supply wiring 581G is arranged closer to the image sensor 300 than the central C8. Since the entire power supply wiring 581G is arranged closer to the image sensor 300 than the central C8 in the Z direction of the wiring board 500G, the area S80 of the closed loop L80 of the analog power supply can be reduced. Since the induced electromotive force generated in the closed loop L80 is proportional to the area S80 of the closed loop L80, the induced electromotive force generated in the closed loop L80 can be reduced by reducing the area S80. Therefore, it is possible to reduce the potential fluctuation of the analog power supply, and thereby it is possible to prevent pattern noise from occurring in the output image of the image pickup device 300. That is, it is possible to suppress the image generated by the image sensor 300 from being disturbed, and the quality of the generated image is improved.

In the tenth embodiment, the power supply wiring 581G is composed of only one conductor pattern 515G. As shown in FIGS. 20 and 21, the conductor pattern 515G is arranged on the conductor layer 1G, which is the surface layer on the wiring board 500G on which the image pickup device 300 is mounted. Since the conductor pattern 515G is arranged in the conductor layer 1G, the area S80 of the closed loop L80 can be made as small as possible, and the image generated by the image sensor 300 can be effectively suppressed from being disturbed. The quality of the image is further improved.

As shown in FIGS. 20 and 21, the power supply electrode 521 is integrally formed with the conductor pattern 515G. A conductor pattern 516G connected to the power supply terminal of the circuit component 601 is arranged on the conductor layer 8G. The conductor pattern 516G is electrically connected to the conductor pattern 515G by one via conductor 517G. Power is supplied to the analog circuit and circuit component 601 of the image sensor 300 through these wirings. By narrowing the distance between the via conductor 511G and the via conductor 517G, the closed loop area including the analog power supply and the analog ground can be reduced.

The present invention is not limited to the embodiments described above, and many modifications can be made within the technical idea of the present invention. Moreover, the effects described in the embodiments are merely a list of the most preferable effects arising from the present invention, and the effects according to the present invention are not limited to those described in the embodiments.

100 ... camera (imaging device), 300 ... imaging element, 301 ... light receiving surface, 310 ... pixel array, 330 ... analog ground wiring, 400 ... imaging unit, 500 ... wiring board, 511 ... via conductor (first via conductor), 571 ... Ground wiring (first ground wiring), 572 ... Ground wiring (second ground wiring)

Claims (23)

An image sensor having an analog circuit including analog ground wiring,
With a wiring board on which the image sensor is mounted,
The wiring board
A first ground wiring that is connected to the analog ground wiring and forms a closed loop with the analog ground wiring when viewed from the side,
An imaging unit characterized by having a second ground wiring connected to the first ground wiring only by a first via conductor. In the imaging unit according to claim 1,
The image pickup unit is characterized in that the first ground wiring is arranged closer to the image pickup element than the center in the thickness direction of the wiring board. In the imaging unit according to claim 1 or 2.
The image pickup unit is characterized in that the first ground wiring is arranged closer to the image pickup element than the second ground wiring in the thickness direction of the wiring board. In the imaging unit according to claim 2 or 3,
The first ground wiring is an imaging unit characterized in that it is composed of only one first conductor pattern arranged on the surface layer of the wiring board. In the imaging unit according to claim 2 or 3,
The first ground wiring includes a plurality of first conductor patterns arranged at intervals from each other, and a plurality of second via conductors connecting the plurality of first conductor patterns.
An imaging unit characterized in that at least one of the plurality of first conductor patterns is arranged on the surface layer of the wiring board. In the imaging unit according to any one of claims 1 to 5,
The image sensor has a digital circuit including digital ground wiring, and has a digital circuit.
The second ground wiring is an imaging unit characterized in that it is connected to the digital ground wiring. In the imaging unit according to any one of claims 1 to 6,
The analog circuit includes analog power supply wiring.
The imaging unit is characterized in that the wiring board is connected to the analog power supply wiring and has a power supply wiring that forms a closed loop with the analog power supply wiring when viewed from the side surface. In the imaging unit according to any one of claims 1 to 7.
The analog circuit is an imaging unit including a pixel array having a plurality of pixels. An image sensor having an analog circuit including analog ground wiring,
A wiring board on which the image sensor is mounted is provided.
The wiring board
A first ground wiring that is connected to the analog ground wiring and forms a closed loop with the analog ground wiring when viewed from the side,
The first ground wiring has a second ground wiring connected only by a plurality of first via conductors.
In a plan view, the length of the first side of the image sensor is X1, the length of the second side intersecting the first side is Y1, and the most distant 2 of the plurality of first via conductors. When the distance between the two first via conductors is D1,

An imaging unit characterized by satisfying. In the imaging unit according to claim 9,
The image pickup unit is characterized in that the first ground wiring is arranged closer to the image pickup element than the center in the thickness direction of the wiring board. In the imaging unit according to claim 9 or 10.
The image pickup unit is characterized in that the first ground wiring is arranged closer to the image pickup element than the second ground wiring in the thickness direction of the wiring board. In the imaging unit according to claim 10 or 11.
The first ground wiring is an imaging unit characterized in that it is composed of only one first conductor pattern arranged on the surface layer of the wiring board. In the imaging unit according to claim 10 or 11.
The first ground wiring includes a plurality of first conductor patterns arranged at intervals from each other, and a plurality of second via conductors connecting the plurality of first conductor patterns.
An imaging unit characterized in that at least one of the plurality of first conductor patterns is arranged on the surface layer of the wiring board. In the imaging unit according to claim 13,
The distance between the two first via conductors that are the most separated from the plurality of first via conductors is narrower than the distance between the two most separated second via conductors among the plurality of second via conductors. An imaging unit characterized by this. In the imaging unit according to any one of claims 9 to 14,
The second ground wiring includes a plurality of second conductor patterns arranged at intervals from each other, and a plurality of third via conductors connecting the plurality of second conductor patterns.
The distance between the two first via conductors that are the most separated from the plurality of first via conductors is narrower than the distance between the two most separated third via conductors among the plurality of third via conductors. An imaging unit characterized by this. In the imaging unit according to any one of claims 9 to 15,
The wiring board is an imaging unit having a third conductor pattern that connects the plurality of first via conductors. In the imaging unit according to any one of claims 9 to 16,
The image sensor has a digital circuit including digital ground wiring, and has a digital circuit.
The second ground wiring is an imaging unit characterized in that it is connected to the digital ground wiring. In the imaging unit according to any one of claims 9 to 17,
The analog circuit includes analog power supply wiring.
The imaging unit is characterized in that the wiring board is connected to the analog power supply wiring and has a power supply wiring that forms a closed loop with the analog power supply wiring. In the imaging unit according to any one of claims 9 to 18.
The analog circuit is an imaging unit including a pixel array having a plurality of pixels. With the housing
The inductor element arranged inside the housing and
An image pickup apparatus comprising the image pickup unit according to any one of claims 1 to 19, which is arranged inside the housing. In the imaging device according to claim 20,
The inductor element is an imaging device characterized by being a coil that mechanically drives the imaging unit. With the housing
The imaging unit according to any one of claims 1 to 19, which is arranged inside the housing.
An imaging device including a mount to which a lens barrel having an optical system and an inductor element can be attached and detached. In the imaging device according to claim 22,
The inductor element is an imaging device characterized by being a coil that mechanically drives the optical system.

Images