JP2019029618A - Electronic component and electronic device - Google Patents

Abstract

To stabilize operation of a semiconductor element.SOLUTION: An electronic component 130 includes an imaging element 141, an insulating substrate portion 171 for supporting the imaging element 141, a loop conductor 181 disposed across the imaging element 141 and the insulating substrate portion 171. Further, an electronic component 130 includes a loop conductor 182 provided on the insulating substrate portion 171. The loop conductor 182 is disposed at a position surrounding a part or all of the loop conductor 181 when viewed from the X direction parallel to a light receiving surface 142 of the imaging element 141.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic component having a semiconductor element and an electronic device having the electronic component.

  In recent years, with the increase in sensitivity of semiconductor elements, the influence of weak magnetic field noise on signals generated in semiconductor elements has become a problem. For example, in a digital still camera and a digital video camera which are examples of electronic devices, high sensitivity of ISO (International Organization for Standardization) is required. For this reason, an image pickup device which is an example of a semiconductor device has a problem that a generated image is disturbed even when incident magnetic field noise is weak. As a generation source of the magnetic field noise, for example, a lens driving motor disposed inside the interchangeable lens can be cited.

  Patent Document 1 describes a technique of providing a loop conductor that surrounds an image sensor in order to reduce magnetic field noise incident on a light receiving surface that is a main surface of the image sensor.

Japanese Patent Laid-Open No. 11-284163

  The technique described in Patent Document 1 is to reduce magnetic field noise incident perpendicularly to the main surface of the semiconductor element, and for magnetic field noise incident in a direction parallel to the main surface of the semiconductor element. Not listed. On the other hand, the lower the magnetic field noise frequency, the more magnetic flux that passes through the conductor. Therefore, with respect to low-frequency (for example, 500 [kHz] or less) magnetic field noise incident in a direction parallel to the main surface of the semiconductor element, even if a conductor exists on the outer periphery of the semiconductor element, the shielding effect by the conductor is low. There was a problem of passing through the conductor. In addition, a loop conductor is structurally formed between the semiconductor element and the insulating substrate. For example, a semiconductor element has a plurality of power supply terminals. When each power supply terminal is connected to the same conductor pattern arranged on an insulating substrate, a loop conductor is formed. When magnetic field noise that has passed through the conductor surrounding the semiconductor element links the loop conductor formed between the semiconductor element and the insulating substrate, a noise current is induced in the loop conductor. When noise current induced in the loop conductor flows into the semiconductor element, the operation of the semiconductor element becomes unstable. When the semiconductor element is, for example, an image sensor, the generated image is disturbed.

  Accordingly, an object of the present invention is to stabilize the operation of a semiconductor element.

  The electronic component of the present invention is provided in a semiconductor element, an insulating substrate portion that supports the semiconductor element, a first loop conductor that is disposed across the semiconductor element and the insulating substrate portion, and the insulating substrate portion. And a second loop conductor disposed at a position surrounding a part or all of the first loop conductor when viewed from a direction parallel to the main surface of the semiconductor element.

  According to the present invention, the operation of the semiconductor element is stabilized.

It is explanatory drawing which shows the imaging device which is an example of the electronic device which concerns on 1st Embodiment. It is a top view of the electronic component in a 1st embodiment. (A) is sectional drawing of the electronic component which follows the IIIA-IIIA line | wire of FIG. (B) is sectional drawing of the electronic component which follows the IIIB-IIIB line | wire of FIG. (A) is a perspective view which shows typically the electronic component which concerns on 1st Embodiment. (B) is a perspective view which shows a 1st loop conductor. (C) is a perspective view showing a second loop conductor. (A) And (b) is a top view of the electronic component which shows the modification of 1st Embodiment. It is explanatory drawing which shows the model of a magnetic field noise source. It is a graph which shows the electromagnetic field simulation result of Example 1 and Comparative Example 1. It is sectional drawing of the electronic component which concerns on 2nd Embodiment. It is a graph which shows the electromagnetic field simulation result of Example 2 and Example 1. FIG. It is sectional drawing of the electronic component which concerns on 3rd Embodiment. It is a graph which shows the electromagnetic field simulation result of Example 2 and Example 3. (A) is a perspective view which shows typically the electronic component which concerns on 4th Embodiment. (B) is a top view of the electronic component which concerns on 4th Embodiment. (A) And (b) is a graph which shows the electromagnetic field simulation result of Example 4 and Example 5. FIG. (A) is a perspective view which shows typically the electronic component which concerns on 5th Embodiment. (B) is a top view of the electronic component which concerns on 5th Embodiment. It is a graph which shows the electromagnetic field simulation result of Example 6 and Example 7. (A) is a top view of the electronic component which concerns on 6th Embodiment. (B) is sectional drawing of the electronic component which concerns on 6th Embodiment. It is a graph which shows the electromagnetic field simulation result of Example 8 and Comparative Example 2.

Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings.
[First Embodiment]
FIG. 1 is an explanatory diagram illustrating an imaging apparatus 100 that is an example of an electronic apparatus according to the first embodiment. The imaging apparatus 100 is a digital camera such as a digital still camera or a digital video camera, and is a digital single-lens reflex camera in the example of FIG. The imaging apparatus 100 includes a main body 101 and an interchangeable lens 102 that is a lens device that can be attached to and detached from the main body 101. The main body 101 includes a casing 110 that is a first casing, and an electronic component 130 disposed inside the casing 110. The interchangeable lens 102 includes a housing 120 that is a second housing that can be attached to and detached from the housing 110, a lens 121 that is disposed inside the housing 120, and a magnetic field generation source that is disposed inside the housing 120. And a motor 122 that drives the lens 121, which is an example. Note that the motor 122 may be disposed inside the housing 110.

  The electronic component 130 is a printed circuit board, and includes a semiconductor package 140 and a printed wiring board 160. The semiconductor package 140 is mounted on the printed wiring board 160. Specifically, the semiconductor package 140 is mechanically and electrically connected to the printed wiring board 160 with a conductive connecting material such as solder and supported by the printed wiring board 160. Note that circuit components (not shown) that are electrically connected to the semiconductor package 140 are mounted on the printed wiring board 160.

  FIG. 2 is a plan view of the electronic component 130 in the first embodiment. FIG. 3A is a cross-sectional view of the electronic component 130 taken along line IIIA-IIIA in FIG. FIG. 3B is a cross-sectional view of the electronic component 130 taken along line IIIB-IIIB in FIG.

  The structure of the semiconductor package 140 is an LCC (Leadless Chip Carrier). The semiconductor package 140 includes a package substrate 150, an image sensor 141 that is an example of a semiconductor element, and a lid 145.

  The image sensor 141 is a solid-state image sensor, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. The image sensor 141 has a light receiving surface 142 which is a main surface, converts light received by the light receiving surface 142 into an electrical signal, and outputs it as an image signal.

  The package substrate 150 is a multilayer substrate including an insulating substrate 151 that is a first insulating substrate and a conductor 152 that is provided on the insulating substrate 151 and includes a conductor pattern or a via conductor. The conductor pattern of the conductor 152 is a flat conductor, and the via conductor of the conductor 152 is a conductor disposed on the via of the insulating substrate 151. The insulating substrate 151 is made of, for example, ceramic, and the conductor 152 is made of, for example, tungsten. The insulating substrate 151 has a convex portion 153 and a concave portion 154 surrounded by the convex portion 153, and the imaging element 141 is accommodated in the concave portion 154. The image sensor 141 is fixed (mounted) on the bottom of the recess 154 with the light receiving surface 142 facing the opening side of the recess 154.

  The lid 145 is a transparent plate such as glass, and is fixed to the convex portion 153 of the insulating substrate 151 with an adhesive or the like so as to cover the light receiving surface 142 of the imaging element 141, that is, to close the concave portion 154. As a result, the concave portion 154 that houses the image sensor 141 is sealed by the lid body 145. The semiconductor package 140 is not limited to the above configuration, and various configurations can be adopted.

  The printed wiring board 160 is a multilayer board composed of an insulating board 161 that is a second insulating board and a conductor 162 that is provided on the insulating board 161 and includes a conductor pattern and a via conductor. The conductor pattern of the conductor 162 is a flat conductor, and the via conductor of the conductor 162 is a conductor disposed on the via of the insulating substrate 161. The insulating substrate 161 is made of, for example, an epoxy resin, and the conductor 162 is made of, for example, copper.

  The insulating substrate 161 supports the insulating substrate 151 via a conductive connecting material 184 such as solder. The insulating substrate 151 and the insulating substrate 161 constitute an insulating substrate portion 171 that supports the image sensor 141. The image sensor 141 is electrically connected to a conductor pad provided on the surface of the insulating substrate 151 with a bonding wire. The conductor pads on the surface are electrically connected to the conductor pads arranged at the lower part of the insulating substrate 151 through the conductor patterns and via conductors arranged inside the insulating substrate 151. Conductor pads are arranged on the surface of the insulating substrate 161. The conductor pads arranged on the surface of the insulating substrate 161 are electrically and mechanically connected to the conductor pads arranged under the insulating substrate 151 by a connecting material 184 such as solder.

  FIG. 4A is a perspective view schematically showing the electronic component 130 according to the first embodiment. The electronic component 130 has a power supply line 180 that is disposed across the imaging element 141 and the insulating substrate portion 171. Power is supplied to the image sensor 141 via the power line 180. The power supply line 180 includes a loop conductor (first loop conductor) 181 disposed across the image sensor 141 and the insulating substrate 151. Although illustration of the loop conductor 181 is omitted in FIG. 2, the loop conductor 181 is viewed from the Z direction perpendicular to the light receiving surface 142 of the image sensor 141. , 1414 are arranged along the side 1411. Of the four sides 1411, 1412, 1413, and 1414, the sides 1411 and 1413 are long sides, and the sides 1412 and 1414 are short sides.

  FIG. 4B is a perspective view showing the loop conductor 181. The loop conductor 181 includes a conductor pattern 1811, a conductor pattern 1812, two via conductors 1813 and 1814, two conductor pads 1815 and 1816, and two bonding wires 1817 and 1818.

  The conductor pattern 1811 is disposed on the image sensor 141. The conductor pattern 1812, the via conductors 1813 and 1814, and the conductor pads 1815 and 1816 are part of the conductor 152 (FIG. 3A) and are disposed on the insulating substrate 151. The conductor pads 1815 and 1816 are disposed on the front surface of the insulating substrate 151, and the conductor pattern 1812 is disposed inside or on the back surface of the insulating substrate 151. Conductive pattern 1812 and conductive pads 1815 and 1816 are electrically connected by via conductors 1813 and 1814. The conductor pads 1815 and 1816 and the conductor pattern 1811 are electrically connected by bonding wires 1817 and 1818.

  Thereby, the loop conductor 181 has a loop shape when viewed from the X direction parallel to the light receiving surface 142 of the imaging element 141. That is, as shown in FIG. 3B, the loop conductor 181 forms a loop L1. When magnetic flux of magnetic field noise leaking from the motor 122 is linked to the loop conductor 181, a noise current is induced in the loop conductor 181. More specifically, as shown in FIG. 3A, when the magnetic field noise H is incident on the insulating substrate 151 of the package substrate 150, the light receiving surface 142 of the image sensor 141 is formed by the conductor pattern arranged on the conductor layer of the package substrate 150. The magnetic field noise H1 of the X direction component parallel to is dominant. Similarly, the magnetic field noise H1 of the X direction component is dominant over the insulating substrate 161 of the printed wiring board 160. When the magnetic flux of magnetic field noise H1 is linked to the loop conductor 181, an electromotive force is generated and an induced current flows.

  In the first embodiment, the electronic component 130 includes a loop conductor 182 that is a second loop conductor. The loop conductor 182 is disposed at a position surrounding a part or the whole of the loop conductor 181, preferably the whole, when viewed from the X direction parallel to the light receiving surface 142 of the image sensor 141. The loop conductor 182 is provided on the insulating substrate 171, in the first embodiment, the insulating substrate 151. That is, the loop conductor 182 is a part of the conductor 152 (FIG. 3A) and is included in the package substrate 150.

  When the magnetic flux of magnetic field noise H1 is linked to the loop conductor 182, an electromotive force is generated and an induced current flows. This induced current generates a demagnetizing field in a direction that cancels the magnetic field noise H1. Thereby, the magnetic field noise H1 in the loop conductor 181 is reduced. Therefore, the operation of the image sensor 141 is stabilized, and the occurrence of disturbance in the image is suppressed.

  FIG. 4C is a perspective view showing the loop conductor 182. The loop conductor 182 includes two conductor patterns 1821 and 1822 that are arranged in the Z direction perpendicular to the light receiving surface 142 of the image sensor 141 and perpendicular to the X direction. The loop conductor 182 includes two via conductors 1823 and 1824 that are arranged in a direction parallel to the light receiving surface 142 of the image sensor 141 and spaced from each other in the Y direction orthogonal to the X direction. The via conductors 1823 and 1824 are arranged between the conductor pattern 1821 and the conductor pattern 1822 and electrically connect the conductor pattern 1821 and the conductor pattern 1822. Thus, the loop conductor 182 forms the loop L2 shown in FIG. 3B with the conductors provided on the insulating substrate 151, that is, the conductor patterns 1821 and 1822 and the via conductors 1823 and 1824.

  Further, as shown in FIG. 2, the loop conductor 182 is formed on the insulating substrate 151 of the package substrate 150, as viewed from the Z direction, outside the imaging element 141, that is, the convex portion 153 of the insulating substrate 151 shown in FIG. It is arrange | positioned in the outer peripheral part which is located. A part of the loop conductor 182, specifically, the entire conductor pattern 1821 and a part of the via conductors 1823 and 1824 are located inside the convex portion 153 of the insulating substrate 151. Thereby, as viewed from the X direction, the area surrounded by the loop conductor 182 can be increased, and the entire loop conductor 181 can be surrounded by the loop conductor 182. Therefore, the magnetic field noise H1 in the loop conductor 181 can be reduced more effectively. In addition, since the area where the magnetic flux interlinks in the loop conductor 182 is increased, a larger demagnetizing field can be generated. Therefore, the magnetic field noise in the loop conductor 181 can be reduced more effectively.

  As shown in FIG. 2, the loop conductor 182 is arranged along the side 1411 among a plurality of sides of the image sensor 141, that is, the four sides 1411, 1412, 1413, and 1414 as viewed from the Z direction. Since the loop conductor 181 is also disposed along the side 1411, the loop conductor 182 is disposed close to the loop conductor 181 and the magnetic field noise H1 in the loop conductor 181 can be more effectively reduced. .

  Further, the loop conductor 182 is disposed so as not to be connected to the loop conductor 181, so that the induced current generated in the loop conductor 182 does not flow into the loop conductor 181. The loop conductor 182 is preferably not connected to other conductors in the package substrate 150, such as a power supply line, a signal line, and a ground line, but may be electrically connected to the ground line.

  The short distance between the loop conductor 181 and the loop conductor 182 is better. In the first embodiment, a part of the loop conductor 181 is located between the conductor patterns 1821 and 1822. That is, as viewed from the Z direction, part of the loop conductor 181 overlaps with the conductor patterns 1821 and 1822.

  Further, since the loop conductor 182 is disposed on the insulating substrate 151, it is not necessary to add a member different from the package substrate 150, and space saving and cost reduction can be achieved.

  In addition, although the case where the loop conductor 181 and the loop conductor 182 are one was demonstrated, there may be a plurality of cases. FIG. 5A and FIG. 5B are plan views of electronic components showing a modification of the first embodiment. For example, as illustrated in FIG. 5A, the loop conductor 181 and the loop conductor 182 may also be disposed on the side 1412 that is the short side of the imaging element 141. Further, for example, as shown in FIG. 5B, the loop conductor 181 and the loop conductor 182 are also arranged on the side 1413 which is the long side of the image sensor 141 and the sides 1412 and 1414 which are the short sides. Good. 5A and 5B, the illustration of the loop conductor 181 is omitted.

Example 1
As Example 1 corresponding to the electronic component 130 of the first embodiment, a magnetic field analysis for verifying the interlinkage magnetic flux in the electronic component 130 was performed. As an analysis tool, Maxwell 3D of ANSYS which is an electromagnetic field simulator was used.

The size of the conductor patterns 1821 and 1822 in the loop conductor 182 was 40 [mm] × 4 [mm] × 0.01 [mm]. The material of the conductor patterns 1821 and 1822 was tungsten, and the conductivity σ = 1.82 × 10 ⁷ [S / m]. The conductor pattern 1821 and the conductor pattern 1822 were arranged with an interval of 4 [mm] in the Z direction. The via conductors 1823 and 1824 are 0.2 [mm] in diameter and 4 [mm] in length. The via conductors 1823 and 1824 are made of tungsten, which is the same as the conductor patterns 1821 and 1822. The distance between the centers of the via conductors 1823 and 1824 was 38 [mm], and the via conductors 1823 and 1824 were arranged at a distance of 19 [mm] from the centers of the conductor patterns 1821 and 1822.

FIG. 6 is an explanatory diagram showing a model of the magnetic field noise source. As shown in FIG. 6, a Helmholtz coil 900 model was used as the magnetic field noise source. In the model of the Helmholtz coil 900, it is assumed that the magnetic field noise H1 is uniformly incident on the electronic component 130 in the X direction. The size of the Helmholtz coil 900 was set such that the coil radius was 200 [mm], the thickness of the copper wiring constituting the coil was 20 [mm], and the conductivity σ = 5.8 × 10 ⁷ [S / m]. The Helmholtz coil 900 was supplied with a sinusoidal alternating current 1 [A] of 100 [kHz] as the frequency of the magnetic field noise source.

The evaluation point is an area R1 indicated by a broken line in FIG. 4B, which is an inner area surrounded by the loop conductor 181 that constitutes the circuit to be damaged. The evaluation amount was a magnetic flux interlinking the region R1. The interlinkage magnetic flux was calculated from the following formula (1) with the region R1 as 36.5 [mm] × 3.5 [mm].
Φ = B · S (1)
Φ is the flux linkage [Wb], B is the magnetic flux density [T], and S is the area 1.2775 × 10 ⁻⁴ [m ² ] of the region R1.

  As Comparative Example 1, an electronic component in which the via conductors 1823 and 1824 of the loop conductor 182 were omitted and only the conductor patterns 1821 and 1822 were arranged on the insulating substrate 151 was used as a model. The conditions of the conductor patterns 1821 and 1822 were the same as those in Example 1.

FIG. 7 is a graph showing electromagnetic field simulation results of Example 1 and Comparative Example 1. As shown in FIG. 7, the interlinkage magnetic flux in Example 1 is 506.1 × 10 ⁻¹² [Wb], which is 1.5% of the interlinkage magnetic flux 514.4 × 10 ⁻¹² [Wb] in Comparative Example 1. Reduced.

[Second Embodiment]
Next, electronic components of an imaging apparatus that is an example of an electronic apparatus according to the second embodiment will be described. FIG. 8 is a cross-sectional view of an electronic component 230 according to the second embodiment. In addition, in the electronic component 230 of 2nd Embodiment shown in FIG. 8, the same code | symbol is attached | subjected about the structure similar to the electronic component 130 of 1st Embodiment, and the description is abbreviate | omitted.

  The electronic component 230 is a printed circuit board, and includes a semiconductor package 240 and a printed wiring board 260. The semiconductor package 240 is mounted on the printed wiring board 260. Specifically, the semiconductor package 240 is mechanically and electrically connected to the printed wiring board 260 with a conductive connecting material such as solder and supported by the printed wiring board 260. Note that circuit components (not shown) that are electrically connected to the semiconductor package 240 are mounted on the printed wiring board 260.

  The structure of the semiconductor package 240 is an LCC as in the first embodiment. The semiconductor package 240 includes a package substrate 250, an image sensor 141, and a lid 145. The package substrate 250 is a multilayer substrate composed of an insulating substrate 151 and a conductor provided on the insulating substrate 151 and made of a conductor pattern or a via conductor.

  The printed wiring board 260 is a multilayer board composed of an insulating board 161 and a conductor provided on the insulating board 161 and made of a conductor pattern and a via conductor. The insulating substrate 151 and the insulating substrate 161 constitute an insulating substrate portion 171 that supports the image sensor 141.

  The electronic component 230 of the second embodiment includes a loop conductor 181 that is a first loop conductor having the same configuration as that of the first embodiment, and a loop that is a second loop conductor having a configuration different from the loop conductor 182 of the first embodiment. And a conductor 282. The loop conductor 282 is disposed at a position surrounding a part or the whole of the loop conductor 181, preferably the whole, when viewed from the X direction. The arrangement position of the loop conductor 282 viewed from the Z direction is the same as that of the loop conductor 182 of the first embodiment.

  When magnetic flux of magnetic field noise is linked to the loop conductor 282, an electromotive force is generated and an induced current flows. This induced current generates a demagnetizing field in a direction that cancels the magnetic field noise. Thereby, magnetic field noise in the loop conductor 181 is reduced. Therefore, the operation of the image sensor 141 is stabilized, and the occurrence of disturbance in the image is suppressed.

  In the second embodiment, the loop conductor 282 is disposed across the insulating substrate portion 171, specifically, the insulating substrate 151 and the insulating substrate 161. Hereinafter, the configuration of the loop conductor 282 will be specifically described.

  The loop conductor 282 has a conductor pattern 2821 disposed on the insulating substrate 151. The loop conductor 282 includes two via conductors 2823 and 2824 that are arranged on the insulating substrate 151 with a space therebetween in the Y direction and are electrically connected to the conductor pattern 2821. The loop conductor 282 has a conductor pattern 2822 disposed on the insulating substrate 161. The loop conductor 282 includes two via conductors 2825 and 2826 that are arranged at intervals in the Y direction on the insulating substrate 161 and are electrically connected to the conductor pattern 2822. Furthermore, the loop conductor 282 is electrically connected between the via conductor 2823 and the via conductor 2825, such as a conductive connecting material 2827 such as solder, and electrically connected between the via conductor 2824 and the via conductor 2826, solder or the like. Conductive connection material 2828. The connection members 2827 and 2828 also serve as a mechanical connection between the semiconductor package 240 and the printed wiring board 260. With the above configuration, the loop conductor 282 forms a loop L2 shown in FIG.

  As described above, since the loop conductor 282 is disposed across the insulating substrate 151 and the insulating substrate 161, the area of the region surrounded by the loop conductor 282 when viewed from the X direction is the loop conductor 182 described in the first embodiment. It can be larger than the area of the region surrounded by. That is, since the area where the magnetic flux interlinks in the loop conductor 282 increases, a larger demagnetizing field can be generated. Therefore, the magnetic field noise in the loop conductor 181 can be reduced more effectively.

  Further, the loop conductor 282 is disposed so as not to be connected to the loop conductor 181, so that the induced current generated in the loop conductor 282 does not flow into the loop conductor 181. The loop conductor 282 is preferably not connected to other conductors in the package substrate 250 and the printed wiring board 260, such as a power supply line, a signal line, and a ground line, but may be electrically connected to the ground line. Good.

  The short distance between the loop conductor 181 and the loop conductor 282 is better. In the second embodiment, a part of the loop conductor 181 is located between the conductor patterns 2821 and 2822. That is, a part of the loop conductor 181 overlaps with the conductor patterns 2821 and 2822 when viewed from the Z direction.

  Further, since the loop conductor 282 is disposed across the insulating substrate 151 and the insulating substrate 161, it is not necessary to add a member different from the package substrate 250, the printed wiring board 260, and the connection materials 2827 and 2828, and space saving. And cost reduction.

  In addition, although the case where each of the loop conductor 181 and the loop conductor 282 has been described has been described, a plurality of cases may be used as illustrated in FIGS. 5A and 5B, for example. In this case, a plurality of loop conductors 282 may be connected to each other.

(Example 2)
As Example 2 corresponding to the electronic component 230 of the second embodiment, a magnetic field analysis for verifying the interlinkage magnetic flux in the electronic component 230 was performed. As an analysis tool, Maxwell 3D of ANSYS which is an electromagnetic field simulator was used.

The size of the conductor pattern 2821 arranged on the insulating substrate 151 was 40 [mm] × 4 [mm] × 0.01 [mm]. The material of the conductor pattern 2821 was tungsten, and the conductivity σ = 1.82 × 10 ⁷ [S / m].

The conductor pattern 2822 disposed on the insulating substrate 161 is disposed at a position 4.8 [mm] away from the conductor pattern 2821, and the size is the same as that of the conductor pattern 2821. The material of the conductor pattern 2822 was copper, and the conductivity σ = 5.8 × 10 ⁷ [S / m].

  The via conductors 2823 and 2824 arranged on the insulating substrate 151 have a diameter of 0.2 [mm] and a length of 4 [mm]. The via conductors 2823 and 2824 were made of tungsten, which is the same as the conductor pattern 2821. The distance between the centers of the via conductors 2823 and 2824 was 38 [mm], and the via conductors 2823 and 2824 were arranged at a distance of 19 [mm] from the center of the conductor pattern 2821.

  The via conductors 2825 and 2826 arranged on the insulating substrate 161 have a diameter of 0.2 [mm] and a length of 0.58 [mm]. The via conductors 2825 and 2826 are made of the same copper as the conductor pattern 2822. The distance between the centers of the via conductors 2825 and 2826 is 38 [mm], and the via conductors 2825 and 2826 are disposed at a distance of 19 [mm] from the center of the conductor pattern 2822.

The size of the connecting members 2827 and 2828 was a cylindrical model having a diameter of 0.2 [mm] and a height of 0.2 [mm]. The material of the connecting materials 2827 and 2828 was solder, and the conductivity σ = 0.7 × 10 ⁷ [S / m].

  In Example 2, as a magnetic field noise source, the model of the Helmholtz coil 900 shown in FIG. 6 was used as in Example 1, and the evaluation amount and evaluation points were also the same as in Example 1.

FIG. 9 is a graph showing electromagnetic field simulation results of Example 2 and Example 1. The interlinkage magnetic flux in Example 2 was 495.5 × 10 ⁻¹² [Wb], which was 2.1% lower than the interlinkage magnetic flux 506.1 × 10 ⁻¹² [Wb] in Example 1.

[Third Embodiment]
Next, electronic components of an imaging apparatus that is an example of an electronic apparatus according to the third embodiment will be described. FIG. 10 is a cross-sectional view of an electronic component 330 according to the third embodiment. In addition, in the electronic component 330 of 3rd Embodiment shown in FIG. 10, the same code | symbol is attached | subjected about the structure similar to the electronic component 130 of 1st Embodiment, and the electronic component 230 of 2nd Embodiment, and the description is abbreviate | omitted. .

  The electronic component 330 is a printed circuit board, and includes a semiconductor package 340 and a printed wiring board 360. The semiconductor package 340 is mounted on the printed wiring board 360. Specifically, the semiconductor package 340 is mechanically and electrically connected to the printed wiring board 360 with a conductive connecting material such as solder and supported by the printed wiring board 360. Note that circuit components (not shown) that are electrically connected to the semiconductor package 340 are mounted on the printed wiring board 360.

  The structure of the semiconductor package 340 is an LCC as in the first embodiment. The semiconductor package 340 includes a package substrate 350, an image sensor 141, and a lid 145. The package substrate 350 is a multilayer substrate composed of an insulating substrate 151 and a conductor formed on the insulating substrate 151 and made of a conductor pattern or a via conductor.

  The printed wiring board 360 is a multilayer board composed of an insulating substrate 161 and a conductor formed on the insulating substrate 161 and made of a conductor pattern and a via conductor. The insulating substrate 151 and the insulating substrate 161 constitute an insulating substrate portion 171 that supports the image sensor 141.

  The electronic component 330 of the third embodiment includes a loop conductor 381 that is a first loop conductor, a loop conductor 182 that is a second loop conductor having the same configuration as that of the first embodiment, and a loop conductor 383 that is a third loop conductor. And having. The loop conductor 381 is disposed across the insulating substrate 151 and the insulating substrate 161, and forms a loop L1. The loop conductor 383 is provided on the insulating substrate 161. The loop conductor 383 is disposed adjacent to the loop conductor 182 in the Z direction when viewed from the X direction.

  The loop conductor 383 has two conductor patterns 3831 and 3832 that are spaced apart from each other in the Z direction. In addition, the loop conductor 383 includes two via conductors 3833 and 3834 that are arranged to be spaced from each other in the Y direction. The via conductors 3833 and 3834 are arranged between the conductor pattern 3831 and the conductor pattern 3832, and electrically connect the conductor pattern 3831 and the conductor pattern 3832. Thus, the loop conductor 383 forms a loop L3 with the conductors provided on the insulating substrate 161, that is, the conductor patterns 3831 and 3832 and the via conductors 3833 and 3834.

  The loop conductor 182 and the loop conductor 383 may not be electrically connected, but are preferably electrically connected. Specifically, the via conductor 1823 disposed on the insulating substrate 151 and the via conductor 3833 disposed on the insulating substrate 161 are electrically connected by a conductive connecting material 3841 such as solder. In addition, the via conductor 1824 disposed on the insulating substrate 151 and the via conductor 3834 disposed on the insulating substrate 161 are electrically connected by a conductive connecting material 3842 such as solder.

  Thereby, a large loop combining the loop L2 and the loop L3 and individual loops such as the loop L2 and the loop L3 are formed. A demagnetizing field is generated by the magnetic flux of the magnetic field noise interlinking each of the loops L2 and L3, and the magnetic field noise in the loop conductor 381 is reduced. In addition, due to the large loop including the loop L2 and the loop L3, the linkage flux as a whole increases and the induced current increases. Therefore, a larger demagnetizing field can be generated, and magnetic field noise in the loop conductor 381 can be more effectively reduced. A large loop including the loop L2 and the loop L3 is preferably formed so as to have a larger area than the loop L1 and surround the entire loop L1 when viewed from the X direction.

  Similarly to the loop conductor 182, the loop conductor 383 is disposed outside the imaging element 141 as viewed from the Z direction. A part of the loop conductor 182, specifically, the entire conductor pattern 1821 and a part of the via conductors 1823 and 1824 are located inside the convex portion 153 of the insulating substrate 151. Thereby, when viewed from the X direction, the area surrounded by the loop including the loop conductor 182 and the loop conductor 383 can be increased, and the entire loop conductor 381 can be surrounded by the loop conductor 182 and the loop conductor 383. it can. Therefore, the magnetic field noise in the loop conductor 381 can be reduced more effectively. In addition, since the area where the magnetic flux links in the loop including the loop conductor 182 and the loop conductor 383 is increased, a larger demagnetizing field can be generated. Therefore, magnetic field noise in the loop conductor 381 can be reduced more effectively.

  A loop conductor 182 is disposed on the insulating substrate 151, and a loop conductor 383 is disposed on the insulating substrate 161. Therefore, it is not necessary to add a member different from the package substrate 350, the printed wiring board 360, and the connection members 3841 and 3842, and space saving and cost reduction can be achieved.

  Further, even if the conductor of the package substrate 350 and the conductor of the printed wiring board 360 are made of different materials, magnetic field noise can be effectively reduced.

  In addition, although the case where each of the loop conductor 381, the loop conductor 182 and the loop conductor 383 is described has been described, a plurality of cases may be used as shown in FIGS. 5A and 5B, for example. In this case, the plurality of loop conductors 182 may be connected to each other, or the plurality of loop conductors 383 may be connected to each other.

(Example 3)
As Example 3 corresponding to the electronic component 330 of the third embodiment, a magnetic field analysis for verifying the interlinkage magnetic flux in the electronic component 330 was performed. As an analysis tool, Maxwell 3D of ANSYS which is an electromagnetic field simulator was used.

The loop conductor 182 has the same conditions as in Example 1. The conditions for the loop conductor 383 will be described. The sizes of the conductor patterns 3831 and 3832 are the same as the sizes of the conductor patterns 1821 and 1822 of the loop conductor 182. The material of the conductor patterns 3831 and 3832 was copper, and the conductivity σ was 5.8 × 10 ⁷ [S / m]. The conductor pattern 1822 arranged on the insulating substrate 151 and the conductor pattern 3831 arranged on the insulating substrate 161 were arranged with an interval of 0.2 [mm] in the Z direction.

  The via conductors 3833 and 3834 had a diameter of 0.2 [mm] and a length of 0.58 [mm]. The material of the via conductors 3833 and 3834 was the same copper as the conductor patterns 3831 and 3832. The distance between the centers of the via conductors 3833 and 3834 was 38 [mm], and the via conductors 3833 and 3834 were arranged at a distance of 19 [mm] from the center of the via conductors 3833 and 3834.

The size of the connecting members 3841 and 3842 was a cylindrical model having a diameter of 0.2 [mm] and a height of 0.2 [mm]. The connecting materials 3841 and 3842 were made of solder and had a conductivity σ = 0.7 × 10 ⁷ [S / m].

  In the third embodiment, the magnetic field noise source is the model of the Helmholtz coil 900 shown in FIG. 6 as in the first and second embodiments, and the evaluation amount and the evaluation points are the same as those in the first and second embodiments.

FIG. 11 is a graph showing electromagnetic field simulation results of Example 2 and Example 3. The interlinkage magnetic flux in Example 3 was 489.1 × 10 ⁻¹² [Wb], which was 1.3% lower than the interlinkage magnetic flux 495.5 × 10 ⁻¹² [Wb] in Example 2.

[Fourth Embodiment]
Next, electronic components of an imaging apparatus that is an example of an electronic apparatus according to the fourth embodiment will be described. FIG. 12A is a perspective view schematically showing an electronic component 430 according to the fourth embodiment. FIG. 12B is a plan view of the electronic component 430 according to the fourth embodiment. In addition, in the electronic component 430 of 4th Embodiment shown to Fig.12 (a) and FIG.12 (b), about the structure similar to the electronic component 130 of 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted. .

  The electronic component 430 is a printed circuit board, and includes a semiconductor package 440 and a printed wiring board 160. The semiconductor package 440 is mounted on the printed wiring board 160. Specifically, the semiconductor package 440 is mechanically and electrically connected to the printed wiring board 160 by a conductive connecting material such as solder and supported by the printed wiring board 160. Note that circuit components (not shown) that are electrically connected to the semiconductor package 440 are mounted on the printed wiring board 160.

  The structure of the semiconductor package 440 is an LCC as in the first embodiment. The semiconductor package 440 includes a package substrate 450 and an image sensor 141. The package substrate 450 is a multilayer substrate composed of an insulating substrate 151 and a conductor provided on the insulating substrate 151 and made of a conductor pattern or a via conductor.

  The electronic component 430 includes a loop conductor 181 that is a first loop conductor having a configuration similar to that of the first embodiment, and a loop conductor 182 that is a second loop conductor having a configuration similar to that of the first embodiment.

  A plurality of loop conductors 181 are arranged along each of the two sides 1411 and 1412 of the plurality of sides 1411, 1412, 1413 and 1414 of the image sensor 141 when viewed from the Z direction. In FIG. 12A, only the loop conductor 181 disposed along the side 1411 of the image sensor 141 is illustrated, and the illustration of the loop conductor 181 disposed along the side 1412 is omitted.

  A plurality of loop conductors 182 are arranged along each of a plurality (two) sides 1411 and 1412 of the image sensor 141 as viewed from the Z direction. The two loop conductors 182 are connected to each other, and are L-shaped along the two adjacent sides 1411 and 1412 of the image sensor 141 as viewed from the Z direction.

  The structure including the two loop conductors 182 has conductor patterns 4821 and 4822 having L-shapes as viewed from the Z direction, which are spaced apart from each other in the Z direction. The structure including the two loop conductors 182 includes three via conductors 4823, 4824, and 4825 that electrically connect the conductor pattern 4821 and the conductor pattern 4822.

  The conductor patterns 4821 and 4822 and the via conductors 4823 and 4824 form one loop L21 when viewed from the X direction. The conductor patterns 4821 and 4822 and the via conductors 4824 and 4825 form one loop L22 when viewed from the Y direction.

  The loop conductor 182 constituted by the loop L21 is arranged so as to surround a part or all, preferably all, of the loop conductor 181 arranged along the side 1411 when viewed from the X direction. The loop conductor 182 constituted by the loop L22 is arranged so as to surround a part or all, preferably all, of the loop conductor 181 arranged along the side 1412 when viewed from the Y direction. Since each loop conductor 182 has the same arrangement relationship as that of the first embodiment with respect to each loop conductor 181, description thereof is omitted.

  According to the fourth embodiment, even when magnetic field noise enters the image sensor 141 from the X and Y directions, an electromotive force is generated in the loops L21 and L22, and an induced current flows. The induced current generates a demagnetizing field that cancels the magnetic field noise. Therefore, the magnetic flux interlinking with each loop conductor 181 is reduced, the operation of the image sensor 141 is stabilized, and the occurrence of disturbance in the image is suppressed.

  Further, since the loop conductor 182 is disposed on the insulating substrate 151, it is not necessary to add a member different from the package substrate 450, and space saving and cost reduction can be achieved.

  In addition, although the case where the loop conductor 182 is disposed on the two sides of the image sensor 141 has been described, the loop conductor 182 may be disposed on three or more sides.

Example 4
As Example 4 corresponding to the electronic component 430 of the fourth embodiment, magnetic field analysis for verifying the interlinkage magnetic flux in the electronic component 430 was performed. As an analysis tool, Maxwell 3D of ANSYS which is an electromagnetic field simulator was used.

The size of the L-shaped conductor patterns 4821 and 4822 is such that the outer long side (side facing when viewed from the X direction) is 40 [mm] and the outer short side (side facing when viewed from the Y direction). 35 [mm], width 4 [mm], and thickness 0.01 [mm]. The material of the conductor patterns 4821 and 4822 was tungsten, and the conductivity σ = 1.82 × 10 ⁷ [S / m]. The conductor pattern 4821 and the conductor pattern 4822 were arranged with an interval of 4 [mm] in the Z direction.

  The via conductors 4823, 4824, and 4825 were 0.2 [mm] in diameter and 4 [mm] in length. The via conductors 4823, 4824, and 4825 were made of the same tungsten as the conductor patterns 4821 and 4822. The via conductors 4823 and 4824 were disposed at a distance of 19 [mm] from the center of the long sides of the conductor patterns 4821 and 4822 with the distance between the centers being 38 [mm]. The via conductors 4824 and 4825 were arranged at a distance of 16.5 [mm] from the center of the short sides of the conductor patterns 4821 and 4822, with the distance between the centers being 33 [mm].

  Here, a model of the magnetic field noise source will be described. A Helmholtz coil 900 model was used as the magnetic field noise source, as in Example 1. In the fourth embodiment, the simulation of the model of the Helmholtz coil 900 was performed with two patterns of an arrangement for generating a magnetic field in the X direction and an arrangement for generating a magnetic field in the Y direction.

In the case of an arrangement in which a magnetic field is generated in the X direction, the evaluation amount and the evaluation point are the same as those in Example 1. In the arrangement in which a magnetic field is generated in the Y direction, the evaluation amount is the same as in Example 1, and the evaluation point, that is, the region R1 shown in FIG. 4B is 31 [mm] × 3.5 [mm]. . That is, the area of the region R1 was 1.085 × 10 ⁻⁴ [m ² ].

(Example 5)
In the first embodiment, the loop conductors 181 and 182 are arranged on the long side 1411 (see FIG. 2), but in the fifth embodiment, in addition to the configuration of the first embodiment, the short side 1412 (see FIG. 2). 5 (a)), the case where the loop conductors 181 and 182 are arranged was also simulated.

The size of the conductor patterns 1821 and 1822 in the loop conductor 182 arranged on the side 1412 side was set to 35 [mm] × 4 [mm] × 0.01 [mm]. The material of the conductor patterns 1821 and 1822 was tungsten, and the conductivity σ = 1.82 × 10 ⁷ [S / m]. The conductor pattern 1821 and the conductor pattern 1822 were arranged with an interval of 4 [mm] in the Z direction. The via conductors 1823 and 1824 are 0.2 [mm] in diameter and 4 [mm] in length. The via conductors 1823 and 1824 are made of tungsten, which is the same as the conductor patterns 1821 and 1822. The distance between the centers of the via conductors 1823 and 1824 is 33 [mm], and the via conductors 1823 and 1824 are arranged at a distance of 16.5 [mm] from the centers of the conductor patterns 1821 and 1822.

  Here, a model of the magnetic field noise source will be described. A Helmholtz coil 900 model was used as the magnetic field noise source, as in Example 1. In the fifth embodiment, the simulation of the model of the Helmholtz coil 900 was performed with two patterns of an arrangement for generating a magnetic field in the X direction and an arrangement for generating a magnetic field in the Y direction.

  FIGS. 13A and 13B are graphs showing electromagnetic field simulation results of Example 4 and Example 5. FIG. FIG. 13A shows a case where a magnetic field is generated in the X direction in the fourth and fifth embodiments. FIG. 13B shows a case where a magnetic field is generated in the Y direction in the fourth and fifth embodiments. The case is illustrated.

As shown in FIG. 13 (a), the flux linkage in Example ^{4, 504.6 × 10 -12 [Wb} ] , and the flux linkage 506.1 × ¹⁰ -12 in Example 5 [Wb] than Reduced by 0.3%.

As shown in FIG. 13B, the interlinkage magnetic flux in Example 4 is 426.5 × 10 ⁻¹² [Wb], and the interlinkage magnetic flux in Example 5 is 427.2 × 10 ⁻¹² [Wb]. Was also reduced by 0.17%.

  With the above configuration, in the fourth embodiment, magnetic field noise in each loop conductor 181 can be reduced as compared with the case where an independent annular structure is used as in the fifth embodiment. This is because the two loop conductors 182 are electrically connected in an L shape, so that the electric resistance value decreases and the induced current generated in the loops L21 and L22 increases. The induced current generates a larger demagnetizing field than canceling the magnetic field noise in each loop conductor 181, and can reduce the flux linkage in each loop conductor 181.

[Fifth Embodiment]
Next, electronic components of an imaging apparatus that is an example of an electronic apparatus according to the fifth embodiment will be described. FIG. 14A is a perspective view schematically showing an electronic component 530 according to the fifth embodiment. FIG. 14B is a plan view of the electronic component 530 according to the fifth embodiment. In addition, in the electronic component 530 of 5th Embodiment shown to Fig.14 (a) and FIG.14 (b), about the structure similar to the electronic component 130 of 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted. .

  The electronic component 530 is a printed circuit board, and includes a semiconductor package 540 and a printed wiring board 160. The semiconductor package 540 is mounted on the printed wiring board 160. Specifically, the semiconductor package 540 is mechanically and electrically connected to the printed wiring board 160 with a conductive connecting material such as solder and supported by the printed wiring board 160. Note that circuit components (not shown) that are electrically connected to the semiconductor package 540 are mounted on the printed wiring board 160.

  The structure of the semiconductor package 540 is an LCC as in the first embodiment. The semiconductor package 540 includes a package substrate 550 and an image sensor 141. The package substrate 550 is a multilayer substrate composed of an insulating substrate 151 and a conductor formed on the insulating substrate 151 and made of a conductor pattern or a via conductor.

  The electronic component 530 includes a loop conductor 181 that is a first loop conductor having a configuration similar to that of the first embodiment, and a loop conductor 182 that is a second loop conductor having a configuration similar to that of the first embodiment.

  A plurality of loop conductors 181 are arranged along each of a plurality of (four) sides 1411, 1412, 1413, and 1414 of the image sensor 141 when viewed from the Z direction. In FIG. 14A, only the loop conductor 181 disposed along the side 1411 of the image sensor 141 is illustrated, and the loop conductor 181 disposed along the side 1412, the side 1413, and the side 1414 is not illustrated. doing.

  A plurality of loop conductors 182 are arranged along each of a plurality (four) sides 1411, 1412, 1413, and 1414 of the image sensor 141 as viewed from the Z direction. The four loop conductors 182 are connected to each other, and have a square ring shape along the four adjacent sides 1411, 1412, 1413, and 1414 of the image sensor 141 as viewed from the Z direction.

  The structure formed by the four loop conductors 182 has rectangular ring-shaped conductor patterns 5821 and 5822 as viewed from the Z direction, which are arranged at intervals in the Z direction. The structure including the four loop conductors 182 includes four via conductors 5823, 5824, 5825, and 5826 that electrically connect the conductor pattern 5821 and the conductor pattern 5822. Four loops L21, L22, L23, and L24 that are electrically connected to each other are formed by the structure including the four loop conductors 182 described above. Since each loop conductor 182 has the same arrangement relationship as that of the first embodiment with respect to each loop conductor 181, description thereof is omitted.

  Further, in the fifth embodiment, the loop L25 is formed by a structure including four loop conductors 182 as viewed from the Z direction. According to the fifth embodiment, the four loops L21, L22, L23, and L24 generate a demagnetizing field that cancels the magnetic field even with respect to the magnetic field from all directions in the X and Y directions, and magnetic field noise in the loop conductor 181. Can be effectively reduced. Further, the loop L25 generates a demagnetizing field that cancels the magnetic field even with respect to the magnetic field from the Z direction, and can effectively reduce magnetic field noise incident on the image sensor 141. Therefore, the operation of the image sensor 141 is stabilized, and image disturbance can be effectively suppressed.

  Further, since the loop conductor 182 is disposed on the insulating substrate 151, it is not necessary to add a member different from the package substrate 550, and space saving and cost reduction can be achieved.

(Example 6)
As Example 6 corresponding to the electronic component 530 of the fifth embodiment, magnetic field analysis for verifying the interlinkage magnetic flux in the electronic component 530 was performed. As an analysis tool, Maxwell 3D of ANSYS which is an electromagnetic field simulator was used.

The square ring-shaped conductor patterns 5821 and 5822 have a size of 40 [mm] on the outer long side, 35 [mm] on the outer short side, 4 [mm] on the width, and 0.01 [mm] on the thickness. It was. The material of the conductor patterns 5821 and 5822 was tungsten, and the conductivity σ = 1.82 × 10 ⁷ [S / m]. The conductor pattern 5821 and the conductor pattern 5822 were arranged with an interval of 4 [mm] in the Z direction.

  The via conductors 5823, 5824, 5825, and 5826 were 0.2 [mm] in diameter and 4 [mm] in length. The via conductors 5823, 5824, 5825, and 5826 are made of tungsten, which is the same as the conductor patterns 5821 and 5822. The distance between the center of the via conductor 5823 and the via conductor 5824 and the distance between the center of the via conductor 5825 and the via conductor 5826 are 38 [mm], and 19 [mm] from the center of the long side of the conductor patterns 5821 and 5822. Placed at a distance of. The distance between the centers of the via conductor 5824 and the via conductor 5825 and the distance between the centers of the via conductor 5826 and the via conductor 5823 is 33 [mm], and 16.5 [16.5] from the center of the short side of the conductor patterns 5821 and 5822. mm].

  Here, a model of the magnetic field noise source will be described. A Helmholtz coil 900 model was used as the magnetic field noise source, as in Example 1. In Example 6, the simulation of the arrangement of the model of the Helmholtz coil 900 was performed with an arrangement that generates a magnetic field in the Z direction.

The evaluation amount was the same as in Example 1. The evaluation point was a circuit in which the image sensor 141 was damaged, and the area of 36 [mm] × 32 [mm] above the image sensor 141 was 11.52 × 10 ⁻⁴ [m ² ].

(Example 7)
As Example 7, a simulation was performed when the four loop conductors 182 were not connected to each other (see FIG. 5B). As shown in FIG. 5B, the remaining two sides (long side, short side) 1413 and 1414 of Example 5 (FIG. 5A) are further provided with loop conductors 182 of the same size as Example 5. Provided.

FIG. 15 is a graph showing electromagnetic field simulation results of Example 6 and Example 7. The interlinkage magnetic flux in Example 6 was 860 × 10 ⁻¹² [Wb], which was 20.9% lower than the interlinkage magnetic flux 680 × 10 ⁻¹² [Wb] in Example 7.

[Sixth Embodiment]
Next, electronic components of an imaging apparatus that is an example of an electronic apparatus according to the sixth embodiment will be described. FIG. 16A is a plan view of an electronic component 630 according to the sixth embodiment. FIG. 16B is a cross-sectional view of the electronic component 630 along the line XVIB-XVIB in FIG. In addition, in the electronic component 630 of 6th Embodiment shown to Fig.16 (a) and FIG.16 (b), about the structure similar to the electronic component 130 of 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted. .

  In the first to fifth embodiments, the case where the image sensor 141 is mounted on the package substrate has been described as an example, but the present invention is not limited to this. Hereinafter, a case where the image sensor 141 is directly mounted on the printed wiring board 660 will be described.

  The electronic component 630 includes an image sensor 141 and a printed wiring board 660 on which the image sensor 141 is fixed (mounted). In addition, the electronic component 630 includes a frame body 671 that surrounds the image sensor 141 and a lid body 672 that is a transparent plate fixed to the frame body 671 and is disposed on the printed wiring board 660.

  The printed wiring board 660 is a multilayer board composed of an insulating board 661 and a conductor composed of a conductor pattern and a via conductor disposed on the insulating board 661. The image sensor 141 is electrically connected to a conductor pad of the printed wiring board 660 via, for example, a bonding wire.

  In the sixth embodiment, the electronic component 630 includes a loop conductor 681 that is a part of the power supply line and is the first loop conductor. The loop conductor 681 is disposed across the image sensor 141 and the insulating substrate 661. In the sixth embodiment, the insulating substrate 661 is an insulating substrate portion.

  Furthermore, in the sixth embodiment, the electronic component 630 includes a loop conductor 682 that is a second loop conductor provided on the insulating substrate 661. The loop conductor 682 is disposed at a position surrounding part or all of the loop conductor 681 in the sixth embodiment, in the sixth embodiment. Thereby, magnetic field noise in the loop conductor 681 can be reduced.

  Further, the loop conductor 682 is disposed outside the image sensor 141 as viewed from the Z direction. The loop conductor 682 is provided with two conductor patterns 6821 and 6822 spaced apart in the Z direction, and two via conductors 6823 electrically disposed between the conductor patterns 6821 and 6822 spaced apart in the Y direction. , 6824. Thus, the loop conductor 682 forms a loop L2 with the conductors provided on the insulating substrate 651, that is, the conductor patterns 6821 and 6822 and the via conductors 6823 and 6824.

  Further, the loop conductor 682 is disposed so as not to be connected to the loop conductor 681, so that the induced current generated in the loop conductor 682 does not flow into the loop conductor 681. The loop conductor 682 is preferably not connected to other conductors in the printed wiring board 660 such as a power supply line, a signal line, and a ground line, but may be electrically connected to the ground line.

  The short distance between the loop conductor 681 and the loop conductor 682 is better. In the sixth embodiment, a part of the loop conductor 681 is located between the conductor patterns 6821 and 6822. That is, as viewed from the Z direction, a part of the loop conductor 681 overlaps the conductor patterns 6821 and 6822.

  Further, since the loop conductor 682 is disposed on the insulating substrate 651, it is not necessary to add a member different from the printed wiring board 660, and space saving and cost reduction can be achieved.

  In addition, although the case where there is one loop conductor 681 and one loop conductor 682 has been described, there may be a plurality of cases as shown in FIGS. 5A and 5B, for example. In this case, a plurality of loop conductors 682 may be connected to each other as in the fourth or fifth embodiment.

(Example 8)
As Example 8 corresponding to the electronic component 630 of the sixth embodiment, a magnetic field analysis for verifying the interlinkage magnetic flux in the electronic component 630 was performed. As an analysis tool, Maxwell 3D of ANSYS which is an electromagnetic field simulator was used.

The size of the conductor patterns 6821 and 6822 was 40 [mm] × 4 [mm] × 0.02 [mm]. The material of the conductor patterns 6821 and 6822 was copper, and the conductivity σ = 5.8 × 10 ⁷ [S / m]. The conductor pattern 6821 and the conductor pattern 6822 were arranged with an interval of 0.6 [mm] in the Z direction.

  The via conductors 6823 and 6824 were 0.2 [mm] in diameter and 0.6 [mm] in length. The via conductors 6823 and 6824 were made of the same copper as the conductor patterns 6821 and 6822. The distance between the centers of the via conductors 6823 and 6824 was 38 [mm], and the via conductors 6823 and 6824 were arranged at a distance of 19 [mm] from the centers of the conductor patterns 6821 and 6822.

The model for the magnetic field noise source is the same as that in the first embodiment, and is omitted. As an evaluation amount, a magnetic flux interlinking the inner region of the loop conductor 681 was used. The area inside the loop conductor 681 was set to 36.5 [mm] × 0.4 [mm], and the magnetic flux was calculated from the above equation (1). Here, in Formula (1), S is the area of the area | region inside the loop conductor 681, and is 0.146 * 10 < ^-4 > [m < ² >].

(Comparative Example 2)
As Comparative Example 2, an electronic component in which only the conductor patterns 6821 and 6822 are arranged is modeled. Since the conditions of the conductor patterns 6821 and 6822 are the same as those in the eighth embodiment, the description thereof is omitted.

FIG. 17 is a graph showing electromagnetic field simulation results of Example 8 and Comparative Example 2. The interlinkage magnetic flux in Example 8 was 57.1 × 10 ⁻¹² [Wb], which was 2.7% lower than the interlinkage magnetic flux 58.7 × 10 ⁻¹² [Wb] in Comparative Example 2.

  The present invention is not limited to the embodiment described above, and many modifications are possible within the technical idea of the present invention. In addition, the effects described in the embodiments are merely a list of the most preferable effects resulting from the present invention, and the effects of the present invention are not limited to those described in the embodiments.

  In the first to sixth embodiments, the case where the semiconductor element is an imaging element has been described as an example. However, the present invention is not limited to this, and the present invention can be applied to various semiconductor elements. Moreover, although the said 1st-6th embodiment demonstrated the case where an electronic device was an imaging device, it is not limited to this, This invention is applicable about various electronic devices.

  In the first to sixth embodiments, the case where the structure of the semiconductor package is LCC has been described. However, the present invention is not limited to this, and may be, for example, an LGA (Land Grid Array).

  In the first to sixth embodiments, the case where the first loop conductor is formed by the power supply line has been described. However, the first loop conductor may be formed by a ground line. In this case, the second loop conductor is preferably not connected to the power supply line, the ground line, and the signal line.

  Moreover, although the said 1st, 4th and 5th embodiment demonstrated the case where the loop conductor 182 was arrange | positioned at the insulated substrate 151, it is not limited to this. For example, the loop conductor 182 may be disposed across the insulating substrate 151 and the insulating substrate 161, or may be disposed only on the insulating substrate 161.

  In the first, fourth, and fifth embodiments, the case where the electronic component includes the semiconductor package and the printed wiring board has been described. However, the electronic component may include only the semiconductor package.

  In the first to sixth embodiments, the laminated structure of the package substrate and the printed wiring board has been described. However, the present invention is not limited to this. The present invention is applicable.

  Further, the configurations of the first loop conductor, the second loop conductor, and the third loop conductor are not limited to those illustrated in the first to sixth embodiments, and various modifications can be made.

DESCRIPTION OF SYMBOLS 100 ... Imaging device (electronic device), 130 ... Electronic component, 141 ... Imaging element (semiconductor element), 142 ... Light-receiving surface (main surface), 151 ... Insulating substrate (first insulating substrate), 161 ... Insulating substrate (second Insulating substrate), 171 ... Insulating substrate part, 181 ... Loop conductor (first loop conductor), 182 ... Loop conductor (second loop conductor)

Claims (15)

A semiconductor element;
An insulating substrate for supporting the semiconductor element;
A first loop conductor disposed across the semiconductor element and the insulating substrate portion;
A second loop conductor provided on the insulating substrate portion and disposed at a position surrounding a part or all of the first loop conductor when viewed from a direction parallel to the main surface of the semiconductor element.
An electronic component characterized by that. The second loop conductor is disposed outside the semiconductor element when viewed from a direction perpendicular to the main surface of the semiconductor element.
The electronic component according to claim 1. The insulating substrate unit has a first insulating substrate on which the semiconductor element is mounted,
The second loop conductor forms a loop with a conductor provided on the first insulating substrate,
The electronic component according to claim 1, wherein the electronic component is an electronic component. The insulating substrate unit includes a second insulating substrate that supports the first insulating substrate;
A third loop conductor provided on the second insulating substrate and disposed adjacent to the second loop conductor as viewed from a direction parallel to the main surface of the semiconductor element;
The electronic component according to claim 3. The third loop conductor is electrically connected to the second loop conductor;
The electronic component according to claim 4. The insulating substrate part is
A first insulating substrate on which the semiconductor element is mounted;
A second insulating substrate that supports the first insulating substrate;
The second loop conductor is disposed across the first insulating substrate and the second insulating substrate;
The electronic component according to claim 1 or 2, characterized in that The second loop conductor is disposed along the side of the semiconductor element when viewed from a direction perpendicular to the main surface of the semiconductor element.
The electronic component according to claim 1, wherein the electronic component is an electronic component. A plurality of the second loop conductors are arranged along each of the plurality of sides of the semiconductor element when viewed from a direction perpendicular to the main surface of the semiconductor element.
The electronic component according to claim 1, wherein the electronic component is an electronic component. A plurality of the second loop conductors are connected to each other;
The electronic component according to claim 8. The first loop conductor is a loop conductor formed of a power line or a loop conductor formed of a ground line.
The electronic component according to claim 1, wherein the electronic component is an electronic component. The first loop conductor and the second loop conductor are disconnected.
The electronic component according to claim 1, wherein the electronic component is an electronic component. The semiconductor element is an imaging element.
The electronic component according to claim 1, wherein the electronic component is an electronic component. A magnetic field source;
A semiconductor element disposed at a distance from the magnetic field generation source;
An insulating substrate for supporting the semiconductor element;
A first loop conductor disposed across the semiconductor element and the insulating substrate portion;
A second loop conductor provided on the insulating substrate portion and disposed at a position surrounding a part or all of the first loop conductor when viewed from a direction parallel to the main surface of the semiconductor element.
An electronic device characterized by that. The semiconductor element is an imaging element.
The electronic device according to claim 13. The magnetic field generation source is a motor.
The electronic device according to claim 13 or 14, characterized in that:

Images