JP6770629B1 - Silicon material shipping bag and silicon material packaging - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a packaging material capable of suppressing the occurrence of cracks in a barrier layer, a bag for transporting a silicon material, and a packaging body made of a silicon material. SOLUTION: A packaging material used for a bag for transporting a silicon material is a laminate in which at least a first resin base material layer, a barrier layer, a second resin base material layer, and a sealant layer are laminated in this order. The body. [Selection diagram] FIG. 1A

Description

The present disclosure relates to a shipping bag made of silicon material and a packing body made of silicon material.

Silicon wafers used in the manufacture of semiconductor products, etc., and bags used for packing silicon materials such as polysilicon, which is the raw material for silicon wafers, contain oxygen, water vapor, etc. that can alter the silicon material that is the content. It is composed of a packaging material having a barrier function capable of blocking permeation. As such a packaging material, polyethylene terephthalate (PET) is arranged on one side of a vapor deposition layer (barrier layer) of aluminum oxide, and low density polyethylene (LDPE) or linear low density polyethylene (LLDPE) is arranged on the other side. Is known (see Patent Document 1).

Japanese Unexamined Patent Publication No. 2004-148633

When a silicon material is packed in a bag made of the packaging material disclosed in Patent Document 1, the inside of the bag is degassed and vacuum-packed after the silicon material is contained in the bag. In the vacuum-packed packaging body, a predetermined stress is applied to the packaging material constituting the bag. When stress is applied to the packaging material, there is a difference between the strain of PET located on one side of the barrier layer and the strain of polyethylene (LDPE, LLDPE) located on the other side, and the difference in strain causes the barrier layer. There is a possibility that the barrier layer cannot be followed and cracks occur. If cracks occur in the barrier layer, the barrier function of blocking the permeation of oxygen, water vapor, etc. is reduced.

Further, even when the packing body in which the silicon material is packed in the bag is exposed to an environment of relatively high temperature and high humidity, the elongation rate of PET and polyethylene (LDPE, LLDPE) located on one side of the barrier layer There is a risk that cracks will occur in the barrier layer due to differences in the above.

In view of the above problems, one object of the present disclosure is to provide a packaging material capable of suppressing the occurrence of cracks in the barrier layer, a bag for transporting the silicon material, and a packaging body for the silicon material.

In order to solve the above problems, as one embodiment of the present disclosure, a packaging material used for a transport bag of a silicon material, wherein the packaging material includes a first resin base material layer, a barrier layer, and a first. and second resin substrate layer, and a resin layer, Ri laminate der laminating a sealant layer in this order, wherein the resin layer is composed of polyethylene, and the first resin substrate layer and the second The resin base material layer is made of the same resin material, and the indentation elastic coefficient of the resin material constituting the first resin base material layer and the second resin base material layer is within the range of 1500 MPa to 3500 MPa. A packaging material is provided in which the indentation elastic coefficient of the material constituting the sealant layer is in the range of 300 MPa to 500 MPa .
Further, as one embodiment of the present disclosure, it is a packaging material used for a bag for transporting a silicon material, and the packaging material includes a first resin base material layer, a barrier layer, and a second resin base material layer. A resin layer and a sealant layer are laminated in this order. The resin layer is composed of a two-component urethane resin adhesive, and the first resin base material layer and the second resin. The base material layer is made of the same resin material, and the indentation elastic coefficient of the resin material constituting the first resin base material layer and the second resin base material layer is in the range of 1500 MPa to 3500 MPa. There is provided a packaging material in which the indentation elastic coefficient of the material constituting the sealant layer is in the range of 300 MPa to 500 MPa.

Resin material constituting the resin material and the second resin substrate layer constituting the first resin substrate layer may be a polyester resin or polyamide resin may be a pre-Symbol polyester resin.

The thickness of the resins layer may be 1 m to 5 m. May be pre-Symbol barrier layer has a transparency, the barrier layer may include silica or alumina.

As one embodiment of the present disclosure, a silicon material transport bag, wherein the silicon material transport bag is made of the packaging material, and the sealant layer is located inside the silicon material transport bag. A shipping bag of silicone material is provided.

As one embodiment of the present disclosure, there is provided a silicone material packing body including the silicon material transport bag and the silicon material housed in the silicon material transport bag.

According to the present disclosure, it is possible to provide a packaging material capable of suppressing the occurrence of cracks in the barrier layer, a bag for transporting a silicon material, and a packaging body of the silicon material.

FIG. 1A is a partially enlarged cut end view showing a schematic configuration of one aspect of a packaging material according to an embodiment of the present disclosure. FIG. 1B is a partially enlarged cut end view showing a schematic configuration of another aspect of the packaging material in one embodiment of the present disclosure. FIG. 1C is a partially enlarged cut end view showing a schematic configuration of another aspect of the packaging material in one embodiment of the present disclosure. FIG. 2 is a partially enlarged cut end view showing a schematic configuration of another aspect of the packaging material in one embodiment of the present disclosure. FIG. 3 is a partially enlarged cut end view showing a schematic configuration of one aspect of the sealant according to the embodiment of the present disclosure. FIG. 4 is a partially enlarged cut end view showing a schematic configuration of another aspect of the sealant in one embodiment of the present disclosure. FIG. 5 is a perspective view showing a schematic configuration of a silicon material transport bag in an unfolded state according to an embodiment of the present disclosure. FIG. 6 is a perspective view showing a schematic configuration of a silicon material transport bag in a closed state according to an embodiment of the present disclosure. FIG. 7 is a perspective view showing a schematic configuration of a package of silicon material according to an embodiment of the present disclosure. FIG. 8A is a mass spectrum showing the GC / MS analysis result of Sample 1. FIG. 8B is a mass spectrum showing the results of GC / MS analysis of Sample 2. FIG. 8C is a mass spectrum showing the results of GC / MS analysis of Sample 3.

Embodiments of the present disclosure will be described with reference to the drawings.
In the drawings attached to the present specification, in order to facilitate understanding of the present disclosure, the shape, scale, aspect ratio, etc. of each part may be changed or exaggerated from the actual product. The numerical range represented by using "~" in the present specification and the like means a range including each of the numerical values before and after "~" as a lower limit value and an upper limit value. In the present specification and the like, terms such as "film", "sheet" and "board" are not distinguished from each other based on the difference in designation. For example, "board" is a concept that includes members that can be generally called "sheet" or "film".

As shown in FIG. 1A, the packaging material 1 according to the present embodiment is used for the silicon material transport bag 10 (see FIGS. 5 and 6), and is the first resin base material layer 21 and the first resin base material layer 21. A resin base material layer 2 having the resin base material layer 22 of 2, a barrier layer 3 located between the first resin base material layer 21 and the second resin base material layer 22, and a second resin base material layer. It is a laminate having a sealant layer 5 located on the opposite side of the barrier layer 3 in 22 via a resin layer 4. In the silicone material transport bag 10 made of the packaging material 1, the sealant layer 5 is located inside and the first resin base material layer 21 is located outside.

Both the first resin base material layer 21 and the second resin base material layer 22 are made of, for example, a polyester resin material such as polyethylene terephthalate (PET) or polybutylene terephthalate (PBT), and are of one type. It may be a single layer of a resin material or a laminate of two or more kinds of resin materials.

The first resin base material layer 21 and the second resin base material layer 22 may both contain a polyamide-based resin material such as nylon (Ny, a registered trademark), but at least a second resin group. It is preferable that the material layer 22 does not contain the polyamide-based resin material, and it is particularly preferable that both the first resin base material layer 21 and the second resin base material layer 22 do not contain the polyamide-based resin material. .. Caprolactam, which is a residual monomer of the polyamide-based resin material, can be a causative substance that contaminates the silicon material 62 which is the content of the package 60 (see FIG. 7), but the transport bag 10 is the first resin base material layer 21. By having the barrier layer 3 located inside the surface, it is possible to reduce the possibility that the caprolactam contaminates the silicon material 62. In this respect, even if the second resin base material layer 22 does not contain the polyamide-based resin material, if the first resin base material layer 21 contains the polyamide-based resin material, when the transportation bag 10 is opened, Although it cannot be denied that the silicon material 62 may be contaminated with caprolactam that may be contained in the first resin base material layer 21, the first resin base material layer 21 does not contain the polyamide-based resin material. , The possibility of contaminating the silicon material 62 as the content can be further reduced.

The resin material constituting the first resin base material layer 21 and the resin material constituting the second resin base material layer 22 may be the same resin material or different resin materials from each other. It is good, but it is preferable that the resin materials are the same as each other. When the silicon material 62 is packed in the silicon material transport bag 10 composed of the packaging material 1 according to the present embodiment, the silicon material 62 is housed in the transport bag 10 and then the inside of the transport bag 10 is degassed. And vacuum package. In the vacuum-packed packing body 60, a predetermined stress is applied to the packaging material 1 constituting the transportation bag 10. A large amount of strain is between the strain of the first resin base material layer 21 located on one side of the barrier layer 3 and the strain of the second resin base material layer 22 located on the other side when stress is applied to the packaging material 1. If a difference occurs, the barrier layer 3 may not be able to follow the difference in strain, and cracks may occur in the barrier layer 3. If cracks occur in the barrier layer 3, the barrier function of blocking the permeation of oxygen, water vapor, etc. is deteriorated, and the silicon material 62 as the content may be contaminated. In the present embodiment, when the first resin base material layer 21 and the second resin base material layer 22 are located on both side surfaces of the barrier layer 3, a predetermined stress is applied to the packaging material 1. Even so, it is difficult for a large strain difference to occur between the first resin base material layer 21 and the second resin base material layer 22, and it is possible to suppress the occurrence of cracks in the barrier layer 3. .. In order to more effectively suppress the occurrence of cracks in the barrier layer 3, the resin material constituting the first resin base material layer 21 and the resin material constituting the second resin base material layer 22 are mutually used. Even if they are different, it is preferable that the difference in indentation elastic modulus between the two resin materials is small, and it is particularly preferable that both resin materials are the same as each other. When the two resin materials are different from each other, the difference in indentation elastic modulus between the two resin materials is preferably 1000 MPa or less, and particularly preferably 800 MPa or less.

Further, as in the present embodiment, the resin base material layer 2 (the first resin base material layer 21 and the second resin base material layer 22) is provided on both sides of the barrier layer 3, so that the packaging material 1 is provided. The strength of the plastic can be relatively improved. By improving the strength of the packaging material 1, the silicon material transport bag 10 is less likely to be torn, and the workability when packing the silicon material 52 in the silicon material transport bag 10 is improved. Can be played.

The indentation elastic modulus of the first resin base material layer 21 and the second resin base material layer 22 may be 1500 MPa to 3500 MPa, respectively, and is preferably 1800 MPa to 3300 MPa. Although it depends on the thickness of the packaging material 1, if the indentation elastic modulus is less than 1500 MPa, the strength of the transport bag 10 made of silicon material tends to be relatively lowered, and the transport bag 10 may be damaged. If it exceeds 3500 MPa, the rigidity of the transport bag 10 made of silicon material tends to be relatively large, and there is a high possibility that the workability when packing the silicon material in the transport bag 10 is lowered. Become.

The thickness of the first resin base material layer 21 and the second resin base material layer 22 may be, for example, 6 μm to 40 μm, and preferably 10 μm to 30 μm, respectively. Although it depends on the indentation elastic modulus of the first resin base material layer 21 and the second resin base material layer 22, if the thickness is less than 6 μm, the strength of the silicon material transport bag 10 is relatively lowered. The transport bag 10 is more likely to be damaged, and if it exceeds 40 μm, the rigidity of the transport bag 10 made of a silicon material tends to be relatively large, and the transport bag 10 is made of a silicon material. There is a high possibility that workability when packing the plastic will be reduced. As described above, from the viewpoint of the strength of the transport bag 10 of the silicon material and the workability of packing the silicon material in the transport bag 10, the first resin base material layer 21 and the second resin constituting the packaging material 1 are formed. It is important to set the indentation elastic modulus and the thickness of the base material layer 22 in an appropriate range. For example, when the indentation elastic modulus is relatively small, the thickness is relatively thick, and when the indentation elastic modulus is relatively large, the thickness is relatively thin to transport the silicon material. It is possible to improve the strength of the bag 10 and the workability of packing the silicon material in the transportation bag 10. On the other hand, the barrier layer 3 is sandwiched between the first resin base material layer 21 and the second resin base material layer 22, which have a predetermined rigidity and have a higher indentation elastic modulus than, for example, the sealant layer 5. It is possible to prevent the layer 3 from being damaged. Therefore, from the viewpoints of the strength of the transport bag 10 of the silicon material, the workability of packing the silicon material in the transport bag 10, the protection of the barrier layer 3, and the like, the first resin base material layer 21 and the second resin base material layer 21 and the second It is preferable to set the indentation elastic modulus and the thickness of the resin base material layer 22 in an appropriate range.

A resin layer 4 may be provided between the first resin base material layer 21 and the sealant layer 5. The resin layer 4 can be provided between the first resin base material layer 21 and the barrier layer 3. Further, the resin layer 4 can be provided between the barrier layer 3 and the second resin base material layer 22. Further, the resin layer 4 can be provided between the second resin base material layer 22 and the sealant layer 5. A plurality of resin layers 4 can be provided between the first resin base material layer 21 and the sealant layer 5. The plurality of resin layers 4 may be provided outside the barrier layer 3 or may be provided inside the barrier layer 3. Further, at least one resin layer 4 may be provided on the outer side and the inner side of the barrier layer 3. The resin layer 4 may be formed by extrusion lamination of polyolefin such as polyethylene (PE), or may be formed by an adhesive that adheres the second resin base material layer 22 and the sealant layer 5. Examples of the adhesive include a two-component urethane resin adhesive and the like. As the two-component urethane resin adhesive, for example, a two-component urethane resin adhesive in which a main agent (Ru77t manufactured by Rock Paint Co., Ltd.) and a curing agent (H-7 manufactured by Rock Paint Co., Ltd.) are mixed can be used. ..

When the resin layer 4 is formed of an adhesive, the resin layer 4 formed of the adhesive (hereinafter, may also be referred to as an "adhesive layer") is the first resin base material layer 21 and a barrier layer. It is preferable that it is provided between 3 and 3. As shown in FIGS. 1B and 1C, for example, the packaging material 1 includes a first resin base material layer 21, a resin layer 4 (adhesive layer), a barrier layer 3, a second resin base material layer 22, and a sealant. A laminate in which layers 5 are laminated in this order, a first resin base material layer 21, a first resin layer 41 (adhesive layer), a barrier layer 3, a second resin base material layer 22, and a second resin layer. 42, a laminated body in which the sealant layer 5 is laminated in this order, and the like can be mentioned. When the silicon material transport bag 10 is manufactured using the packaging material 1 having such a configuration, the resin layer 4 (adhesive layer) is arranged outside the transport bag 10 rather than the barrier layer 3. It is possible to prevent the organic components contained in the resin layer 4 (adhesive layer) from moving to the inside of the transportation bag 10. As a result, when the silicon material is contained in the transportation bag 10, deterioration of the silicon material in the transportation bag 10 can be suppressed. Examples of the organic component that can be moved from the resin layer 4 (adhesive layer) include unreacted monomers such as acrylic acid and methacrylic acid. The thickness of the resin layer 4 (adhesive layer) formed by the adhesive may be, for example, about 1 μm to 5 μm, and preferably about 2 μm to 4 μm. If the thickness of the resin layer 4 (adhesive layer) formed by the adhesive is thinner than 1 μm, sufficient adhesive strength may not be obtained. On the other hand, if the thickness of the resin layer 4 (adhesive layer) formed by the adhesive is thicker than 5 μm, it takes time for the curing reaction, so that the resin layer 4 contains more unreacted substances, residual solvent, and the like. There is a risk that it will end up. The thickness of the resin layer 4 formed by the extrusion lamination may be, for example, about 10 μm or more.

Specific examples of the layer structure of the packaging material 1 include the following.
[Specific example of layer structure of first resin base material layer 21 / resin layer 4 / barrier layer 3 / second resin base material layer 22 / resin layer 4 / sealant layer 5]
-PET / Adhesive layer / AlO _X / PET / PE / Sealant layer-PET / Adhesive layer / SiO _X / PET / PE / Sealant layer-Nylon / Adhesive layer / AlO _X / PET / PE / Sealant layer-Nylon / Adhesive layer / SiO _X / PET / PE / Sealant layer / Nylon / Adhesive layer / AlO _X / Nylon / PE / Sealant layer / Nylon / Adhesive layer / SiO _X / Nylon / PE / Sealant layer [1st Specific example of the layer structure of the resin base material layer 21 / barrier layer 3 / resin layer 4 / second resin base material layer 22 / resin layer 4 / sealant layer 5]
-PET / AlO _X / Adhesive layer / PET / PE / Sealant layer-PET / SiO _X / Adhesive layer / PET / PE / Sealant layer-Nylon / AlO _X / Adhesive layer / PET / PE / Sealant layer-Nylon / SiO _X / Adhesive layer / PET / PE / Sealant layer / Nylon / AlO _X / Adhesive layer / Nylon / PE / Sealant layer / Nylon / SiO _X / Adhesive layer / Nylon / PE / Sealant layer The above layer In a specific example of the configuration, examples of the "sealant layer" include Sample 1, Sample 2, and Sample 3, which will be described later. In specific examples of the layer structure, "AlO _X" is a deposited film of alumina, "SiO _X" is a deposited film of silica. In the specific example of the layer structure, "PET" is a polyethylene terephthalate layer, "nylon" is a nylon layer, and "PE" is a polyethylene layer.

In addition, "inside the barrier layer" means that when the transport bag 10 made of a silicon material is manufactured using the packaging material 1, it is located inside the transportation bag 10 than the barrier layer 3 of the packaging material 1. Means. On the other hand, "outside the barrier layer" means that when the shipping bag 10 made of a silicon material is produced using the packaging material 1, the bag 10 is located outside the barrier layer 3 of the packaging material 1. means.

The sealant layer 5 has a first surface 5A and a second surface 5B facing the first surface 5A. In the packaging material 1, the second surface 5B of the sealant layer 5 is located on the side of the second resin base material layer 22. The sealant layer 5 is sandwiched between the first surface layer 51 located on the first surface 5A side, the second surface layer 52 located on the second surface 5B side, and the first surface layer 51 and the second surface layer 52. It may be a laminated structure having the intermediate layer 53 (see FIG. 3), or a single-layer structure having the first surface 5A and the second surface 5B (see FIG. 4).

The sealant layer 5 may contain a heat-sealable resin component, and may contain, for example, a polyolefin, a cyclic polyolefin, a carboxylic acid-modified polyolefin, a carboxylic acid-modified cyclic polyolefin, or the like.

Examples of the polyolefin include polyethylenes such as low density polyethylene (LDPE), medium density polyethylene, high density polyethylene, and linear low density polyethylene (LLDPE); homopolypropylene, block copolymers of polypropylene (for example, block copolymers of propylene and ethylene, etc.) ), Polypropylene such as a random copolymer of polypropylene (for example, a random copolymer of propylene and ethylene); ethylene-butene-propylene tarpolymer; and the like.

The cyclic polyolefin is a copolymer of an olefin and a cyclic monomer, and examples of the olefin which is a constituent monomer of the cyclic polyolefin include ethylene, propylene, 4-methyl-1-pentene, styrene, butadiene, and isoprene. .. Examples of the cyclic monomer that is a constituent monomer of the cyclic polyolefin include cyclic alkenes such as norbornene; specific examples thereof include cyclic diene such as cyclopentadiene, dicyclopentadiene, cyclohexadiene, and norbornadiene.

The carboxylic acid-modified polyolefin is a polymer modified by block polymerization or graft polymerization of polyolefin with carboxylic acid. Examples of the carboxylic acid used for modification include maleic acid, acrylic acid, itaconic acid, crotonic acid, maleic anhydride, itaconic anhydride and the like.

The carboxylic acid-modified cyclic polyolefin is obtained by copolymerizing a part of the monomers constituting the cyclic polyolefin in place of α, β-unsaturated carboxylic acid or its anhydride, or α, β-with respect to the cyclic polyolefin. It is a polymer obtained by block-polymerizing or graft-polymerizing an unsaturated carboxylic acid or an anhydride thereof.

The first surface layer 51 located on the first surface 5A side of the sealant layer 5 may be a layer containing low density polyethylene (LDPE) to which a slip agent is substantially not added, and may be on the second surface 5B side. The second surface layer 52 located may be, for example, a layer containing low density polyethylene (LDPE) to which a slip agent is substantially not added, like the first surface layer 51, and the first surface layer 51 may be used. The intermediate layer 53 sandwiched between the surface layer 52 and the second surface layer 52 may be, for example, a layer containing linear low density polyethylene (LLDPE) to which a slip agent is substantially not added. In the present embodiment, "substantially no slip agent is added" means that a component that actually improves the slipperiness of the surface of the sealant as a slipper actually affects the slipperiness of the surface of the sealant. It means that it is not added in excess of the amount that actually affects the slipperiness of the surface of the sealant. Examples of the slip agent include particles such as calcium carbonate or talc, and surfactants such as silicone resin or quaternary ammonium salt compound.

Since the sealant layer 5 is located in the innermost layer of the transport bag 10, it can be used for silicon materials such as polysilicon and silicon wafers in which volatile components derived from the sealant layer 5 (outgas components derived from the sealant layer 5 and the like) are contained. If it adheres, it may cause a defect in a semiconductor device or the like manufactured by using the silicon material. Therefore, it is desirable that the amount of volatile components derived from the sealant layer 5 is as small as possible. In order to reduce the volatile components derived from the sealant layer 5, it is desirable to make the thickness T5 of the sealant layer 5 as thin as possible. Since the thickness T5 of the sealant layer 5 is relatively thin, the volatile components derived from the sealant layer 5 are released to the outside of the film, so that the volatile components derived from the sealant layer 5 can be reduced. On the other hand, if the thickness T5 of the sealant layer 5 is made too thin, the resistance to mechanical properties such as tensile strength is lowered, and the function as a bag for packing the contents may be deteriorated. In this respect, linear low density polyethylene (LLDPE) has higher elasticity and resistance to bending than low density polyethylene (LDPE). Therefore, by using linear low density polyethylene (LLDPE) as the sealant layer 5, the sealant The thickness T5 of the layer 5 can be made relatively thin.

Further, since the resin case 61 is housed in the transport bag 10 and then degassed from the transport bag 10 and packed, the sealant layer 5 contained in the packaging material 1 constituting the transport bag 10 is covered with the sealant layer 5. Good followability is required. In this respect as well, since the linear low density polyethylene (LLDPE) has a relatively high elasticity, the followability of the sealant layer 5 can be improved by using the linear low density polyethylene (LLDPE). ..

If the sealant layer is composed of a single layer of linear low density polyethylene (LLDPE), the indentation elasticity of the sealant layer composed of a single layer of linear low density polyethylene (LLDPE) can be adjusted to about 150 MPa to 600 MPa. Therefore, it is considered that the thickness of the sealant layer can be reduced. Further, it can be said that it is preferable that the sealant layer is composed of a single layer of linear low density polyethylene (LLDPE) in consideration of improving the followability of the sealant layer. However, since the pressure during the polymerization of the linear low density polyethylene (LLDPE) is lower than the pressure during the polymerization of the low density polyethylene (LDPE), the linear low density polyethylene (LLDPE) becomes the low density polyethylene (LDPE). In comparison, low-density components are more likely to volatilize. Therefore, if the sealant layer is composed of a single layer of linear low density polyethylene (LLDPE), even if the thickness of the sealant layer can be reduced, the silicon material is contaminated by the volatile components derived from the sealant layer. It is considered that there is a risk of this. Further, since linear low density polyethylene (LLDPE) tends to have lower slipperiness than low density polyethylene (LDPE), if the sealant layer is composed of a single layer of linear low density polyethylene (LLDPE), the sealant It is considered that the slipperiness of the surface of the layer may be lowered. Since it is preferable that the sealant layer 5 used in the transport bag 10 is substantially free of a slip agent that may become a foreign substance, it is preferable to improve the slipperiness by means other than the use of the slip agent. In the present embodiment, the intermediate layer 53 containing the linear low density polyethylene (LLDPE) may be sandwiched between the first surface layer 51 and the second surface layer 52 containing the low density polyethylene (LDPE). Therefore, in the sealant layer 5 of the transportation bag 10, the thickness T5 can be made relatively thin, the followability and slipperiness are good, and the linear low density polyethylene (LLDPE) contained in the intermediate layer 53. It is possible to prevent the low molecular weight components from volatilizing.

The sealant layer 5 (see FIG. 4) of the monolayer structure may include low density polyethylene (LDPE) and linear low density polyethylene (LLDPE). In the sealant layer 5, the blending ratio of the low-density polyethylene (LDPE) and the linear low-density polyethylene (LLDPE) may be about 50:50 to 70:30. As described above, since the blending amount of the low density polyethylene (LDPE) is larger than the blending amount of the linear low density polyethylene (LLDPE), the abundance of the low density polyethylene (LDPE) is increased on the first surface 5A side of the sealant layer 5. In addition to being able to increase the number, the effect of reducing the thickness T5 of the sealant layer 5 by using linear low density polyethylene (LLDPE), that is, the effect of preventing low molecular weight components from volatilizing is exhibited. When viewed in the thickness direction of the sealant layer 5, the low-density polyethylene (LDPE) and the linear low-density polyethylene (LLDPE) may be present substantially uniformly, and the first surface 5A side and the first surface 5A side and the first Low-density polyethylene (LDPE) may be unevenly distributed on the two sides 5B side.

The thickness T5 of the sealant layer 5 can be appropriately set according to the thickness of the transport bag 10 made of the packaging material 1, and may be, for example, about 35 μm to 60 μm.

In the embodiment shown in FIG. 3, the first surface layer 51 containing low-density polyethylene (LDPE) and the second surface layer 52 containing low-density polyethylene (LDPE) are arranged with the intermediate layer 53 interposed therebetween, thereby forming a sealant layer. The internal stress on one side of 5 and the internal stress on the other side cancel each other to some extent, and curling of the sealant layer 5 can be suppressed. Further, in the embodiment shown in FIG. 3, the thicknesses T51 and T52 of the first surface layer 51 and the second surface layer 52 are both thinner than the thickness T53 of the intermediate layer 53, respectively. Since the thicknesses T51 and T52 of the first surface layer 51 and the second surface layer 52 are thinner than the thickness T53 of the intermediate layer 53, the sealant layer 5 can be provided with a predetermined followability. The ratio of the thickness T51 of the first surface layer 51 to the thickness T53 of the intermediate layer 53 may be about 1: 1 to 10, and is preferably about 1: 2 to 3. When the thickness ratio is in the above range, the sealant layer 5 is provided with sufficient followability by the low-density linear polyethylene (LLDPE) contained in the intermediate layer 53, and the indentation elastic modulus of the sealant layer 5 is 300 MPa to 500 MPa. Can be a range. The indentation elastic modulus can be measured by a microhardness tester (product name "PICODETOR HM500", manufactured by Fisher Instruments).

It is known that the seal strength of the sealant can be controlled by the seal temperature at the time of heat sealing, the seal pressure, the seal time, and the like. Generally, the higher the sealing temperature, the higher the sealing strength tends to be. However, if the sealing temperature is too high, the sealant may melt more than necessary, and the sealing strength may be lowered. In the present embodiment, the sealing strength when the first surfaces 5A of the sealant layer 5 are sealed under the heat sealing conditions of a sealing temperature of 150 ° C., a sealing pressure of 0.1 MPa, and a sealing time of 1 second is 30 N / 15 mm or more. However, it is preferably 50 N / 15 mm or more and less than 60 N / 15 mm. When the seal strength is less than 30 N / 15 mm, the silicon material transport bag is being transported during the transportation of the silicon material packaging body 60 packaged in the transport bag 10 made of the packaging material 1 having the sealant layer 5. The heat-sealed portion of 10 (for example, the upper surface heat-sealed portion HST1 or the like (see FIG. 7)) may be peeled off.

As described above, from the viewpoint of making the thickness T5 of the sealant layer 5 relatively thin, it is considered that it is preferable to use linear low density polyethylene (LLDPE) as a constituent material of the sealant layer 5. However, in the sealant layer made of linear low density polyethylene (LLDPE), the sealing temperature required to obtain a predetermined sealing strength becomes relatively high. In this respect, in the present embodiment, since the first surface layer 51 of the sealant layer 5 contains low density polyethylene (LDPE), the sealing temperature required to obtain a predetermined sealing strength can be relatively lowered. it can.

The haze of the sealant layer 5 in the present embodiment may be 25% or less, preferably 20% or less. When the haze of the sealant layer 5 is 20% or less, the visibility inside the transport bag 10 can be improved. Further, before packaging the silicon material in the silicon material transport bag 10, it is possible to confirm whether or not foreign matter is attached to the first surface 5A of the sealant layer 5, and the contamination of the silicon material can be prevented. You can also do it. The haze of the sealant layer 5 can be measured according to JIS-K7136 using, for example, a haze meter (product name: HM-150, manufactured by Murakami Color Research Institute).

The sealant layer 5 having the above-mentioned structure can be produced by using a conventionally known film forming method. For example, the sealant layer 5 having the structure shown in FIG. 3 is manufactured by laminating the second surface layer 52, the intermediate layer 53, and the first surface layer 51 by using a coating method such as a die coating method or an inflation method. Can be done. Similarly, the sealant layer 5 having the structure shown in FIG. 4 can be manufactured by using the above-mentioned coating method, extrusion inflation method, or the like.

The barrier layer 3 in the present embodiment may be, for example, a vapor-deposited film or the like in which an inorganic oxide such as silica or alumina is vapor-deposited on a PET layer or the like. When the packaging material 1 has the barrier layer 3, it is possible to prevent gas or the like that contaminates the surface of the silicon material 62, which is the content, from entering the inside of the transport bag 10 from the outside. The barrier layer 3 may be a metal vapor deposition film formed by depositing a metal such as aluminum on the first resin base material layer 21 or the second resin base material layer 22, or a metal foil such as aluminum. When the barrier layer 3 is such a metal vapor-deposited film or a metal foil, transparency is not ensured in the transportation bag 10, but the transportation bag 10 can be provided with not only a barrier property but also a light shielding property. Further, in this embodiment, since the sealant layer 3 has a predetermined transparency, it is possible to more easily confirm whether or not foreign matter is attached to the first surface 5A of the sealant layer 5 in the transport bag 10. it can.

As described above, the sealant layer 5 is transparent enough to allow the inside of the transport bag 10 to be visible when the silicon material is packaged in the transport bag 10 of the silicon material (see FIGS. 5 and 6). Have. Therefore, it is desirable that the packaging material 1 having the sealant layer 5 also has transparency to the extent that the inside of the transport bag 10 can be visually recognized. From such a viewpoint, the haze of the packaging material 1 according to the present embodiment may be, for example, 30% or less, preferably 25% or less. If the haze of the packaging material 1 exceeds 30%, the visibility inside the transportation bag 10 manufactured from the packaging material 1 deteriorates, or foreign matter is foreign matter on the first surface 5A of the sealant layer 5 in the transportation bag 10. It may be difficult to confirm whether or not the seal is attached. The haze of the packaging material 1 can be measured in accordance with JIS-K7136 using, for example, a haze meter (product name: HM-150, manufactured by Murakami Color Research Institute).

Here, low-density polyethylene (LDPE to which a slip agent is not substantially added, manufactured by Ube Maruzen Polyethylene Co., Ltd., product name: UBE polyethylene B128) is used as the constituent material of the first surface layer 51, and the constituent material of the intermediate layer 53 is used. Low density polyethylene (LDPE with substantially no slip agent added, manufactured by Ube Maruzen Polyethylene, product name: UBE polyethylene B128) and linear low density polyethylene (LDPE with substantially no slip agent added, prime polymer) Made by the company, product name: Ultozex 3500ZA) using a melt mixture (blending ratio = 1: 1 (mass basis)), low density polyethylene (substantially added slip agent) as a constituent material of the second surface layer 52. No LDPE, manufactured by Ube Maruzen Polyethylene, product name: UBE polyethylene B128), and a sealant layer 5 (first surface layer 51 (thickness: 8 μm)) having the structure shown in FIG. 3 by a multi-layer coextrusion inflation film formation method. , Intermediate layer 53 (thickness: 24 μm), second surface layer 52 (thickness: 8 μm)) was prepared (Sample 1).

In addition, pellets of low-density polyethylene (LDPE with substantially no slip agent added, manufactured by Ube-Maruzen Polyethylene, product name: UBE polyethylene B128) and linear low-density polyethylene (LDPE with substantially no slip agent added). , Made by Prime Polymer Co., Ltd., Product name: Ultozex 3500ZA) melt-mixed at a blending ratio of 7: 3 (mass basis), and the sealant layer 5 (thickness: 40 μm) having the structure shown in FIG. ) Was prepared (Sample 2).

Further, a sealant layer (thickness: 50 μm) made of additive-free linear low-density polyethylene (additive-free LLDPE, manufactured by Tamapoli, product name: NB-1) was prepared (Sample 3).

A section obtained by cutting out the sealant layer of Samples 1 to 3 into 100 mm × 25 mm was immersed in ethanol at 60 ° C. for 1 week, and then the volatile components from the section were analyzed by GC / MS under the following conditions, and the mass spectrum was obtained. Got The obtained mass spectra are shown in FIGS. 8A to 8C.

<GC / MS conditions>
-Gas chromatograph: GCMS-QP2010 (manufactured by Shimadzu Corporation)
-Column: 670-15003-03 (length: 30 mm, inner diameter: 0.25 mm, manufactured by Shimadzu Corporation)
・ Column oven temperature: 50 ℃
・ Injection volume: 1 μL
-Carrier gas: He (57.1 mL / min)
・ Vaporization chamber temperature setting: 300 ℃
・ Measurement mode: Split

As shown in the mass spectra shown in FIGS. 8A to 8C, no volatile component was detected in the sealant layers of Sample 1 and Sample 2, but volatile components were detected in the sealant layer of Sample 3. Like Samples 1 and 2, the first portion located on the first surface 5A side contains low density polyethylene (LDPE), and the second portion located on the second surface 5B side is linear low density polyethylene (linear low density polyethylene (LDPE). It can be inferred that the inclusion of LLDPE) can prevent the volatilization of low molecular weight components from the sealant layer.

Further, for the sections cut out from the sealant layers of Samples 1 to 3 in a desired size, the indentation elastic modulus was measured in an atmosphere of a temperature of 23 ° C. ± 2 ° C. and a humidity of 60% RH ± 5% RH in accordance with ISO14577: 2015. did. First, an adhesive resin (product name "Aron Alpha (registered)" was applied to a commercially available slide glass (hereinafter referred to as "first slide glass") so that the first surface 5A of the section cut out to a size of 20 mm x 20 mm was the upper surface. Fixed via "Trademark)" for general use ", manufactured by Toagosei Co., Ltd.). Specifically, the adhesive resin was dropped onto the central portion of the first slide glass (product name "slide glass (cut-off type) 1-9645-11", manufactured by AS ONE Corporation). At this time, one drop of the adhesive resin was dropped so that the adhesive resin did not spread out from the section when the adhesive resin was not spread and spread as described later. After that, the section is brought into contact with the first slide glass so that the first surface 5A side is the upper surface and the adhesive resin is located at the center of the section, and the adhesive resin is spread between the first slide glass and the section. , Temporarily glued. Then, another new slide glass (hereinafter referred to as "second slide glass") was placed on the section to obtain a laminate of the first slite glass / adhesive resin / section / second slide glass. Next, a weight of 30 g or more and 50 g was placed on the second slide glass and left at room temperature for 12 hours. After that, the weight and the second slide glass were removed, and this was used as a measurement sample. Then, this measurement sample was fixed to the measurement stage of a micro-hardness tester (product name: PICODETOR HM500, manufactured by Fisher Instruments) installed in parallel with the vibration isolation table. For this fixing, the four sides of the first slide glass were fixed with tape (product name: cellophane tape (registered trademark), manufactured by Nichiban Co., Ltd.) so that the measurement sample did not move. Next, on the first surface 5A of the section, an ultra-micro load hardness tester (Picodenter HM500, manufactured by Fisher Instruments) equipped with a Vickers indenter (a diamond indenter having a regular quadrangular pyramid with a facing angle of 136 °) was used. The indentation elastic modulus (MPa) was measured under the conditions of a indentation speed of 0.15 μm / sec, a indentation depth of 3 μm, a holding time of 5 seconds, and a withdrawal speed of 0.15 μm / sec. In one section, measurements were taken at at least five different points, and the average of those measurements was taken as the value of the indentation modulus for the sealant under that condition.

As a result, the indentation elastic modulus of the sample 1 was 457.3 MPa, the indentation elastic modulus of the sample 2 was 371.6 MPa, the indentation elastic modulus of the sample 3 was 159.0 MPa, and the indentation elastic modulus of the sample 1 and the sample 2 was the sample. Although it is larger than the indentation elastic modulus of 3, it is presumed that it has elasticity and bending resistance to the extent that it can exhibit sufficient followability in practical use. Further, it is presumed that the sealant layers of Sample 1 and Sample 2 can secure sufficient transparency.

Further, the first surfaces of the sealant layers of Samples 1 to 3 are heat-sealed at the sealing temperatures of 110 ° C., 120 ° C., 130 ° C., 140 ° C. and 150 ° C., and a heat-sealing test piece having a width of 15 mm including the heat-sealing portion is formed. The sample was collected, and the seal strength (N / 15 mm) at each seal temperature of the heat seal test piece was determined in accordance with JIS-Z1711.

As a result, the seal strength of sample 1 was 13.7 N / 15 mm and the seal strength of sample 2 was 9.4 N / 15 mm under the condition of the seal temperature of 130 ° C., whereas the seal strength of sample 3 was 2.3 N / 15 mm. It was 15 mm. Further, the seal strength of the sample 2 was 55.7 N / 15 mm while the seal strength of the sample 2 was 26.1 N / 15 mm under the condition of the seal temperature of 140 ° C., whereas the seal strength of the sample 3 was 9.2 N / 15 mm. .. From this result, it is inferred that the sealant layers of Sample 1 and Sample 2 can obtain high sealing strength at a lower sealing temperature than the sealant layer of Sample 3. Under the conditions of the sealing temperature of 110 ° C. and 120 ° C., neither of the samples 1 to 3 had a satisfactory sealing strength.

The packaging material 1 according to the present embodiment may have a plurality of barrier layers. For example, as shown in FIG. 2, the packaging material 1 includes a first resin base material layer 21 (resin base material layer 2), a first barrier layer 31 (barrier layer 3), and a second resin base material layer 22. (Resin base material layer 2), a second barrier layer 32 (barrier layer 3), a third resin base material layer 23 (resin base material layer 2), a resin layer 4 and a sealant layer 5 in this order. It may be. In this embodiment, the first resin base material layer 21 and the second resin base material layer 22 may be made of a polyester-based resin material or a polyamide-based resin material, but the third resin base material layer 23 is It is preferably composed of a polyester resin material. In addition to the above aspects, the packaging material 1 includes, for example, a first resin base material layer 21 (resin base material layer 2), a first barrier layer 31 (barrier layer 3), and a second resin base material layer 22 ( A laminate having a resin base material layer 2), a resin layer 4, a second barrier layer 32 (barrier layer 3), a third resin base material layer 23 (resin base material layer 2), and a sealant layer 5 in this order. There may be a first resin base material layer 21 (resin base material layer 2), a resin layer 4, a first barrier layer 31 (barrier layer 3), and a second resin base material layer 22 (resin base material). A laminated body having a layer 2), a second barrier layer 32 (barrier layer 3), a third resin base material layer 23 (resin base material layer 2), and a sealant layer 5 in this order may be used. In addition, also in the aspect of these packaging materials 1, a plurality of resin layers 4 may be provided as described above.

The silicon material transport bag 10 in the present embodiment is a packaging bag that becomes a substantially rectangular parallelepiped shape (substantially rectangular parallelepiped shape) when expanded, and the first side surface film 11, the second side surface film 12, the first gusset film 13 and the like. It is composed of a second gusset film 14. The first side surface film 11, the second side surface film 12, the first gusset film 13 and the second gusset film 14 are all made of the packaging material 1 according to the present embodiment. The transport bag 10 may not have the first gusset film 13 and the second gusset film 14. In this case, the first side surface film 11 and the second side surface film 12 may be heat-sealed at the three side edges so that the first side surface 5A of the sealant layer 5 faces each other.

In the transport bag 10, the first side surface 5A of each sealant layer 5 of the first side surface film 11, the second side surface film 12, the first gusset film 13 and the second gusset film 14 is located on the innermost surface, and the first resin. The base material layer 21 is configured to be located on the outermost surface.

In the transportation bag 10, one of the two opposing side edges of the first side film 11 and one of the two opposing side edges of the folded first gusset film 13 are overlapped and welded by heat sealing. The first heat-sealed portion HS11 is formed, and the other side edge portion of the first side surface film 11 and one of the two opposing side edge portions of the folded second gusset film 14 are overlapped with each other to heat. A second heat-sealed portion HS12 formed by welding by sealing is formed. Further, a third heat-sealing portion formed by superimposing one of the two opposing side edge portions of the second side surface film 12 and the other side edge portion of the folded first gusset film 13 and welding them by heat sealing. A fourth heat-sealed portion formed by forming an HS13 and superimposing the other side edge portion of the second side film 12 and the other side edge portion of the folded second gusset film 14 and welding them by heat sealing. HS14 is formed. A first surface heat-sealed portion HSB1 formed by superimposing the side edge portions of the first side surface film 11 and the second side surface film 12 and welding them by heat sealing is formed, and is located opposite to the bottom surface heat-sealing portion HSB1. The side edges of the side film 11 and the second side film 12 are not heat-sealed and form an opening 15 of the transport bag 10.

With a large number of transport bags 10 in which the first gusset film 13 and the second gusset film 14 are folded are stacked, the first side surface film 11 or the second side surface film 22 is sucked and held and lifted upward to open the opening. The part 15 can be opened. A resin case 61 (see FIG. 7) for storing the silicon material 62 is housed in the transport bag 10 through the open opening 15, and the first side film 11 and the second side film 22 in the opening 15 are respectively accommodated. The upper surface heat-sealed portion HST1 is formed by superimposing the side edge portions of the above and heat-sealing. In this way, a packing body 60 made of a silicon material can be produced.

In the transportation bag 10 of the present embodiment, the first resin base material layer 21 and the second resin base material layer 22 are located on both sides of the barrier layer 3, so that the transportation bag 10 (packaging) is located. Even when a predetermined stress is applied to the material 1), it is difficult for a large strain difference to occur between the first resin base material layer 21 and the second resin base material layer 22, and the barrier layer 3 is cracked. Can be suppressed from occurring.

Further, low density polyethylene (LDPE) is contained on the first surface 5A side of the sealant layer 5 located in the innermost layer of the transport bag 10, and linear low density polyethylene (LLDPE) is contained on the second surface 5B side. It has been. The linear low-density polyethylene (LLDPE) constituting the sealant layer 5 makes it possible to make the thickness T5 of the sealant layer 5 relatively thin, improve the followability, and the first surface 5A side of the sealant layer 5. The low density polyethylene (LDPE) contained in the above can prevent the volatilization of low molecular weight components from the linear low density polyethylene (LLDPE). Further, since the sealant layer 5 has a predetermined transparency, it can be easily confirmed whether or not foreign matter is attached to the first surface 5A of the sealant layer 5 in the transport bag 10.

The embodiments described above are described for facilitating the understanding of the present disclosure, and are not described for limiting the present disclosure. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present disclosure.

In the above embodiment, the silicon material transport bag 10 is a double wrapping including a first bag as a so-called outer bag and a second bag as a so-called inner bag arranged in the first bag. It may be a bag. In this case, at least the second bag may be made of the packaging material 1 according to the above embodiment, and the first bag is also preferably made of the packaging material 1.

1 ... Packaging material 2 ... Resin base material layer 21 ... First resin base material layer 22 ... Second resin base material layer 3 ... Barrier layer 4 ... Resin layer 5 ... Sealant layer 10 ... Silicon material transport bag 60 ... Silicon material packing body 62 ... Silicon material

Claims (9)

A packaging material used for shipping bags made of silicone materials.
Said packaging material, a first resin substrate layer, a barrier layer, and the second resin substrate layer, and a resin layer, Ri laminate der laminating a sealant layer in this order,
The resin layer is made of polyethylene.
The first resin base material layer and the second resin base material layer are made of the same resin material.
The indentation elastic modulus of the resin material constituting the first resin base material layer and the second resin base material layer is in the range of 1500 MPa to 3500 MPa.
A packaging material in which the indentation elastic modulus of the material constituting the sealant layer is in the range of 300 MPa to 500 MPa . A packaging material used for shipping bags made of silicone materials.
The packaging material is a laminate in which a first resin base material layer, a barrier layer, a second resin base material layer, a resin layer, and a sealant layer are laminated in this order.
The resin layer is composed of a two-component urethane resin adhesive.
The first resin base material layer and the second resin base material layer are made of the same resin material.
The indentation elastic modulus of the resin material constituting the first resin base material layer and the second resin base material layer is in the range of 1500 MPa to 3500 MPa.
The indentation elastic modulus of the material constituting the sealant layer is in the range of 300 MPa to 500 MPa.
Packaging material. Thickness before Bark fat layer is 1 m to 5 m, the packaging material according to claim 2. The packaging material according to any one of claims 1 to 3, wherein the resin material constituting the first resin base material layer and the resin material constituting the second resin base material layer are polyester resin or polyamide resin. The packaging material according to claim 4 , wherein the resin material constituting the first resin base material layer and the resin material constituting the second resin base material layer are the polyester resin. The packaging material according to any one of claims 1 to 5 , wherein the barrier layer has transparency. The packaging material according to any one of claims 1 to 6 , wherein the barrier layer contains silica or alumina. A shipping bag made of silicone material
The bag for transporting the silicon material is made of the packaging material according to any one of claims 1 to 7 .
A silicone material transport bag in which the sealant layer is located inside the silicone material transport bag. The silicon material transport bag according to claim 8 and
A packing body of a silicon material including the silicon material housed in the transport bag of the silicon material.

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