JP6761078B1 - Sealants, packaging materials, silicone material transport packaging and silicone material packaging used for silicone material transportation packaging - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sealant, a packaging material, a packaging material for transporting a silicon material and a packaging body for a silicon material, which are used for a packaging material for transporting a silicon material and have reduced volatile components and improved sealing strength. SOLUTION: A sealant used for a packaging for transporting a silicon material includes a sealant base material having a first surface and a second surface facing the first surface, and the sealant base material is a first surface including the first surface. Includes a portion and a second portion located on the second surface side of the first portion, the first portion contains low density polyethylene (LDPE) and the second portion contains linear low density polyethylene (LLDPE). .. [Selection diagram] Fig. 1

Description

The present disclosure relates to a sealant, a packaging material, a silicone material transport package, and a silicone material package used for a silicone material transport package.

Since silicon wafers used in the manufacture of semiconductor products and silicon materials such as polysilicon, which are the raw materials for silicon wafers, are required to have extremely high cleanliness (cleanliness), they are clean during transportation. After storing a plurality of silicon wafers in a resin case or the like that has been washed, the resin case is packaged in a package and sealed. As a packaging material constituting such a packaging body, one using linear low density polyethylene (LLDPE) is known.

Japanese Unexamined Patent Publication No. 2013-136405

A sealant is located in the innermost layer of the package for packaging a silicon material, but if a volatile component derived from the sealant (outgas component derived from the sealant) adheres to polysilicon or a silicon wafer, the silicon wafer is moved. There is a problem of causing defects in the semiconductor device manufactured by using the device. Therefore, it is desired that the amount of volatile components from the sealant is small. One of the methods to reduce the volatile components from the sealant is to make the sealant thinner. Considering the resistance to bending and the like when the sealant is thinned, it is preferable to use LLDPE as a constituent material of the sealant. However, in LLDPE, since the pressure at the time of polymerization is low, low molecular weight components are likely to be generated, and volatile components may be easily generated from the sealant. Further, since the sealing temperature of LLDPE is relatively high, there is a problem that it is difficult to obtain the sealing strength.

In view of the above problems, the present disclosure discloses a sealant, a packaging material, a silicone material transport packaging body, and a silicone material packaging, which are used for a silicone material transportation package and have reduced volatile components and improved sealing strength. One purpose is to provide the body.

In order to solve the above problems, as one embodiment of the present disclosure, a sealant base material used for a packaging for transporting a silicon material, which has a first surface and a second surface facing the first surface. wherein the sealant base is located between the the first surface layer comprising a first surface, a second front surface layer containing the second surface, the first surface layer and the second surface layer and an intermediate layer, the first surface layer and the second surface layer comprises a low density polyethylene (LDPE), the intermediate layer is linear low density polyethylene (LLDPE) seen including, thickness of the intermediate layer A sealant is provided that is thicker than the thickness of the first surface layer and the thickness of the second surface layer, respectively .

As one embodiment of the present disclosure, the sealant used for a packaging body for transporting a silicon material includes a sealant base material having a first surface and a second surface facing the first surface, and the sealant base material is provided. , A single-layer structure containing low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE), and the blending amount of the low-density polyethylene (LDPE) is equal to or greater than the blending amount of the linear low-density polyethylene (LLDPE). Sealant is provided .

The blending amount of the low density polyethylene (LDPE) may be larger than the blending amount of the linear low density polyethylene (LLDPE), and the blending ratio of the low density polyethylene (LDPE) and the linear low density polyethylene (LLDPE). However, it may be 50:50 to 70:30.

Before SL low density polyethylene (LDPE) may be a low density polyethylene slip agent is not added pressure, before Symbol linear low density polyethylene (LLDPE) slip agent is not added pressure linear low density polyethylene It may be. The thickness of the sealant may be 35 μm or more and 60 μm or less.

As one embodiment of the present disclosure, the sealant has a base made of a resin material and the sealant provided on one surface side of the base portion, and the sealant has the second surface on one surface side of the base portion. A packaging material provided so as to be in contact with the base, a packaging material further having a gas barrier layer provided on the other side of the base; a packaging material for transporting a silicon material composed of the packaging material; and the above. A package of a silicon material including a package for transportation and a package of a silicon material housed in the package for transportation is provided.

According to the present disclosure, there are provided a sealant, a packaging material, a silicon material transportation package, and a silicon material package, which are used for a silicon material transportation package and have reduced volatile components and improved sealing strength. be able to.

FIG. 1 is a partially enlarged cut end view showing a schematic configuration of one aspect of the sealant according to the embodiment of the present disclosure. FIG. 2 is a partially enlarged cut end view showing a schematic configuration of another aspect of the sealant according to the embodiment of the present disclosure. FIG. 3 is a partially enlarged cut end view showing a schematic configuration of one aspect of the packaging material in one embodiment of the present disclosure. FIG. 4 is a partially enlarged cut end view showing a schematic configuration of another aspect of the packaging material in one embodiment of the present disclosure. FIG. 5 is a schematic diagram schematically showing a configuration of an example of a manufacturing apparatus capable of manufacturing a packaging material according to an embodiment of the present disclosure. FIG. 6 is a perspective view showing a schematic configuration of a package for transporting a silicon material according to an embodiment of the present disclosure. FIG. 7 is a perspective view showing a schematic configuration of a package of a silicon material according to an embodiment of the present disclosure. FIG. 8A is a mass spectrum showing the GC / MS analysis result of Example 1. FIG. 8B is a mass spectrum showing the results of GC / MS analysis of Example 2. FIG. 8C is a mass spectrum showing the GC / MS analysis result of Comparative Example 1.

Embodiments of the present disclosure will be described with reference to the drawings.
In the drawings attached to the present specification, in order to facilitate understanding, the shape, scale, aspect ratio, etc. of each part may be changed or exaggerated from the actual product. The numerical range represented by using "~" in the present specification and the like means a range including each of the numerical values before and after "~" as a lower limit value and an upper limit value. In the present specification and the like, terms such as "film", "sheet" and "board" are not distinguished from each other based on the difference in designation. For example, "board" is a concept that includes members that can be generally called "sheet" or "film".

[Sealant]
As shown in FIGS. 1 and 2, the sealant 10 according to the present embodiment is for a packaging body (a packaging body for transporting a silicon material) used when transporting a silicon material, and has a first surface 11A. A sealant base material 11 having a second surface 11B facing the sealant base material 11 is provided. The sealant base material 11 is placed between the first surface layer 111 located on the first surface 11A side, the second surface layer 112 located on the second surface 11B side, and the first surface layer 111 and the second surface layer 112. It may be a laminated structure having a sandwiched intermediate layer 113 (see FIG. 1), or a single-layer structure having a first surface 11A and a second surface 11B (see FIG. 2). ..

In the embodiment shown in FIG. 1, the first surface layer 111 located on the first surface 11A side is a layer containing low density polyethylene (LDPE) to which a slip agent is substantially not added. The second surface layer 112 located on the second surface 11B side is, like the first surface layer 111, a layer containing, for example, low-density polyethylene (LDPE) to which a slip agent is substantially not added, and is a first layer. The intermediate layer 113 sandwiched between the surface layer 111 and the second surface layer 112 is, for example, a layer containing linear low density polyethylene (LLDPE) to which a slip agent is substantially not added. In the present embodiment, "substantially no slip agent is added" means that a component that actually improves the slipperiness of the surface of the sealant as a slipper actually affects the slipperiness of the surface of the sealant. Means that it is not added in excess of the amount that actually affects the slipperiness of the surface of the sealant. Examples of the slip agent include particles such as calcium carbonate or talc, and surfactants such as a silicone resin or a quaternary ammonium salt compound.

If a volatile component derived from the sealant 10 (outgas component derived from the sealant 10 or the like) located in the innermost layer of the packaging for transporting a silicon material adheres to the polysilicon or silicon wafer as the contents, the silicon wafer is removed. There is a risk of causing defects in the semiconductor device manufactured in use. Therefore, it is desirable that the amount of volatile components derived from the sealant 10 is as small as possible. In order to reduce the volatile components derived from the sealant 10, it is desirable to make the thickness T10 of the sealant 10 as thin as possible. Since the thickness T10 of the sealant 10 is relatively thin, the volatile component derived from the sealant 10 is released to the outside of the film, so that the volatile component derived from the sealant 10 can be reduced. On the other hand, if the thickness T10 of the sealant 10 is made too thin, the resistance to mechanical properties such as tensile strength is lowered, and the function as a bag for packing the contents may be deteriorated. In this respect, linear low density polyethylene (LLDPE) has higher elasticity and resistance to bending than low density polyethylene (LDPE). Therefore, by using linear low density polyethylene (LLDPE) as the sealant 10, the sealant 10 is used. Thickness T10 can be made relatively thin.

Further, since the resin case 51 is housed in the packaging body 40 for transporting the silicon material and then degassed from the packaging body 40 and packed, the sealant 10 contained in the packaging material constituting the packaging body 40 may be used. Good followability is required. In this respect as well, since the linear low density polyethylene (LLDPE) has a relatively high elasticity, the followability of the sealant 10 can be improved by using the linear low density polyethylene (LLDPE).

If the sealant is composed of a single layer of linear low density polyethylene (LLDPE), the indentation elastic modulus of the sealant composed of a single layer of linear low density polyethylene (LLDPE) can be adjusted to about 150 MPa to 600 MPa. It is considered that the thickness of the sealant can be reduced. Further, it can be said that it is preferable that the sealant is composed of a single layer of linear low density polyethylene (LLDPE) in consideration of improving the followability of the sealant. However, since the pressure during the polymerization of the linear low density polyethylene (LLDPE) is lower than the pressure during the polymerization of the low density polyethylene (LDPE), the linear low density polyethylene (LLDPE) becomes the low density polyethylene (LDPE). In comparison, low-density components are more likely to volatilize. Therefore, if the sealant is composed of a single layer of linear low density polyethylene (LLDPE), even if the thickness of the sealant can be reduced, there is a risk that the silicon material will be contaminated by the volatile components derived from the sealant. It is believed that there is. Also, linear low density polyethylene (LLDPE) tends to be less slippery than low density polyethylene (LDPE), so if the sealant is composed of a single layer of linear low density polyethylene (LLDPE), the sealant will It is considered that the slipperiness of the surface may be lowered. Since it is preferable that the sealant used for the transportation packaging of the silicon material does not substantially contain a slip agent that may become a foreign substance, it is preferable to improve the slipperiness by means other than the use of the slip agent. In this embodiment, the intermediate layer 113 containing linear low density polyethylene (LLDPE) is sandwiched between the first surface layer 111 and the second surface layer 112 containing low density polyethylene (LDPE). Therefore, according to the sealant 10 according to the present embodiment, the thickness T10 can be made relatively thin, the followability and slipperiness are good, and the linear low density polyethylene (LLDPE) contained in the intermediate layer 113 is used. It is possible to prevent the low molecular weight components from volatilizing.

In the sealant 10 shown in FIG. 2, the sealant base material 11 having a single-layer structure contains low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE). In the sealant base material 11, the blending ratio of the low density polyethylene (LDPE) and the linear low density polyethylene (LLDPE) may be about 50:50 to 70:30. As described above, since the blending amount of the low density polyethylene (LDPE) is larger than the blending amount of the linear low density polyethylene (LLDPE), the abundance of the low density polyethylene (LDPE) on the first surface 11A side of the sealant base material 11. The effect of reducing the thickness T10 of the sealant 10 by using linear low density polyethylene (LLDPE), that is, the effect of preventing low molecular weight components from volatilizing is exhibited. When viewed in the thickness direction of the sealant base material 11, the low-density polyethylene (LDPE) and the linear low-density polyethylene (LLDPE) may be present substantially uniformly, and the first surface 11A side and the first surface 11A side and Low-density polyethylene (LDPE) may be unevenly distributed on the second surface 11B side.

The thickness T10 of the sealant 10 according to the present embodiment can be appropriately set according to the thickness of the packaging for transporting the silicon material composed of the packaging material containing the sealant 10, and can be appropriately set, for example, from 35 μm to 35 μm. It may be about 60 μm.

In the embodiment shown in FIG. 1, the first surface layer 111 containing low-density polyethylene (LDPE) and the second surface layer 112 containing low-density polyethylene (LDPE) are arranged so as to sandwich the intermediate layer 113, whereby the sealant 10 The internal stress on one side and the internal stress on the other side are canceled to some extent, and curling of the sealant 10 can be suppressed. Further, in the embodiment shown in FIG. 1, the thicknesses T111 and T112 of the first surface layer 111 and the second surface layer 112 are each thinner than the thickness T113 of the intermediate layer 113. Since the thicknesses T111 and T112 of the first surface layer 111 and the second surface layer 112 are thinner than the thickness T113 of the intermediate layer 113, the sealant 10 can be provided with a predetermined followability. The ratio of the thickness T111 of the first surface layer 111 to the thickness T113 of the intermediate layer 113 may be about 1: 1 to 10, and is preferably about 1: 2 to 3. When the thickness ratio is in the above range, sufficient followability of the low-density linear polyethylene (LLDPE) contained in the intermediate layer 113 is imparted to the sealant 10, and the indentation elastic modulus of the sealant 10 is in the range of 300 MPa to 500 MPa. can do. The indentation elastic modulus can be measured by a microhardness tester (product name "PICODETOR HM500", manufactured by Fisher Instruments).

It is known that the seal strength of the sealant can be controlled by the seal temperature at the time of heat sealing, the seal pressure, the seal time, and the like. Generally, the higher the sealing temperature, the higher the sealing strength tends to be. However, if the sealing temperature is too high, the sealant may melt more than necessary, and the sealing strength may be lowered. In the present embodiment, the sealing strength when the first surfaces 11A of the sealant 10 are sealed with each other under heat sealing conditions of a sealing temperature of 150 ° C., a sealing pressure of 0.1 MPa, and a sealing time of 1 second is 30 N / 15 mm or more. It may be sufficient, and preferably 50 N / 15 mm or more and less than 60 N / 15 mm. When the seal strength is less than 30 N / 15 mm, the transport package of the silicon material is being transported during the transport of the silicon material packaged in the transport package 40 of the silicon material composed of the packaging material 20 having the sealant 10. The heat-sealed portion of 40 (for example, the upper surface heat-sealed portion HST or the like (see FIG. 7)) may be peeled off.

As described above, from the viewpoint of making the thickness T10 of the sealant 10 relatively thin, it is considered that it is preferable to use linear low density polyethylene (LLDPE) as a constituent material of the sealant 10. However, in a sealant made of linear low density polyethylene (LLDPE), the sealing temperature required to obtain a predetermined sealing strength becomes relatively high. In this respect, in the present embodiment, since the first surface layer 111 of the sealant 10 contains low density polyethylene (LDPE), the sealing temperature required to obtain a predetermined sealing strength can be relatively lowered. ..

The haze of the sealant 10 according to the present embodiment may be 25% or less, preferably 20% or less. When the haze of the sealant 10 is 20% or less, the visibility inside the packaging material 40 for transporting the silicon material produced from the packaging material 20 having the sealant 10 can be improved. Further, before packaging the silicon material in the transport package of the silicon material, it is possible to confirm whether or not foreign matter is attached to the first surface 11A of the sealant 10, and it is possible to prevent the silicon material from being contaminated. You can also do it. The haze of the sealant 10 can be measured according to JIS-K7136 using, for example, a haze meter (product name: HM-150, manufactured by Murakami Color Research Institute).

The sealant 10 having the above-mentioned structure can be produced by using a conventionally known film forming method. For example, the sealant 10 having the structure shown in FIG. 1 is manufactured by laminating the second surface layer 112, the intermediate layer 113, and the first surface layer 111 by using a coating method such as a die coating method or an inflation method. obtain. Similarly, the sealant 10 having the configuration shown in FIG. 2 can be produced by using the above-mentioned coating method, extrusion inflation method, or the like.

[Packaging material]
As shown in FIG. 3, the packaging material 20 in the present embodiment has a multilayer structure in which the sealant 10 is laminated so that the second surface 11B is brought into contact with one surface side of the base 21.
The base 21 is formed by, for example, one type of resin material selected from polyethylene (PE), polyethylene terephthalate (PET), nylon (registered trademark, Ny), polybutylene terephthalate (PBT), and the like, or a laminate of two or more types of resin materials. It is composed of the body. In the example shown in FIG. 3, the base 21 is composed of a laminate of two types of resin materials (first resin layer 211 and second resin layer 212), and the first resin layer 211 is the sealant 10th. It functions as an adhesive layer for the two surfaces 11B. In this case, for example, the first resin layer 211 may be made of polyethylene (PE), and the second resin layer 212 may be made of polyethylene terephthalate (PET).

The sealant 10 in the packaging material 20 is such that the inside of the packaging body 40 can be visually recognized when the silicon material is packaged in the packaging body 40 for transporting the silicon material produced from the packaging material 20 (see FIG. 6). Has transparency. Therefore, it is desirable that the packaging material 20 having the sealant 10 also has transparency to the extent that the inside of the packaging body 40 can be visually recognized. From such a viewpoint, the haze of the packaging material 20 in the present embodiment may be, for example, 30% or less, preferably 25% or less. If the haze of the packaging material 20 exceeds 30%, the visibility inside the transport packaging 40 of the silicon material produced from the packaging material 20 deteriorates, or the sealant 10 in the transportation packaging 40 of the silicon material 10 It may be difficult to confirm whether or not foreign matter is attached to the first surface 11A of the above. The haze of the packaging material 20 can be measured in accordance with JIS-K7136 using, for example, a haze meter (product name: HM-150, manufactured by Murakami Color Research Institute).

In the present embodiment, the gas barrier layer 22 may be provided on the other side of the base 21 (see FIG. 4). By having the gas barrier layer 22, it is possible to prevent gas or the like that contaminates the surface of the silicon material from entering from the outside of the packaging body 40 for transporting the silicon material produced from the packaging material 20. The gas barrier layer 22 may be, for example, a thin-film film formed by depositing an inorganic oxide such as silica or alumina on a resin layer (for example, a PET layer). Further, the packaging material 20 may have a metal vapor deposition film formed by depositing a metal such as aluminum or a metal foil such as aluminum on the other surface side of the base material 21. When these metal vapor deposition films or metal foils are provided on the other side of the base material 21, transparency is not ensured in the packaging material 20, but the packaging material 40 for transporting the silicon material produced from the packaging material 20 has a gas barrier property. In addition, light shielding property can be imparted. Further, in this embodiment, the sealant 10 provided on one side of the base material 21 has a predetermined transparency, so that the sealant 10 in the transport package 40 of the silicon material produced from the packaging material 20 is the first. It is possible to more easily confirm whether or not foreign matter is attached to the surface 11A.

The packaging material 20 having the above-described configuration may be produced by a conventionally known production method such as a film. For example, as shown in FIG. 5, the first roll 61, the second roll 62, the third roll 63, and T It can be made using a manufacturing apparatus 60 having a die 64. In such a manufacturing apparatus, the resin material constituting the first resin layer 211 is extruded from the T die 64 in the form of a film between the second surface 11B of the sealant 10 and the second resin layer 212, and the first roll 61, The packaging material 20 is produced by being surface-pressed and cooled by the second roll 62 and the third roll 63.

[Packaging for transportation of silicon material]
As shown in FIG. 6, the packaging body 40 for transporting a silicon material in the present embodiment is a packaging bag that becomes a substantially rectangular parallelepiped shape (substantially rectangular parallelepiped shape) when expanded, and is a first side film 41 and a second side surface. It is composed of a film 42, a first gusset film 43, and a second gusset film 44. The first side surface film 41, the second side surface film 42, the first gusset film 43, and the second gusset film 44 are all made of the above-mentioned packaging material 20. In the silicone material transport package 40, the first surface 11A of the sealant 10 of any of the first side film 41, the second side film 42, the first gusset film 43, and the second gusset film 44 is located on the innermost surface. The other side of the base 21 is configured to be located on the outermost surface.

In the package 40 for transporting the silicon material, one of the two opposing side edges of the first side film 41 and one of the two opposing side edges of the folded first gusset film 43 are overlapped with each other. The first heat-sealed portion HS1 formed by welding by heat-sealing is formed, and the other side edge portion of the first side film 41 and one of the two opposing side edge portions of the folded second gusset film 44 are formed. A second heat-sealed portion HS2 formed by overlapping and welding by heat-sealing is formed. Further, a third heat-sealing portion formed by superimposing one of the two opposing side edge portions of the second side surface film 42 and the other side edge portion of the folded first gusset film 43 and welding them by heat sealing. A fourth heat-sealed portion formed by forming HS3 and superimposing the other side edge portion of the second side film 42 and the other side edge portion of the folded second gusset film 44 and welding them by heat sealing. HS4 is formed. A first side surface film 41 and a second side surface film 42 are overlapped with each other and welded by heat sealing to form a bottom surface heat sealing portion HSB, which is located opposite to the bottom surface heat sealing portion HSB. The side edges of the side film 41 and the second side film 42 are not heat-sealed and form an opening 45 of the packaging 40 for transporting the silicon material.

In a state where a large number of silicone material transport packages 40 in which the first gusset film 43 and the second gusset film 44 are folded are stacked, the first side surface film 41 or the second side surface film 42 is adsorbed and held and lifted upward. As a result, the opening 45 can be opened. From the open opening 45, a resin case 51 (see FIG. 7) for storing the silicon material 52 is housed in the packaging body 40 for transporting the silicon material, and the first side surface film 41 and the second side surface in the opening 45 are accommodated. By superimposing the side edges of the film 42 and heat-sealing the film 42, the upper surface heat-sealing portion HST can be formed to produce a package 50 (see FIG. 7) made of a silicon material.

In the packaging body 40 for transporting a silicon material in the present embodiment, low density polyethylene (LDPE) is contained on the first surface 11A side of the sealant 10 located in the innermost layer thereof, and linear on the second surface 11B side. Contains low density polyethylene (LLDPE). The linear low-density polyethylene (LLDPE) constituting the sealant 10 makes it possible to make the thickness T10 of the sealant 10 relatively thin, improve the followability, and include the sealant 10 on the first surface 11A side. The low density polyethylene (LDPE) can prevent the volatilization of low molecular weight components from the linear low density polyethylene (LLDPE). When a metal vapor deposition film or a metal foil is provided on the other side of the base material 21 of the packaging material 20 constituting the packaging body 40 for transporting a silicon material, the predetermined transparency is not ensured, but the packaging material 20 By providing the metal vapor deposition film or the metal foil on the other side of the base material 21 of the above material, it is possible to impart gas barrier property and light shielding property to the packaging body 40 for transporting the silicon material. Further, since the sealant 10 provided on one surface side of the base material 21 has a predetermined transparency, foreign matter adheres to the first surface 11A of the sealant 10 in the packaging body 40 for transporting the silicon material. It can be easily confirmed whether or not it is used.

The embodiments described above have been described for facilitating the understanding of the present disclosure, and are not described for limiting the present disclosure. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present disclosure.

The packaging body 50 of the silicon material in the above embodiment may have the packaging body 40 for transporting the silicon material as an inner bag, and may further have an outer bag having a similar configuration. In this case, the inner bag may be provided. The silicon material 52 may be housed in the packaging body 40 for transporting the silicon material, and further housed in an outer bag. The packaging material constituting each of the first side surface film 41, the second side surface film 42, the first gusset film 43, and the second gusset film 44 of the outer bag is a packaging material 20 having the configurations shown in FIGS. 3 and 4. It may be present, or a resin film having an antistatic function (for example, a nylon film with an antistatic layer (product name: Bonnil AS, manufactured by Kojin Film & Chemicals Co., Ltd.)), a gas barrier layer 22, a first resin layer. It may be a laminated body or the like in which 211 and the sealant 10 are laminated in this order.

The packaging body 40 for transporting the silicon material in the above embodiment may not have the first gusset film 43 and the second gusset film 44. In this case, the first side surface film 41 and the second side surface film 42 may be heat-sealed at the three side edges so that the first side surfaces 11A of the sealants 10 face each other.

Hereinafter, the present disclosure will be described in more detail with reference to Examples and the like, but the present disclosure is not limited to the following Examples and the like.

[Example 1]
Low density polyethylene (LDPE with substantially no slip agent added, manufactured by Ube Maruzen Polyethylene, product name: UBE polyethylene B128) is used as a constituent material of the first surface layer 111, and low density polyethylene is used as a constituent material of the intermediate layer 113. Polyethylene (LDPE with virtually no slip agent added, manufactured by Ube Maruzen Polyethylene, product name: UBE polyethylene B128) and linear low-density polyethylene (LDPE with virtually no slip agent added, manufactured by Prime Polymer Co., Ltd., Product name: Ultozex 3500ZA) melt mixture (blending ratio = 1: 1 (mass basis)) is used, and low density polyethylene (LDPE with substantially no slip agent added) is used as a constituent material of the second surface layer 112. Using Ube Maruzen Polyethylene Co., Ltd., product name: UBE polyethylene B128), the sealant 10 (first surface layer 111 (thickness: 8 μm), intermediate layer 113) having the configuration shown in FIG. 1 by the multilayer coextrusion inflation film forming method. (Thickness: 24 μm), second surface layer 112 (thickness: 8 μm)) was prepared.

[Example 2]
Pellets of low-density polyethylene (LDPE with virtually no slip agent added, manufactured by Ube-Maruzen Polyethylene, product name: UBE polyethylene B128) and linear low-density polyethylene (LDPE with virtually no slip agent added, prime) Pellets of Ultzex 3500ZA (manufactured by Polymer Co., Ltd.) are melt-mixed at a blending ratio of 7: 3 (mass basis), and a sealant 10 (thickness: 40 μm) having the configuration shown in FIG. did.

[Comparative Example 1]
Additive-free linear low-density polyethylene (additive-free LLDPE, manufactured by Tamapoli, product name: NB-1) sealant (thickness: 50 μm) was prepared.

[Test Example 1]
Sections of the sealants of Examples 1 and 2 and Comparative Example 1 cut into 100 mm × 25 mm were prepared as test samples, and the test samples were immersed in ethanol at 60 ° C. for 1 week. The volatile components from the test sample immersed in ethanol were analyzed by GC / MS under the following conditions to obtain a mass spectrum. The obtained mass spectra are shown in FIGS. 8A to 8C.

<GC / MS conditions>
-Gas chromatograph: GCMS-QP2010 (manufactured by Shimadzu Corporation)
-Column: 670-15003-03 (length: 30 mm, inner diameter: 0.25 mm, manufactured by Shimadzu Corporation)
・ Column oven temperature: 50 ℃
・ Injection volume: 1 μL
-Carrier gas: He (57.1 mL / min)
・ Vaporization chamber temperature setting: 300 ℃
・ Measurement mode: Split

[Test Example 2] Indentation elastic modulus A section cut out from the sealants of Examples 1 and 2 and Comparative Example 1 in a desired size was prepared as a test sample, and the temperature of the test sample was 23 ° C. ± in accordance with ISO14577: 2015. The indentation elastic modulus was measured in an atmosphere of 2 ° C. and a humidity of 60% RH ± 5% RH. First, an adhesive resin (product name "Aron Alpha (registered trademark) for general use", manufactured by Toagosei Co., Ltd.) was applied to a commercially available slide glass so that the first surface 11A of the test sample cut out to a size of 20 mm x 20 mm was the upper surface. It was fixed via. Specifically, the adhesive resin was dropped onto the central portion of the slide glass 1 (product name "slide glass (cut-off type) 1-9645-11", manufactured by AS ONE Corporation). At this time, one drop of the adhesive resin was dropped so that the adhesive resin did not spread out from the test sample when the adhesive resin was not spread and spread as described later. After that, the test sample cut out to the above size is brought into contact with the slide glass so that the first surface 11A side is the upper surface and the adhesive resin is located at the center of the test sample, and the test sample is adhered between the slide glass 1 and the test sample. The resin was spread and temporarily bonded. Then, another new slide glass 2 was placed on the test sample to obtain a laminate of slite glass 1 / adhesive resin / test sample / slide glass 2. Next, a weight of 30 g or more and 50 g was placed on the slide glass 2 and left at room temperature for 12 hours. Then, the weight and the slide glass 2 were removed, and this was used as a measurement sample. Then, this measurement sample was fixed to the measurement stage of a micro-hardness tester (product name: PICODETOR HM500, manufactured by Fisher Instruments) installed in parallel with the vibration isolation table. For this fixing, the four sides of the slide glass 1 were fixed with tape (product name: cellophane tape (registered trademark), manufactured by Nichiban Co., Ltd.) so that the measurement sample did not move. Next, on the first surface 11A of the test sample, an ultra-micro load hardness tester (Picodenter HM500, manufactured by Fisher Instruments) equipped with a Vickers indenter (a diamond indenter having a regular quadrangular pyramid with a facing angle of 136 °) was attached. The indentation elastic modulus was measured under the conditions of a indentation speed of 0.15 μm / sec, a indentation depth of 3 μm, a holding time of 5 seconds, and a withdrawal speed of 0.15 μm / sec. In one test sample, measurements were taken at at least five different points, and the average of those measurements was taken as the value of the indentation modulus for the sealant under that condition. The results are shown in Table 1.

[Test Example 3] Seal strength The first surfaces of the sealants of Examples 1 and 2 and Comparative Example 1 are heat-sealed under the conditions shown in Table 2 below, and a heat-seal test piece having a width of 15 mm including the heat-seal portion is collected. , The seal strength of the heat seal test piece was determined in accordance with JIS-Z1711. The results are shown in Table 2.

As is clear from the results shown in FIGS. 8A to 8C, no volatile component was detected in the sealants of Examples 1 and 2, but volatile components were detected in the sealant of Comparative Example 1. From this result, as in Examples 1 and 2, the first portion located on the first surface 11A side contains low density polyethylene (LDPE), and the second portion located on the second surface 11B side thereof. It is presumed that the inclusion of linear low density polyethylene (LLDPE) can prevent the volatilization of low molecular weight components from the sealant.

As is clear from the results shown in Table 1, the indentation elastic modulus of Example 1 and Example 2 is larger than the indentation elastic modulus of Comparative Example 1, but it expands and contracts to such an extent that sufficient followability can be exhibited in practice. It is presumed to have properties and bending resistance. Further, it was confirmed that the sealants of Examples 1 and 2 can ensure sufficient transparency.

As is clear from the results shown in Table 2, it was confirmed that the sealants of Examples 1 and 2 can obtain high sealing strength at a lower sealing temperature than the sealants of Comparative Examples 1 to 3. Was done.

10 ... Sealant 11A ... First side 11B ... Second side 20 ... Packaging material 40 ... Silicon material transportation packaging 50 ... Silicon material packaging

Claims (11)

A sealant used for shipping packaging of silicone materials.
A sealant substrate having a first surface and a second surface facing the first surface is provided.
The sealant substrate, a first surface layer comprising a first surface, a second front surface layer containing the second surface, and an intermediate layer located between the first surface layer and the second surface layer Have ,
The first surface layer and the second surface layer contain low density polyethylene (LDPE).
The intermediate layer, viewed contains a linear low density polyethylene (LLDPE),
The thickness of the intermediate layer is thicker than the thickness of the first surface layer and the thickness of the second surface layer, respectively . A sealant used for shipping packaging of silicone materials.
A sealant substrate having a first surface and a second surface facing the first surface is provided.
The sealant base material has a single-layer structure containing low-density polyethylene (LDPE) and linear low-density polyethylene (LLDPE).
The blending amount of the low density polyethylene (LDPE) is equal to or larger than the blending amount of the linear low density polyethylene (LLDPE).
Sealant. The blending amount of the low density polyethylene (LDPE) is larger than the blending amount of the linear low density polyethylene (LLDPE).
The sealant according to claim 2. The blending ratio of the low density polyethylene (LDPE) and the linear low density polyethylene (LLDPE) is 50:50 to 70:30.
The sealant according to claim 2. Before SL low density polyethylene (LDPE), sealant according to any one of claims 1-4 slip agent is a low density polyethylene which is not added pressure. Before SL linear low density polyethylene (LLDPE) sealant according to any one of claims 1-5 slip agent is a linear low density polyethylene which is not added pressure. The thickness of the sealant is 35 μm or more and 60 μm or less.
The sealant according to any one of claims 1 to 6. The base made of resin material and
The sealant according to any one of claims 1 to 7 , which is provided on one side of the base portion.
The sealant is a packaging material provided so that the second surface is brought into contact with one surface side of the base portion. The packaging material according to claim 8 , further comprising a gas barrier layer provided on the other side of the base. A packaging body for transporting a silicon material composed of the packaging material according to claim 8 or 9 . The packaging for transporting the silicon material according to claim 10 ,
A package of a silicon material including the silicon material contained in the package for transporting the silicon material.

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