JP6759367B2 - Component mounting device - Google Patents

Description

The present invention relates to a component mounting device, and more particularly to a component mounting device including a static eliminator for removing static electricity charged on a substrate or a component.

The component mounting device is provided with a static eliminator that removes static electricity charged on a substrate, a component, or the like in order to suppress troubles such as poor adsorption and mounting failure of the component caused by static electricity.

For example, in Patent Document 1, air is ionized using a high voltage to generate positive and negative electric charges (air ions), which are then released together with air to generate static electricity (electric charges) on substrates and parts. A component mounting device including a non-contact static eliminator called a summing ionizer is disclosed.

In this type of conventional component mounting device, the static eliminator is configured to discharge an electric charge with a constant flow rate of air into a large space within the device on which the mounting work is performed.

However, the size of the substrate, the type of the component, the size, etc. differ depending on the component mounting substrate to be produced, and the charge amount of the substrate, the component, etc. is not always constant. Therefore, when the electric charge is discharged to a wide space together with the air having a constant flow rate, it is conceivable that the static electricity of the substrate or the component cannot be sufficiently removed. In addition, it is wasteful to uniformly discharge the electric charge toward a wide space when a part of the static elimination target does not exist, such as when waiting for the substrate to be carried in. Therefore, it is required to solve these problems.

JP-A-2002-20498

An object of the present invention is to provide a component mounting device capable of more efficiently and effectively removing static electricity charged on a substrate, a component, or the like.

Then, according to the present invention, a board transfer mechanism for carrying a board to a mounting work position, a component supply unit for supplying mounting components, and a head unit for taking out components from the component supply section and mounting them on the board at the mounting work position. A static eliminator unit that removes static electricity in a non-contact manner by discharging electric charges, and the static eliminator unit includes a static eliminator that discharges electric charges and a discharge direction switching device that switches the charge discharge direction by the static eliminator. To prepare.

It is the schematic sectional drawing of the component mounting apparatus which concerns on 1st Embodiment of this invention. It is a perspective view which looked at the said component mounting apparatus from the front side. It is a top view of the static elimination unit. It is an enlarged view of the main part of FIG. 1 for demonstrating the charge discharge angle of the static elimination unit. It is a block diagram which shows the control system of the said component mounting apparatus. It is a flowchart which shows an example of static elimination processing control by a main control part. It is a conceptual diagram of the table data (static elimination control table) stored in the storage part. It is a flowchart which shows an example of the static elimination processing control by the main control part of the 2nd Embodiment of this invention. It is a conceptual diagram of the table data (static elimination control table) stored in the storage part of the component mounting apparatus which concerns on 2nd Embodiment. It is the schematic sectional drawing of the component mounting apparatus which concerns on 3rd Embodiment of this invention. It is a flowchart which shows an example of static elimination processing control by the main control part of 3rd Embodiment. It is a conceptual diagram of the table data (static elimination control table) stored in the storage part of the component mounting apparatus which concerns on 3rd Embodiment.

Hereinafter, the first embodiment of the present invention will be described with reference to the accompanying drawings.

[Configuration of component mounting device]
FIG. 1 is a schematic cross-sectional view of the component mounting device 1 according to the first embodiment of the present invention, and FIG. 2 is a perspective view of the component mounting device 1 as viewed from the front side. In FIG. 1, the left side is the front side of the device, and the right side is the rear side of the device.

The component mounting device 1 includes a base 2, a substrate transport mechanism 4 for transporting a substrate P such as a printed wiring board, a component supply unit 6, a head unit 8 for mounting components, a component recognition camera 10, and a casing 12. And a static elimination unit 14.

The base 2 is a table-like structure. The front-rear central portion of the base 2 is a work area for mounting components on the board P, and the board transfer mechanism 4 is arranged in this work area.

The substrate transport mechanism 4 includes a pair of front and rear conveyors 4a, a positioning mechanism (not shown) for positioning the substrate P conveyed by the conveyor 4a at a predetermined mounting work position Wp (position shown in the figure), and the mounting work position. It is provided with a substrate detection sensor 5 (see FIG. 5) that detects the substrate P in Wp. The conveyor 4a is a belt conveyor in this example, and the substrate P is carried into the device by the conveyor 4a from the right side of the device, that is, from the front side in the direction orthogonal to the paper surface of FIG. 1, and after the parts mounting work is completed, the left side of the device. Is carried out of the device.

The component supply units 6 are provided on both front and rear sides of the substrate transfer mechanism 4. A plurality of tape feeders 7 are detachably arranged along the conveyor 4a in the component supply unit 6, respectively. The tape feeder 7 supplies electronic components (hereinafter, simply referred to as components) using the tape as a carrier. For example, in addition to small piece-shaped chip parts such as ICs, transistors, and capacitors, package parts such as FOP (Small Outline Package) are supplied by the tape feeder 7.

The head unit 8 is mounted above the base 2. The head unit 8 takes out parts from the tape feeder 7 of each parts supply unit 6 and mounts them on the board P. The head unit drive mechanism (not shown) using a servomotor or a linear motor as a drive source causes the head unit 8 to move forward, backward, left and right. It is designed to be movable.

The head unit 8 is equipped with a plurality of heads 9 for sucking parts in a line in the left-right direction. The parts are taken out from the parts outlet 7a provided at the tip of the tape feeder 7 by being attracted by these heads 9.

The component recognition camera 10 is mounted on the base 2 between the component supply unit 6 and the substrate transfer mechanism 4, respectively. The component recognition camera 10 images the component in order for each head 9 to recognize the suction state of the component taken out from the tape feeder 7, and is arranged upward on the base 2.

The casing 12 forms the appearance of the component mounting device 1, and is a base 2, a substrate transport mechanism 4 arranged on the base 2, a component supply unit 6, a head unit 8, and a component recognition camera. It covers 10 mag from the outside.

The casing 12 is provided with an opening / closing cover 13 at a position above the component supply portions 6 on both the front and rear sides. The casing 12 has a substantially L-shaped cross-sectional shape having a vertical wall portion 13a extending vertically and an upper wall portion 13b extending in the front-rear direction from the upper end thereof. The vertical wall portion 13a is provided with a window portion 131 covered with, for example, a transparent acrylic material, which allows the inside of the device to be visually recognized, and is an outer wall surface of the vertical wall portion 13a and is the window portion 131. A handle 13c for opening / closing operation is provided on the lower side. Note that FIG. 2 shows the component mounting device 1 with the tape feeder 7 removed from the component supply unit 6.

The static elimination unit 14 is mounted on the inner wall surface of the opening / closing cover 13, specifically, the inner wall surface of the vertical wall portion 13a. The static eliminator unit 14 removes static electricity charged on the substrate P, parts, and the like, and the static eliminator unit 14 of this example has positive and negative charges (air ions) by ionizing air using a high voltage. ) Is generated and discharged into the internal space S of the casing 12. This is a corona discharge type static eliminator unit.

FIG. 3 is a plan view of the static elimination unit 14. As shown in FIGS. 1 to 3, the static elimination unit 14 drives a static elimination device 20 that generates and discharges positive and negative charges, a discharge direction switching device 22 that switches the discharge direction of the charges, and a static elimination device 20. Includes drive unit. To be precise, among the components of the static elimination unit 14, the static elimination device 20 and the discharge direction switching device 22 are mounted on the inner wall surface of the opening / closing cover 13, and the drive device is mainly arranged inside the base 2. ing.

The static eliminator 20 includes a hollow and long electrode casing 21 extending in the left-right direction from one end to the other end of the component supply unit 6, and a plurality of discharge needles (FIGS.) arranged inside the electrode casing 21. (Omitted) and. Charge discharge ports 21a are formed in the electrode casing 21 at regular intervals in the longitudinal direction thereof, and each discharge needle is arranged at a position corresponding to these charge discharge ports 21a.

The drive device includes an unexpected power supply system (power supply device) that applies a high voltage current to each discharge needle, and an air supply system (air supply device) 26 that supplies air into the electrode casing 21. .. The air supply system 26 includes an air supply source 30 such as a compressor, an air supply line 28 that supplies air to the electrode casing 21, and an air dryer 32, an air filter 33, and a flow rate provided in the air supply line 28 in order from the upstream side. It includes a control valve 34. That is, the static eliminator 20 discharges positive and negative charges generated by applying a high voltage current to each discharge needle from each charge discharge port 21a together with the air supplied by the air supply system 26. It is configured. Then, the flow rate of air is controlled by the flow rate control valve 34, so that the amount of charge released by the static elimination device 20 is adjusted. That is, in this example, the air supply system 26 corresponds to the emission amount switching device of the present invention.

The discharge direction switching device 22 can rotate the static eliminator 20 to open / close covers 13 (vertical wall portions 13a) at both ends in the longitudinal direction so that the direction of the charge discharge port 21a is displaced (swinged) in the vertical direction. Includes a bracket 23 that supports the device and a motor 24 that drives the static elimination device 20. With this configuration, as shown in FIG. 4, the static elimination unit 14 is configured so that the charge discharge direction can be switched in the vertical direction. Although only the static elimination unit 14 on the rear side of the device is shown in FIG. 4, the static elimination unit 14 on the front side of the device has the same configuration.

Reference numeral 16 in FIG. 2 is an input / output device including a touch panel monitor, which displays the operating status of the component mounting device 1, various messages, and the like, and accepts input of various information to the component mounting device 1. It is a thing.

[Explanation of control system of component mounting device]
FIG. 5 shows a control unit 40 mounted on the component mounting device 1. The control unit 40 includes a main control unit 42 that comprehensively controls the operation of the component mounting device 1, a storage unit 43 that stores programs and various data, a head unit drive control unit 44, and a static elimination unit drive control unit. 46 and an input / output unit 48 are included.

The main control unit 42 is a computer composed of a CPU and a memory, and is connected to a storage unit 43, a head unit drive control unit 44, a static elimination unit drive control unit 46, and an input / output unit 48 via a bus 41.

The main control unit 42 controls the head unit 8 via the head unit drive control unit 44 according to the program and data stored in the storage unit 43, so that the component is taken out from the component supply unit 6 and mounted on the board P ( In addition to executing the component mounting process to be mounted), various arithmetic processes related to the process are performed. Further, the main control unit 42 controls the static eliminator unit 14 via the static eliminator unit drive control unit 46 based on the programs and data stored in the storage unit 43, so that the board P and the like are operated while the component mounting device 1 is in operation. Performs static electricity removal processing to remove static electricity charged in the program. In this example, the main control unit 42 and the static elimination unit drive control unit 46 correspond to the control device of the present invention.

The storage unit 43 is composed of a hard disk, a memory, or the like, and stores various programs and various data required for controlling the operation of the component mounting device 1. The storage unit 43 stores component data and a static elimination control table (corresponding to the table data of the present invention) as various data. The component data is table data in which data indicating mounting points on the substrate P and data indicating components (types) are associated with each type of substrate P. Further, the static elimination control table is table data in which the data indicating the operating state of the component mounting device 1 is associated with the charge discharge direction and the charge discharge amount of the static elimination unit 14. The static elimination control table will be described in detail later.

The head unit drive control unit 44 controls the drive of the motor or the like of the head unit drive mechanism based on a command from the main control unit 42.

The static elimination unit drive control unit 46 controls on / off of switches (not shown) of the power supply system of the static elimination unit 14 and the opening degree of the flow control valve 34 of the air supply system 26 based on a command from the main control unit 42. At the same time, it controls the drive of the motor 24 of the discharge direction switching device 22.

The input / output unit 48 is an interface for various sensors, actuators, and the like equipped in the component mounting device 1, and the board detection sensor 5 and the input / output device 16 are connected to the input / output unit 48.

[Static elimination processing control]
Next, the static elimination process will be described in detail. As described above, the static eliminating process is a process executed to remove static electricity charged on the substrate P or the like while the component mounting device 1 is in operation.

FIG. 6 is a flowchart showing an example of static elimination processing control by the main control unit 42. This static elimination process is executed when the component mounting device 1 is activated.

First, the main control unit 42 determines the operating state of the component mounting device 1 (step S1). Specifically, which of the "regular operation", the "part suction operation" by the head unit 8, and the "part recognition operation" by the component recognition camera 10 is in the operating state of the component mounting device 1 is determined. Determine. This determination is made based on the program currently being executed and the output signal from the encoder or the like (position detection device) incorporated in the motor of the head unit drive mechanism. The "regular operation" refers to a calibration operation for obtaining a correction value for correcting a movement error of the head unit 8 due to thermal expansion of each part of the head unit drive mechanism, foreign matter adhering to the head 9, and the like. This is an incidental operation that is periodically performed in the component mounting operation on the substrate P, such as a cleaning operation for removing.

When the determination of the operating state is completed, the main control unit 42 refers to the static elimination control table stored in the storage unit 43, and executes the static elimination process according to the static elimination conditions corresponding to the operating state (step S3).

FIG. 7 is a conceptual diagram showing an example of the static elimination control table. As shown in FIG. 7, the static elimination control table contains data indicating "regular operation", "part adsorption operation", and "part recognition operation", and the corresponding static elimination conditions, specifically, "charge release angle θ". It is the table data which defined the data which shows the "charge emission amount Q".

Here, the charge discharge angle θ is the angle of the static elimination device 20, and is defined with the angle at which the charge discharge port 21a points toward the component outlet 7a of the tape feeder 7 as a reference (θ = 0 °). The charge release amount Q is the charge release amount by the static eliminator 20, and is defined by the flow rate of the air supplied by the air supply system 26 to the static eliminator 20. That is, in the static elimination unit 14, the amount of electric charge generated by the static elimination device 20 is kept substantially constant (the value of the applied current to the discharge needle is kept substantially constant), and the air flow rate is adjusted by the flow rate control valve 34. The amount of charge released is changed by being charged.

More specifically, the static elimination control table of FIG. 7 will be described. During the component suction operation, the charge discharge port 21a of the static elimination device 20 is the component picking of the tape feeder 7 as shown by the broken line arrow of the circled number 1 in FIG. The charge discharge angle θ is set so as to point toward the outlet 7a, and during the periodic operation, the charge discharge port 21a points toward the mounting work position Wp (board P) as shown by the broken line arrow of the circled number 2 in FIG. The charge release angle θ is set so as to be performed, and during the component recognition operation, the component recognition position (the component that is the subject is arranged) above the component recognition camera 10 as shown by the broken line arrow of the circled number 3 in the figure. The charge release angle θ is set so that the charge discharge port 21a is directed to the position). In the static elimination control table of FIG. 7, the charge release angle θ (θ = 0 °) during the component adsorption operation is used as a reference (θ = 0 °), and the charge release angle θ (θ = 20 °) during the periodic operation and the component recognition operation are performed. The charge release angle θ (θ = 10 °) is defined.

On the other hand, the charge release amount Q is based on the charge release amount Q (Q = 10 L / min) during the component adsorption operation, and as the charge release angle θ increases, in other words, the charge release target position is the component outlet 7a. The value is set so that the charge emission amount Q becomes larger as the distance from the distance increases. Specifically, the charge release amount Q at the time of component recognition is set to 20 L / min, and the charge release amount Q during regular operation is set to 30 L / min.

After the process of step S3, the main control unit 42 determines whether all the production has been completed (step S5), and if it is determined to be No here, the process shifts to step S1. On the other hand, if it is determined to be Yes, the flowchart is terminated.

[Action effect, etc.]
According to the component mounting device 1 described above, the charge release angle θ of the static eliminator unit 14 can be switched according to the operating state thereof, so that static electricity can be efficiently and effectively removed. That is, since the electric charge is discharged toward the component outlet 7a of the tape feeder 7 during the component suction operation, the electric charge discharged from the static elimination unit 14 is concentrated on the component to effectively remove the static electricity of the component. be able to. Further, since the electric charge is discharged toward the mounting work position Wp during the periodic operation, the electric charge is concentrated on the substrate P waiting at the mounting work position Wp to effectively remove the static electricity of the substrate P. It becomes possible. Further, during the component recognition operation, the electric charge is discharged toward the component recognition position above the component recognition camera 10, so that the electric charge is concentrated on the component and the head 9 immediately before mounting to effectively remove these static electricitys. can do.

Moreover, in the static elimination control table, with reference to the charge release angle θ during the component adsorption operation, the larger the charge release angle θ, in other words, the farther the charge release target position is from the component outlet 7a, the more the charge release amount Q. Since the value is set so as to increase, it is possible to supply an amount of electric charge comparable to the emission target position during any operation.

Therefore, the component mounting device 1 is compared with the conventional component mounting device (component mounting device described in Patent Document 1) that always releases an electric charge together with a constant flow rate of air in a space inside a housing (casing). , The static electricity charged on the substrate P, the parts, and the like can be removed more efficiently and effectively. Therefore, it is possible to more highly suppress the occurrence of troubles caused by static electricity, that is, troubles such as poor adsorption of parts and poor mounting.

(Second Embodiment)
Next, the component mounting device 1 according to the second embodiment of the present invention will be described.

Since the basic configuration of the component mounting device 1 according to the second embodiment is common to the component mounting device 1 of the first embodiment, the common points with the first embodiment are omitted or simplified in the following description. The differences from the first embodiment will be described in detail.

In the component mounting device 1 of the second embodiment, the main control unit 42 executes the static elimination process based on the flowchart shown in FIG. Similar to the first embodiment, this static elimination process is also executed by activating the component mounting device 1.

First, the main control unit 42 determines the presence or absence of the board P at the mounting work position Wp based on the output signal from the board detection sensor 5 as the operating state of the component mounting device 1 (steps S11 and S13). Here, in the case of Yes, the main control unit 42 refers to the static elimination control table stored in the storage unit 43, and statically eliminates electricity according to the static elimination condition (board static elimination condition) when the substrate P is at the mounting work position Wp. The process is executed (step S15). On the other hand, if No in step S13, the main control unit 42 refers to the static elimination control table and executes static elimination processing according to the static elimination conditions (component static elimination conditions) when there is no board P at the mounting work position Wp (step). S17).

As shown in FIG. 9, the static elimination control table of the second embodiment includes data indicating the case where the substrate is present at the mounting work position Wp and the case where the substrate P is not present at the mounting work position Wp, and the corresponding charge release angle θ. It is the table data which corresponds with the data which shows the charge emission amount Q. In this example, when the substrate P is located at the mounting work position Wp, the charge discharge port 21a of the static eliminator 20 points toward the substrate P at the mounting work position Wp as shown by the broken line arrow of the circled number 2 in FIG. When the charge release angle θ (θ = 20 °) is set and there is no substrate P at the mounting work position Wp, the charge discharge port 21a is a tape feeder as shown by the broken line arrow of the circled number 1 in FIG. The charge discharge angle θ (θ = 10 °) is set so as to be directed to the component outlet 7a of 7. The value of the charge emission amount Q is set so as to be larger when the substrate P is present than when the substrate P is not present at the mounting work position Wp. That is, in step S15, the main control unit 42 controls the static elimination unit 14 so that a set amount of electric charge is discharged toward the substrate P at the mounting work position Wp, while in step S17, the component removal of the tape feeder 7 is performed. The static elimination unit 14 is controlled so that a set amount of electric charge is discharged toward the outlet 7a.

After the processing of step S15 or step S17, the main control unit 42 determines whether all the production has been completed (step S19), and if it is determined to be No, the processing shifts to step S11 and the determination is Yes. If so, the flowchart is terminated.

In this example, in the static elimination control table (table data) shown in FIG. 9, the data when the substrate P is at the mounting work position Wp corresponds to the first data of the present invention, and the substrate P is at the mounting work position Wp. The data in the absence of the above corresponds to the second data of the present invention.

[Action effect, etc.]
According to the component mounting device 1 of the second embodiment described above, the charge discharge direction of the static elimination unit 14 is switched according to the presence or absence of the board P at the mounting work position Wp, so that static electricity on the board P or the like is rationally removed. It has the advantage of being able to. That is, when the substrate P is located at the mounting work position Wp, the electric charge is mainly emitted toward the substrate P, and when there is no substrate P, the electric charge is emitted toward the component of the component supply unit 6. In the situation where the substrate P does not exist at the mounting work position Wp, it is suppressed that the electric charge is discharged toward the mounting work position Wp. In other words, when the substrate P does not exist, it is possible to intensively supply electric charges to the components of the component supply unit 6 by utilizing the period. Therefore, according to the component mounting device 1 of the second embodiment, it is possible to proceed with the mounting work of the substrate P while rationally removing the static electricity of the substrate P and the components.

Further, the value of the charge emission amount Q is set so as to be larger when the substrate P is present than when the substrate P is not present at the mounting work position Wp. That is, the value is set so that the charge release amount Q becomes larger as the charge discharge target position is farther away. Therefore, also in this second embodiment, it is possible to supply an electric charge in an amount comparable to the emission target position during both the operation in which the substrate P is present at the mounting work position Wp and in the state where the substrate P is not present.

(Third Embodiment)
Next, the component mounting device 1 according to the third embodiment of the present invention will be described.

Since the basic configuration of the component mounting device 1 according to the third embodiment is the same as that of the component mounting device 1 of the first embodiment, the common points with the first embodiment are omitted or simplified in the following description. The differences from the first embodiment will be described in detail.

[Configuration of component mounting device]
FIG. 10 is a schematic cross-sectional view of the component mounting device 1 according to the third embodiment of the present invention. As shown in the figure, in the component mounting device 1 of the third embodiment, the head unit 8 is equipped with a surface electrometer 50 (an example of the measuring instrument of the present invention). The surface electrometer 50 measures the voltage of the components supplied by the substrate P and the tape feeder 7 supported by the conveyor 4a, that is, the amount of static electricity charged on the substrate P and the like in a non-contact manner. The surface electrometer 50 is not limited to the non-contact type, and may be a contact type. The surface electrometer 50 is electrically connected to the input / output unit 48 of the control unit 40, and outputs a signal indicating a measurement result to the main control unit 42.

In the third embodiment, as the component data, data indicating the component (type), data indicating the mounting point (position on the substrate P on which the component is mounted), and data indicating the necessity of static elimination processing are performed. The table data associated with the above is stored in the storage unit 43. That is, the component data includes data indicating whether or not the mounting point on the substrate P and the component mounted on the mounting point need to be subjected to static elimination processing in advance.

Further, in the third embodiment, the table data as shown in FIG. 12 is stored as the static elimination control table. This static elimination control table is table data in which data indicating a plurality of voltage (charge amount) E ranges and corresponding static elimination conditions, that is, data indicating a charge release angle θ and a charge release amount Q are associated with each other. The static elimination conditions include each condition when the substrate P is the static elimination target and when the component is the static elimination target.

In this example, static elimination conditions are set for the case where the voltage E range is 0 V or more and less than 100 V, 100 V or more and less than 200 V, and 200 V or more and less than 300 V, respectively. The charge emission amount Q of 100 V or more is the voltage. The value is set so that the higher the value is, the larger the value is, and the value is set so that the value of the substrate P is larger than that of the component. On the other hand, the charge release angle θ is set to the same value regardless of the voltage E, and when the static elimination target is the substrate P, the charge of the static elimination device 20 is shown by the broken line arrow of the circled number 2 in FIG. The value is set so that the discharge port 21a points to the substrate P at the mounting work position Wp, and when the static elimination target is a component, as shown by the broken line arrow of the circled number 1 in FIG. The value is set so that the charge discharge port 21a points toward the component outlet 7a of the tape feeder 7. In this static elimination control table, when the voltage E range is 0V or more and less than 100V, data indicating that the static elimination process is not executed is associated with the data indicating the charge release angle θ and the charge release amount Q. Has been done.

[Static elimination processing control]
FIG. 11 is a flowchart showing an example of static elimination processing control by the main control unit 42 of the third embodiment. This static elimination processing is executed at the timing when the substrate P is conveyed to and positioned at the mounting work position Wp by the substrate conveying mechanism 4.

First, the main control unit 42 refers to the component data stored in the storage unit 43, and among the components requiring static elimination processing, the component having the closest (earliest) mounting order and its mounting point are set as the target component and the target mounting point. (Each of them corresponds to the static elimination object of the present invention), and the voltage of the target component and the target mounting point is measured by the surface potential meter 50 (step S21). Specifically, the main control unit 42 controls the head unit 8 via the head unit drive control unit 44, so that the surface electrometer 50 is placed on the component outlet 7a of the tape feeder 7 that supplies the target component. The surface electrometer 50 is arranged above the target mounting point on the substrate P to measure the voltage of the target component, and the voltage at the target point is measured.

Next, the main control unit 42 determines whether the voltage at the target mounting point is equal to or higher than the voltage of the target component based on the measurement result (step S23). Here, in the case of Yes, the main control unit 42 refers to the static elimination control table stored in the storage unit 43, and whether or not to execute the static elimination processing of the substrate P, specifically, the voltage of the target mounting point. It is determined whether or not is 100 V or more (step S25). When the voltage is 100 V or higher, the main control unit 42 executes the static elimination process according to the static elimination conditions corresponding to the voltage value (step S27). Specifically, the main control unit 42 charges the charge at the charge release angle θ (θ = 20 °) determined in the static elimination control table, that is, toward the substrate P at the mounting work position Wp. The angle of the static eliminator 20 is controlled so that the electric charge is discharged. Further, the air supply system 26 is controlled so that the charge emission amount Q becomes a value corresponding to the measurement result (voltage value) of the target mounting point. Specifically, the main control unit 42 has a charge emission amount Q of 30 L / min when the voltage value of the target mounting point is 100 V or more and less than 200 V, and a charge emission amount when the voltage value is 200 V or more and less than 300 V. The flow rate control valve 34 is controlled so that Q becomes 40 L / min.

When the static elimination process is executed, the main control unit 42 turns on the timer and waits for the set time T1 to be timed (steps S29 and S31). When the set time T1 is timed, the surface electrometer together with the head unit 8 50 is moved, the voltage of the target mounting point measured in step S21 is remeasured, and the process shifts to step S25. Although not explicitly shown in the flowchart of FIG. 11, the main control unit 42 mounts other parts that do not require static elimination processing until the timer is turned on in step S29 and the set time T1 is clocked. Execute the process.

On the other hand, when it is determined as No in step S23, that is, when the voltage at the target mounting point is less than the voltage of the target component, and when it is determined as No in step S25, that is, the voltage at the target mounting point is less than 100V. In that case, the main control unit 42 shifts the process to step S35.

In step S35, the main control unit 42 refers to the static elimination control table stored in the storage unit 43, and whether or not to execute the mounting process of the target component, specifically, the voltage of the target component is 100 V or more. Judge whether or not. When the voltage is 100 V or higher, the main control unit 42 executes the static elimination process according to the static elimination conditions corresponding to the voltage value (step S37). Specifically, the main control unit 42 discharges the electric charge at the charge discharge angle θ (θ = 0 °) specified in the static elimination control table, that is, toward the component outlet 7a of the tape feeder 7. The angle of the static eliminator 20 is controlled so that the electric charge is discharged. Further, the air supply system 26 is controlled so that the charge emission amount Q becomes a value corresponding to the measurement result (voltage value) of the target component. Specifically, the main control unit 42 has a charge emission amount Q of 20 L / min when the voltage value of the target component is 100 V or more and less than 200 V, and a charge emission amount Q when the voltage value is 200 V or more and less than 300 V. The flow rate control valve 34 is controlled so that the voltage becomes 30 L / min.

When the static elimination process is executed, the main control unit 42 turns on the timer and waits for the set time T2 to be timed (steps S39 and S41). When the set time T2 is timed, the surface electrometer together with the head unit 8 50 is moved, the voltage of the target component measured in step S21 is remeasured, and the process shifts to step S35. Until the timer is turned on in step S39 and the set time T2 is timed, the main control unit 42 executes the component mounting process of other components that do not require the static elimination process.

When No is determined in step S35, that is, when the voltage of the target component is less than 100 V, the main control unit 42 is the target mounting point whose voltage has been measured and has not undergone the process of step S25. It is determined whether or not there is (step S45), and if Yes, the process proceeds to step S25. On the other hand, in the case of No, the main control unit 42 refers to the component data stored in the storage unit 43, and determines whether or not there are unmounted components that require static elimination processing (step S47). Then, in the case of Yes, the process proceeds to step S21, and in the case of No, it waits for all the parts to be mounted on the substrate P (step S49), and when the mounting of all the parts is completed (step). Yes) in S49), this flowchart ends.

The contents of the above static elimination control will be roughly explained as follows.

The main control unit 42 extracts the parts and their mounting points registered in the part data as requiring static elimination processing as the target parts and the target mounting points, and actually uses the surface electrometer 50 to extract these voltages (charges). Measure and compare the measurement results. Then, it is determined whether or not static elimination processing is necessary (whether or not the voltage value is 100 V or more) preferentially from the target component and the target mounting point, whichever has the larger measured voltage value, and if necessary, static elimination is performed. Execute the process. When the static elimination process is executed, the main control unit 42 executes remeasurement by the surface electrometer 50 until the voltage values of the target component and the target mounting point drop to a level (less than 100 V) that does not require the static elimination process. Repeat the static elimination process.

[Action effect, etc.]
According to the component mounting device 1 of the third embodiment described above, data indicating whether or not it is necessary to perform static electricity elimination processing on the component and the mounting point on which the component is mounted is incorporated in the component data. The voltage of the component and the mounting point is actually measured by the surface potential meter 50, and static electricity is removed only when the component and its mounting point are actually charged with static electricity (when the measured voltage is 100 V or more). The process is executed. In other words, if it is not charged with static electricity, or if it is charged but does not require static electricity removal treatment, the static electricity removal treatment is not executed. Therefore, as compared with the conventional component mounting device (component mounting device described in Patent Document 1) in which static electricity elimination processing is always executed during the mounting work, the substrate P (mounting point) and the component can be efficiently mounted without waste. It is possible to remove static electricity. In that case, the measured voltage at the mounting point is compared with the measured voltage of the component, and the static electricity elimination process is preferentially executed from the one with the higher voltage, so that static electricity can be rationally removed.

Moreover, according to the component mounting device 1, when the static elimination process is executed for the component or the mounting point, the remeasurement by the surface electrometer 50 is executed, and the voltage value of the component or the mounting point does not require static elimination. The static elimination process is repeatedly executed until the level drops to less than 100V. Therefore, it is possible to reliably remove static electricity from parts and mounting points to less than a certain level, and therefore, there is an advantage that the occurrence of troubles caused by static electricity can be suppressed to a higher degree.

[Modification example, etc.]
The component mounting device described above is an example of a preferred embodiment of the component mounting device according to the present invention, and the specific configuration thereof can be appropriately changed without departing from the gist of the present invention. For example, the following configuration is also applicable.

(1) The values of the charge release angle θ and the charge release amount Q described in the above embodiment are examples, and the specific values of the charge release angle θ and the charge release amount Q are the configuration and arrangement of the static elimination device 20. It is changed as appropriate according to the above.

(2) In the above embodiment, the tape feeder 7 is provided in the component supply unit 6, but a tray feeder may be provided instead of the tape feeder 7. The tray feeder supplies the package parts in a state of being aligned and arranged on the tray. In the static elimination process of the component in this case, the charge release angle θ of the static elimination unit 14 may be set so that the charge is discharged toward the component removal position on the tray by the head 9.

(3) In the above embodiment, the discharge direction switching device 22 changes the direction (angle) of the static elimination device 20, but for example, the discharge direction switching device 22 is in front of the charge discharge port 21a of the electrode casing 21. A flap that can swing in the vertical direction and a motor that drives the flap may be provided, and the charge release angle θ may be switched by driving the flap. According to this configuration, it is not necessary to change the direction of the entire static elimination device 20, so that the charge release angle θ can be switched with less driving force.

(4) In the above embodiment, the discharge direction switching device 22 changes the charge release angle θ in the vertical direction, but may be configured to further change the charge release angle θ in the left-right direction. For example, the discharge direction switching device 22 further includes a flap that can swing in the left-right direction arranged in front of the charge discharge port 21a of the electrode casing 21, and a motor that drives the flap, and the charge is generated by driving the flap. The discharge direction may be switched to the left or right. According to this configuration, the degree of freedom in the direction of charge emission is increased.

(5) In the above embodiment, the charge release amount Q is switched only by adjusting the flow rate of air by the air supply system 26 (control of the flow rate control valve 34), but only by controlling the power supply system or electric power. It may be performed in combination with the control of the supply system. Specifically, the applied current value to the discharge needle of the static eliminator 20 is changed while the air flow rate is kept constant, or the applied current value to the discharge needle is changed while changing the air flow rate. May be good.

(6) In the above embodiment, the static elimination unit 14 is a corona discharge type static elimination unit that generates positive and negative charges (air ions) by ionizing air using a high voltage. For example, soft X-rays. It may be another type of static elimination unit such as the type of static elimination unit.

(7) In the above embodiment, the discharge direction switching device 22 is configured to switch the direction of the static eliminator 20 using the motor 24 as a drive source, but the static eliminator 20 is operated by an actuator other than the motor, such as an air cylinder or an electromagnetic solenoid. It may be configured to switch the direction. Further, in addition to the configuration in which the orientation of the static elimination device 20 is switched by using the motor 24 or the like, a configuration in which the orientation of the static elimination device 20 is manually switched may be used. For example, the direction of the static eliminator 20 may be manually switched, and the direction of the static eliminator 20 may be fixed by bolt fastening, a clamp device, or the like.

(8) In the above embodiment (third embodiment), the surface electrometer 50 is mounted on the head unit 8, but may be movably provided separately from the head unit 8. Further, the surface electrometer 50 may be fixedly provided at a specific place.

The present invention described above can be summarized as follows.

The component mounting device of the present invention includes a board transfer mechanism that carries a board to a mounting work position, a component supply unit that supplies components for mounting, and a component supply unit that takes out components and mounts them on the board at the mounting work position. It includes a head unit and a static eliminator unit that removes static electricity in a non-contact manner by discharging electric charges. It is equipped with.

According to this configuration, the degree of freedom in the charge discharge direction by the static elimination unit is increased. Therefore, it is possible to efficiently and effectively remove static electricity by intensively discharging electric charges to those that are easily charged with static electricity, depending on the substrate, parts, and the like.

In this case, it is preferable that the discharge direction switching device changes the direction of the static elimination device.

According to this configuration, it is possible to switch the charge emission direction with a relatively simple configuration at low cost.

In the above component mounting device, a storage unit that stores table data in which a control device that controls the emission direction switching device and data indicating the operating state of the component mounting device and data indicating the charge emission direction are associated with each other is stored. It is preferable that the control device controls the discharge direction switching device based on the operating state and the table data in order to discharge the charge in the direction corresponding to the current operating state. is there.

According to this configuration, it is possible to proceed with the component mounting work while automatically switching the charge discharge direction of the static eliminator toward the optimum location according to the operating state of the component mounting device.

More specifically, it further includes a board detection sensor that detects the board at the mounting work position, and the table data includes data indicating a state in which the board is at the mounting work position and charges toward the board at the mounting work position. It is possible to discharge the charge toward the component supply unit with the first data in which the data indicating the charge release direction capable of discharging the data is associated with the data indicating the state in which the substrate is not present at the mounting work position. The control device determines the presence or absence of a substrate at the mounting work position based on the output signal from the substrate detection sensor, including the second data associated with the data indicating the charge discharge direction, and the first data. Alternatively, the emission direction switching device is controlled based on the second data.

According to this configuration, when the board is in the mounting work position, the electric charge is discharged from the static eliminator toward the board, and when the board is not in the mounting work position, the charge is discharged from the static eliminator to the component of the component supply unit. Charges are released toward. Therefore, it is possible to effectively use the electric charge emitted from the static eliminator to eliminate static electricity on the substrate and parts.

In the above-mentioned component mounting device, a measurement for measuring the charge amount of a plurality of static elimination objects including at least a control device for controlling the emission direction switching device, a substrate at the mounting work position, and a component of the component supply unit. The control device further includes a device, and the control device selects a static elimination candidate that requires static elimination based on the measurement result of each static elimination target by the measuring device, and discharges the charge toward the static elimination candidate. It may be the one that controls.

According to this configuration, it is possible to efficiently discharge static electricity only to the substrates, parts, etc. that are charged to a level that actually requires static electricity removal (static electricity). Can be removed.

In this case, the control device executes a static elimination process of discharging electric charges toward the static elimination candidate and a process of re-measuring the charge amount of the static elimination candidate after the static elimination process, and the charge amount at the time of remeasurement is increased. If it is equal to or more than the threshold value, it is preferable that the static elimination process of the static elimination candidate is executed again.

According to this configuration, it is possible to more reliably remove the static electricity charged on the static electricity elimination object.

In the above-mentioned component mounting device, it is preferable that the static elimination unit further includes a discharge amount switching device capable of switching the charge emission amount by the static elimination device.

According to this configuration, the degree of freedom is increased not only in the charge discharge direction in the static elimination unit but also in the charge discharge amount. Therefore, it is possible to efficiently and effectively remove static electricity by intensively releasing more electric charge to an object that is easily charged with static electricity, depending on the substrate, parts, and the like.

In this case, the release direction switching device and the control device for controlling the release amount switching device, and the storage unit in which the table data in which the data indicating the charge release direction and the data indicating the charge release amount are associated with each other are further stored. It is preferable that the control device controls the emission direction switching device and the emission amount switching device based on the table data.

According to this configuration, it is possible to automatically switch between the charge discharge direction and the charge discharge amount in conjunction with each other, so that it is possible to proceed with the mounting work of the component while effectively removing static electricity.

In this case, the storage unit stores, as the table data, table data in which data indicating the operating state of the component mounting device, data indicating the charge release direction, and data indicating the charge release amount are associated with each other. The control device has the emission direction switching device and the emission amount switching device based on the operating state and the table data in order to discharge an amount of charge corresponding to the operating state in the direction corresponding to the current operating state. It may be the one that controls.

According to this configuration, it is possible to proceed with the component mounting work while automatically discharging the charge from the static elimination unit at the optimum charge release angle and the optimum charge release amount suitable for the operating condition of the component mounting device. ..

More specifically, it further includes a board detection sensor that detects the board at the mounting work position, and the table data includes data indicating a situation where the board is at the mounting work position and charges toward the board at the mounting work position. The first data in which the data indicating the charge release direction capable of discharging the data and the data indicating the charge release amount are associated with each other, the data indicating the situation where the substrate is not present at the mounting work position, and the data indicating the component supply unit The control device includes the second data in which the data indicating the charge release direction capable of discharging the charge and the data indicating the charge release amount are associated with each other, and the control device is mounted based on the output signal from the board detection sensor. The presence or absence of the substrate at the working position is determined, and the emission direction switching device and the emission amount switching device are controlled based on the first data or the second data.

According to this configuration, when the board is in the mounting work position, the electric charge is discharged from the static eliminator toward the board, and when the board is not in the mounting work position, the charge is discharged from the static eliminator to the component of the component supply unit. Charges are released toward. Therefore, it is possible to effectively use the electric charge emitted from the static eliminator to eliminate static electricity on the substrate and parts.

In this case, if the component supply unit is provided on the side of the mounting work position and the static elimination device is arranged at the position above the component supply unit, the charge release amount in the first data is the second. It is preferable that the value is smaller than the charge emission amount in the data.

According to this configuration, it is possible to supply an amount of electric charge comparable to that of the substrate or the component. Therefore, it is possible to appropriately remove static electricity from the substrate and parts.

In the above-mentioned component mounting device, a plurality of static elimination objects including at least the release direction switching device, the control device for controlling the emission amount switching device, the substrate at the mounting work position, and the components of the component supply unit. Further provided with a measuring device for measuring the amount of charge, the control device selects a static elimination candidate that requires static elimination based on the measurement result of each static elimination target by the measuring instrument, and discharges the charge toward the static elimination candidate. to said discharge direction switching device and the may be the controls the volume switching device release.

According to this configuration, it is possible to efficiently discharge static electricity only to the substrates, parts, etc. that are charged to a level that actually requires static electricity removal (static electricity). Can be removed.

In this case, the control device executes a static elimination process of discharging electric charges toward the static elimination candidate and a process of re-measuring the charge amount of the static elimination candidate after the static elimination process, and the charge amount at the time of remeasurement is increased. If it is equal to or more than the threshold value, it is preferable that the static elimination process of the static elimination candidate is executed again.

According to this configuration, it is possible to more reliably remove the static electricity charged on the static electricity elimination object.

[Explanation of symbols]
1 Parts mounting device 4 Board transfer mechanism 5 Board detection sensor 6 Parts supply unit 8 Head unit 14 Static elimination unit 20 Static elimination device 22 Discharge direction switching device 26 Air supply system (discharge amount switching device)
40 Control unit 42 Main control unit (control device)
43 Storage unit 44 Head unit drive control unit 46 Static elimination unit drive control unit (control device)
50 Surface electrometer (measuring instrument)
P board WP mounting work position

Claims (16)

A board transfer mechanism that carries the board to the mounting work position,
A component supply unit that supplies components for mounting,
A head unit that takes out parts from the parts supply unit and mounts them on the board at the mounting work position.
It is equipped with a static eliminator unit that removes static electricity in a non-contact manner by releasing electric charges.
The charge-eliminating unit, a charge removing device that emits a charge, e Bei the emission direction switching device for switching the charge discharge direction by the neutralization apparatus in the vertical direction,
The discharge direction switching device can switch the charge discharge direction within a range including a direction in which the charge is discharged toward the component outlet of the component supply unit and a direction in which the charge is discharged toward the mounting work position. in a component mounting apparatus characterized by. In the component mounting apparatus according to claim 1,
The component mounting device is characterized in that the discharge direction switching device changes the direction of the static elimination device. In the component mounting apparatus according to claim 1 or 2.
A control device that controls the emission direction switching device and
Further, a storage unit for storing table data in which data indicating the operating state of the component mounting device and data indicating the charge discharge direction are associated with each other is provided.
The control device is a component mounting device that controls the discharge direction switching device based on the operating state and the table data in order to discharge charges in a direction corresponding to the current operating state. In the component mounting apparatus according to claim 3,
Further equipped with a board detection sensor for detecting the board at the mounting work position,
The table data is a first data in which data indicating a state in which the substrate is present at the mounting work position and data indicating a charge discharge direction capable of discharging charges toward the substrate at the mounting work position are associated with each other. , The second data in which the data indicating the state where the substrate is not present at the mounting work position and the data indicating the charge discharge direction capable of discharging the charge toward the component supply unit are associated with each other.
The control device is characterized in that it determines the presence or absence of a board at the mounting work position based on an output signal from the board detection sensor, and controls the emission direction switching device based on the first data or the second data. Component mounting device. In the component mounting apparatus according to claim 1 or 2.
A control device that controls the emission direction switching device and
Further provided with a substrate at the mounting work position and a measuring instrument for measuring the charge amount of a plurality of static elimination objects including at least the components of the component supply unit.
The control device selects a static elimination candidate that requires static elimination based on the measurement result of each static elimination target by the measuring device, and controls the emission direction switching device so as to discharge an electric charge toward the static elimination candidate. A featured component mounting device. In the component mounting apparatus according to claim 5,
The control device executes a static elimination process of discharging charges toward the static elimination candidate and a process of re-measuring the charge amount of the static elimination candidate after the static elimination process, and the charge amount at the time of remeasurement is equal to or higher than the threshold value. In this case, the component mounting device is characterized in that the static elimination process of the static elimination candidate is executed again. In the component mounting apparatus according to claim 1 or 2.
The static elimination unit is a component mounting device further including a discharge amount switching device capable of switching the charge discharge amount by the static elimination device. In the component mounting apparatus according to claim 7,
A control device that controls the emission direction switching device and the emission amount switching device,
It further includes a storage unit in which table data in which data indicating the charge release direction and data indicating the charge release amount are associated with each other is stored.
The control device is a component mounting device that controls the release direction switching device and the release amount switching device based on the table data. In the component mounting apparatus according to claim 8,
The storage unit stores, as the table data, table data in which data indicating the operating state of the component mounting device, data indicating the charge release direction, and data indicating the charge release amount are associated with each other.
The control device is a release direction switching device and a discharge amount switching device based on the operating state and the table data in order to discharge an amount of electric charge corresponding to the operating state in a direction corresponding to the current operating state. A component mounting device characterized by controlling. In the component mounting apparatus according to claim 9,
Further equipped with a board detection sensor for detecting the board at the mounting work position,
The table data includes data indicating the situation where the substrate is at the mounting work position, data indicating the charge release direction capable of discharging the charge toward the substrate at the mounting work position, and data indicating the charge release amount. The associated first data, data indicating the situation where the substrate is not present at the mounting work position, data indicating the charge release direction capable of discharging the charge toward the component supply unit, and data indicating the charge release amount. Including the second data associated with
The control device determines the presence or absence of a board at the mounting work position based on an output signal from the board detection sensor, and uses the first data or the second data to switch the emission direction switching device and the emission amount switching device. A component mounting device characterized by being controlled. In the component mounting apparatus according to claim 10,
A component supply unit is provided on the side of the mounting work position, and the static elimination device is arranged at a position above the component supply unit.
A component mounting device characterized in that the charge release amount in the first data is a value smaller than the charge release amount in the second data. In the component mounting apparatus according to claim 7,
A control device that controls the emission direction switching device and the emission amount switching device,
Further provided with a substrate at the mounting work position and a measuring instrument for measuring the charge amount of a plurality of static elimination objects including at least the components of the component supply unit.
The control device, the selected static elimination candidate required static elimination on the basis of the measurement result of the neutralization target object by the measuring instrument, the emission direction switching device and the discharge volume switch in order to release the charge toward the charge removal candidate A component mounting device characterized by controlling the device. In the component mounting apparatus according to claim 12,
The control device executes a static elimination process of discharging charges toward the static elimination candidate and a process of re-measuring the charge amount of the static elimination candidate after the static elimination process, and the charge amount at the time of remeasurement is equal to or higher than the threshold value. In this case, the component mounting device is characterized in that the static elimination process of the static elimination candidate is executed again. In the component mounting device according to any one of claims 1 to 13.
The component mounting device is characterized in that the static elimination device extends from one end to the other end of the component supply unit along the substrate transfer direction by the substrate transfer mechanism. In the component mounting apparatus according to claim 14,
A plurality of tape feeders, each having a component outlet, are arranged in the component supply section along the transfer direction of the substrate.
The static eliminator is a component mounting device capable of discharging an electric charge toward a component at a component outlet of each tape feeder. In the component mounting apparatus according to claim 14 or 15.
The static eliminator has an electrode casing extending from one end to the other end of the component supply unit and having charge discharge ports for discharging charges at a plurality of positions in the longitudinal direction thereof. A featured component mounting device.

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