JP2005012001A - Surface-mounting apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface-mounting apparatus wherein a rational structure is provided for eliminating charges at a plurality of spots and the tact time is shortened while charge elimination is accomplished. <P>SOLUTION: The surface-mounting apparatus has a movable head unit 5 provided with a suction nozzle 20a for sucking parts, and is so designed that the head unit 5 sucks a part out of a part supply section 4 and mounts the part on a printed circuit board 3 at the mounting work position. The head unit 5 has a charge eliminator comprising an ionized gas generator 36 and a discharging member 37 (sprayer) for spraying the ionized gas generated in the ionized gas generator 36. The rational design for the head unit 5 to move and spray the ionized gas on a given spot enables charge elimination at a plurality of spots. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface mounter that adsorbs an electronic component such as an IC from a component supply unit by a movable head unit having a component mounting head, and transfers the electronic component onto a substrate such as a printed circuit board for mounting. It is about.
[0002]
[Prior art]
Conventionally, a surface mounting machine (hereinafter abbreviated as a mounting machine) that takes out an electronic component such as an IC (hereinafter abbreviated as a part) from a component supply unit and mounts it at a predetermined position on a printed circuit board by a movable head unit is generally used As is known, for example, a component feeder equipped with a tape feeder has recently been proposed with a static eliminator (see Patent Document 1).
[0003]
That is, in a tape feeder that supplies parts while feeding the tape using the tape as a carrier, it is possible to take out the stored parts by peeling off the cover tape as is well known. The vicinity of the feeder part outlet of the feeder is charged (static electricity is generated), and this static electricity prevents accurate removal of the part or causes damage to the part. Therefore, in the apparatus disclosed in Patent Document 1, a static eliminator capable of spraying ionized air (referred to as ionized gas) is installed in the vicinity of the tape feeder, and at an appropriate timing, in the vicinity of the component outlet of the tape feeder. Electric charges are neutralized electronically by blowing ionized gas to neutralize the charge.
[0004]
In addition to this, Patent Document 2 proposes a mounting machine including a static elimination device having an ionized gas ejection port between a component supply unit and a mounting work position. In this apparatus, after adsorbing the components, before the mounting, the adsorbing components are arranged in the vicinity of the ejection port and ionized gas is blown to discharge the adsorbing components.
[0005]
[Patent Document 1]
JP 2001-36287 A
[Patent Document 2]
JP 2001-352196 A
[0006]
[Problems to be solved by the invention]
By the way, the problem of charging in the mounting machine is not necessarily limited to the component supply unit such as a tape feeder. For example, the mounting board itself may be damaged due to charging. For this reason, it is conceivable to provide a static eliminator at all the places where the influence of charging is considered, but in this case, there is an adverse effect of increasing the size and cost of the mounting machine by providing the static eliminator individually at a plurality of locations. is there. In addition, since the frequency with which static elimination is required varies from place to place, it is not always reasonable to provide a static elimination device uniformly.
[0007]
On the other hand, a head unit that is constantly moving for component adsorption and mounting is easily charged by air friction. For example, static electricity is generated in the adsorption nozzle and is discharged when the component is adsorbed. It is conceivable that a mounting error (so-called take-out of parts) is induced by electric power. In this regard, according to the apparatus disclosed in Patent Document 2, it is possible to eliminate the above-described problem by performing static elimination by blowing ionized gas to an adsorption nozzle or the like before and after component adsorption. . However, the apparatus of Patent Document 2 is disadvantageous in reducing the tact time because it is necessary to always arrange an adsorption nozzle or the like at a specific location (jet port) in order to perform static elimination.
[0008]
The present invention has been made in order to solve the above problems, and in a surface mounter equipped with a static eliminator, it is possible to perform static elimination at a plurality of locations with a rational configuration, while performing static elimination while reducing tact time. The purpose is to shorten.
[0009]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention has a movable head unit having a suction nozzle for picking up a component, and the head unit sucks the component from the component supply unit and mounts it on the substrate at the mounting work position. In a surface mount machine configured to perform the above, a discharger having an ionized gas ejection part, and neutralizing the charge electronically by spraying the ionized gas onto a charged part, and identifying the ejection part And a movable member that is movably supported at an arbitrary location within the region.
[0010]
According to this configuration, it is possible to discharge the ionized gas by spraying the ionized gas to an arbitrary location (charging location) by moving the ejection portion as the movable member moves. Therefore, it is possible to perform neutralization at a plurality of locations with a common neutralization device.
[0011]
In this configuration, the movable member may be a dedicated member for moving the ejection part, but the head unit is also used as a movable member by providing the ejection part in the head unit. ,preferable.
[0012]
According to this configuration, it is possible to move the ejection part with a rational configuration using an existing mechanism. As a result, there is an advantage that an increase in the size and cost of the mounting machine can be suppressed.
[0013]
The ejection part may be provided so that the ionized gas can be well sprayed to a desired place. For example, the ejection part may be provided as a charged part so that the ionized gas can be sprayed to the adsorption nozzle. For example, since the ionized gas can be blown to the suction nozzle or the component sucked by the head unit during the movement of the head unit, it is possible to efficiently neutralize the suction nozzle and the suction component.
[0014]
In addition to this, for example, in the state where the head unit is arranged in the component supply unit for component adsorption, an injection unit is provided so that ionized gas can be sprayed to the vicinity including the component adsorption position by the adsorption nozzle be able to. According to this configuration, it is possible to satisfactorily prevent component adsorption mistakes due to the influence of static electricity. In addition, it is possible to provide an injection unit so that ionized gas can be sprayed onto the substrate in a state where the head unit is disposed on the substrate at the mounting operation position. According to this configuration, it is possible to prevent circuit breakdown or the like accompanying electrostatic discharge.
[0015]
In this configuration, it is more preferable that a plurality of regions for injecting ionized gas are provided in the injection unit and switching means for switching the region for injecting ionized gas is provided.
[0016]
According to this configuration, it is possible to spray an appropriate amount of ionized gas according to the location by selectively switching the ionized gas injection region as necessary, thereby preventing unnecessary consumption of ionized gas and improving efficiency. It is possible to perform static elimination well.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described with reference to the drawings.
[0018]
1 and 2 schematically show a surface mounter according to the present invention. In the figure, the X axis, the Y axis, and the Z axis are shown to clarify the direction.
[0019]
As shown in the figure, on a base 1 of a surface mounter (hereinafter abbreviated as a mounter), a conveyer 2 for conveying a printed circuit board is arranged in the X-axis direction, and the printed circuit board 3 is placed on the conveyor 2. It is transported and stopped at a predetermined mounting work position.
[0020]
A component supply unit 4 is disposed on the side of the conveyor 2. The component supply unit 4 is provided with a component supply feeder. For example, a plurality of tape feeders 4a are installed in parallel in the X-axis direction.
[0021]
Each tape feeder 4a accommodates small pieces of IC, transistors, capacitors, etc. at predetermined intervals, leads out the held tape from the reel, and intermittently removes the tape as the head unit 5 removes the parts. It is configured to pay out automatically. The configuration of the tape feeder 4a will be supplemented later.
[0022]
Above the base 1, a head unit 5 for mounting components is further provided. The head unit 5 is movable over the component supply unit 4 and the mounting work position where the printed circuit board 3 is located, and can move in the X-axis direction and the Y-axis direction.
[0023]
That is, on the base 1, a pair of fixed rails 7 extending in the Y-axis direction and a ball screw shaft 8 provided in parallel to the Y-axis servo motor 9 and driven to rotate are disposed. A head unit support member 11 is disposed on the rail 7, and the ball screw shaft 8 is screwed into a nut portion 12 provided on the support member 11. The support member 11 is provided with a guide member 13 extending in the X-axis direction and a ball screw shaft 14 provided in parallel with the guide member 13 and driven by an X-axis servo motor 15. The head unit 5 is movably held, and the ball screw shaft 14 is screwed into a nut portion 16 (see FIG. 4) provided in the head unit 5. The support member 11 is moved in the Y-axis direction by the operation of the Y-axis servo motor 9, while the head unit 5 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15. The head unit 5 can be moved to an arbitrary position in the XY axis direction.
[0024]
As shown in FIG. 2, the head unit 5 is provided with a shaft-shaped mounting head 20 provided with a component suction nozzle (referred to as a suction nozzle 20a) at the tip. Six mounting heads 20 are provided side by side in the direction.
[0025]
Each mounting head 20 can be moved up and down (moving in the Z-axis direction) and rotated around the nozzle center axis (around the R axis) with respect to the frame of the head unit 5 and driven by a servo motor. It has become.
[0026]
More specifically, as shown in FIGS. 3 and 4, each mounting head 20 is supported by a support member 25 provided on the frame 24 of the head unit 5 in a state that allows rotation and elevation around the R axis. ing. The frame 24 further includes a guide member 26 extending in the vertical direction corresponding to each of the mounting heads 20, a ball screw shaft 29 provided in parallel thereto and driven by a Z-axis servomotor 28, A connecting member 27 that is movably attached to the guide member 26 is provided. The connecting member 27 is connected to the upper end of the mounting head 20, and the ball screw shaft 29 is screwed into the nut member 28 incorporated in the connecting member 27. With this configuration, when the ball screw shaft 29 is driven by the Z-axis servomotor 28, the connecting member 27 moves along the guide member 26, and the mounting head 20 moves up and down with respect to the frame 24 along with this movement. It is configured as follows.
[0027]
The frame 24 is provided with a pair of drive pulleys 32 that are respectively driven to rotate by R-axis servomotors 30a and 30b, and pulleys 34 are attached to the mounting heads 20, respectively. A transmission belt 33 is stretched over the transmission pulley 34. More specifically, the transmission belt 33 is stretched across the drive pulley 32a on one side and the three pulleys 34 (three pulleys 34 on the left side in FIG. 3), and the remaining drive pulley 32b and the rest A transmission belt 33 is stretched around the three pulleys 34 in a staggered manner. With this configuration, when the R-axis servomotors 30a and 30b are operated, the three mounting heads 20 are rotated together.
[0028]
Each pulley 34 is rotatably supported on the lower end portion of the support member 25 of the frame 24, and the relative movement in the axial direction of the mounting head 20 is possible, and relative rotation around the R axis is prevented. Each of them is spline-coupled to the mounting head 20 so that it can rotate integrally around the R axis. As a result, the mounting head 20 is supported by the support member 25 so as to be movable up and down, and can be rotated by the operation of the R-axis servomotors 30a and 30b.
[0029]
The head unit 5 is further equipped with a static eliminator. The static eliminator performs static elimination by blowing ionized air (ionized gas) onto a preset location and electronically neutralizing the charge accumulated in the location, and an ionized gas generator 36, It has the discharge | release member 37 (injection part) which discharge | releases (injects) the ionized gas produced | generated toward the object location here.
[0030]
The ionized gas generator 36 is a conventionally known apparatus called by the name of an ionizer, for example, and generates an ionized gas by applying a high voltage. In the present embodiment, four ionized gas generators 36 are provided, and the generated ionized gas is introduced into the after-mentioned gas passages 40 a to 40 d of the discharge member 37 through the supply pipe 43.
[0031]
The discharge member 37 is a plate-like member and is horizontally assembled to the lower end portion of the head unit 5, specifically, the lower end portion of the frame 24 as shown in FIGS. 3 and 4. As shown in FIG. 5, the discharge member 37 is formed with through holes 38 penetrating in the vertical direction, and the mounting head 20 is inserted through these through holes 38.
[0032]
A plurality of injection ports 42 are formed on the lower surface of the discharge member 37, and ionized gas is injected downward from these injection ports 42.
[0033]
More specifically, inside the discharge member 37, four parallel gas passages 40a to 40d (referred to as first to fourth gas passages 40a to 40d as necessary) extending in the X-axis direction are provided. The injection port 42 is provided along the gas passages 40a to 40d and communicates with the nearest gas passages 40a to 40d. The gas passages 40a to 40d are respectively connected to the ionized gas generator 36 via the supply pipe 43 and the electromagnetic valve 36a (switching means), so that the ionized gas generated by the ionized gas generator 36 is Each is injected from each injection port 42 while being introduced into the gas passages 40a to 40d.
[0034]
In addition, the ejection area | region of the ionization gas in the discharge | emission member 37 is divided into four area | regions corresponding to the gas passages 40a-40d. Specifically, the first and fourth regions S1 and S4 of the outermost part (Y-axis direction outer side) of the discharge member 37 and the second and second parts of the inner side (both sides of the mounting head 20). When the ionized gas is introduced into the first and fourth gas passages 40a and 40d, the ionized gas is injected from the first region S1 and the fourth region S4, respectively. When ionized gas is introduced into the second and third gas passages 40b and 40c, ionized gas is injected from the second region S2 and the third region S3, respectively.
[0035]
Each injection port 42 is provided so as to inject ionized gas from the lower surface of the discharge member 37 in a shower shape. Although not shown in detail, the mounting head 20 is set at the rising end position in the vicinity of the through hole 38 among the injection holes 42 in the second region S2 and the third region S3 (shown in FIG. 5). The injection port 42 is provided to face the adsorption nozzle 20a so that ionized gas can be sprayed onto the adsorption nozzle 20a and its adsorption component in the state).
[0036]
Next, the outline of the structure of the tape feeder 4a mounted in the said component supply part 4 is demonstrated. FIG. 6 is a perspective view showing the main part of the tape feeder 4a, specifically, the structure of the component take-out part 50.
[0037]
The tape feeder 4a is provided with a reel (not shown) around which a tape 60 containing a large number of components is wound at the rear end portion (the end opposite to the conveyor 2), and pulling out the tape 60 from the reel. The tape feeding mechanism 52 guides to the component take-out part 50 at the front end portion of the feeder, and the component is picked up by the mounting head 20 (suction nozzle 20a).
[0038]
As shown in the figure, a hood 55 that covers the upper part of the tape guide groove is provided in the component take-out unit 10, and the tape 60 guided from the reel to the component take-out unit 10 is located under the hood 55 along the tape guide groove. It is designed to move from side to side.
[0039]
As shown in FIG. 7, the tape 6 led out from the reel 5 includes a tape main body 62a and a cover tape 62b. The tape body 62a is formed with a large number of component storage portions 63 opened in the upper part at regular intervals in the longitudinal direction, the components C are stored in these component storage portions 63, and the component storage portion of the tape body 62a. A large number of engagement holes 64 (see FIG. 6) are formed at regular intervals on the side of 63. One surface of the cover tape 62b is an adhesive surface, and the cover tape 62b is bonded to the upper surface of the tape main body 6a via the adhesive surface so as to close each component storage portion 63 of the tape main body 62a from above.
[0040]
Then, the cover tape 62b is peeled off from the tape main body 62a in the component take-out portion 10 so that the component C can be taken out, and the component is sucked and taken out by the suction nozzle 20a. Yes. More specifically, an opening portion 56 for taking out components is formed in the central portion of the hood 55, and a slit 57 is formed on the rear side of the opening portion 56. The slit 57 forms a cover tape. 62b is folded and peeled off from the tape body 62a. Then, as the tape main body 62a is fed while the cover tape 62b is peeled off, the component storage portion 63 is opened upward by the opening 56 as shown in FIG. The part C is taken out by the nozzle 20a.
[0041]
As shown in FIG. 5, the tape feeding mechanism 52 is disposed below the component take-out unit 50, and is a sprocket (not shown) that engages with the engagement hole 64 of the tape 60 guided to the component take-out unit 50. ), A ratchet 53 connected to the sprocket, and the ratchet drive mechanism using an air cylinder as a drive source. When supplying the parts, the tape 60 is intermittently fed out by a certain amount by intermittently rotating the ratchet only in a certain direction by driving the air cylinder. The tape feeder 4a is provided with a tape take-up mechanism (not shown) linked to the tape feed mechanism 52, and the cover tape 62b peeled off from the tape 60 in the component take-out portion 50 is taken up by this take-up mechanism. It is wound by the mechanism.
[0042]
By the way, although not shown in the above-described mounting machine, a well-known CPU that executes logical operations, a ROM that stores various programs for controlling the CPU, and various data temporarily during operation of the apparatus. Control means comprising RAM for storing is provided, and the servo motors 9, 15, 28, 30a, 30b, the ionized gas generator 36 of the static eliminator, the electromagnetic valve 36a, etc. are all electrically connected to this control means. It is connected. In the mounting operation, the servo motor 9 and the like are comprehensively controlled by this control means, so that a series of component mounting operations are executed according to a program stored in advance.
[0043]
Hereinafter, an example of the mounting operation by the mounting machine based on the control of the control means will be described with reference to the flowchart of FIG.
[0044]
When the mounting operation is started, first, in step S1, the printed circuit board 3 is carried into the mounting machine along the conveyor 2 and positioned at the mounting work position.
[0045]
Then, after the head unit 5 is disposed above the printed circuit board 3, ionized gas is ejected from the discharge member 37, whereby the printed circuit board 3 is neutralized (step S2). As described above, by eliminating the charge of the printed circuit board 3, for example, it is possible to prevent the discharge of electric charges accumulated on the printed circuit board 3 during the mounting of the components, and to prevent the mounted components and circuits from being destroyed due to the occurrence of the discharge phenomenon. It becomes possible to prevent. In the charge removal process in step S2, for example, each electromagnetic valve 36a is driven and controlled so that ionized gas is ejected from all the regions S1 to S4 of the discharge member 37, so that the entire printed circuit board 3 can be quickly moved. And ionized gas will be sprayed reliably.
[0046]
When the charge removal processing of the printed circuit board 3 is completed, the head unit 5 then moves from the mounting work position toward the component supply unit 4 to pick up the mounted components, and during this time, the second region S2 and the second region S2 of the discharge member 37 are moved. The ionized gas is jetted from the three regions S3, and thereby the static electricity is removed from each adsorption nozzle 20a (steps S3 and S4). By performing the charge removal of the suction nozzle 20a in this way, it is possible to prevent the electric charge accumulated in the suction nozzle 20a from being discharged at the time of component suction, and to prevent the mounting components from being destroyed due to the discharge phenomenon. It becomes possible. In the processes of steps S3 and S4, the mounting heads 20 are driven and controlled so that all the suction nozzles 20a are set at the rising end position (position shown in FIG. 5). Thus, ionized gas is surely sprayed.
[0047]
When the head unit 5 reaches the component supply unit 4, specifically, as shown in FIG. 7, when the suction nozzle 20 a that should first suck the component reaches above the component extraction unit 50 of the tape feeder 4 a, the suction nozzle 20 a Prior to taking out the part C, the charge removing process of the part taking-out part 50 is executed (step S5). At this time, as the ionized gas is injected from all the regions S1 to S4 of the discharge member 37, as shown in FIG.
[0048]
That is, in the tape feeder 4a, static electricity is generated when the cover tape 62b is peeled off as described above, and the static electricity is accumulated in the vicinity of the opening portion 56. Generation | occurrence | production of the component adsorption | suction mistake etc. resulting from the static electricity collected in 56 will be prevented beforehand.
[0049]
Next, components are picked up from the tape 60 as the mounting head 20 moves up and down (step S6). When the component adsorption by one mounting head 20 is completed, the movement of the head unit 5, the charge removal process, and the component pick-up operation are repeated in the same manner as described above in order to adsorb the component by the other mounting head 20.
[0050]
When the suction of the components by all the mounting heads 20 is completed, the head unit 5 moves from the component supply unit 4 onto the printed circuit board 3 at the mounting work position in order to mount the components. The ionized gas is jetted from the second region S2 and the third region S3, whereby the parts adsorbed by the respective suction nozzles 20a are neutralized (steps S7 and S8). By performing static elimination of the suction component in this way, it is possible to prevent the electric charge accumulated in the component from being discharged during mounting, and to prevent destruction of the mounted component and the circuit on the board due to the discharge phenomenon. It becomes possible to do. At this time, similarly to step S3, each mounting nozzle 20a is driven and controlled so that all the suction nozzles 20a are set at the rising end position (position shown in FIG. 5). Thus, the ionized gas is surely sprayed onto the adsorbing part.
[0051]
When the head unit 5 reaches the printed circuit board 3, the respective suction components are sequentially arranged above the mounting target position, and are mounted at a predetermined position on the printed circuit board 3 as the mounting head 20 is moved up and down (step S9).
[0052]
Then, it is determined whether or not the mounting of all components to be mounted on the printed circuit board 3 is completed. If it is determined that the mounting is not completed, the process returns to step S3 and the processes of steps S3 to S9 are repeated. Done.
[0053]
On the other hand, when it is determined that mounting of all components is completed (YES in step S10), the process proceeds to step S11, and the mounting of components is completed by ejecting ionized gas from the discharge member 37. The neutralization process of the printed circuit board 3 is performed (step S11). As described above, by performing the charge removal process on the printed circuit board 3, it is possible to prevent the charge from being taken to the next process and to prevent troubles in the next process due to the charge. Also in this case, for example, each electromagnetic valve 36a is driven and controlled so that ionized gas is ejected from all the regions S1 to S4 of the discharge member 37, so that the entire printed board 3 can be quickly and reliably. The ionized gas will be sprayed on.
[0054]
When the neutralization process of the printed circuit board 3 is completed in this way, the printed circuit board 3 is carried out to the next process along the conveyor 2 (step S12), and thus this flowchart is completed.
[0055]
As described above, in this mounting machine, the head unit 5 is provided with the ionized gas discharge member 37 as described above, and the head unit 5 moves to move away from each other such as the tape feeder 4a and the printed circuit board 3. Since it is configured so that static elimination can be performed by a common static elimination device, it is reasonable compared to a conventional mounting machine of this type (Patent Document 1 of the prior art) in which a static elimination device is installed at each location where static elimination is required. Static electricity can be removed from each part with the configuration.
[0056]
In particular, since the ionized gas can be sprayed to any place as long as it is within the movable region of the head unit 5, the static elimination location is not limited in relation to the installation space of the static elimination device. In addition, all settings, changes, and additions of static elimination locations can be easily performed on the program. Therefore, for example, when a location where static elimination is necessary later occurs, it is possible to respond quickly. .
[0057]
In addition, the discharge member 37 is configured to be capable of spraying ionized gas to the respective suction nozzles 20a and the parts adsorbed by these suction nozzles 20a, and each suction nozzle 20a is moved during the movement of the head unit 5 as described above. In addition, since it is configured to be able to perform static elimination of the adsorbing component, it is extremely in comparison with the conventional device (Patent Document 2 of the prior art) that needs to transport the adsorbing component to a specific location and spray the ionized gas. It is possible to efficiently remove static electricity from components and the like. Therefore, there is also an advantage that the tact time can be shortened.
[0058]
Further, in the static eliminator, the ionization gas injection region in the discharge member 37 is composed of the first to fourth regions S1 to S4 so that the injection region can be selected according to the control of the electromagnetic valve 36a. Since it is comprised, there exists an advantage that the suitable quantity of ionized gas according to the place which removes static electricity, or its width can be sprayed. For example, in the embodiment, when static electricity is removed from the suction nozzle 20a or the suction component, ionized gas is jetted only from the regions (second region S2 and fourth region S4) on both sides of the mounting head 20. For this reason, a small amount of ionized gas can be effectively sprayed onto the adsorption nozzle 20a or the like for static elimination. On the other hand, when discharging the printed circuit board 3, ionized gas is sprayed from all the regions S1 to S4, so that the ionized gas is sprayed quickly and reliably over the entire printed circuit board 3. Can be removed.
[0059]
By the way, the mounting machine described above is an embodiment of the surface mounting machine according to the present invention, and the specific configuration thereof can be appropriately changed without departing from the gist of the present invention. For example, the following configuration modes can be adopted.
(1) In the embodiment, the static eliminator is mounted on the head unit 5. For example, a movable member is provided separately from the head unit 5, and the static eliminator is mounted on the movable member. You may comprise so that ionization gas can be sprayed to arbitrary places. However, according to the configuration in which the static eliminator is mounted on the head unit 5 as in the embodiment, the ionized gas can be sprayed to an arbitrary place with a rational configuration using an existing mechanism. There is an advantage that the size and cost of the machine can be suppressed.
(2) In the embodiment, the ionized gas generator 36 and the electromagnetic valve 36 a are mounted on the head unit 5. However, by installing the ionized gas generator 36 and the electromagnetic valve 36 a on the base 1, the weight of the head unit 5 can be reduced. You may make it plan.
(3) In the embodiment, first to fourth four regions S1 to S4 arranged in the Y-axis direction are provided as ionized gas blowing regions, and these regions S1 to S4 are controlled based on the control of the electromagnetic valve 36a. The ionized gas is selectively injected, but the specific location and area of the region or the specific selection of the region to which the ionized gas is injected are not limited to those in the embodiment, and can be selected as appropriate. is there. For example, six regions surrounding each through-hole 38 (that is, the mounting head 20) may be provided, and ionized gas may be selectively ejected from these regions. According to this configuration, for example, it is possible to spray ionized gas individually for each mounting head 20 or for each component adsorbed to the mounting head 20, and at the time of component adsorption, the mounting head that adsorbs the component Thus, it becomes possible to spray the ionized gas only on the tape feeder 4a (component extraction unit 50) corresponding to the number 20.
[0060]
Further, the arrangement, size, shape, and the like of the ejection ports 42 in the discharge member 37 are not limited by the present invention, and may be appropriately selected so that ionized gas can be appropriately blown to the static elimination portion. That's fine.
(4) A movable nozzle may be provided as the ejection port 42 of the discharge member 37 so that the distance and the direction in which the ionized gas is ejected can be changed according to the size of the adsorbing component, for example. According to this, when the static electricity is removed from the adsorbing component, it becomes possible to spray the ionized gas under conditions more suitable for the component, and it is possible to prevent troubles such as dropping of the component due to the ionized gas spraying.
(5) In the embodiment, the tape feeder 4a (component extraction unit 50) and the printed circuit board 3 are targeted as static elimination locations other than the suction nozzle 20a and the suction components. Of course, other locations can be selected as static elimination locations. Needless to say.
[0061]
【The invention's effect】
As described above, the surface mounter according to the present invention is provided with an injection port for ionized gas generated by the static eliminator in the movable member, and by moving the movable member, at least the component supply unit and the mounting work position can be arbitrarily set Since ionized gas can be sprayed to the position, it is possible to perform static elimination at a plurality of locations on the surface mounter with a rational configuration using a common static elimination device. In particular, if the ejection unit is mounted on a head unit and the head unit is also used as the movable member, the ejection unit can be moved with a rational configuration using an existing mechanism. There is an effect that increase in size and cost can be suppressed.
[Brief description of the drawings]
FIG. 1 is a plan view showing a surface mounter according to the present invention.
FIG. 2 is a front view showing a surface mounter (mainly a head unit and its drive mechanism) according to the present invention.
FIG. 3 is a front view showing a head unit.
FIG. 4 is a side view showing the head unit.
FIG. 5 is a cross-sectional view showing a configuration of a discharge member (injection unit) for injecting ionized gas.
FIG. 6 is a perspective view showing a configuration of a component take-out portion of the tape feeder.
FIG. 7 is a side view (partial cross-sectional view) showing a state of a tape fed to a component take-out portion and a head unit arranged on the component take-out portion to take out a component from the tape.
FIG. 8 is a flowchart for explaining an example of the mounting operation of the surface mounter based on the control of the control means.
[Explanation of symbols]
5 Head unit
20 Mounting head
20a Suction nozzle
36 Ionized gas generator
37 Release member
40a-40d gas passage
42 injection port

Claims (6)

In a surface mounting machine configured to have a movable head unit equipped with a suction nozzle for picking up a component, and to suck the component from the component supply unit by this head unit and mount it on the substrate at the mounting work position,
An ionization gas jetting unit that neutralizes charges by spraying the ionized gas onto the charged part to neutralize the charge, and supports the jetting unit so that it can be moved to any location within a specific area. A surface mounting machine comprising a movable member. In the surface mounting machine according to claim 1,
A surface mounting machine characterized in that a head unit is also used as the movable member by providing the ejection unit in the head unit. In the surface mounting machine according to claim 2,
The surface mounting machine, wherein the ejection part is provided so that ionized gas can be sprayed onto the adsorption nozzle. In the surface mounting machine according to claim 2 or 3,
The ejection unit is provided so that ionized gas can be sprayed to the vicinity including the component adsorption position by the adsorption nozzle in a state where the head unit is arranged in the component supply unit for component adsorption. A featured surface mounter. In the surface mounting machine according to any one of claims 2 to 4,
The surface mounting machine, wherein the ejection unit is provided so that ionized gas can be sprayed onto the substrate in a state where the head unit is disposed on the substrate at the mounting operation position. In the surface mounting machine according to any one of claims 2 to 5,
A surface mounting machine, wherein a plurality of regions for injecting ionized gas are provided in the injection unit, and switching means for switching the region for injecting ionized gas is provided.

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