WO2020008630A1

WO2020008630A1 - Component feeding device

Info

Publication number: WO2020008630A1
Application number: PCT/JP2018/025721
Authority: WO
Inventors: 祐輔山▲崎▼
Original assignee: 株式会社Ｆｕｊｉ
Priority date: 2018-07-06
Filing date: 2018-07-06
Publication date: 2020-01-09
Also published as: JP6908787B2; CN112369134A; JPWO2020008630A1; CN112369134B

Abstract

A component feeding device for which, from a taped component configured by a plurality of lead components, and a carrier tape to which the leads of that plurality of lead components are taped, lead components are supplied to a component feeding position, wherein the component feeding device comprises: a carrying route for carrying the taped component to a component feeding position; and a foreign matter removal device that removes foreign matter from the lead components of the taped component carried on a carrying route.

Description

Parts supply device

The present invention relates to a component supply device that supplies a lead component at a component supply position from a taped component including a plurality of lead components and a carrier tape on which leads of the plurality of lead components are taped.

部品 In a component supply device that supplies components from taped components, the taped components are transported to a component supply position on the transport path, and the components are supplied at the component supply position. The following Patent Document describes an example of such a component supply device.

JP-A-2004-22865 JP 2010-109109 A

異物 There is a possibility that foreign matter such as dust may adhere to the taped components conveyed in the conveyance path. For this reason, foreign matter adheres to the component, and when the component to which the foreign matter is attached is mounted on a circuit board, there is a possibility that the component becomes a defective board. Accordingly, it is an object to remove foreign matter from a tape-formed component conveyed in a conveyance path.

In order to solve the above problems, the present specification supplies the lead components at a component supply position from a taped component configured by a plurality of lead components and a carrier tape on which the leads of the plurality of lead components are taped. A transport path for transporting the taped component to the component supply position, and a foreign matter removing device that removes foreign matter from the lead component of the taped component transported in the transport path. A component supply device including:

According to the present disclosure, it is possible to satisfactorily supply components by removing foreign matter from the taped components set in the component supply device.

It is a perspective view which shows an electronic component mounting apparatus. It is a perspective view of a feeder type component supply apparatus. FIG. 2 is an enlarged perspective view of various devices constituting the tape feeder. It is an enlarged view of a lead cutting device. It is an enlarged view of a lead cutting device. It is a schematic diagram of a lead cutting device and a tape cutting device. It is an expansion perspective view showing the inside of a tape feeder. It is a schematic sectional drawing of a guide mechanism. It is a schematic side view of a guide mechanism.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings as an embodiment for carrying out the present invention.

(A) Configuration of Electronic Component Mounting Apparatus FIG. 1 shows an electronic component mounting apparatus 10. The electronic component mounting apparatus 10 includes two electronic component mounting machines (hereinafter, may be abbreviated as “mounting machines”) 14. Each mounting machine 14 mainly includes a mounting machine main body 20, a transport device 22, a moving device 24, a mounting head 26, and a supply device 28.

The mounting machine main body 20 includes a frame portion 32 and a beam portion 34 mounted on the frame portion 32. The transfer device 22 includes two

conveyor devices

40 and 42. Each of the two

conveyor devices

40, 42 transports a circuit board supported by each

conveyor device

40, 42. In the following description, the transport direction of the circuit board is referred to as an X direction, a horizontal direction perpendicular to the direction is referred to as a Y direction, and a vertical direction is referred to as a Z direction.

The moving device 24 is an XY robot type moving device, and moves the slider 50 to an arbitrary position. When the mounting head 26 is attached to the slider 50, the mounting head 26 is moved to an arbitrary position on the frame portion 32. The mounting head 26 has a suction nozzle 60 provided on the lower end surface. The suction nozzle 60 sucks and holds the electronic component by negative pressure, and separates the held electronic component by positive pressure.

The mounting head 26 mounts electronic components on the circuit board. A suction nozzle 60 is provided on a lower end surface of the mounting head 26. The suction nozzle 60 communicates with a positive / negative pressure supply device (not shown) via a negative pressure air and a positive pressure air passage. Thus, the suction nozzle 60 sucks and holds the electronic component by the negative pressure, and separates the held electronic component by the positive pressure. The mounting head 26 has a nozzle elevating device (not shown) for elevating and lowering the suction nozzle 60, and changes the vertical position of the electronic component to be held.

The supply device 28 includes a plurality of feeder-type component supply devices 66. Each of the feeder-type component supply devices 66 includes a tape feeder 70 and a tape component 72 inside the tape feeder 70, as shown in FIG. And a guide mechanism 74 for guiding the The tape feeder 70 includes a feeder main body 76, and is detachably mounted on a mounting table (see FIG. 1) 77 provided at an end of the frame 32 in the feeder main body 76. The tape feeder 70 is a device that removes the radial lead component 78 from the taped component 72 and supplies the removed radial lead component 78.

(3) As shown in FIG. 3, the taped component 72 includes a plurality of radial lead components 78 and a carrier tape 80. The radial lead component 78 includes a generally cylindrical main body 82 and two leads 84 extending from the bottom surface of the main body 82 in the same direction. The two leads 84 of the radial lead component 78 are taped to the carrier tape 80 at the lower ends. In the carrier tape 80, a plurality of feed holes 88 are formed at an equal pitch. The plurality of radial lead components 78 are taped to the carrier tape 80 at the same pitch as the pitch at which the feed holes 88 are formed.

The tape feeder 70 has a transport path 100, a sending device 102, a lead cutting device 104, and a tape cutting device 106. The transport path 100, the sending device 102, the lead cutting device 104, the tape cutting device 106, Are disposed inside the feeder body 76. In the description of the tape feeder 70, a side on which the tape cutting device 106 is provided may be referred to as a front side, and a side opposite to the front side may be referred to as a rear side.

The transport path 100 is defined by a pair of guide rails 110. The pair of guide rails 110 are disposed so as to extend in the front-rear direction while facing each other on the upper end surface of the feeder main body 76, and a pair of guide rails 110 is transported between the opposed side surfaces. The route 100 is set. Then, the carrier tape 80 of the taped component 72 extends vertically in the width direction of the carrier tape 80 between the opposing side surfaces of the pair of guide rails 110, that is, in the transport path 100, that is, in the upright position. It is inserted in the state where it was done. The state in which the carrier tape 80 is erected is a state in which the carrier tape 80 and the upper surface of the tape feeder 70 generally intersect at a right angle, and the leads 84 taped on the carrier tape 80 extend in the vertical direction. Then, the radial lead component 78 held by the carrier tape 80 extends upward from between the pair of guide rails 110.

The delivery device 102 has a pawl member (not shown) and a delivery air cylinder (not shown). The claw member is disposed slidably in the front-rear direction below the pair of guide rails 110, and slides in the front-rear direction by the operation of the delivery air cylinder. The claw member is engaged with the feed hole 88 of the taped component 72 inserted between the pair of guide rails 110. Then, when the claw member slides forward, the taped component 72 is sent forward. In addition, the amount of one slide of the claw member is set to the same length as the formation pitch of the feed holes 88 to the taped component 72. When the claw member slides rearward, the engagement of the claw member with the feed hole 88 is released. As a result, the claw member makes one reciprocation in the front-rear direction, so that the taped component 72 moves forward between the pair of guide rails 110, that is, in the transport path 100, in an amount corresponding to the formation pitch of the feed hole 88. Sent out.

リード Further, a lead cutting device 104 is provided in a direction in which the tape-formed component 72 is sent out by the sending device 102, that is, in front of the sending device 102. As shown in FIGS. 3 and 4, the lead cutting device 104 includes a fixing member 120, a swing member 122, and a lead cutting air cylinder 124. In FIG. 3, the fixing member 120 is omitted. The fixing member 120 and the swinging member 122 are disposed on the front side of the delivery device 102 with the carrier tape 80 of the taped component 72 delivered by the delivery device 102 interposed therebetween, and are provided with a lead cutting air cylinder. Reference numeral 124 is disposed on the rear side of the lower ends of the fixing member 120 and the swinging member 122.

The fixing member 120 is fixedly disposed in a posture extending in the vertical direction, and the upper end of the fixing member 120 faces the lead 84 held by the carrier tape 80. Note that a fixed-side holding plate 126 is provided at the upper end of the fixed member 120. Further, the swing member 122 is disposed in a posture extending in the up-down direction with the carrier tape 80 sandwiched therebetween and facing the fixing member 120, and is capable of swinging about an axis extending in the front-rear direction. . The swing member 122 swings in a controllable manner by the operation of the lead cutting air cylinder 124. The upper end of the swing member 122 faces the lead 84 held by the carrier tape 80, and a swing-side holding plate 128 is provided at the upper end of the swing member 122. As a result, the swing member 122 swings, so that the swing-side holding plate 128 of the swing member 122 approaches and separates from the fixed-side holding plate 126 of the fixed member 120.

第 A first wiping device 129 is provided on the upper surfaces of the fixed-side holding plate 126 and the swing-side holding plate 128. Specifically, a fixed-side arm 130 extending upward is fixed to the upper surface of the fixed-side holding plate 126, and a fixed-side cleaning brush 132 is provided at an upper end of the fixed-side arm 130. The fixed-side cleaning brush 132 faces the upper end of the lead 84 held by the carrier tape 80, that is, the end on the side of the main body 82. A swing arm 134 extending upward is also fixed to the upper surface of the swing holding plate 128, and a swing cleaning brush 136 is disposed at the upper end of the swing arm 134. I have. The swing-side cleaning brush 136 faces the fixed-side cleaning brush 132 with the upper end of the lead 84 held by the carrier tape 80 interposed therebetween. As described above, in the first wiping device 129 including the fixed-side arm 130, the fixed-side cleaning brush 132, the swing-side arm 134, and the swing-side cleaning brush 136, the swing member 122 swings. Then, the swing-side cleaning brush 136 approaches and separates from the fixed-side cleaning brush 132.

With such a structure, the swing member 122 swings in a direction in which the upper end portion approaches the fixing member 120, so that the lead 84 taped to the carrier tape 80 becomes the lead 84 as shown in FIG. At the center of the holding member, the holding member is sandwiched between a fixed-side holding plate 126 and a swing-side holding plate 128. In addition, the swing member 122 swings in a direction in which the upper end portion approaches the fixing member 120, so that the lead 84 taped to the carrier tape 80 is fixed to the fixed cleaning brush 132 at the upper end portion of the lead 84. The cleaning brush 136 is sandwiched between the oscillating-side cleaning brush 136. That is, the swing member 122 swings in the direction in which the upper end approaches the fixing member 120, so that the lead 84 taped to the carrier tape 80 is moved by the fixed side holding plate 126 and the swing side holding plate 128. The cleaning brush 132 is held between the fixed cleaning brush 132 and the swinging cleaning brush 136.

揺 Further, below the swinging side holding plate 128, a swinging side cutter 138 is provided with its cutting edge directed to the lead 84 taped to the carrier tape 80. On the other hand, on the lower end surface of the fixed side holding plate 126, a fixed side cutter 140 is formed at a position facing the swing side cutter 138. Therefore, the lead 84 sandwiched between the fixed-side holding plate 126 and the swing-side holding plate 128 is cut by the swing-side cutter 138 and the fixed-side cutter 140. At this time, the radial lead component 78 is separated from the carrier tape 80, and the taped component 72 becomes a carrier tape in which the radial lead component 78 is separated (hereinafter, referred to as “waste tape”).

リード Further, in the lead cutting device 104, a first air ejection device 150 is provided on the lower surface of the swinging side holding plate 128. The first air ejection device 150 is provided at an arbitrary timing from between the swing-side holding plate 128 and the swing-side cutter 138 toward the lead 84 held between the fixed-side holding plate 126 and the swing-side holding plate 128. It is possible to blow out the air.

Furthermore, as shown in FIG. 6, the lead cutting device 104 is provided with a second air ejection device 152 for ejecting air to both the swinging cutter 138 and the fixed cutter 140. The second air ejection device 152 is disposed on the rear side of the lead cutting device 104, that is, on the opposite side to the sending direction of the taped component 72, and includes a cutting edge of the swing-side cutter 138 and a cutting edge of the fixed-side cutter 140. , It is possible to eject air at an arbitrary timing.

As shown in FIG. 3, the tape cutting device 106 is disposed in front of the lead cutting device 104, that is, in the direction in which the tape-formed component 72 is sent out, and includes a fixed arm 160, a swing arm 162, and a tape cutting device. Air cylinder (not shown). The fixed arm 160 and the swing arm 162 are disposed on the front side of the lead cutting device 104 with a waste tape interposed therebetween. The fixed arm 160 is fixedly disposed in a posture extending in the vertical direction, and a fixed-side cutter 166 is disposed on a side edge facing the waste tape. Further, the swing arm 162 is disposed in a posture extending in the vertical direction with the waste tape sandwiched therebetween and facing the fixed arm 160, and is swingable about a shaft 168 extending in the front-rear direction. . A swing-side cutter (not shown) is provided on a side edge of the swing arm 162 facing the waste tape. The swing arm 162 swings in a controllable manner by the operation of the tape cutting air cylinder. With such a structure, in the tape cutting device 106, when the swing arm 162 swings in a direction approaching the fixed arm 160, the waste tape is cut by the fixed cutter 166 and the swing cutter. .

排出 Further, as shown in FIGS. 6 and 7, a discharge path 170 is formed in the front side of the tape cutting device 106, that is, in the feeding direction of the tape-formed component 72. The discharge path 170 is for discharging the waste tape cut by the tape cutting device 106 (hereinafter, referred to as “waste tape piece”) to the outside of the tape feeder 70. The discharge path 170 is provided on the front side of the tape cutting device 106 with a first duct 172 formed to extend in the vertical direction, and a second duct (continuous from the lower end of the first duct 172 and descending rearward). (Not shown). Then, the waste tape extends from between the fixed arm 160 and the swing arm 162 of the tape cutting device 106 to the upper end of the first duct 172, and the rear end of the second duct becomes the rear end of the feeder body 76. Open to the part.

Therefore, the waste tape piece cut by the tape cutting device 106 is discharged to the first duct 172, and falls by its own weight in the first duct 172. A blower 176 is provided at the upper end of the first duct 172, and the blower 176 blows air downward inside the first duct 172. For this reason, the waste tape piece is sent downward in the first duct 172 by its own weight and air blowing. Then, the waste tape piece sent downward in the first duct 172 is sent rearward in the second duct by the air blow from the blower 176, and from the opening on the rear end side of the second duct, The sheet is discharged to the outside of the feeder body 76, that is, the tape feeder 70.

The guide mechanism 74 is a mechanism for guiding the taped component 72 from the storage box 180 of the taped component 72 to the inside of the tape feeder 70, as shown in FIG. , That is, at the end of the taped component 72 opposite to the sending direction. More specifically, the guide mechanism 74 includes a pair of

side walls

186 and 188 and a bottom 190 (see FIG. 8). The pair of

side walls

186 and 188 are disposed so as to face each other with a predetermined dimension therebetween, and are connected at the lower end by a bottom 190. As a result, as shown in FIG. 8, the cross-sectional shape of the guide mechanism 74 is generally U-shaped, and the inside of the guide mechanism 74 is a groove 192 having an open upper end. As shown in FIG. 2, the guide mechanism 74 is provided so as to extend in the front-rear direction, and a front end of the guide mechanism 74 is attached to a rear end of the tape feeder 70 through a dash hole. Are connected so that they can be easily attached and detached by loosening. At this time, the rear end of the transport path 100 of the tape feeder 70 communicates with the front end of the groove 192 of the guide mechanism 74.

A housing box 180 is placed below the guide mechanism 74 connected to the rear end of the tape feeder 70, and the taped component 72 is placed in the housing box 180 in a state where it is folded in the horizontal direction. Housed in. Then, one end of the taped component 72 is taken out of the storage box 180, and one end of the taped component 72 is inserted into the groove 192 of the guide mechanism 74 from an opening on the rear end side of the guide mechanism 74. At this time, as shown in FIG. 8, the carrier tape 80 of the taped component 72 enters the groove 192, and the radial lead component 78 taped to the carrier tape 80 extends from the upper end of the groove 192. The radial lead component 78 of the taped component 72 removed from the storage box 180 and inserted into the opening on the rear end side of the guide mechanism 74 is not shown in FIG.

Then, the taped component 72 inserted into the groove 192 of the guide mechanism 74 is pushed toward the inside of the guide mechanism 74, and the inside of the transport path 100 of the tape feeder 70 via the groove 192 of the guide mechanism 74. Change the angle to enter the vertical direction. That is, the groove portion 192 functions as a guide path for guiding the taped component 72 from the storage box 180 to the tape feeder 70, or in other words, functions as a transport path.

Furthermore, when the taped component 72 is pushed into the guide mechanism 74, the taped component 72 reaches the delivery device 102 of the tape feeder 70. At this time, the claw member of the sending device 102 is engaged with the feed hole 88 formed in the taped component 72, and the operation of the sending device 102 is controlled. It is sent forward. As described above, in the guide mechanism 74, after the taped component 72 stored in the storage box 180 is guided to the inside of the tape feeder 70, the tape feeder 70 is sent forward by the operation of the sending device 102 in the tape feeder 70. Then, components are supplied according to the above-described procedure.

Further, the guide mechanism 74 is provided with a second wiping device 200 as shown in FIG. More specifically, an arm 202 extending upward from the side wall 188 is fixed to an upper end of the side wall 188 of the guide mechanism 74, and a cleaning brush 204 is provided at an upper end of the arm 202. The cleaning brush 204 faces the upper end of the lead 84 held by the carrier tape 80 inserted into the groove 192 of the guide mechanism 74. An arm 206 extending upward from the side wall 186 is also fixed to the upper end of the side wall 186, and a cleaning brush 208 is provided at the upper end of the arm 206. The cleaning brush 208 is in contact with the cleaning brush 204 with the upper end of the lead 84 held by the carrier tape 80 inserted into the groove 192 interposed therebetween. As described above, in the second wiping device 200 including the

arms

202 and 206 and the cleaning brushes 204 and 208, when the taped component 72 is guided toward the tape feeder 70 in the groove 192 of the guide mechanism 74. Then, the lead 84 taped to the taped component 72 passes between the cleaning brushes 204 and 208.

Further, as shown in FIG. 9, a third air ejection device 210 that ejects air to the second wiping device 200 is provided in the guide mechanism 74. Specifically, a bracket 212 extending upward from the side wall 186 is fixed to the upper end of the side wall 186 of the guide mechanism 74 in front of the second wiping device 200. A three air ejection device 210 is provided. The third air ejection device 210 is capable of ejecting air toward the space between the cleaning brush 204 and the cleaning brush 208 of the second wiping device 200 at an arbitrary timing. The bracket 212 is bent so that the radial lead component 78 extending upward from the groove 192 does not contact the third air ejection device 210.
(B) Mounting work by mounting machine

The mounting machine 14 performs the operation of mounting components on the circuit board by the above-described configuration. Specifically, the circuit board is transported to the work position by the transport device 22, and is fixedly held at that position. In the supply device 28, a radial lead component 78 is supplied in a feeder type component supply device 66. Specifically, in the tape feeder 70 of the feeder-type component supply device 66, the taped component 72 is fed forward at a predetermined pitch by the operation of the sending device 102. Here, the predetermined pitch is a pitch at which the feed holes 88 are formed in the taped component 72, and is an arrangement pitch of the radial lead components 78 in the taped component 72. Therefore, each time the taped component 72 is fed forward at a predetermined pitch, one radial lead component 78 moves between the fixing member 120 and the swinging member 122 of the lead cutting device 104.

Then, when one radial lead component 78 moves between the fixing member 120 and the swing member 122, the lead 84 of the radial lead component 78 is moved by the operation of the lead cutting device 104 to the swing side cutter 138. It is cut by the fixed cutter 140. At this time, the lead 84 is held between the fixed-side holding plate 126 and the swing-side holding plate 128 above the cut portion. Therefore, the radial lead component 78 is supplied in a state where the radial lead component 78 is held between the fixed-side holding plate 126 and the swing-side holding plate 128 on the lead 84. That is, the upper surface side of the fixed side holding plate 126 and the swing side holding plate 128 of the lead cutting device 104 is the component supply position of the tape feeder 70.

リード Further, when the leads 84 are cut by the lead cutting device 104, the carrier tape 80 on which the radial lead components 78 are taped becomes waste tape. Then, the waste tape is inserted between the fixed arm 160 and the swing arm 162 of the tape cutting device 106 with the sending of the taped component 72 by the sending device 102. In the tape cutting device 106, each time the lead 84 is cut by the lead cutting device 104, the waste tape is cut by the fixed cutter 166 of the fixed arm 160 and the swing cutter of the swing arm 162.

Then, the waste tape cut by the tape cutting device 106, that is, the waste tape piece is discharged to the discharge path 170. In the discharge path 170, the waste tape piece moves downward in the first duct 172 due to its own weight and the air blown from the blower 176, and falls to the second duct. Then, the waste tape pieces that have fallen into the second duct move rearward due to the air blown from the blower 176. Thereby, the waste tape piece is discharged to the outside of the tape feeder 70 from the opening on the rear end side of the second duct.

As described above, in the tape feeder 70, the radial lead component 78 is positioned at the component supply position and is supplied to the mounting head 26 while being sandwiched by the fixed-side holding plate 126 and the swing-side holding plate 128. Then, in the mounting machine 14, the mounting head 26 is moved above the component supply position of the tape feeder 70 by the operation of the moving device 24, and the radial lead component 78 is held by the suction nozzle 60.

Subsequently, the operation of the moving device 24 is controlled so that the through hole formed in the circuit board and the tip of the lead 84 of the radial lead component 78 overlap in the vertical direction, and the radial lead held by the suction nozzle 60 is controlled. The part 78 is positioned. Then, when the suction nozzle 60 holding the radial lead component 78 moves down, the lead 84 of the radial lead component 78 is inserted into the through hole of the circuit board, and the radial lead component 78 is mounted on the circuit board. .
(C) Removal of foreign matter attached to the lead

As described above, in the mounting machine 14, the components supplied by the supply device 28 are held by the suction nozzles 60 and mounted on the circuit board. At this time, if a component to which some foreign matter is attached is mounted on the circuit board, the circuit board may be defective. In particular, since the radial lead component 78 supplied by the tape feeder 70 is supplied after the lead 84 has been cut in the tape feeder 70, burrs may be attached to the leading end of the lead 84 in some cases. The burrs may not only occur at the tip of the lead 84 due to the cutting of the lead 84, but may also have a beard-like burr on the outer peripheral surface of the lead 84 regardless of the cutting of the lead 84. Further, chips generated by the cutting, scum of the carrier tape, and the like may also be attached to the leads 84. Here, the foreign material means a material unnecessary or unnecessary as a lead component or a taped lead component, and includes a material that is integral with the lead 84. That is, dust, slag, dust, and the like that are separate from the lead 84 are, of course, foreign matter, but burrs integrated with the lead 84 are also foreign matter.

Therefore, in the mounting machine 14, foreign matter is removed from the radial lead components 78 in the feeder-type component supply device 66 before the radial lead components 78 are mounted on the circuit board. Specifically, in the guide mechanism 74 of the feeder-type component supply device 66, as shown in FIG. 8, when the taped component 72 is guided toward the tape feeder 70 in the groove 192 of the guide mechanism 74, the tape is formed. The lead 84 taped to the component 72 passes between the contacting cleaning brushes 204 and 208 in the second wiping device 200. At this time, the outer peripheral surface of the lead 84 is wiped by the cleaning brushes 204 and 208, and foreign matter, such as beard-like burrs and dust, attached to the outer peripheral surface of the lead 84 is removed by the cleaning brushes 204 and 208. .

Further, in the guide mechanism 74, as shown in FIG. 9, the third air ejection device 210 ejects air toward between the cleaning brush 204 and the cleaning brush 208 of the second wiping device 200. At this time, the foreign matter removed by the cleaning brushes 204, 208 is removed from the cleaning brushes 204, 208 by blowing air. Accordingly, it is possible to prevent the foreign matter adhering to the cleaning brushes 204 and 208 from re-adhering to the lead 84. The direction in which the third air ejection device 210 ejects air is opposite to the direction in which the taped component 72 is sent out, that is, in the direction away from the tape feeder 70. Accordingly, it is possible to prevent the foreign matter removed by the ejection of the air from the cleaning brushes 204 and 208 from being mixed into the tape feeder 70. The third air ejecting device 210 ejects air while the taped component 72 is being sent out by the sending device 102 and for a predetermined time after the feeding of the taped component 72 is completed. Thus, the foreign matter is blown off by the air at the timing when the foreign matter is removed by the cleaning brushes 204, 208, so that it is possible to prevent the foreign matter from entering the inside of the cleaning brushes 204, 208.

As described above, in the guide mechanism 74, before the taped component 72 enters the inside of the tape feeder 70, foreign matter is removed from the lead 84 of the radial lead component 78 taped to the taped component 72. This makes it possible to suppress the entry of foreign matter into the tape feeder 70, prevent components with the foreign matter from being attached to the circuit board, and suppress the occurrence of defective boards.

では In the tape feeder 70, foreign matter is removed from the leads 84 in the taped component 72 conveyed in the conveyance path 100. Specifically, in the lead cutting device 104, when the lead 84 is held between the fixed-side holding plate 126 and the swing-side holding plate 128, that is, when the radial lead component 78 is supplied at the component supply position, Air is jetted toward the lead 84 by the first air jetting device 150. The first air ejection device 150 is fixed to the lower surface of the swing-side holding plate 128 disposed right above the swing-side cutter 138, and the upper side of the swing-side cutter 138 is located above the swing-side cutter 138. Blows air toward the cutting edge.

In addition, the first air ejection device 150 moves the swing-side cutter 138 closest to the fixed-side cutter 140 and moves away from the fixed-side cutter 140 with the operation of cutting the lead 84 by the lead cutting device 104. Sprays air while swinging. That is, after the lead 84 is cut by the swing-side cutter 138 and the fixed-side cutter 140, the first air ejection device 150 attaches the first lead to the cut portion of the lead, that is, the tip of a new lead by cutting. The air ejection device 150 ejects air. Accordingly, burrs generated when the lead 84 is cut by the swing-side cutter 138 and the fixed-side cutter 140 can be removed from the lead 84 by jetting air. Further, for example, when dust or the like adheres to the cutting edge of the swing-side cutter 138 or the like, even if the dust or the like adheres to the tip end of the lead when cutting the lead, the air is blown out. The dust and the like can be removed.

In the tape feeder 70, at the component supply position, the lead 84 is held at the tip end by the fixed-side holding plate 126 and the swing-side holding plate 128, and the upper end of the lead, that is, the main body 82 Is sandwiched between the fixed-side cleaning brush 132 and the swinging-side cleaning brush 136 of the first wiping device 129. For this reason, when the radial lead component 78 supplied by the component supply device is held by the suction nozzle 60 and moves from the component supply position, the outer peripheral surface of the lead is fixed to the fixed-side cleaning brush 132 and the swing-side cleaning brush 136. And is wiped by.

More specifically, when the radial lead component 78 in a state of being held between the fixed-side holding plate 126 and the swing-side holding plate 128 at the tip end of the lead is held by the suction nozzle 60, the swing member 122 is moved to the fixed member 120. Swing away from Thus, the holding of the lead by the fixed-side holding plate 126 and the swing-side holding plate 128 is released. Then, the suction nozzle 60 holding the radial lead component 78 rises at the timing when the holding of the lead by the fixed-side holding plate 126 and the swing-side holding plate 128 is released. When the swing member 122 swings in a direction away from the fixed member 120, the swing cleaning brush 136 also swings in a direction away from the fixed cleaning brush 132. In the cleaning brush 136, the tips of the brushes are in contact with each other. Therefore, when the suction nozzle 60 holding the radial lead component 78 rises, the outer peripheral surface of the lead 84 is wiped by the fixed cleaning brush 132 and the oscillating cleaning brush 136 that are in contact with each other. As a result, foreign matter, such as beard-like burrs and dust, attached to the outer peripheral surface of the lead 84 is removed by the fixed-side cleaning brush 132 and the swing-side cleaning brush 136.

Further, in the tape feeder 70, in the lead cutting device 104, as shown in FIG. 6, air is blown by the second air ejection device 152 toward the cutting edges of the swinging cutter 138 and the fixed cutter 140 that cut the lead 84. Is squirted. The second air ejection device 152 operates in accordance with the operation of the first air ejection device 150. That is, similarly to the first air ejecting device 150, the second air ejecting device 152 also has a structure in which the swing-side cutter 138 is closest to the fixed-side cutter 140 and is swinging in a direction away from the fixed-side cutter 140. Squirting air.

Accordingly, when the lead 84 is cut by the swing-side cutter 138 and the fixed-side cutter 140, burrs are generated. When the burrs adhere to the swing-side cutter 138 or the fixed-side cutter 140, the burrs are removed. It can be removed from the swing-side cutter 138 or the fixed-side cutter 140. Further, when dust or the like attached to the lead before cutting the lead adheres to the swing-side cutter 138 or the fixed-side cutter 140 due to the cutting of the lead, the dust or the like is removed from the swing-side cutter 138 or It can be removed from the fixed cutter 140. Accordingly, it is possible to prevent foreign matter from re-adhering to the lead 84 from the swing-side cutter 138 or the fixed-side cutter 140. That is, the cutter is periodically cleaned regardless of the type of burrs or dust.

{Circle around (2)} The second air ejection device 152 operates at the same timing as the first air ejection device 150. Therefore, the foreign matter removed from the lead by the ejection of the air from the first air ejection device 150 is also blown off by the air from the second air ejection device 152. The cutting edge of the swing-side cutter 138 and the like is located below the base end of the lead sandwiched between the swing-side cleaning brush 136 and the like. Therefore, the foreign matter removed from the lead by the first wiping device 129 is also blown off by the air of the second air ejection device 152. The direction of air ejection by the second air ejection device 152 is a direction from the rear of the lead cutting device 104 to the front, and the first duct 172 of the discharge path 170 is provided in front of the lead cutting device 104. ing. Therefore, the foreign matter blown off by the ejection of the air from the second air ejection device 152 is discharged to the first duct 172 of the discharge path 170. Thus, inside the tape feeder 70, the foreign matter removed by the operation of the first air ejection device 150, the second air ejection device 152, and the first wiping device 129 passes through the discharge path 170 to the tape feeder 70. It is discharged outside. This makes it possible to prevent foreign substances from re-adhering inside the tape feeder 70.

As described above, in the tape feeder 70, when the radial lead component 78 is supplied at the component supply position, the radial lead component 78 is held by the suction nozzle 60, and immediately before the mounting operation to the circuit board is performed. Then, foreign matter on the lead is removed. Accordingly, it is possible to prevent the component with the foreign substance from being attached to the circuit board, and to suppress the occurrence of a defective board.

The feeder-type component supply device 66 is an example of a component supply device. The tape feeder 70 is an example of a tape feeder. The taped component 72 is an example of a taped component. The radial lead component 78 is an example of a lead component. The carrier tape 80 is an example of a carrier tape. The lead 84 is an example of a lead. The transport path 100 is an example of a transport path. The lead cutting device 104 is an example of a cutting device. The first wiping device 129 is an example of a foreign matter removing device. The swing-side cutter 138 is an example of a cutter. The first air ejection device 150 is an example of a foreign matter removing device. The storage box 180 is an example of a storage unit. The groove 192 is an example of a transport path. The second wiping device 200 is an example of a foreign matter removing device. The third air ejection device 210 is an example of a foreign matter removal device.

The present invention is not limited to the above embodiments, but can be implemented in various modes with various changes and improvements based on the knowledge of those skilled in the art. Specifically, for example, in the above embodiment, the feeder-type component supply device 66 includes the tape feeder 70 and the guide mechanism 74, but may include only the tape feeder 70. That is, the feeder-type component supply device 66 may include at least the tape feeder 70 and may include the guide mechanism 74. Alternatively, the feeder-type component supply device 66 may be one in which the tape feeder 70 and the guide mechanism 74 are integrated. Further, the tape feeder is not limited to the radial feeder that supplies the radial lead component 78, but may be an axial feeder that supplies an axial lead component, or a general tape component supply feeder that supplies a square chip regardless of the lead component. It is possible to adopt the present invention.

In the above embodiment, the first air ejection device 150 and the second air ejection device 152 operate after the lead is cut by the lead cutting device 104 after the lead is cut. , May be operated at various timings. Specifically, the first air ejection device 150 and the second air ejection device 152 may operate at various timings, such as before the lead is cut or while the lead is being cut. Further, in the above embodiment, the first air ejection device 150 and the second air ejection device 152 operate at the same timing, but the first air ejection device 150 and the second air ejection device 152 operate at different timings. May be.

In the above-described embodiment, the first air ejection device 150 is provided on the swinging side holding plate 128 constituting the lead cutting device 104, but is provided on other components constituting the lead cutting device 104. May be done. For example, it may be provided on the fixed-side holding plate 126, the swing-side cutter 138, or the like. That is, the first air ejection device 150 may be provided on the cutter of the lead cutting device 104 or on a component of the lead cutting device 104 provided near the cutter.

Further, in the above-described embodiment, the components are supplied at the positions where the leads are cut by the lead cutting device 104 in the tape feeder 70, but the positions where the leads are cut by the lead cutting device 104 and the component supply positions are different. Is also good.

Further, in the above embodiment, the taped component 72 housed in the storage box 180 is guided by the guide mechanism 74 and inserted into the tape feeder 70, but the taped component 72 wound on a reel or the like is used. It may be inserted into the tape feeder 70.

In the above embodiment, the groove 192 of the guide mechanism 74 is employed as a path from the storage box 180 to the tape feeder 70. May be adopted.

Further, in the above embodiment, foreign matter is removed from the lead by jetting air and wiping using a brush. However, foreign matter is removed from the lead by jetting air and wiping using a brush. May be removed.

66: feeder-type component supply device (component supply device) $ 70: tape feeder $ 72: taped component $ 78: radial lead component (lead component) $ 80: carrier tape $ 84: lead $ 100: transport path $ 104: lead cutting device (cutting device) 129: First wiping device (foreign matter removing device) 138: Oscillating side cutter (cutter) 150: First air ejecting device (foreign matter removing device) 180: Housing box (housing part) 192: Groove part (transport path) 200: Second wiping device (foreign matter removing device) # 210: Third air ejection device (foreign matter removing device)

Claims

A component supply device that supplies the lead component at a component supply position from a taped component configured by a plurality of lead components and a carrier tape on which the leads of the plurality of lead components are taped,
A transport path for transporting the taped component to the component supply position,
A foreign matter removing device that removes foreign matter from the lead component of the taped component conveyed in the conveyance path.
A cutting device for cutting the lead to separate the lead component taped from the carrier tape,
2. The component supply device according to claim 1, wherein the foreign matter is removed by the foreign matter removing device in accordance with an operation for cutting the lead by the cutting device.
The foreign matter removing device is disposed in the cutting device,
3. The component supply device according to claim 2, wherein the foreign matter is removed by the foreign matter removing device in accordance with an operation for cutting the lead by the cutting device.
4. The component supply device according to claim 3, wherein the foreign matter is removed by the foreign matter removing device after the lead is cut by the cutter of the cutting device.
The component supply device,
A tape feeder that feeds the taped component to the component supply position and supplies the lead component at the component supply position,
The foreign matter removing device,
2. The component supply device according to claim 1, wherein the component supply device is disposed in a path from the storage unit of the taped component to the tape feeder.