CN112369134B

CN112369134B - Component supply device

Info

Publication number: CN112369134B
Application number: CN201880095227.5A
Authority: CN
Inventors: 山崎祐辅
Original assignee: Fuji Corp
Current assignee: Fuji Corp
Priority date: 2018-07-06
Filing date: 2018-07-06
Publication date: 2022-09-09
Anticipated expiration: 2038-07-06
Also published as: JPWO2020008630A1; CN112369134A; WO2020008630A1; JP6908787B2

Abstract

A component supply device supplies a pin component from a component tape at a component supply position, the component tape being composed of a plurality of pin components and a carrier tape obtained by taping pins of the plurality of pin components, the component supply device including: a conveying path for conveying the component tape to a component supply position; and a foreign matter removing device for removing foreign matters from the pin components of the component tape conveyed in the conveying path.

Description

Component supply device

Technical Field

The present invention relates to a component supply device for supplying a lead component from a component tape constituted by a plurality of lead components and a carrier tape obtained by taping the leads of the plurality of lead components at a component supply position.

Background

In a component feeding apparatus that feeds a component from a component tape, in a feeding path, the component tape is fed to a component feeding position, and the component is fed at the component feeding position. An example of such a component supply device is described in the following patent documents.

Documents of the prior art

Patent document 1: japanese patent laid-open No. 2004-22865

Patent document 2: japanese laid-open patent publication No. 2010-109109

Disclosure of Invention

Problems to be solved by the invention

Foreign matter such as dust may adhere to the component tape conveyed in the conveyance path. Therefore, when foreign matter adheres to the element and the element to which the foreign matter adheres is mounted on the circuit board, there is a possibility that the element becomes a defective board. Therefore, it is a problem to remove foreign matter from the element of the element braid conveyed in the conveying path.

Means for solving the problems

In order to solve the above-described problems, the present specification discloses a component supply device configured to supply the lead components from a component tape composed of a plurality of lead components and a carrier tape in which the leads of the plurality of lead components are taped, at a component supply position, the component supply device including: a conveying path for conveying the component tape to the component supply position; and a foreign matter removing device that removes foreign matter from the pin elements of the element braid conveyed in the conveying path.

Effects of the invention

According to the present disclosure, it is possible to satisfactorily supply components by removing foreign substances from a component tape installed in a component supply device.

Drawings

Fig. 1 is a perspective view showing an electronic component mounting apparatus.

Fig. 2 is a perspective view of a feeder-type component feeding device.

Fig. 3 is an enlarged perspective view of various devices constituting the tape feeder.

Fig. 4 is an enlarged view of the pin cutting device.

Fig. 5 is an enlarged view of the pin cutting device.

Fig. 6 is a schematic view of the lead cutting device and the tape cutting device.

Fig. 7 is an enlarged perspective view showing the inside of the tape feeder.

Fig. 8 is a schematic sectional view of the guide mechanism.

Fig. 9 is a schematic side view of the guide mechanism.

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings as modes for carrying out the present invention.

(A) Structure of electronic component mounting device

Fig. 1 shows an electronic component mounting apparatus 10. The electronic component mounting apparatus 10 is composed of two electronic component mounting machines (hereinafter, may be simply referred to as "mounting machines") 14. Each mounting machine 14 mainly includes a mounting machine body 20, a conveying device 22, a moving device 24, a mounting head 26, and a feeding device 28.

The mounting machine body 20 includes a frame portion 32 and a beam portion 34 extending from the frame portion 32. The transport device 22 includes two

transport devices

40 and 42. The two

transfer devices

40 and 42 transfer the circuit boards supported by the

transfer devices

40 and 42, respectively. In the following description, the conveying direction of the circuit board is referred to as the X direction, the horizontal direction perpendicular to the X direction is referred to as the Y direction, and the vertical direction is referred to as the Z direction.

The moving device 24 is an XY robot type moving device, and moves the slider 50 to an arbitrary position. Then, by mounting the mounting head 26 on the slider 50, the mounting head 26 is moved to an arbitrary position on the frame portion 32. The mounting head 26 has a suction nozzle 60 provided on a lower end surface. The suction nozzle 60 holds the electronic component by suction with negative pressure, and releases the held electronic component by positive pressure.

The mounting head 26 mounts electronic components to the circuit substrate. A suction nozzle 60 is provided on the lower end surface of the mounting head 26. The suction nozzle 60 communicates with a positive/negative pressure supply device (not shown) via a negative pressure air passage and a positive pressure air passage. Thus, the suction nozzle 60 holds the electronic component by suction with a negative pressure, and separates the held electronic component by a positive pressure. The mounting head 26 has a nozzle lifting device (not shown) for lifting the nozzles 60, and changes the position of the held electronic component in the vertical direction.

The supply device 28 is configured by a plurality of feeder-type component supply devices 66, and each feeder-type component supply device 66 includes a tape feeder 70 and a guide mechanism 74 that guides a component tape 72 into the tape feeder 70, as shown in fig. 2. The tape feeder 70 includes a feeder main body 76, and is detachably mounted to a mounting base (see fig. 1)77 provided at an end of the frame 32 on the feeder main body 76. The tape feeder 70 is a device that detaches the radial pin component 78 from the component tape 72 and supplies the detached radial pin component 78.

As shown in fig. 3, the component tape 72 is made up of a plurality of radial pin components 78 and a carrier tape 80. The radial pin element 78 includes a generally cylindrical body portion 82 and two pins 84 extending in the same direction from the bottom surface of the body portion 82. The two leads 84 of the radial lead element 78 are braided with the carrier tape 80 at the lower end portions thereof. In addition, a plurality of feed holes 88 are formed at equal pitches in the carrier tape 80. Also, the plurality of radial pin members 78 are taped to the carrier tape 80 at the same pitch as the formation pitch of the feed holes 88.

The tape feeder 70 includes a conveying path 100, a feeding device 102, a lead cutting device 104, and a tape cutting device 106, and the conveying path 100, the feeding device 102, the lead cutting device 104, and the tape cutting device 106 are disposed inside the feeder main body portion 76. In the description of tape feeder 70, the side on which tape cutting device 106 is disposed may be referred to as the front side, and the side opposite to the front side may be referred to as the rear side.

The conveying path 100 is divided by a pair of guide rails 110. The pair of guide rails 110 are arranged so as to extend in the front-rear direction in a state where the upper end surfaces of feeder main body 76 face each other, and a conveyance path 100 is defined between the facing side surfaces of the pair of guide rails 110. The carrier tape 80 of the component tape 72 is inserted into the conveyance path 100 between the facing side surfaces of the pair of guide rails 110 in a state where the carrier tape 80 extends in the vertical direction in the width direction thereof, i.e., in a standing state. The carrier tape 80 is erected in a state where the carrier tape 80 crosses the upper surface of the tape feeder 70 substantially at right angles, and is knitted to the leads 84 of the carrier tape 80 to extend in the vertical direction. The radial pin elements 78 held by the carrier tape 80 extend upward from between the pair of guide rails 110.

The feeding device 102 includes a claw member (not shown) and a feeding cylinder (not shown). The claw member is disposed slidably in the front-rear direction below the pair of guide rails 110, and slides in the front-rear direction by the operation of the delivery cylinder. The claw member engages with the feed hole 88 of the element braid 72 inserted between the pair of guide rails 110. Then, the claw member slides forward, and the element braid 72 is fed forward. The one-time sliding amount of the claw member is set to the same length as the formation pitch of the element braid 72 on the feeding hole 88. When the claw member slides backward, the engagement of the claw member with the feed hole 88 is released. Thus, the element braid 72 is fed forward between the pair of guide rails 110, that is, in the conveying path 100 by an amount corresponding to the formation pitch of the feed holes 88 by reciprocating the claw member once in the front-rear direction.

Further, a lead cutting device 104 is disposed in the direction in which the component tape 72 is fed out by the feeding device 102, i.e., in front of the feeding device 102. As shown in fig. 3 and 4, the pin cutting device 104 includes: a fixed member 120, a swinging member 122, and a pin cutting cylinder. In fig. 3, the fixing member 120 is omitted. The fixing member 120 and the swinging member 122 are disposed on the front side of the feeder 102 in a state of sandwiching the carrier tape 80 of the component tape 72 fed by the feeder 102, and the pin cutting cylinder is disposed on the rear side of the lower end portions of the fixing member 120 and the swinging member 122.

The fixing member 120 is fixedly disposed in a posture extending in the vertical direction, and an upper end portion of the fixing member 120 faces the leads 84 held by the carrier tape 80. Further, a fixed-side holding plate 126 is disposed at the upper end of the fixed member 120. The swinging member 122 is disposed in a posture extending in the vertical direction in a state facing the fixed member 120 with the carrier tape 80 interposed therebetween, and is capable of swinging about an axis extending in the front-rear direction. The swinging member 122 is controllably swung by the operation of the pin-cutting cylinder. Further, the upper end of the swinging member 122 faces the lead pins 84 held by the carrier tape 80, and a swinging-side holding plate 128 is disposed at the upper end of the swinging member 122. As a result, the swing member 122 is swung, whereby the swing side holding plate 128 of the swing member 122 approaches and separates from the fixed side holding plate 126 of the fixed member 120.

Further, a first wiping device 129 is disposed on the upper surfaces of the fixed-side clamp plate 126 and the swing-side clamp plate 128. Specifically, a fixed-side arm 130 extending upward is fixed to the upper surface of the fixed-side clamp plate 126, and a fixed-side cleaning brush 132 is disposed at the upper end of the fixed-side arm 130. The fixed-side cleaning brush 132 faces the upper end of the lead 84 held by the carrier tape 80, that is, the end on the side of the body 82. A swing side arm 134 extending upward is also fixed to the upper surface of the swing side holding plate 128, and a swing side cleaning brush 136 is disposed at the upper end of the swing side arm 134. The oscillating side cleaning brush 136 faces the fixed side cleaning brush 132 across the upper end of the lead 84 held by the carrier tape 80. In this way, in the first wiping device 129 including the fixed-side arm 130, the fixed-side cleaning brush 132, the swing-side arm 134, and the swing-side cleaning brush 136, the swing member 122 swings to cause the swing-side cleaning brush 136 to approach and separate from the fixed-side cleaning brush 132.

With such a configuration, the swing member 122 swings the upper end portion in a direction approaching the fixed member 120, whereby the lead pins 84 braided on the carrier tape 80 are held between the fixed-side holding plate 126 and the swing-side holding plate 128 at the center portions of the lead pins 84, as shown in fig. 5. The swing member 122 swings the upper end portion in a direction approaching the fixing member 120, so that the leads 84 braided with the carrier tape 80 are sandwiched between the fixed side cleaning brush 132 and the swing side cleaning brush 136 at the upper end portions of the leads 84. That is, the swing member 122 swings the upper end portion in a direction approaching the fixed member 120, so that the lead pins 84 braided with the carrier tape 80 are sandwiched between the fixed-side nip plate 126 and the swing-side nip plate 128, and sandwiched above them by the fixed-side cleaning brush 132 and the swing-side cleaning brush 136.

Further, below the swing-side holding plate 128, a swing-side cutter 138 is disposed in a state where its cutting edge is directed toward the leads 84 of the tape 80. On the other hand, a fixed side cutter 140 is formed on the lower end surface of the fixed side clamp plate 126 at a position facing the swing side cutter 138. Therefore, the lead 84 clamped by the fixed-side clamp plate 126 and the swing-side clamp plate 128 is cut by the swing-side cutter 138 and the fixed-side cutter 140. At this time, the radial lead members 78 are separated from the carrier tape 80, and the component tape 72 becomes a carrier tape (hereinafter, referred to as "waste tape") in a state where the radial lead members 78 are separated.

In the lead cutting device 104, a first air ejector 150 is disposed on the lower surface of the swing-side clamping plate 128. The first air blowing device 150 can blow air from between the swing side clamp plate 128 and the swing side cutter 138 to the lead pins 84 clamped by the fixed side clamp plate 126 and the swing side clamp plate 128 at any timing.

As shown in fig. 6, a second air ejector 152 that ejects air to both the swing side blade 138 and the fixed side blade 140 is disposed in the lead cutting device 104. The second air blowing device 152 is disposed on the rear side of the lead cutting device 104, that is, on the side opposite to the feeding direction of the element tape 72, and can blow air to the cutting edge of the swinging side blade 138 and the cutting edge of the fixed side blade 140 at any timing.

As shown in fig. 3, the tape cutting device 106 is disposed on the front side of the lead cutting device 104, i.e., in the feeding direction of the component tape 72, and includes a fixing arm, a swing arm 162, and a tape cutting cylinder (not shown). The fixed arm 160 and the swing arm 162 are disposed on the front side of the lead cutting device 104 so as to sandwich the waste tape. The fixing arm 160 is fixedly disposed in a posture extending in the vertical direction, and a fixing-side cutter 166 is disposed on a side edge facing the waste tape. The swing arm 162 is disposed in a posture extending in the vertical direction with the waste tape interposed therebetween and facing the fixing arm 160, and is configured to be swingable about a shaft 168 extending in the front-rear direction. A swing-side cutter (not shown) is disposed on a side edge of the swing arm 162 facing the waste tape. The swing arm 162 is controllably swung by the operation of the tape cutting cylinder. With such a configuration, in the tape cutting device 106, the swing arm 162 swings in a direction approaching the fixed arm 160, and the fixed-side cutter 166 and the swing-side cutter cut the waste tape.

As shown in fig. 6 and 7, a discharge path 170 is formed on the front side of the tape cutting device 106, that is, in the feeding direction of the element braid 72. The discharge path 170 is used to discharge the waste tape (hereinafter, referred to as "waste tape piece") cut by the tape cutting device 106 to the outside of the tape feeder 70. The discharge path 170 is composed of a first duct 172 formed to extend in the vertical direction on the front side of the tape cutting device 106, and a second duct (not shown) continuing from the lower end of the first duct 172 and descending as it approaches the rear side. The waste tape extends from between the fixed arm 160 and the swing arm 162 of the tape cutting device 106 at the upper end of the first tube 172, and the rear end of the second tube opens at the rear end of the feeder main body 76.

Therefore, the waste tape pieces cut by the tape cutting device 106 are discharged to the first duct 172, and fall down by their own weight in the first duct 172. Further, an air blower 176 is disposed at an upper end portion of the first duct 172, and the air blower 176 sends air downward inside the first duct 172. Therefore, the waste tape pieces are sent out downward in the first duct 172 by the self weight and the conveyance of air. The waste tape pieces fed downward in the first duct 172 are fed rearward in the second duct by the air from the air blower 176, and are discharged to the outside of the tape feeder 70, which is the feeder main body 76, from the opening on the rear end side of the second duct.

As shown in fig. 2, the guide mechanism 74 is a mechanism for guiding the component braid 72 from the storage box 180 of the component braid 72 into the tape feeder 70, and is disposed at an end portion on the rear side of the tape feeder 70, that is, at an end portion on the opposite side to the feeding direction of the component braid 72. Specifically, the guide mechanism 74 includes a pair of

side walls

186 and 188 and a bottom (see fig. 8) 190. The pair of

side walls

186, 188 are disposed so as to face each other with a predetermined dimension therebetween, and are connected at the lower ends thereof by a bottom 190. As a result, as shown in fig. 8, the cross-sectional shape of the guide mechanism 74 is substantially U-shaped, and the inside of the guide mechanism 74 is a groove 192 having an open upper end. As shown in fig. 2, the guide mechanism 74 is disposed so as to extend in the front-rear direction, and the front end portion of the guide mechanism 74 is coupled to the rear end portion of the tape feeder 70 so as to be easily attachable and detachable by loosening the mounting bolt fastened to the rear end portion of the tape feeder 70 via the keyhole hole. At this time, the rear end of the conveying path 100 of the tape feeder 70 communicates with the front end of the groove 192 of the guide mechanism 74.

Further, a storage box 180 is placed below the guide mechanism 74 connected to the rear end portion of the tape feeder 70, and the component tape 72 is stored in the storage box 180 in a state folded in the lateral direction. Then, one end of the element braid 72 is taken out of the housing box 180, and the one end of the element braid 72 is inserted into the groove 192 of the guide mechanism 74 from the opening on the rear end side of the guide mechanism 74. At this time, as shown in fig. 8, the carrier tape 80 of the component tape 72 enters the groove 192, and the radial pin components 78 taped to the carrier tape 80 extend from the upper end of the groove 192. In the element braid 72 which is taken out from the housing box 180 and inserted into the opening on the rear end side of the guide mechanism 74, the radial pin element 78 is not shown in fig. 2.

Then, the component braid 72 inserted into the groove 192 of the guide mechanism 74 is pushed into the guide mechanism 74, passes through the groove 192 of the guide mechanism 74, changes the angle, and enters the inside of the conveying path 100 of the tape feeder 70 in the longitudinal direction. That is, the groove 192 functions as a guide path for guiding the component tape 72 from the storage box 180 to the tape feeder 70, in other words, as a transport path.

Further, when the component tape 72 is pushed into the guide mechanism 74, the component tape 72 reaches the feeder device 102 of the tape feeder 70. At this time, the claw member of the feeding device 102 engages with the feed hole 88 formed in the element braid 72, and the element braid 72 is fed forward in the conveyance path 100 by controlling the operation of the feeding device 102. In this way, in the guide mechanism 74, the component tape 72 stored in the storage box 180 is guided to the inside of the tape feeder 70, and then is fed forward by the operation of the feeding device 102 in the tape feeder 70, and components are supplied in the above-described order.

As shown in fig. 8, a second wiping device 200 is disposed in the guide mechanism 74. Specifically, an arm 202 extending upward from the side wall 188 is fixed to an upper end portion of the side wall 188 of the guide mechanism 74, and a cleaning brush 204 is disposed at an upper end of the arm 202. The cleaning brush 204 faces the upper end portions of the leads 84 held by the carrier tape 80 inserted into the groove portions 192 of the guide mechanism 74. An arm 206 extending upward from the side wall 186 is also fixed to an upper end portion of the side wall 186, and a cleaning brush 208 is disposed at an upper end of the arm 206. The cleaning brush 208 is in contact with the cleaning brush 204 so as to sandwich the upper end portions of the leads 84 held by the carrier tape 80 inserted into the grooves 192. In the second wiping apparatus 200 including the

arms

202 and 206 and the cleaning brushes 204 and 208, when the component braid 72 is guided to the tape feeder 70 by the groove 192 of the guide mechanism 74, the lead pins 84 braided with the component braid 72 pass between the cleaning brushes 204 and 208.

As shown in fig. 9, a third air blowing device 210 for blowing air to the second wiping device 200 is disposed in the guide mechanism 74. Specifically, a bracket 212 extending upward from the side wall 186 is fixed to the upper end portion of the side wall 186 of the guide mechanism 74 on the front side of the second wiper device 200, and the third air ejector 210 is disposed at the upper end of the bracket 212. The third air blowing device 210 can blow air between the cleaning brush 204 and the cleaning brush 208 of the second wiping device 200 at any timing. The holder 212 is bent so as to avoid the radial pin member 78 extending upward from the groove 192 from contacting the third air ejector 210.

(B) Mounting work by mounting machine

In the mounting machine 14, the mounting work of components is performed on the circuit board by the above-described configuration. Specifically, the circuit substrate is conveyed to the working position by the conveying device 22, and is fixedly held at the position. In addition, in the supply device 28, the radial pin elements 78 are supplied in the feeder-type element supply device 66. Specifically, in the tape feeder 70 of the feeder-type component supply device 66, the component tape 72 is fed forward by a predetermined pitch by the operation of the feeding device 102. The predetermined pitch here is a formation pitch of the feed holes 88 in the component tape 72, and is an arrangement pitch of the radial pin components 78 in the component tape 72. Accordingly, each time the component tape 72 is fed forward by a predetermined pitch, one of the radial pin components 78 moves between the fixed member 120 and the swinging member 122 of the pin cutting device 104.

When one of the radial lead elements 78 moves between the fixed member 120 and the swinging member 122, the lead 84 of the radial lead element 78 is cut by the swinging side cutter 138 and the fixed side cutter 140 by the operation of the lead cutting device 104. At this time, the lead 84 is sandwiched between the fixed-side clamping plate 126 and the swinging-side clamping plate 128 above the cut portion. Therefore, the radial pin element 78 is supplied in a state of being sandwiched by the fixed-side sandwiching plate 126 and the swing-side sandwiching plate 128 at the pin 84. That is, the upper surfaces of fixed-side clamp plate 126 and swing-side clamp plate 128 of lead cutting device 104 are the component supply positions of tape feeder 70.

The carrier tape 80 obtained by taping the radial lead elements 78 by cutting the leads 84 with the lead cutting device 104 becomes a waste tape. Then, as the feeding device 102 feeds the component tape 72, the waste tape is inserted between the fixing arm 160 and the swing arm 162 of the tape cutting device 106. In the tape cutting device 106, each time the lead 84 is cut by the lead cutting device 104, the waste tape is cut by the fixed-side cutter 166 of the fixed arm 160 and the swing-side cutter of the swing arm 162.

The waste tape cut by the tape cutting device 106, that is, the waste tape piece, is discharged to the discharge path 170. In the discharge path 170, the waste tape piece moves downward in the first duct 172 by its own weight and air sent from the air blower 176, and drops to the second duct. The waste tape piece dropped to the second duct is moved backward by the air sent from the air blower 176. Thereby, the waste tape pieces are discharged from the opening on the rear end side of the second duct to the outside of the tape feeder 70.

In this way, in the tape feeder 70, the radial pin components 78 are positioned at the component supply position and supplied to the mounting head 26 in a state of being held by the fixed-side holding plate 126 and the swing-side holding plate 128. In the mounter 14, the mounting head 26 moves above the component supply position of the tape feeder 70 by the operation of the moving device 24, and holds the radial lead component 78 by the suction nozzle 60.

Next, the operation of the moving device 24 is controlled so that the through hole formed in the circuit board and the tip of the lead 84 of the radial lead element 78 overlap in the vertical direction, and the radial lead element 78 held by the suction nozzle 60 is positioned. Then, the suction nozzle 60 holding the radial pin component 78 is lowered, and the pins 84 of the radial pin component 78 are inserted into the through holes of the circuit board, so that the radial pin component 78 is mounted on the circuit board.

(C) Removal of foreign matter adhering to pin

As described above, in the mounting machine 14, the components supplied from the supply device 28 are held by the suction nozzle 60 and mounted on the circuit board. In this case, when the element with some foreign matter adhered thereto is mounted on the circuit board, the circuit board may become a defective product. In particular, since the radial pin components 78 supplied from the tape feeder 70 are supplied after the pins 84 are cut in the tape feeder 70, burrs may adhere to the tip portions of the pins 84. In addition, burrs are generated not only at the distal end portions of the leads 84 by cutting the leads 84, but also at the outer peripheral surfaces of the leads 84 in some cases, regardless of cutting of the leads 84, as whisker-like burrs. In addition, chips generated by cutting, slag carried by the tape, and the like may adhere to the leads 84. The foreign matter herein refers to foreign matter unnecessary as a lead element or a lead element braid or foreign matter with low necessity, and the foreign matter integral with the lead 84 is also included in the foreign matter. That is, although chips, slag, dust, and the like, which are separate from the pins 84, are foreign substances, burrs integral with the pins 84 are also foreign substances.

Therefore, in the mounting machine 14, before the radial pin members 78 are mounted on the circuit board, foreign substances are removed from the radial pin members 78 in the feeder-type component supply device 66. Specifically, in the guide mechanism 74 of the feeder-type component supply device 66, as shown in fig. 8, when the component tape 72 is guided to the tape feeder 70 in the groove portion 192 of the guide mechanism 74, the lead pin 84 of the component tape 72 passes between the cleaning brushes 204 and 208 in a state of contact with the second wiping device 200. At this time, the outer peripheral surfaces of the leads 84 are wiped by the cleaning brushes 204, 208, and foreign substances, such as beard-like burrs, dust, and the like, adhering to the outer peripheral surfaces of the leads 84 are removed by the cleaning brushes 204, 208.

In the guide mechanism 74, as shown in fig. 9, the third air blowing device 210 blows air between the cleaning brush 204 and the cleaning brush 208 of the second wiping device 200. At this time, the foreign substances removed by the cleaning brushes 204, 208 are removed from the cleaning brushes 204, 208 by the ejection of air. This prevents foreign matter adhering to the cleaning brushes 204, 208 from adhering to the pins 84 again. The air discharge direction by the third air discharge device 210 is the direction opposite to the feeding direction of the component tape 72, i.e., the direction away from the tape feeder 70. This prevents foreign substances removed from the cleaning brushes 204, 208 by the ejection of air from entering the tape feeder 70. The third air blowing device 210 blows air during the feeding of the component tape 72 by the feeding device 102 and at a predetermined time after the completion of the feeding of the component tape 72. Thus, the foreign matter is blown off by the air at the timing when the foreign matter is removed by the cleaning brushes 204, 208, and therefore, the foreign matter can be prevented from entering into the cleaning brushes 204, 208.

In this way, in the guide mechanism 74, before the component tape 72 enters the inside of the tape feeder 70, foreign substances are removed from the leads 84 of the radial lead components 78 taped to the component tape 72. This can suppress the entry of foreign matter into the tape feeder 70, prevent the mounting of components on the circuit board in a state where foreign matter is adhered, and suppress the occurrence of defective boards.

In the tape feeder 70, foreign matter is removed from the leads 84 in the component tape 72 conveyed in the conveying path 100. In detail, in the lead cutting device 104, when the lead 84 is clamped by the fixed-side clamping plate 126 and the swing-side clamping plate 128, that is, when the radial lead component 78 is supplied at the component supply position, air is ejected toward the lead 84 by the first air ejection device 150. The first air ejection device 150 is fixed to the lower surface of the swing-side clamping plate 128 disposed directly above the swing-side cutter 138, and ejects air toward the cutting edge of the swing-side cutter 138 above the swing-side cutter 138.

The first air ejector 150 ejects air when the swing side blade 138 is closest to the fixed side blade 140 and swings in a direction away from the fixed side blade 140 in accordance with the operation for cutting the leads 84 by the lead cutting device 104. That is, the first air blowing device 150 blows air to the cutting portion of the lead, that is, the tip portion of the new lead by cutting after the lead 84 is cut by the swing side cutter 138 and the fixed side cutter 140. As a result, burrs generated when the lead 84 is cut by the swing side cutter 138 and the fixed side cutter 140 can be removed from the lead 84 by the ejection of air. Further, for example, in the case where dust or the like adheres to the cutting edge of the swinging-side cutter 138 or the like, even in the case where the dust or the like adheres to the tip portion of the lead at the time of cutting the lead, the dust or the like can be removed by the ejection of air.

In the tape feeder 70, in a state where the lead 84 is held between the fixed-side holding plate 126 and the swing-side holding plate 128 at the leading end portion thereof, the upper end portion of the lead, that is, the base end portion on the main body 82 side is held by the fixed-side cleaning brush 132 and the swing-side cleaning brush 136 of the first wiping device 129 at the component supply position. Therefore, when the radial pin components 78 supplied by the component supply device are held by the suction nozzle 60 and moved from the component supply position, the outer peripheral surfaces of the pins are wiped by the fixed side cleaning brush 132 and the oscillating side cleaning brush 136.

Specifically, when the radial pin element 78 is held by the suction nozzle 60 in a state where the leading end portion of the pin is sandwiched between the fixed-side sandwiching plate 126 and the swing-side sandwiching plate 128, the swing member 122 swings in a direction away from the fixed member 120. Thereby, the clamping of the lead by the fixed-side clamping plate 126 and the swing-side clamping plate 128 is released. Then, at a timing when the clamping of the pins by the fixed-side clamping plate 126 and the swing-side clamping plate 128 is released, the suction nozzles 60 holding the radial pin elements 78 are raised. When the swing member 122 swings in a direction away from the fixed member 120, the swing side cleaning brush 136 also swings in a direction away from the fixed side cleaning brush 132, but the tips of the brushes contact each other in the fixed side cleaning brush 132 and the swing side cleaning brush 136. Therefore, when the suction nozzle 60 holding the radial pin member 78 is raised, the outer peripheral surfaces of the pins 84 are wiped by the fixed side cleaning brush 132 and the swing side cleaning brush 136 which are in contact with each other. Thereby, foreign substances, such as beard-like burrs, dust, and the like, adhering to the outer peripheral surface of the lead 84 are removed by the fixed-side cleaning brush 132 and the oscillating-side cleaning brush 136.

In addition, in tape feeder 70, in pin cutting device 104, as shown in fig. 6, air is ejected toward the cutting edges of oscillating side cutter 138 and fixed side cutter 140 of cutting pin 84 by second air ejection device 152. In addition, the second air ejection device 152 operates in cooperation with the operation of the first air ejection device 150. That is, the second air ejection device 152 ejects air when the swing side cutter 138 is closest to the fixed side cutter 140 and then swings in a direction away from the fixed side cutter 140, as in the first air ejection device 150.

Accordingly, when a burr is generated when the lead 84 is cut by the swing side cutter 138 and the fixed side cutter 140 and the burr adheres to the swing side cutter 138 or the fixed side cutter 140, the burr can be removed from the swing side cutter 138 or the fixed side cutter 140. In addition, when dust and the like attached to the lead before the lead cutting adhere to the swing side blade 138 or the fixed side blade 140 along with the lead cutting, the dust and the like can be removed from the swing side blade 138 or the fixed side blade 140. This prevents foreign matter from being attached again to the lead 84 from the swing side cutter 138 or the fixed side cutter 140. That is, the tool can be periodically cleaned regardless of the type of burr or dust.

In addition, the second air ejection device 152 operates at the same timing as the first air ejection device 150. Therefore, the foreign substances removed from the leads by the ejection of the air from the first air ejection device 150 are also blown off by the air from the second air ejection device 152. The cutting edge of the swing side cutter 138 or the like is located below the base end portion of the lead held between the swing side cleaning brush 136 or the like. Therefore, the foreign substances removed from the pins by the first wiping device 129 are also blown off by the air of the second air blowing device 152. The air blowing direction by the second air blowing device 152 is a direction from the rear of the lead cutting device 104 to the front, and the first duct 172 of the discharge path 170 is arranged in front of the lead cutting device 104. Therefore, the foreign substances blown off by the ejection of the air from the second air ejection device 152 are discharged to the first duct 172 of the discharge path 170. Accordingly, the foreign substances removed by the operations of the first air blowing device 150, the second air blowing device 152, and the first wiping device 129 inside the tape feeder 70 are discharged to the outside of the tape feeder 70 through the discharge path 170. This prevents foreign matter from re-adhering to the inside of tape feeder 70.

In this way, in the tape feeder 70, in a state where the radial pin component 78 is supplied at the component supply position, the radial pin component 78 removes foreign matter from the pin immediately before the mounting work on the circuit board is carried out while being held by the suction nozzle 60. This prevents the element from being mounted on the circuit board in a state where foreign matter is attached, and thus prevents the occurrence of a defective board.

Further, the feeder-type component supply device 66 is an example of a component supply device. The tape feeder 70 is an example of a tape feeder. The element braid 72 is an example of an element braid. The radial pin element 78 is an example of a pin element. Carrier tape 80 is an example of a carrier tape. Pin 84 is an example of a pin. The conveyance path 100 is an example of a conveyance path. The pin cut-off device 104 is an example of a cut-off device. The first wiping device 129 is an example of a foreign substance removal device. The swing side cutter 138 is an example of a cutter. The first air ejection device 150 is an example of a foreign substance removal device. The storage box 180 is an example of a storage section. The groove 192 is an example of a conveyance path. The second wiping apparatus 200 is an example of a foreign substance removal apparatus. The third air ejection device 210 is an example of a foreign substance removal device.

The present invention is not limited to the above-described embodiments, and can be implemented in various forms of modifications and improvements based on knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, the feeder-type component supply device 66 includes the tape feeder 70 and the guide mechanism 74, but may include only the tape feeder 70. That is, the feeder-type component supply device 66 may include at least the tape feeder 70 and the guide mechanism 74. Alternatively, feeder-type component supply device 66 may be configured such that tape feeder 70 and guide mechanism 74 are integrated. The tape feeder is not limited to a radial feeder that supplies the radial pin components 78, and the invention of the present application can be applied to an axial feeder that supplies axial pin components, a normal component tape supply feeder that supplies square chips regardless of pin components, and the like.

In the above embodiment, the first air ejection device 150 and the second air ejection device 152 are operated after the leads are cut in accordance with the operation for cutting the leads by the lead cutting device 104, but may be operated at various timings. Specifically, the first air ejection device 150 and the second air ejection device 152 may be operated at various timings before the lead is cut, during the lead is cut, or the like. In the above embodiment, the first air ejection device 150 and the second air ejection device 152 operate at the same timing, but the first air ejection device 150 and the second air ejection device 152 may operate at different timings.

In the above-described embodiment, the first air ejection device 150 is disposed on the swing-side holding plate 128 constituting the lead cutting device 104, but may be disposed on another component constituting the lead cutting device 104. For example, the tool holder may be disposed on the fixed-side clamp plate 126, the swing-side cutter 138, or the like. That is, the first air ejection device 150 may be a cutter disposed in the lead cutting device 104 or a component of the lead cutting device 104 disposed in the vicinity of the cutter.

In the above-described embodiment, in tape feeder 70, the components are supplied to the locations where the leads are cut by lead cutting device 104, but the cutting position of the leads by lead cutting device 104 may be different from the component supply position.

In the above embodiment, the component braid 72 stored in the storage box 180 is guided by the guide mechanism 74 and inserted into the tape feeder 70, but the component braid 72 wound on a reel or the like may be inserted into the tape feeder 70.

In the above embodiment, the groove 192 of the guide mechanism 74 is used as the path from the storage box 180 to the tape feeder 70, but any path may be used as long as it is between the storage box 180 and the tape feeder 70.

In addition, in the above-described embodiment, the foreign substances are removed from the pins by the ejection of air and the wiping with the brush, but the foreign substances may be removed from the pins by one of the ejection of air and the wiping with the brush.

Description of the reference numerals

66. Feeder-type component supply devices (component supply devices); 70. a tape feeder; 72. braiding the element; 78. a radial pin element (pin element); 80. carrying a tape; 84. a pin; 100. a conveying path; 104. a pin cutting device (cutting device); 129. a first wiping device (foreign matter removing device); 138. swing side cutters (knives); 150. a first air ejection device (foreign matter removal device); 180. a storage box (storage section); 192. a groove portion (conveying path); 200. a second wiping device (foreign matter removing device); 210. a third air ejection device (foreign matter removal device).

Claims

1. A component supply device supplies a lead component from a component tape composed of a plurality of lead components and a carrier tape in which leads of the plurality of lead components are taped to a mounting head for mounting the held lead component on a circuit board at a component supply position,

the component supply device includes:

a conveying path for conveying the component tape to the component supply position; and

a foreign matter removing device that removes foreign matter from the pin elements of the element braid being conveyed in the conveying path,

the component supplying device includes a cutting device having a fixed-side cutter and a swinging-side cutter, the lead is cut by the fixed-side cutter and the swinging-side cutter to separate the lead component from the carrier tape,

the foreign matter removing device operates to remove foreign matter when the swing-side tool swings in a direction away from the fixed-side tool after approaching the fixed-side tool in closest proximity to the fixed-side tool in conjunction with the operation for cutting the lead by the cutting device.

2. The component supplying apparatus according to claim 1,

the foreign matter removing device is disposed in the cutting device.

3. The component supplying apparatus according to claim 1 or 2,

the component supply device includes a tape feeder that feeds the component tape to the component supply position and supplies the pin component at the component supply position,

the foreign matter removing device is disposed in a path from the storage portion of the component braid to the tape feeder.