JP6745128B2 - パラジウム錯体インクを備えるセンサ - Google Patents

パラジウム錯体インクを備えるセンサ Download PDF

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Publication number
JP6745128B2
JP6745128B2 JP2016070327A JP2016070327A JP6745128B2 JP 6745128 B2 JP6745128 B2 JP 6745128B2 JP 2016070327 A JP2016070327 A JP 2016070327A JP 2016070327 A JP2016070327 A JP 2016070327A JP 6745128 B2 JP6745128 B2 JP 6745128B2
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JP
Japan
Prior art keywords
substrate
palladium
sensor
features
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2016070327A
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English (en)
Japanese (ja)
Other versions
JP2016206176A5 (https=
JP2016206176A (ja
Inventor
ツェ・ガー・ウン
シフヘン・コー
イリアン・ウー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Palo Alto Research Center Inc
Xerox Corp
Original Assignee
Palo Alto Research Center Inc
Xerox Corp
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Filing date
Publication date
Application filed by Palo Alto Research Center Inc, Xerox Corp filed Critical Palo Alto Research Center Inc
Publication of JP2016206176A publication Critical patent/JP2016206176A/ja
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Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C10/00—Adjustable resistors
    • H01C10/10—Adjustable resistors adjustable by mechanical pressure or force
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
    • G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
    • G01L1/2287—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges constructional details of the strain gauges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component
    • H01C17/06526—Precursor compositions therefor, e.g. pastes, inks, glass frits or green body characterised by the resistive component composed of metals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Ink Jet Recording Methods And Recording Media Thereof (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP2016070327A 2015-04-21 2016-03-31 パラジウム錯体インクを備えるセンサ Expired - Fee Related JP6745128B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/691,868 2015-04-21
US14/691,868 US10043605B2 (en) 2015-04-21 2015-04-21 Sensors comprising palladium complex ink

Publications (3)

Publication Number Publication Date
JP2016206176A JP2016206176A (ja) 2016-12-08
JP2016206176A5 JP2016206176A5 (https=) 2019-05-09
JP6745128B2 true JP6745128B2 (ja) 2020-08-26

Family

ID=57147965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016070327A Expired - Fee Related JP6745128B2 (ja) 2015-04-21 2016-03-31 パラジウム錯体インクを備えるセンサ

Country Status (2)

Country Link
US (1) US10043605B2 (https=)
JP (1) JP6745128B2 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6821422B2 (ja) * 2016-12-21 2021-01-27 トッパン・フォームズ株式会社 金属薄膜基材の製造方法
CN107329615B (zh) * 2017-06-30 2020-06-16 上海天马微电子有限公司 显示面板及显示装置
DE102017221545B4 (de) 2017-11-30 2024-02-29 Contitech Antriebssysteme Gmbh Flexibles Produkt
US10119869B1 (en) * 2017-12-21 2018-11-06 Tactotek Oy Method for manufacturing a strain gauge device, a strain gauge device, and the use of the device
US10960714B2 (en) * 2018-09-26 2021-03-30 The Goodyear Tire & Rubber Company Tire with printed shear sensors
US10823626B2 (en) 2019-04-01 2020-11-03 General Electric Company Strain sensor printing
JP2021032805A (ja) * 2019-08-28 2021-03-01 Koa株式会社 荷重センサ素子及び荷重センサ素子の製造方法
CN111863364B (zh) * 2020-07-24 2021-07-06 江南大学 一种电阻应变片的打印方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3305817A (en) * 1964-04-02 1967-02-21 Hitachi Ltd Electric strain gauge having platinumpalladium-molybdenum alloy filament
JPS60199642A (ja) * 1984-03-23 1985-10-09 日産化学工業株式会社 感圧導電性ゴム状重合体フイルム
US5242722A (en) * 1990-10-29 1993-09-07 Matsushita Electric Industrial Co., Ltd. Strain sensor
US5184516A (en) * 1991-07-31 1993-02-09 Hughes Aircraft Company Conformal circuit for structural health monitoring and assessment
JP2584201B2 (ja) 1994-01-14 1997-02-26 インターナショナル・ビジネス・マシーンズ・コーポレイション 力変換器、コンピュータ・システムおよびキーボード
US20030016116A1 (en) * 2001-07-23 2003-01-23 Blaha Charles A. Method of depositing a thin metallic film and related apparatus
JP5818150B2 (ja) 2010-11-05 2015-11-18 株式会社Ｇｓユアサ 蓄電素子用電極、それを用いた蓄電素子、および蓄電素子用電極の製造方法
US8574665B2 (en) * 2011-06-06 2013-11-05 Xerox Corporation Palladium precursor composition
KR101586782B1 (ko) * 2011-06-07 2016-01-19 자와하랄 네루 센터 포 어드밴스드 사이언티픽 리서치 금속 및 탄소 매트릭스로부터 변형 감지 센서 및/또는 변형 저항 도관 제조
US9406896B2 (en) * 2014-01-10 2016-08-02 Palo Alto Research Center Incorporated Pre-fabricated substrate for printed electronic devices
US9217093B1 (en) * 2014-05-30 2015-12-22 Xerox Corporation Palladium ink compositions
US10161897B2 (en) * 2015-01-09 2018-12-25 Xerox Corporation Sensors incorporating palladium electrodes

Also Published As

Publication number Publication date
US20160314881A1 (en) 2016-10-27
US10043605B2 (en) 2018-08-07
JP2016206176A (ja) 2016-12-08

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