JP6745073B2 - Conductive pattern sheet, heating plate, vehicle equipped with heating plate, and method for manufacturing heating plate - Google Patents

Description

The present invention is a conductive pattern sheet used for a heat generating plate that generates heat when a voltage is applied, a heat generating plate that generates heat when a voltage is applied, a vehicle provided with a heat generating plate, a method of manufacturing a conductive pattern sheet, and The present invention relates to a method for manufacturing a heating plate.

2. Description of the Related Art Conventionally, as a defroster (defrosting or defrosting) device used for a window glass such as a front window or a rear window of a vehicle, a device in which a heating wire made of tungsten or the like is arranged on the window glass is known. In such a defroster device, the heating wire arranged on the window glass is energized to raise the temperature of the window glass by its resistance heating to remove the fog on the window glass, or to remove snow or ice adhering to the window glass. The occupant's view can be secured by melting or evaporating water droplets. For example, Patent Document 1 discloses a heat-generating glass constituting a defroster device. In this heat-generating glass, a transparent film having heating wires arranged in a mesh pattern is arranged between two glass plates. There is. In the heat-generating glass disclosed in Patent Document 1, the heating wire on the transparent film is formed by patterning a metal film laminated on the transparent film, for example, a metal foil.

JP, 2012-14945, A

By the way, the heat-generating glass needs to have transparency. Therefore, the heating wire of the exothermic glass is formed with an extremely high aperture ratio (non-coverage ratio). That is, the heating wire disclosed in Patent Document 1 is patterned by removing most of the metal film, and the utilization efficiency of the metal film is extremely low. Further, in order to remove most of the metal film, it is necessary to use a large amount of treatment liquid and appropriately dispose of a large amount of treatment liquid.

The present invention has been made in consideration of the above points, and the conductive pattern included in the heat generating plate and the conductive pattern of the conductive pattern sheet used for manufacturing the heat generating plate have a high material utilization rate and are inexpensive. The purpose is to manufacture.

The method for producing a conductive pattern sheet according to the present invention,
A method for producing a conductive pattern sheet used for a heating plate that generates heat when a voltage is applied,
Patterning the first metal film laminated on the substrate,
Forming a second metal layer on the first metal layer formed by patterning the first metal film by an electroplating method.

In the method for producing a conductive pattern sheet according to the present invention, the first metal layer is formed by vapor deposition, sputtering, CVD, PVD, ion plating, electroless plating, or a combination of two or more thereof. , May be formed.

In the method of manufacturing a conductive pattern sheet according to the present invention, the thickness of the second metal layer may be thicker than the thickness of the first metal layer.

The method for manufacturing a heat generating plate according to the present invention is a pair of glass plates, and the conductive pattern of the conductive sheet of the conductive sheet manufactured by the above-described manufacturing method according to the present invention is a conductive layer provided between the pair of glass plates. A pair of glass plates of a laminate including a pattern and a bonding layer provided between at least one of the pair of glass plates and the conductive pattern member are heated and pressed toward each other. It has a process.

The conductive pattern sheet according to the present invention,
A conductive pattern sheet used for a heating plate that generates heat when a voltage is applied,
Base material,
A conductive pattern which is laminated on the base material and includes a conductive thin wire,
The conductive thin wire of the conductive pattern includes a first metal layer and a second metal layer stacked adjacent to the first metal layer,
The first metal layer is formed by patterning a first metal film,
The second metal layer is formed on the first metal layer formed by patterning the first metal film by electroplating.

The heating plate according to the present invention is
A heating plate that generates heat when a voltage is applied,
A pair of glass plates,
A conductive pattern that is arranged between the pair of glass plates and includes a conductive thin wire,
A bonding layer disposed between the conductive pattern and at least one of the pair of glass plates,
The conductive thin wire of the conductive pattern includes a first metal layer and a second metal layer stacked adjacent to the first metal layer,
The first metal layer is formed by patterning a first metal film,
The second metal layer is formed on the first metal layer formed by patterning the first metal film by electroplating.

The vehicle according to the invention comprises a heating plate according to the invention.

According to the present invention, the conductive pattern included in the heat generating plate and the conductive pattern of the conductive pattern sheet used for manufacturing the heat generating plate can be manufactured at low cost with high material utilization rate.

FIG. 1 is a view for explaining one embodiment of the present invention, and is a perspective view schematically showing a vehicle equipped with a heating plate. In particular, FIG. 1 schematically shows an automobile equipped with a heating plate as an example of a vehicle. FIG. 2 is a view of the heat generating plate viewed from the direction normal to the plate surface. FIG. 3 is a cross-sectional view of the heating plate of FIG. FIG. 4 is a plan view showing an example of the pattern shape of the conductive pattern of the heat generating plate. FIG. 5 is a plan view showing another example of the pattern shape of the conductive pattern of the heat generating plate. FIG. 6 is a cross-sectional view showing the cross-sectional shape of the conductive thin wire of the conductive pattern. FIG. 7 is a diagram for explaining an example of the method of manufacturing the heat generating plate. FIG. 8: is a figure for demonstrating an example of the manufacturing method of a heat generating plate. FIG. 9: is a figure for demonstrating an example of the manufacturing method of a heat generating plate. FIG. 10 is a diagram for explaining an example of the method of manufacturing the heat generating plate. FIG. 11: is a figure for demonstrating an example of the manufacturing method of a heat generating plate. FIG. 12 is a diagram for explaining an example of the method of manufacturing the heat generating plate. FIG. 13 is a diagram for explaining an example of the method of manufacturing the heat generating plate. FIG. 14: is a figure for demonstrating an example of the manufacturing method of a heat generating plate. FIG. 15: is a figure for demonstrating the modification of the manufacturing method of a heat generating plate. FIG. 16 is a diagram for explaining a modified example of the method for manufacturing the heating plate. FIG. 17 is a diagram for explaining a modified example of the method for manufacturing the heating plate. FIG. 18 is a diagram for explaining a modified example of the method for manufacturing the heating plate. FIG. 19 is a diagram for explaining a modified example of the method for manufacturing the heating plate. FIG. 20 is a diagram for explaining another modification of the method for manufacturing the heating plate. FIG. 21 is a diagram for explaining another modification of the method for manufacturing the heat generating plate.

An embodiment of the present invention will be described below with reference to the drawings. In addition, in the drawings attached to the present specification, for convenience of illustration and understanding, the scales, vertical and horizontal dimensional ratios, etc. are appropriately changed and exaggerated.

In the present specification, the terms “plate”, “sheet”, and “film” are not distinguished from each other based only on the difference in designation. For example, a "conductive pattern sheet" is a concept that includes members that can be called a plate or a film. Therefore, a "conductive pattern sheet" means a "conductive pattern plate (substrate)" or a "conductive pattern". It cannot be distinguished from the member called "film" only by the difference in designation.

The term "sheet surface (plate surface, film surface)" means the target sheet-shaped member (plate shape) when the target sheet-shaped (plate-shaped, film-shaped) member is viewed as a whole and generally. (A member, a film-like member) refers to a surface that coincides with the plane direction.

In the present specification, “joining” includes not only “main joining” that completely completes joining but also so-called “temporary joining” for temporarily fixing before “main joining”.

Further, as used in the present specification, the shape and geometric conditions and their degrees are specified. For example, terms such as “parallel”, “orthogonal”, and “identical” and length and angle values are strict. Without being bound by the meaning, it should be interpreted including the range to the extent that similar functions can be expected.

1 to 14 are views for explaining an embodiment according to the present invention. Among these, FIG. 1 is a diagram schematically showing an automobile provided with a heat generating plate, FIG. 2 is a diagram of the heat generating plate viewed from a direction normal to the plate surface, and FIG. It is a cross-sectional view of a plate.

As shown in FIG. 1, an automobile 1 as an example of a vehicle has window glasses such as a front window, a rear window, and a side window. Here, an example in which the front window 5 is composed of the heat generating plate 10 is illustrated. Further, the automobile 1 has a power source 7 such as a battery.

FIG. 2 shows the heating plate 10 viewed from the direction normal to the plate surface. Further, FIG. 3 shows a cross-sectional view corresponding to the line III-III of the heat generating plate 10 of FIG. In the example shown in FIG. 3, the heat generating plate 10 includes a pair of glass plates 11 and 12, a conductive pattern sheet 20 disposed between the pair of glass plates 11 and 12, and the glass plates 11 and 12 and the conductive pattern sheet 20. And the bonding layers 13 and 14 for bonding the property pattern sheet 20. Although the heating plate 10 is curved in the examples shown in FIGS. 1 and 2, the heating plate 10 and the glass plates 11 and 12 are shown in other drawings for the sake of simplification of the drawing and easy understanding. Is shown as a flat plate.

The conductive pattern sheet 20 includes a sheet-shaped base material 30, a conductive pattern 40 formed on the base material 30, a wiring portion 15 for energizing the conductive pattern 40, the conductive pattern 40 and the wiring portion. And a connecting portion 16 (also referred to as a bus bar or a bus bar electrode) that connects 15 to each other.

In the example shown in FIG. 2 and FIG. 3, the conductive pattern 40 is energized from the power source 7 such as a battery via the wiring portion 15 and the connection portion 16 made of copper wire or the like, and the conductive pattern 40 is heated by resistance heating. Let The heat generated in the conductive pattern 40 is transmitted to the glass plates 11 and 12 through the bonding layers 13 and 14, and the glass plates 11 and 12 are warmed. As a result, it is possible to remove the fogging caused by the dew condensation on the glass plates 11 and 12. If snow or ice adheres to the glass plates 11 and 12, the snow or ice can be melted. Therefore, the visibility of the occupant is ensured in good condition. Although not shown, a switch is usually inserted (connected in series) between the power supply 7 and the connection portion (bus bar) 16 of the conductive pattern 40 in the wiring portion 15. Then, the switch is closed and the conductor 30 is energized only when the heating plate 10 needs to be heated.

When the glass plates 11 and 12 are used for a front window of an automobile, it is preferable to use a glass plate having a high visible light transmittance so as not to obstruct the visual field of an occupant. Examples of the material of such glass plates 11 and 12 include soda lime glass (blue plate glass), borosilicate glass (white plate glass), quartz glass, soda glass, potash glass and the like. The glass plates 11 and 12 preferably have a transmittance in the visible light region of 90% or more. Here, the visible light transmittance of the glass plates 11 and 12 is measured within a measurement wavelength range of 380 nm to 780 nm using a spectrophotometer (“UV-3100PC” manufactured by Shimadzu Corporation, “JIS K 0115 compliant product”). Is specified as the average value of the transmittances at the respective wavelengths. The visible light transmittance may be lowered by coloring some or all of the glass plates 11 and 12. In this case, it is possible to block direct sunlight and make it difficult to visually recognize the inside of the vehicle from the outside.

Moreover, it is preferable that the glass plates 11 and 12 have a thickness of 1 mm or more and 5 mm or less. With such a thickness, the glass plates 11 and 12 excellent in strength and optical characteristics can be obtained.

The glass plates 11 and 12 and the conductive pattern sheet 20 are bonded via the bonding layers 13 and 14, respectively. As the bonding layers 13 and 14 as described above, layers made of materials having various adhesiveness or tackiness can be used. Further, it is preferable that the bonding layers 13 and 14 have a high visible light transmittance. As a typical bonding layer, a layer made of polyvinyl butyral (PVB) can be exemplified. The thickness of each of the bonding layers 13 and 14 is preferably 0.15 mm or more and 0.7 mm or less.

The heat generating plate 10 is not limited to the illustrated example, and may be provided with other functional layers expected to exhibit a specific function. Further, one functional layer may exhibit two or more functions. For example, the glass plates 11 and 12 of the heat generating plate 10, the bonding layers 13 and 14, and the base material of the conductive pattern sheet 20 described later. A function may be added to at least one of 30. Examples of functions that can be imparted to the heat generating plate 10 include an antireflection (AR) function, a scratch-resistant hard coat (HC) function, an infrared shielding (reflection) function, an ultraviolet shielding (reflection) function, and a polarization function. The antifouling function and the like can be exemplified.

Next, the conductive pattern sheet 20 will be described. The conductive pattern sheet 20 includes a sheet-shaped base material 30, a conductive pattern 40 formed on the base material 30, a wiring portion 15 for energizing the conductive pattern 40, the conductive pattern 40 and the wiring portion. It has the connection part 16 which connects 15 and. The conductive pattern sheet 20 may have substantially the same plane dimensions as the glass plates 11 and 12 and may be arranged over the entire heat generating plate 10, or may be provided on a part of the heat generating plate 10 such as a front portion of a driver's seat. It may be arranged only.

The sheet-shaped base material 30 functions as a base material that supports the conductive pattern 40. The base material 30 is a generally electrically transparent substrate that is transparent in the wavelength range of visible light (380 nm to 780 nm). In the examples shown in FIGS. 2, 4, and 5, the base material 30 has substantially the same dimensions as the glass plates 11 and 12, and has a substantially trapezoidal planar shape.

The resin contained in the base material 30 may be any resin that transmits visible light and can appropriately support the conductive pattern 40, but a thermoplastic resin can be preferably used. Examples of the thermoplastic resin include acrylic resins such as polymethylmethacrylate, polyvinyl chloride, polyethylene terephthalate (PET), amorphous polyethylene terephthalate (A-PET), polyester resins such as polyethylene naphthalate (PEN), polyethylene and polypropylene. Polyester such as polymethylpentene and cyclic polyolefin, polyethylene resin, polyolefin resin such as polypropylene, cellulose resin such as triacetyl cellulose (cellulose triacetate), polystyrene, polycarbonate resin, AS resin and the like. Above all, acrylic resins and polyvinyl chloride are preferable because they have excellent etching resistance, weather resistance, and light resistance.

In addition, the base material 30 preferably has a thickness of 0.03 mm or more and 0.3 mm or less in consideration of the holding property of the conductive pattern 40, the light transmittance, and the like.

Next, the conductive pattern 40 will be described with reference to FIGS. 4 and 5. 4 and 5 are plan views of the conductive pattern sheet 20 as viewed from the direction normal to the sheet surface.

The conductive pattern 40 is energized from the power source 7 such as a battery via the wiring portion 15 and the connection portion 16 and generates heat by resistance heating. Then, this heat is transferred to the glass plates 11 and 12 through the bonding layers 13 and 14, so that the glass plates 11 and 12 are warmed.

FIG. 4 shows an example of the pattern shape of the conductive pattern 40. The example shown in FIG. 4 has a plurality of conductive thin wires 41 connecting the pair of connecting portions 16. In the illustrated example, the plurality of conductive thin wires 41 extend from one connecting portion 16 to the other connecting portion 16 in a wavy pattern. The plurality of conductive thin wires 41 are arranged apart from each other in a direction non-parallel to the extending direction of the conductive thin wires 41. In particular, the plurality of conductive thin wires 41 are arranged in the direction orthogonal to the extending direction of the conductive thin wires 41. Each conductive thin wire 41 may extend between the pair of connecting portions 16 in a linear, polygonal line, or sinusoidal pattern in addition to the wavy line pattern.

FIG. 5 shows another example of the pattern shape of the conductive pattern 40. In the example shown in FIG. 5, the conductive thin wires 41 of the conductive pattern 40 are arranged in a mesh pattern that defines a large number of opening regions 44. The conductive pattern 40 includes a plurality of connecting elements 45 extending between two branch points 43 and defining an open area 44. That is, the conductive thin wire 41 of the conductive pattern 40 is configured as a group of a large number of connecting elements 45 forming branch points 43 at both ends.

In the example shown in FIG. 5, the large number of opening regions 44 of the conductive pattern 40 are arranged in a shape and a pitch that do not have repetitive regularity (periodic regularity). In particular, in the illustrated example, a large number of opening regions 44 are arranged so as to correspond to each Voronoi region in the Voronoi diagram. In other words, each connection element 45 of the conductive pattern 40 matches each boundary of the Voronoi region in the Voronoi diagram. Further, each branch point 43 of the conductive pattern 40 coincides with the Voronoi point in the Voronoi diagram. Since this Voronoi diagram is obtained by a known method as disclosed in, for example, Japanese Patent Application Laid-Open No. 2012-178556, detailed description of the method for creating the Voronoi diagram is omitted here.

As still another example, the conductive pattern 40 may be formed of the conductive thin wires 41 arranged in a pattern having a repetitive regularity (periodic regularity) such as a square lattice array or a honeycomb array. Good.

Next, the cross-sectional shape of the conductive thin wire 41 of the conductive pattern 40 will be described with reference to FIG. FIG. 6 is an enlarged view showing a cross section of the conductive pattern sheet 20 corresponding to the line AA in FIGS. 4 and 5.

In the example shown in FIG. 6, the conductive thin wire 41 forming the conductive pattern 40 is a base material in a cross section (hereinafter, also referred to as a main cut surface) orthogonal to the extending direction (longitudinal direction) of the conductive thin wire 41. It has a base end surface 41b forming a surface on the 30 side, a front end surface 41a facing the base end surface 41b, and side surfaces 41c and 41d connecting the front end surface 41a and the base end surface 41b, and has a substantially rectangular cross section as a whole. There is.

The width W of the conductive thin wire 41, that is, the width W of the conductive thin wire 41 along the sheet surface of the base material 30 is preferably 5 μm or more and 20 μm or less. According to the conductive thin wire 41 having such a width W, since the conductive thin wire 41 is sufficiently thinned, the conductive pattern 40 can be effectively made invisible. Further, the height (thickness) H of the conductive thin wire 41, that is, the height (thickness) H of the conductive thin wire 41 along the direction normal to the sheet surface of the base material 30 is set to 5 μm or more and 20 μm or less. It is preferable. With the conductive thin wire 41 having such a height (thickness) H, it is possible to secure sufficient conductivity while having an appropriate resistance value.

As shown in FIG. 6, the conductive thin wire 41 forming the conductive pattern 40 includes a conductive metal including a first metal layer 51 and a second metal layer 52 stacked adjacent to the first metal layer 51. It has a layer 50. In addition, in the example shown in FIG. 6, the conductive thin wire 41 further includes a first dark color layer 53 and a second dark color layer 54 that cover the conductive metal layer 50. The first dark color layer 53 covers the surface of the conductive metal layer 50 on the side of the base material 30 and forms the base end surface 41b of the conductive metal layer 50. The second dark layer 54 covers the surface of the conductive metal layer 50 opposite to the base material 30 and both side surfaces, and forms the front end surface 41 a and both side surfaces 41 c and 41 d of the conductive metal layer 50. doing.

The conductive metal layer 50 is a layer for ensuring the conductivity of the conductive thin wire 41. As a material for forming the first metal layer 51 and the second metal layer 52 that form the conductive metal layer 50, for example, gold, silver, copper, platinum, aluminum, chromium, molybdenum, nickel, titanium, palladium, indium, Tungsten and alloys thereof can be exemplified. On the other hand, the dark color layers 53 and 54 may be layers having a lower visible light reflectance than the conductive metal layer 50, and are dark color layers such as black. The dark-colored layers 53 and 54 make it difficult for the conductive metal layer 50 having a high reflectance to be visually recognized in general, and to ensure a better visual field for the occupant.

Next, an example of a method of manufacturing the heat generating plate 10 will be described with reference to FIGS. 7 to 14. 7 to 14 are cross-sectional views sequentially showing an example of a method for manufacturing the heat generating plate 10.

First, the sheet-shaped base material 30 is prepared. The base material 30 is an electrically insulating resin base material which is transparent, which is generally called, which transmits wavelengths in the visible light wavelength band (380 nm to 780 nm).

Next, as shown in FIG. 7, a dark color film 63 is provided on the base material 30. For example, the dark color film 63 is provided on the base material 30 by a plating method including electric field plating and electroless plating, a sputtering method, a CVD method, a PVD method, an ion plating method, or a method combining two or more of these. it can. Various known materials can be used as the material of the dark color film 63. For example, copper nitride, copper oxide, nickel nitride and the like can be exemplified.

Next, as shown in FIG. 8, the first metal film 61 is provided on the dark color film 63. The first metal film 61 becomes patterned to form the first metal layer 51 of the conductive metal layer 50. As described above, the first metal film 61 is a metal such as gold, silver, copper, platinum, aluminum, chromium, molybdenum, nickel, titanium, palladium, indium, or tungsten, or a nickel-chromium alloy, brass, bronze, or the like. Of one or more of these metal alloys. The first metal film 61 is formed by a vapor deposition method, a sputtering method, a CVD method, a PVD method, an ion plating method, an electroless plating method, or a method combining two or more of these.

The thickness t1 (see FIG. 6) of the first metal film 61 can be, for example, 10 nm or more and 100 nm or less. Even if the thickness of the first metal film 61 is reduced as described above, it can be sufficiently used as a base when the second metal layer 52 is formed by the electroplating method as described later.

Next, as shown in FIG. 9, a resist pattern 65 is provided on the first metal film 61. The resist pattern 65 is a pattern corresponding to the pattern of the conductive pattern 40 to be formed. In the method described here, the resist pattern 65 is provided only in the region that finally forms the conductive pattern 40. The resist pattern 65 can be formed by patterning using a known photolithography technique.

Next, as shown in FIG. 10, the first metal film 61 and the dark color film 63 are etched using the resist pattern 65 as a mask. By this etching, the first metal film 61 and the dark color film 63 are patterned into a pattern substantially the same as the resist pattern 65. The etching method is not particularly limited, and a known method can be adopted. Known methods include, for example, wet etching using an etching solution and plasma etching. In the wet etching, as a corrosive liquid used for the etching process, a publicly known corrosive liquid may be appropriately selected and used depending on the materials of the gold foil and the dark color film (when the dark color film exists). For example, when the metal foil is copper and the dark film is copper(II) oxide (CuO), an aqueous ferric chloride solution is used for both the metal foil and the dark film, or the metal foil portion (copper) is ferric chloride. An aqueous solution is used, and dilute hydrochloric acid is used for the dark color film (copper (II) oxide) portion. Then, as shown in FIG. 11, the resist pattern 65 is removed.

Next, as shown in FIG. 12, the second metal layer 52 is formed on the first metal layer 51 by the electroplating method using the first metal layer 51 formed by patterning the first metal film 61 as an electrode. The second metal layer 52 formed by the electric field plating method is formed only on the first metal layer 51. Then, the conductive metal layer 50 including the first metal layer 51 and the second metal layer 52 is obtained.

The thickness t2 (see FIG. 6) of the second metal layer 52 can be set to such an extent that the conductive metal layer 50 including the first metal layer 51 and the second metal layer 52 has sufficient conductivity. As an example, the thickness t2 (see FIG. 6) of the second metal layer 52 can be set to 1 μm or more and 10 μm or less.

Thereafter, as shown in FIG. 13, the second dark color layer 49 is formed on the surface 41a of the conductive metal layer 50 opposite to the base material 30 and the side surfaces 41c and 41d. The second dark-colored layer 49 is obtained by, for example, performing a darkening treatment (blackening treatment) on a part of the material forming the conductive metal layer 50 to form a metal oxide or a metal sulfide from the part forming the conductive metal layer 50. It is possible to form the second dark color layer 49 of. Alternatively, the second dark color layer 49 may be provided on the surface of the conductive metal layer 50, such as a coating film of a dark color material or a plating layer of nickel, chromium, or the like. Alternatively, the surface of the conductive metal layer 50 may be roughened to provide the second dark color layer 49.

As described above, the conductive pattern sheet 20 shown in FIG. 13 is manufactured. The connecting portion 16 and the wiring portion 15 may be formed integrally with the conductive pattern 40 by using the same material as the conductive pattern 40. Alternatively, the connection portion 16 and the wiring portion 15 prepared separately from the conductive pattern 40 may be provided on the base material 30 so as to be electrically connected to the conductive pattern 40.

Finally, the glass plate 11, the bonding layer 13, the conductive pattern sheet 20, the bonding layer 14, and the glass plate 12 are stacked in this order and heated and pressed. In the example shown in FIG. 14, first, the bonding layer 13 is temporarily bonded to the glass plate 11, and the bonding layer 14 is temporarily bonded to the glass plate 12. Next, the glass plate 11 and the conductive pattern sheet to which the bonding layer 13 is temporarily bonded so that the sides of the glass plates 11 and 12 to which the bonding layers 13 and 14 are temporarily bonded face the conductive pattern sheet 20, respectively. 20, the glass plate 12 to which the bonding layer 14 has been temporarily adhered is stacked in this order, and heated and pressed. Thereby, the glass plate 11, the conductive pattern sheet 20, and the glass plate 12 are joined via the joining layers 13 and 14, and the heat generating plate 10 shown in FIG. 3 is manufactured.

In the present embodiment as described above, the manufacturing method includes a step of patterning the first metal film 61, and an electroplating method on the first metal layer 51 formed by patterning the first metal film 61. And a step of forming the second metal layer 52. When the second metal layer 52 is formed on the first metal layer 51 having a predetermined pattern using the electric field plating method, the second metal layer 52 has the same pattern as the first metal layer 51 on the first metal layer 51. It is formed. That is, in the second metal layer 52, the material forming the second metal layer 52 is provided only in the region necessary for forming the conductive metal layer 50. Therefore, compared with forming the entire conductive metal layer 50 by patterning the metal film, the utilization efficiency of the material can be improved. In the first place, the conductive pattern 40 formed by the conductive metal layer 50 is formed with an extremely high aperture ratio in order to ensure transparency. Therefore, according to the present embodiment, the material utilization efficiency can be dramatically improved. As a result, the manufacturing costs of the conductive pattern sheet 20 and the heat generating plate 10 can be significantly reduced.

Further, according to the present embodiment, the amount of the processing liquid used for patterning can be significantly reduced as compared with the case where the entire conductive metal layer 50 is formed by patterning the metal film. In addition, since the amount of the treatment liquid used is reduced, it is possible to reduce the load at the time of discarding the treatment liquid, and it is preferable not only from a simple cost reduction but also from the viewpoint of environmental problems.

Further, according to the electric field plating method, the metal layer 52 is formed quickly and thickly as compared with the film forming methods such as the vapor deposition method, the sputtering method, the CVD method, the PVD method, the ion plating method and the electroless plating method. be able to. That is, the productivity of the conductive pattern sheet 20 and the heat generating plate 10 can be improved, and the conductive pattern sheet 20 and the heat generating plate 10 can be manufactured in a short time.

Further, when the thickness of the second metal layer 52 is thicker than the thickness of the first metal layer 51, the function and effect of the present embodiment described above, that is, the improvement of the utilization efficiency of the material used for manufacturing the conductive pattern 40, The effects of reducing the amount of the processing liquid used for producing the conductive pattern 40 and shortening the time required for producing the conductive pattern 40 become more remarkable.

The heat generating plate 10 and the conductive pattern 40 of the conductive pattern sheet 20 manufactured by the manufacturing method described in the above embodiment are laminated on the first metal layer 51 and adjacent to the first metal layer 51. The conductive thin wire 51 including the second metal layer 52 is included. The first metal layer 51 is formed by patterning the first metal film. The second metal layer 52 is formed on the first metal layer 51 formed by patterning the first metal film 61 by the electroplating method. The heat generating plate 10 and the conductive pattern sheet 20 having such a conductive pattern 40 improve the utilization efficiency of the material used for manufacturing the conductive pattern 40 described above, and the treatment liquid used for manufacturing the conductive pattern 40. It can be manufactured inexpensively and easily on the basis of the effect of reducing the amount and shortening the time required for manufacturing the conductive pattern 40.

Various modifications can be made to the above-described embodiment. Modifications will be described below with reference to the drawings. In the following description and the drawings used in the following description, for the portions that can be configured in the same manner as the above-described embodiment, the same reference numerals as those used for the corresponding portions in the above-described embodiment are used. A duplicate description is omitted.

A modified example of the method for manufacturing the heating plate 10 will be described with reference to FIGS. 15 to 19 are cross-sectional views sequentially showing a modification of the method for manufacturing the heat generating plate 10.

First, the conductive pattern sheet 20 is produced. The conductive pattern sheet 20 can be manufactured by the method described in the example of the method of manufacturing the heat generating plate 10 described above.

Next, the glass plate 11, the bonding layer 13, and the conductive pattern sheet 20 are stacked in this order, and heated and pressed. In the example shown in FIG. 15, first, the bonding layer 13 is temporarily bonded to the glass plate 11. Next, the glass plate 11 to which the bonding layer 13 is temporarily adhered is attached to the conductive pattern sheet 20 so that the side of the glass plate 11 to which the bonding layer 13 is temporarily adhered faces the conductive pattern sheet 20. The patterns 40 are overlapped from each other and heated and pressed. Thereby, as shown in FIG. 16, the glass plate 11 and the conductive pattern sheet 20 are bonded (temporary bonding or main bonding) via the bonding layer 13.

Next, as shown in FIG. 17, the base material 30 of the conductive pattern sheet 20 is removed. For example, when the conductive pattern sheet 20 is manufactured, a release layer is formed on the base material 30, and the conductive pattern 40 is formed on the release layer. This peeling layer is preferably a layer that is not removed in the step of etching the first metal film 61 and the dark film 63 described above. In this case, the base material 30, the conductive pattern 40, and the bonding layer 13 are bonded via the peeling layer. Then, in the step of removing the base material 30 of the conductive pattern sheet 20, the base material 30 of the conductive pattern sheet 20 is peeled off from the conductive pattern 40 and the bonding layer 13 by using a peeling layer.

As the release layer, for example, an interface release type release layer, an interlayer release type release layer, a cohesive release type release layer, or the like can be used. As the interfacial peeling type peeling layer, a peeling layer having relatively lower adhesiveness with the conductive pattern 40 and the bonding layer 13 than the adhesiveness with the base material 30 can be preferably used. Examples of such a layer include a silicone resin layer, a fluororesin layer, and a polyolefin resin layer. Further, it is also possible to use a peeling layer having a relatively low adhesiveness with the base material 30 as compared with the adhesiveness with the conductive pattern 40 and the bonding layer 13. The interlayer peeling-type peeling layer includes a film having a plurality of layers, and peeling in which the adhesion between the plurality of layers is relatively low as compared with the adhesion between the conductive pattern 40, the bonding layer 13, and the base material 30. The layers can be exemplified. Examples of the cohesive peeling-type peeling layer include a peeling layer in which a filler as a dispersed phase is dispersed in a base resin as a continuous phase.

When an interfacial peeling-type peeling layer having a layer having relatively lower adhesiveness to the conductive pattern 40 and the bonding layer 13 than the adhesiveness to the base material 30 is used as the peeling layer, the peeling layer and the conductive layer A peeling phenomenon occurs between the conductive pattern 40 and the bonding layer 13. In this case, the peeling layer can be prevented from remaining on the conductive pattern 40 and the bonding layer 13 side. That is, the base material 30 is removed together with the release layer. When the base material 30 and the release layer are removed in this manner, the bonding layer 13 is exposed in the opening region 43 of the conductive pattern 40.

On the other hand, when an interfacial peeling type peeling layer is used as the peeling layer, the adhesion between the conductive pattern 40 and the bonding layer 13 is relatively lower than the adhesion between the conductive pattern 40 and the bonding layer 13. A peeling phenomenon occurs between the layer and the substrate 30. As a peeling layer, an interlayer peeling type peeling film having a plurality of layers and having a relatively low adhesiveness between the plurality of layers as compared with the adhesiveness with the conductive pattern 40 and the bonding layer 13 and the base material 30. When a layer is used, a peeling phenomenon occurs between the plurality of layers. When a peeling layer of a cohesive peeling type in which a filler as a dispersed phase is dispersed in a base resin as a continuous phase is used as the peeling layer, a peeling phenomenon occurs due to cohesive failure in the peeling layer.

Finally, the glass plate 11, the bonding layer 13, the conductive pattern 40, the bonding layer 14, and the glass plate 12 are stacked in this order and heated and pressed. In the example shown in FIG. 18, first, the bonding layer 14 is temporarily bonded to the glass plate 12. Next, the glass plate 11, the conductive pattern 40, the bonding layer 13, and the bonding layer 14 are temporarily arranged so that the side of the glass plate 12 to which the bonding layer 14 is temporarily bonded faces the conductive pattern 40 and the bonding layer 13. The adhered glass plates 12 are stacked in this order and heated and pressed. As a result, the glass plate 11, the conductive pattern 40, and the glass plate 12 are bonded (main bonding) via the bonding layers 13 and 14, and the heat generating plate 10 shown in FIG. 19 is manufactured.

According to the heat generating plate 10 shown in FIG. 19, the heat generating plate 10 may not include the base material 30. Thereby, the thickness of the entire heat generating plate 10 can be reduced. Moreover, the number of interfaces in the heat generating plate 10 can be reduced. Therefore, it is possible to suppress deterioration of optical characteristics, that is, deterioration of visibility.

Next, with reference to FIG. 20 and FIG. 21, another modification of the method for manufacturing the heat generating plate 10 will be described. 20 and 21 are cross-sectional views sequentially showing another modification of the method for manufacturing the heat generating plate 10.

First, the glass plate 11 and the conductive pattern sheet 20 are joined (temporarily joined) via the joining layer 13 by the same steps as in the modification of the method for manufacturing the heat generating plate 10 described above. The base material 30 is removed. That is, the glass plate 11, the conductive pattern 40, and the bonding layer 13 which are described in the modified example of the method for manufacturing the heating plate 10 described above with reference to FIG. 17 are obtained.

Next, as shown in FIG. 20, the glass plate 11, the bonding layer 13, the conductive pattern 40, and the glass plate 12 are stacked in this order, and heated and pressed. Thereby, the glass plate 11 and the conductive pattern 40 are bonded (main bonding) via the bonding layer 13, and the glass plate 14 and the glass plate 12 are bonded (main bonding) via the bonding layer 13. .. Then, the heat generating plate 10 shown in FIG. 21 is manufactured.

According to the heat generating plate 10 shown in FIG. 21, the heat generating plate 10 may not include the base material 30 and the bonding layer 14. Thereby, the thickness of the heat generating plate 10 as a whole can be further reduced. Moreover, the number of interfaces in the heat generating plate 10 can be further reduced. Therefore, it is possible to more effectively suppress deterioration of optical characteristics, that is, deterioration of visibility. In addition, since the conductive pattern 40 and the glass plate 12 are in contact with each other, the efficiency of heating the glass plate 12 by the conductive pattern 40 can be increased.

Still another modification will be described. In the above-described embodiment, the plurality of connecting elements 45 included in the conductive pattern 40 each have a linear shape (straight line portion) when viewed from the normal direction of the plate surface of the heat generating plate 10, but this is not a limitation. Alternatively, at least a part of the plurality of connecting elements 45 may have a shape other than a linear shape when viewed from the normal direction of the plate surface of the heat generating plate 10, for example, a curved shape or a polygonal line shape. Specifically, it may have a shape such as an arc shape, a parabola shape, a wavy shape, a zigzag shape, or a combination of a curved line and a straight line. In particular, the number of connecting elements 45 connecting the two branch points 43 as a straight line (straight line segment) is less than 20% of the plurality of connecting elements 45, that is, 80% or more of the plurality of connecting elements 45. Preferably has a shape other than a straight line (straight line segment).

According to the conductive pattern 40 including the connecting element 45 having a shape other than a straight line (straight line portion), the light incident on the side surface of the connecting element 45 having a curved shape, a polygonal line shape, or the like is emitted from the side surface. Diffuse reflection. Accordingly, light (light from headlights of oncoming vehicles, sunlight, etc.) incident on the side surface of the connection element 45 from a certain direction may be reflected by the side surface in a certain direction corresponding to the incident direction. Suppressed. Therefore, it is possible to prevent the reflected light from being viewed by an observer such as a driver and the conductive pattern 40 having the connecting element 45 from being viewed by an observer. As a result, the visibility of the conductive pattern 40 can be prevented from being deteriorated by the observer through the window glass.

The heat generating plate 10 may be used for a rear window, a side window or a sunroof of the automobile 1. Further, it may be used for a transparent portion of windows or doors of vehicles other than automobiles such as railway cars, aircrafts, ships, and spacecrafts.

In addition to the vehicle, the heat generating plate 10 is particularly used in a place that divides the room from the outside, such as a transparent portion of a window or door of a building or a store, a house, a window or door of a building, a refrigerator, an exhibition box, a cabinet, or the like. It can also be used as a transparent part of windows or doors for storage or storage facilities.

Although some modifications of the above-described embodiment have been described above, it is of course possible to appropriately combine and apply a plurality of modifications.

DESCRIPTION OF SYMBOLS 1 Car 5 Front window 7 Power supply 10 Heating plate 11 Glass plate 12 Glass plate 13 Bonding layer 14 Bonding layer 15 Wiring part 16 Connection part 20 Conductive pattern sheet 30 Base material 40 Conductive pattern 41 Conductive thin wire 41a Tip surface 41b Base end surface 41c Side surface 41d Side surface 43 Branch point 44 Opening area 45 Connection element 50 Conductive metal layer 51 First metal layer 52 Second metal layer 53 First dark color layer 54 Second dark color layer 61 First metal film 63 Dark color film 65 Resist pattern

Claims (9)

A method of manufacturing a heating plate that generates heat when a voltage is applied,
A base material, a step of preparing a conductive pattern sheet having a conductive pattern laminated on the base material,
A glass plate, the conductive pattern sheet, the glass plate of the laminate including the bonding layer provided between the glass plate and the conductive pattern of the conductive pattern sheet, and the conductive pattern sheet And heating and pressing toward each other, the step of bonding the bonding layer to the glass plate and the conductive pattern,
Removing the base material from the conductive pattern sheet bonded to the glass plate through the bonding layer,
Another bonding layer and another glass plate are arranged on the side opposite to the bonding layer and the glass plate of the conductive pattern, and the glass plate and the other glass plate are heated and pressed toward each other. And a step of bonding the another bonding layer to the another glass plate and the conductive pattern, the method for manufacturing a heating plate. The method for manufacturing a heat generating plate according to claim 1, wherein the conductive pattern sheet further has a release layer provided on the base material and located between the base material and the conductive pattern. The method for manufacturing a heating plate according to claim 1, wherein the base material is a resin film having visible light transparency. The heat conductive plate according to any one of claims 1 to 3, wherein the conductive pattern includes a conductive metal layer and a dark color layer located between the conductive metal layer and the base material. Production method. A step of preparing a laminated body having a glass plate, a bonding layer provided on the glass plate, and a conductive pattern bonded to the glass plate via the bonding layer;
Another bonding layer and another glass plate are arranged on the side of the conductive pattern of the laminate, and the glass plate and the other glass plate are heated and pressed toward each other, and the another bonding layer. And a step of joining the another glass plate and the conductive pattern to each other. The conductive pattern includes a first metal layer and a second metal layer, which are sequentially stacked,
The thickness of the said 2nd metal layer is thicker than the thickness of the said 1st metal layer, The manufacturing method of the heat generating plate as described in any one of Claims 1-4. A heating plate that generates heat when a voltage is applied,
A pair of glass plates,
A conductive pattern that is arranged between the pair of glass plates and includes a conductive thin wire,
A bonding layer disposed between the conductive pattern and one of the pair of glass plates,
Another bonding layer arranged between the conductive pattern and the other of the pair of glass plates, and,
The conductive thin wire includes a first metal layer and a second metal layer that have different thicknesses and are stacked on each other.
The bonding layer is in contact with the one of the conductive pattern and the pair of glass plates to bond to the one of the conductive pattern and the pair of glass plates,
The said another joining layer is a heat-generating plate which contacts the said conductive pattern and the said other of said pair of glass plates, and is joined to the said conductive pattern and the said other of said pair of glass plates. A heating plate that generates heat when a voltage is applied,
A pair of glass plates,
A conductive pattern that is arranged between the pair of glass plates and includes a conductive thin wire,
A bonding layer disposed between the conductive pattern and one of the pair of glass plates,
Another bonding layer arranged between the conductive pattern and the other of the pair of glass plates, and,
The conductive thin wire includes a conductive metal layer and a dark color layer covering the periphery of the conductive metal layer,
The bonding layer is in contact with the one of the conductive pattern and the pair of glass plates to bond to the one of the conductive pattern and the pair of glass plates,
The said another joining layer is a heat-generating plate which contacts the said conductive pattern and the said other of said pair of glass plates, and is joined to the said conductive pattern and the said other of said pair of glass plates. A vehicle comprising the heating plate according to claim 7.

Images