JP6540037B2 - Heater plate and vehicle - Google Patents

Description

  The present invention relates to a heat generating plate having a pair of glass plates and a conductor disposed between the pair of glass plates, and a vehicle having the heat generating plate.

  Conventionally, as a defroster apparatus used for window glasses, such as a front window of vehicles, and a rear window, what arranged a heating wire which consists of tungsten wires etc. over the whole window glass is known (for example, refer to patent documents 1). In this prior art, the heating wire disposed throughout the window glass is energized, and the resistance heating causes the window glass to rise in temperature to remove the fogging of the window glass or melt snow or ice adhering to the window glass. Thus, the visibility of the occupant can be secured.

  The heat generating plate disclosed in Patent Document 1 includes a conductor including a pair of bus bars and a linear conductor connecting the pair of bus bars. In this conductor, each linear conductor is separated from the other linear conductor and extends between the pair of bus bars. According to such a conductor, it is possible to suppress the generation of a diffraction image called a light beam.

Korean Patent Publication 10-2009-0113757

  However, heat generation unevenness is likely to occur due to the disconnection of the linear conductor. The present invention has been made in consideration of the above points, and an object of the present invention is to provide a heat generating plate capable of suppressing both the light and uneven heat generation.

The heat generating plate in the present invention is
A heating plate that generates heat when a voltage is applied.
With a pair of glasses,
A conductor disposed between the pair of glasses and to which a voltage is applied;
And a bonding layer disposed between the conductor and at least one of the pair of glasses,
The conductor includes a pair of bus bars and a plurality of linear conductors linearly extending between the pair of bus bars,
Each linear conductor intersects at least one other linear conductor.

  In the heat generating plate in the present invention, each linear conductor may intersect with a plurality of other linear conductors.

  In the heat generating plate in the present invention, all of the plurality of linear conductors may be electrically connected to each other directly or indirectly in a region between the pair of bus bars.

  A vehicle according to the invention comprises any of the heating plates according to the invention described above.

  According to the present invention, it is possible to effectively suppress both the light haze and the heat generation unevenness.

FIG. 1 is a view for explaining an embodiment according to the present invention, and is a perspective view schematically showing a vehicle provided with a heat generating plate. In particular, FIG. 1 schematically shows, as an example of a vehicle, a vehicle provided with a front window constituted by a heating plate. FIG. 2 is a view showing the heat generating plate from the normal direction of the plate surface. FIG. 3 is a cross-sectional view of the heat generating plate taken along line III-III in FIG. FIG. 4 is a plan view showing the conductor in the normal direction of the sheet surface, and is a plan view showing an example of the conductor. FIG. 5 is a cross-sectional view of the conductor at line V-V in FIG. FIG. 6 is a figure for demonstrating an example of the manufacturing method of a heat-generating plate. FIG. 7 is a figure for demonstrating an example of the manufacturing method of a heat-generating plate. FIG. 8 is a view for explaining an example of a method of manufacturing a heat generating plate. FIG. 9 is a figure for demonstrating an example of the manufacturing method of a heat-generating plate. FIG. 10 is a diagram for explaining an example of a method of manufacturing a heat generating plate. FIG. 11 is a figure for demonstrating an example of the manufacturing method of a heat-generating plate. FIG. 12 is a figure for demonstrating an example of the manufacturing method of a heat-generating plate. FIG. 13 is a view for explaining a modification of the heat generating plate. FIG. 14 is a view for explaining a modification of the heat generating plate. FIG. 15 is a view for explaining a modification of the heat generating plate. FIG. 16 is a view for explaining a modification of the heat generating plate. FIG. 17 is a view for explaining a modification of the heat generating plate. FIG. 18 is a view for explaining another modified example of the heat generating plate. FIG. 19 is a view for explaining another modified example of the heat generating plate.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of easy illustration and understanding, the scale, vertical and horizontal dimensional ratios, etc. are exaggerated and changed from those of a real thing as appropriate.

  In the present specification, the terms "plate", "sheet" and "film" are not distinguished from one another based only on the difference in designation. For example, "conductor-attached sheet" is a concept including a member that may be called a plate or a film, and thus "conductor-attached sheet" is a "conductor-attached plate (substrate)" or "conductor-attached" It can not be distinguished only by the difference of a name and the member called film.

  In addition, “sheet surface (plate surface, film surface)” refers to a sheet-like member (plate-like member (plate-like member) when the target sheet-like (plate-like, film-like) member is viewed globally and generally. It refers to the surface that coincides with the planar direction of the member (film-like member).

  In the present specification, the term "joining" includes not only "main joining" which completely completes joining, but also so-called "temporary joining" for temporarily fixing before "main joining".

  Furthermore, as used herein, the terms such as “parallel”, “orthogonal”, “identical”, values of length and angle, etc. that specify the shape and geometric conditions and their degree, etc. Without being bound by the meaning, it shall be interpreted including the extent to which the same function can be expected.

  FIGS. 1-19 is a figure for demonstrating one Embodiment by this invention, and its modification. Among these, FIG. 1 is a view schematically showing an automobile provided with a heat generating plate, FIG. 2 is a view of the heat generating plate as viewed from the normal direction of the plate surface, and FIG. It is a cross-sectional view of a board.

  As shown in FIG. 1, an automobile 1 as an example of a vehicle has window glass such as a front window, a rear window, and a side window. Here, an example in which the front window 5 is formed of the heat generating plate 10 will be described. In addition, the automobile 1 has a power source 7 such as a battery.

  As shown in FIGS. 2 and 3, the heating plate 10 in the present embodiment includes a pair of glasses 11 and 12, a conductive sheet 20 disposed between the pair of glasses 11 and 12, and each glass 11. , 12 and the sheet 20 with a conductor, and a pair of bonding layers 13 and 14. In the example shown in FIGS. 1 and 2, the heating plate 10 and the glasses 11 and 12 are curved, but in the other drawings, the heating plate 10 and the glasses 11 and 12 are flat for easy understanding. It is illustrated by.

  The sheet with conductor 20 has a base 25, and a conductor 30 provided on the surface of the base 25 facing the glass 11 and including the linear conductor 31 and the bus bar 35.

  Further, as well shown in FIGS. 1 and 2, the heat generating plate 10 has a wiring portion 15 for energizing the conductor 30. In the illustrated example, the conductor 30 is energized from the power source 7 such as a battery via the wiring portion 15, and the linear conductor 31 of the conductor 30 is heated by resistance heating. The heat generated by the conductor 30 is transferred to the glass 11, 12, and the glass 11, 12 is warmed. As a result, it is possible to remove the fogging due to the condensation adhering to the glasses 11 and 12. Moreover, when snow or ice adheres to the glass 11, 12, this snow or ice can be melted. Therefore, the visibility of the occupant is well secured.

  Hereinafter, each component of the heat generating plate 10 will be described.

  First, the glasses 11 and 12 will be described. When the glass 11, 12 is used for the front window of a car as in the example shown in FIG. 1, it is preferable to use one having a high visible light transmittance so as not to obstruct the view of the occupant. As a material of such glass 11 and 12, soda lime glass and blue plate glass can be exemplified. The glasses 11 and 12 preferably have a transmittance of 90% or more in the visible light region. Here, the visible light transmittance of the glasses 11 and 12 was measured using a spectrophotometer ("UV-3100 PC" manufactured by Shimadzu Corporation, a product conforming to JIS K 0115) at a measurement wavelength of 380 nm to 780 nm. It is specified as the average value of the transmittance at each wavelength. The visible light transmittance may be lowered by coloring a part or the whole of the glasses 11 and 12 or the like. In this case, it is possible to block the direct sunlight and to make it difficult to visually identify the inside of the vehicle from the outside.

  The glasses 11 and 12 preferably have a thickness of 1 mm or more and 5 mm or less. Glass 11 and 12 excellent in intensity | strength and an optical characteristic can be obtained as it is such thickness. The pair of glasses 11 and 12 may be configured the same by the same material, or may be different from each other in at least one of the material and the configuration.

  Next, the bonding layers 13 and 14 will be described. The bonding layer 13 is disposed between the glass 11 and the conductive sheet 20, and bonds the glass 11 and the conductive sheet 20 to each other. The bonding layer 14 is disposed between the glass 12 and the conductive sheet 20 to bond the glass 12 and the conductive sheet 20 to each other.

  As such bonding layers 13 and 14, layers made of materials having various adhesiveness or adhesiveness can be used. In addition, it is preferable that the bonding layers 13 and 14 have high visible light transmittance. As a typical bonding layer, a layer made of polyvinyl butyral (PVB) can be exemplified. The thickness of each of the bonding layers 13 and 14 is preferably 0.15 mm or more and 1 mm or less. The pair of bonding layers 13 and 14 may be made of the same material and be the same, or may be different from each other in at least one of the material and the structure.

  In addition, the heating plate 10 is not limited to the illustrated example, and may be provided with other functional layers expected to exhibit a specific function. In addition, one functional layer may exhibit two or more functions, and, for example, the glass 11, 12 of the heating plate 10, the bonding layers 13, 14, and the base 25 of the sheet 20 with a conductor described later. Some function may be added to at least one of Examples of functions that can be imparted to the heat generating plate 10 include, for example, an anti-reflection (AR) function, a hard coat (HC) function having scratch resistance, an infrared ray shielding (reflection) function, an ultraviolet ray shielding (reflection) function, and antifouling A function etc. can be illustrated.

  Next, the conductive sheet 20 will be described. The sheet with conductor 20 has a base 25, and a conductor 30 provided on the surface of the base 25 facing the glass 11 and including the linear conductor 31 and the bus bar 35. The sheet 20 with a conductor may have substantially the same planar dimensions as the glasses 11 and 12 and may be disposed over the entire heat generating plate 10, or the heat generating plate 10 in the front part of the driver's seat in the example of FIG. It may be arranged only in a part of

  The substrate 25 functions as a substrate for supporting the conductor 30. The substrate 25 is an electrically insulating substrate that is generally transparent and transmits a wavelength (380 nm to 780 nm) in the visible light wavelength band. The base material 25 may be made of any material as long as it transmits visible light and can properly support the conductor 30. For example, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polystyrene, cyclic polyolefin, etc. It can be mentioned. In addition, in consideration of the light transmittance, the appropriate supportability of the conductor 30, and the like, the substrate 25 preferably has a thickness of 0.03 mm or more and 0.20 mm or less.

  Next, the conductor 30 will be described with reference to FIGS. 4 and 5. FIG. 4 is a plan view showing the conductor 30 from the normal direction of the sheet surface. FIG. 4 is a view showing an example of the arrangement of the conductors 30. As shown in FIG. FIG. 5 is a cross-sectional view of the conductor 30 corresponding to the line V-V in FIG.

  As described above, the conductor 30 has the pair of bus bars 35 connected to the corresponding wiring portion 15 and the plurality of linear linear conductors 31 connecting the pair of bus bars 35. The linear conductor 31 is energized from a power source 7 such as a battery via the wiring portion 15 and the bus bar 35, and generates heat due to resistance heating. Then, the heat is transmitted to the glasses 11 and 12 through the bonding layers 13 and 14 to warm the glasses 11 and 12.

  In the example shown in FIG. 4, the plurality of linear conductors 31 each extend in a wavy shape from one bus bar 35 to the other bus bar 35. The wavy shape of the linear conductor 31 is irregularly bent. The plurality of linear conductors 31 are arranged apart from each other in a direction not parallel to the extending direction of the linear conductors 31. In particular, the plurality of linear conductors 31 are arranged in a direction orthogonal to the extending direction of the linear conductors 31. At this time, the arrangement interval of the linear conductors 31 is irregular. However, the bends and the arrangement intervals of the linear conductors 31 are irregular, but are arranged so as not to generate heat generation unevenness when energized. As such a wavy line, in the present embodiment, a curve obtained by modulating a sine curve, y = Asin (ax + b) + cx is used. Here, x is a coordinate in the vertical direction in FIG. 4 and y is a coordinate in the horizontal direction in FIG. Then, one or more of the amplitude A, wavelength (wave number, or spatial frequency) a, phase b, and position c of the node of the sine curve of the sine curve satisfy the design conditions of the above-mentioned broken line The modulation is used. The wavy line used in the present invention is not limited to the example of 此, and in addition to 其, the amplitude, phase, and / or various periodic function curves such as Bessel function curve, elliptic function curve, hyperbolic sine curve, etc. Alternatively, it is also possible to use a curve in which the wavelength is appropriately modulated. Alternatively, the linear conductor 31 may be in the form of a broken line formed by connecting straight line segments. When the linear conductors 31 are irregularly arranged as described above, the generation of the light beam can be effectively suppressed.

  Each linear conductor 31 intersects at least one other linear conductor, as shown in region A of FIG. Thereby, each linear conductor 31 can be stably and electrically connected to at least one other linear conductor. In the conductor 30 having such a configuration, even if the wire conductor 31 is broken at a location, it is possible to make it difficult to generate heat generation unevenness.

  Further, in the example shown in FIG. 4, a certain linear conductor 31 is in contact with another linear conductor in a region B other than the intersection indicated by the region A. Further, in the example shown in FIG. 4, the arrangement order of the linear conductors 31 when connecting to one of the bus bars 35 by the intersection of the two linear conductors shown in the region C, and the other The arrangement order of the linear conductors 31 when connecting to the bus bar 35 is different. According to these configurations, it is possible to effectively suppress the generation of heat generation unevenness due to the disconnection while simultaneously suppressing the generation of the light haze.

  Then, ideally, all of the plurality of linear conductors 31 are electrically connected to each other directly or indirectly in the region between the pair of bus bars 35. That is, ideally, even if the pair of bus bars 35 is excluded, all of the plurality of linear conductors 31 are conductive, in other words, the plurality of linear conductors are not conducted via the pair of bus bars 35 All of the body 31 is in conduction. According to such a configuration, it is possible to more effectively suppress the occurrence of heat generation unevenness due to the disconnection while suppressing the occurrence of the light haze more effectively.

  Examples of materials for forming such a conductor 30 include metals such as gold, silver, copper, platinum, aluminum, chromium, molybdenum, nickel, titanium, palladium, indium, tungsten, and nickel-chromium alloy. One or more alloys of two or more metals selected from these exemplified metals such as brass and the like can be exemplified.

  The conductor 30 can be formed using an opaque metal material as described above. On the other hand, the linear conductor 31 of the conductor 30 is formed with a high non-coverage of about 70% or more and 90% or less. The line width of the linear conductor 31 is about 2 μm to 20 μm. For this reason, the area | region in which the linear conductor 31 of the conductor 30 is formed is grasped | ascertained transparent as a whole, and it does not impair visibility.

  In the example shown in FIG. 5, the linear conductor 31 has a rectangular cross section as a whole. The width W of the linear conductor 31, that is, the width W along the plate surface of the heat generating plate 10 is 2 μm to 20 μm, and the height (thickness) H, that is, the normal direction to the plate surface of the heat generating plate 10 The height (thickness) H along the line is preferably in the range of 1 μm to 60 μm. According to the linear conductor 31 of such a size, since the linear conductor 31 is sufficiently thinned, the conductor 30 can be effectively made invisible.

  In addition, as shown in FIG. 5, the linear conductor 31 is a first dark-colored layer covering the surface of the conductive metal layer 36 and the surface of the conductive metal layer 36 facing the substrate 25. 37, the surface of the conductive metal layer 36 includes a second dark layer 38 covering the side facing the glass 11 and both side faces.

  The conductive metal layer 36 made of a metal material having excellent conductivity exhibits relatively high reflectance. When the light is reflected by the conductive metal layer 36 forming the linear conductor 31 of the conductor 30, the reflected light may be visually recognized, which may hinder the view of the occupant. In addition, when the conductive metal layer 36 is visually recognized from the outside, the designability may be reduced. Therefore, the first and second dark layers 37 and 38 are disposed on at least a portion of the surface of the conductive metal layer 36. The first and second dark layers 37 and 38 may be any layer having a lower visible light reflectance than the conductive metal layer 36, and may be, for example, a dark layer such as black. The dark colored layers 37 and 38 make it difficult for the conductive metal layer 36 to be visually recognized, and the visibility of the occupant can be well maintained. Moreover, the fall of the designability when it sees from the outside can be prevented.

  Note that, as described above, the linear conductor 31 of the conductor 30 is formed on the base 25 with a high non-coverage from the viewpoint of securing the transparency or the visibility. For this reason, as shown in FIG. 3, the bonding layer 13 and the base 25 of the sheet with conductor 20 form a non-covered portion of the linear conductor 31, that is, a region between adjacent linear conductors 31. I am in contact with you. Therefore, the conductor 30 is embedded in the bonding layer 13.

  Next, an example of a method of manufacturing the heat generating plate 10 will be described with reference to FIGS. 6 to 12 are sectional views sequentially showing an example of a method of manufacturing the heat generating plate 10. As shown in FIG.

  First, as shown in FIG. 6, a dark film 37 a is formed on the base 25 so as to form the first dark layer 37. The substrate 25 may be made of any material as long as it can properly hold the conductor 30. Examples of the substrate 25 include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polystyrene and cyclic polyolefin. Further, in consideration of the retentivity and the like of the conductor 30, the thickness of the base 25 is preferably 30 μm or more and 150 μm or less. The dark film 37a can be provided by, for example, a plating method including electrolytic plating and electroless plating, a sputtering method, a CVD method, a PVD method, an ion plating method, or a combination of two or more of these. Various known materials can be used as the material of the dark film 37a. For example, copper nitride, copper oxide, nickel nitride and the like can be exemplified.

  Next, as shown in FIG. 7, a metal film 36a for forming the conductive metal layer 36 is provided on the dark film 37a. The metal film 36a is gold, silver, copper, platinum, aluminum, chromium, molybdenum, nickel, titanium, palladium, indium, tungsten, and their alloys, as already described as the material of the conductive metal layer 36. It may be formed using one or more. The metal film 36a can be formed by a known method. For example, a method of sticking metal foil such as copper foil, a plating method including electrolytic plating and electroless plating, a sputtering method, a CVD method, a PVD method, an ion plating method, or a combination of two or more of these is adopted. can do.

  Next, as shown in FIG. 8, a resist pattern 39 is provided on the metal film 36a. The resist pattern 39 has a shape corresponding to the conductor 30 to be formed. In the method described here, the resist pattern 39 is provided only on the portion which finally forms the conductor 30. The resist pattern 39 can be formed by patterning using a known photolithography technique.

  Next, as shown in FIG. 9, the metal film 36a and the dark film 37a are etched using the resist pattern 39 as a mask. By this etching, the metal film 36 a and the dark film 37 a are patterned in substantially the same pattern as the resist pattern 39. As a result, a conductive metal layer 36 which becomes a part of the linear conductor 31 is formed from the patterned metal film 36 a. In addition, a first dark layer 37 is formed from the patterned dark film 37 a so as to form a part of the linear conductor 31.

  The etching method is not particularly limited, and a known method can be employed. Examples of known methods include wet etching using an etching solution and plasma etching. Thereafter, as shown in FIG. 10, the resist pattern 39 is removed.

  Next, as shown in FIG. 11, the second dark layer 38 is formed on the surface 31a opposite to the surface 31b on which the first dark layer 37 of the conductive metal layer 36 is provided and the side surfaces 31c and 31d. The second dark color layer 38 is obtained, for example, by subjecting a part of the material of the conductive metal layer 36 to a darkening treatment (blackening treatment) to form a part of the conductive metal layer 36 from metal oxide or metal sulfide. A second dark colored layer 38 can be formed. Further, the second dark layer 38 may be provided on the surface of the conductive metal layer 36, such as a coating of a dark material, a plating layer of nickel, chromium or the like. Alternatively, the second dark layer 38 may be provided by roughening the surface of the conductive metal layer 36.

  Finally, as shown in FIG. 12, the bonding layer 13 and the glass 11 are stacked from the side of the conductor 30 to bond the sheet with conductor 20 and the glass 11. Similarly, the bonding layer 14 and the glass 12 are laminated from the side of the base material 25 to bond the conductive sheet 20 and the glass 12. Thereby, the heating plate 10 shown in FIG. 3 is manufactured.

  As described above, heating plate 10 in the present embodiment includes conductor 30 to which voltage is applied between a pair of glasses 11 and 12, a pair of glasses 11 and 12, and a pair of conductors 30. The conductor 30 includes a pair of bus bars 35 and a plurality of linear conductors 31 linearly extending between the pair of bus bars 35. , And each linear conductor 31 intersects at least one other linear conductor 31. According to such a heat generating plate 10, it is possible to suppress the light haze and to suppress the heat generation unevenness caused by the disconnection of the linear conductor 31.

  Moreover, in the heat generating plate 10 in the present embodiment, each linear conductor 31 intersects with a plurality of other linear conductors 31. According to such a heat generating plate 10, it is possible to further suppress the heat generation unevenness caused by the disconnection of the linear conductor 31.

  Furthermore, in the heat generating plate 10 in the present embodiment, all of the plurality of linear conductors 31 are electrically connected directly or indirectly to each other in the region between the pair of bus bars 35. According to such a heat generating plate 10, it is possible to further suppress the heat generation unevenness caused by the disconnection of the linear conductor 31.

  Note that various modifications can be made to the embodiment described above. Hereinafter, modifications will be described with reference to the drawings as appropriate. In the following description and the drawings used in the following description, with respect to parts that can be configured in the same manner as the above-described embodiment, the same reference numerals as those used for the corresponding parts in the above-described embodiment are used. Duplicate descriptions will be omitted.

  A modification of the method of manufacturing the heat-generating plate 10 will be described with reference to FIGS. 13 to 17. 13-17 is sectional drawing which shows the modification of the manufacturing method of the heat-emitting plate 10 in order.

  First, the sheet with conductor 20 is manufactured. The sheet with conductor 20 can be manufactured by the method described in the example of the method for manufacturing the heating plate 10 described above.

  Next, the glass plate 11, the bonding layer 13, and the conductive sheet 20 are stacked in this order and heated and pressed. In the example shown in FIG. 13, first, the bonding layer 13 is temporarily bonded to the glass plate 11. Next, the side of the glass plate 11 to which the bonding layer 13 is temporarily bonded faces the sheet 20 with a conductor, and the glass plate 11 to which the bonding layer 13 is temporarily bonded is a conductor of the sheet 20 with a conductor Layer 30 from the side, heat and press. Thereby, as shown in FIG. 14, the glass plate 11 and the sheet 20 with a conductor are bonded (temporary bonding or main bonding) via the bonding layer 13.

  Next, as shown in FIG. 15, the base 25 of the sheet with conductor 20 is removed. For example, when producing the sheet 20 with a conductor, a release layer is formed on the substrate 25 and the conductor 30 is formed on the release layer. The peeling layer is preferably a layer which is not removed in the step of etching the metal film 36 a and the dark film 37 a described above. In this case, the substrate 25 and the conductor 30 and the bonding layer 13 are bonded via the release layer. Then, in the step of removing the base 25 of the sheet with conductor 20, the base 25 of the sheet with conductor 20 is peeled off from the conductor 30 and the bonding layer 13 using a peeling layer.

  As the release layer, for example, an interface release type release layer, an interlayer release type release layer, an aggregation release type release layer, or the like can be used. As the interfacial peeling type peeling layer, a peeling layer having relatively low adhesion to the conductor 30 and the bonding layer 13 as compared to adhesion to the substrate 25 can be suitably used. As such a layer, a silicone resin layer, a fluorine resin layer, a polyolefin resin layer, etc. may be mentioned. In addition, it is also possible to use a peeling layer whose adhesion to the base 25 is relatively lower than the adhesion to the conductor 30 and the bonding layer 13. The peeling layer of the interlayer peeling type includes a film of a plurality of layers, and the peeling layer has a relatively low adhesion between the plurality of layers compared to the adhesion with the conductor 30, the bonding layer 13, and the substrate 25. Can be illustrated. As an aggregation peeling type peeling layer, the peeling layer which disperse | distributed the filler as a dispersed phase in the base resin as a continuous phase can be illustrated.

  When an interfacial peeling type peeling layer having a layer having relatively low adhesion to the conductor 30 and the bonding layer 13 as compared to adhesion to the substrate 25 is used as the peeling layer, the peeling layer and the conductor Peeling phenomenon occurs between 30 and the bonding layer 13. In this case, the peeling layer can be prevented from remaining on the conductor 30 and the bonding layer 13 side. That is, the substrate 25 is removed together with the release layer. Thus, when the base 25 and the release layer are removed, the bonding layer 13 is exposed to the non-coated portion of the conductor 30.

  On the other hand, in the case of using an interfacial peeling type peeling layer having a relatively low adhesion to the base 25 as compared with the adhesion to the conductor 30 and the bonding layer 13 as the peeling layer, the peeling layer Peeling phenomenon occurs between the substrate 25 and the substrate 25. An interlayer peeling type peeling layer which has a plurality of layers of films as the peeling layer, and in which the adhesion between the plurality of layers is relatively lower than the adhesion with the conductor 30 and the bonding layer 13 and the base 25. In the case where is used, a peeling phenomenon occurs between the plurality of layers. In the case of using a cohesive peeling type peeling layer in which a filler as a dispersed phase is dispersed in a base resin as a continuous phase as a peeling layer, a peeling phenomenon due to cohesive failure in the peeling layer occurs.

  Finally, the glass plate 11, the bonding layer 13, the conductor 30, the bonding layer 14, and the glass plate 12 are stacked in this order and heated and pressed. In the example shown in FIG. 16, first, the bonding layer 14 is temporarily bonded to the glass plate 12. Next, the glass plate 11, the conductor 30, the bonding layer 13, and the bonding layer 14 are temporarily bonded such that the side to which the bonding layer 14 of the glass plate 12 is temporarily bonded faces the conductor 30 and the bonding layer 13. The glass plates 12 are stacked in this order and heated and pressed. Thereby, the glass plate 11, the conductor 30, and the glass plate 12 are joined (mainly joined) via the joining layers 13 and 14, and the heat-producing plate 10 shown in FIG. 17 is manufactured.

  According to the heat generating plate 10 shown in FIG. 17, the heat generating plate 10 can be configured not to include the substrate 25. Thereby, the thickness of the heat-generating plate 10 whole can be made small. In addition, the number of interfaces in the heating plate 10 can be reduced. Therefore, it is possible to suppress the decrease in optical characteristics, that is, the decrease in visibility.

  Next, with reference to FIG. 18 and FIG. 19, another modification of the method of manufacturing the heat generating plate 10 will be described. FIG. 18 and FIG. 19 are cross sectional views sequentially showing another modified example of the method of manufacturing the heat generating plate 10.

  First, the glass plate 11 and the conductor-attached sheet 20 are bonded (temporarily bonded) through the bonding layer 13 in the same steps as in the modification of the method of manufacturing the heat-generating plate 10 described above. The substrate 25 is removed. That is, one obtained by laminating the glass plate 11, the conductor 30, and the bonding layer 13 described with reference to FIG.

  Next, as shown in FIG. 18, the glass plate 11, the bonding layer 13, the conductor 30, and the glass plate 12 are stacked in this order and heated and pressed. Thereby, the glass plate 11 and the conductor 30 are bonded (mainly bonded) via the bonding layer 13, and the glass plate 11 and the glass plate 12 are bonded (mainly bonded) via the bonding layer 13. Then, the heating plate 10 shown in FIG. 19 is manufactured.

  According to the heat generating plate 10 shown in FIG. 19, the heat generating plate 10 can be made free of the base 25 and the bonding layer 14. Thereby, the thickness of the entire heat generating plate 10 can be further reduced. In addition, the number of interfaces in the heating plate 10 can be further reduced. Therefore, it is possible to more effectively suppress the decrease in optical characteristics, that is, the decrease in visibility. In addition, since the conductor 30 and the glass plate 12 are in contact with each other, the heating efficiency of the glass plate 12 by the conductor 30 can be increased.

  In the embodiment described above, an example is shown in which the heat generating plate 10 is formed in a curved surface shape, but the present invention is not limited to this example, and the heat generating plate 10 may be formed in a flat plate shape.

  The heat generating plate 10 may be used for a rear window, a side window or a sunroof of the car 1. Also, it may be used for windows or transparent doors of vehicles such as railway cars, aircraft, ships, spacecraft, etc. other than automobiles.

  Furthermore, the heat generating plate 10 can also be used in places other than vehicles, in particular, in places that partition indoors and outdoors, such as windows or transparent doors of buildings, stores, houses, etc.

  Although some modifications to the above-described embodiment have been described above, it is of course possible to apply a plurality of modifications in combination as appropriate.

Reference Signs List 1 automobile 5 front window 7 power supply 10 heat generating plate 11 glass 12 glass 13 bonding layer 14 bonding layer 15 wiring portion 20 sheet with conductor 25 base material 30 conductor 31 linear conductor 35 bus bar 36 conductive metal layer 36 a metal film 37 First dark layer 37a dark film 38 second dark layer 39 resist pattern

Claims (6)

A heating plate that generates heat when a voltage is applied.
With a pair of glasses,
A conductor disposed between the pair of glasses and to which a voltage is applied;
And a bonding layer disposed between the conductor and at least one of the pair of glasses,
The conductor includes a pair of bus bars and a plurality of linear conductors linearly extending between the pair of bus bars,
Each linear conductor intersects at least one other linear conductor,
Between the adjacent linear conductors, a gap extending in the extending direction of the linear conductors is formed ,
The linear conductor is an irregular curve or a broken line,
The heat generating plate , wherein the gap is irregularly arranged and irregularly shaped . The conductor includes only a pair of bus bars and a plurality of linear conductors extending linearly to connect the pair of bus bars,
Each linear conductor intersects with a plurality of other linear conductors in a point shape ,
The number of gaps formed by the at least one linear conductor is different from the number of gaps formed by the other linear conductors,
The heat generating plate according to claim 1 , wherein at least one of the gaps extends over half or more of a distance between the pair of bus bars .   The heat generating plate according to claim 1, wherein all of the plurality of linear conductors are electrically connected to each other directly or indirectly in a region between a pair of bus bars. The heat generating plate according to any one of claims 1 to 3 , wherein each linear conductor is in contact with another linear conductor. The heat generating plate according to claim 4 , wherein the linear conductor has a smooth curve at least in a portion in contact with the other linear conductor. A vehicle comprising the heat generating plate according to any one of claims 1 to 5 .

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