JP2019135718A - Conductive pattern sheet, heating plate, vehicle including heating plate, and method for manufacturing heating plate - Google Patents

Abstract

To manufacture a conductive pattern of a conductive pattern sheet used for manufacture of a heating plate inexpensively with a high material utilization rate.SOLUTION: A method for manufacturing a conductive pattern sheet 20 used for a heating plate 10 that generates heat when applied with voltage includes: a step of patterning a first metal film 61 laminated on a base material 30; and a step of forming a second metal layer 52 by an electric field plating method on a first metal layer 51 formed by patterning the first metal film 61.SELECTED DRAWING: Figure 1

Description

  The present invention is a conductive pattern sheet used for a heat generating plate that generates heat when a voltage is applied, a heat generating plate that generates heat when a voltage is applied, a vehicle equipped with the heat generating plate, a method for manufacturing a conductive pattern sheet, and The present invention relates to a method for manufacturing a heating plate.

  2. Description of the Related Art Conventionally, as a defroster (defrosting or anti-fogging) device used for a window glass such as a front window or a rear window of a vehicle, an apparatus in which a heating wire made of tungsten or the like is arranged on the window glass is known. In such a defroster device, a heating wire arranged on the window glass is energized, and the window glass is heated by resistance heating to remove fogging of the window glass, or snow and ice attached to the window glass are removed. It can melt or evaporate water droplets to ensure the sight of the occupant. For example, Patent Document 1 discloses a heat generating glass constituting a defroster device. In this heat generating glass, a transparent film having heating wires arranged in a mesh pattern is arranged between two glass plates. Yes. In the exothermic glass disclosed in Patent Document 1, the heating wire on the transparent film is formed by patterning a metal film, for example, a metal foil, laminated on the transparent film.

JP 2012-14945 A

  By the way, the heat generating glass needs to have transparency. Therefore, the heating wire of the exothermic glass is formed with an extremely high aperture ratio (non-covering ratio). That is, the heating wire disclosed in Patent Document 1 is patterned by removing most of the metal film, and the utilization efficiency of the metal film is extremely low. Further, in order to remove most of the metal film, it is necessary to use a large amount of processing liquid and to dispose of a large amount of processing liquid appropriately.

  The present invention has been made in consideration of the above points. The conductive pattern included in the heat generating plate and the conductive pattern of the conductive pattern sheet used for manufacturing the heat generating plate are inexpensive at a high material utilization rate. The purpose is to manufacture.

The method for producing a conductive pattern sheet according to the present invention includes:
A method for producing a conductive pattern sheet used for a heating plate that generates heat when a voltage is applied,
Patterning the first metal film laminated on the substrate;
Forming a second metal layer on the first metal layer formed by patterning the first metal film by electroplating.

  In the method for producing a conductive pattern sheet according to the present invention, the first metal layer is formed by a vapor deposition method, a sputtering method, a CVD method, a PVD method, an ion plating method, an electroless plating method, or a combination of two or more thereof. , May be formed.

  In the method for producing a conductive pattern sheet according to the present invention, the second metal layer may be thicker than the first metal layer.

  The heating plate manufacturing method according to the present invention includes a pair of glass plates and the conductive pattern of the conductive sheet manufactured by the above-described manufacturing method according to the present invention, the conductive pattern provided between the pair of glass plates. The pair of glass plates of a laminate including a pattern and a bonding layer provided between at least one of the pair of glass plates and the conductive pattern member are heated and pressed toward each other. A process is provided.

The conductive pattern sheet according to the present invention is:
A conductive pattern sheet used for a heat generating plate that generates heat when a voltage is applied,
A substrate;
A conductive pattern laminated on the base material and including a conductive fine wire,
The conductive thin wire of the conductive pattern includes a first metal layer and a second metal layer stacked adjacent to the first metal layer,
The first metal layer is formed by patterning a first metal film,
The second metal layer is formed on the first metal layer formed by patterning the first metal film by electroplating.

The heating plate according to the present invention is:
A heating plate that generates heat when a voltage is applied,
A pair of glass plates;
A conductive pattern disposed between the pair of glass plates and including a conductive thin wire; and
A bonding layer disposed between the conductive pattern and at least one of the pair of glass plates,
The conductive thin wire of the conductive pattern includes a first metal layer and a second metal layer stacked adjacent to the first metal layer,
The first metal layer is formed by patterning a first metal film,
The second metal layer is formed on the first metal layer formed by patterning the first metal film by electroplating.

  The vehicle according to the invention comprises a heating plate according to the invention.

  ADVANTAGE OF THE INVENTION According to this invention, the electroconductive pattern of the electroconductive pattern contained in a heat generating plate and the electroconductive pattern sheet utilized for manufacture of a heat generating plate can be manufactured cheaply with a high material utilization factor.

FIG. 1 is a diagram for explaining an embodiment according to the present invention, and is a perspective view schematically showing a vehicle provided with a heat generating plate. In particular, FIG. 1 schematically shows an automobile provided with a heat generating plate as an example of a vehicle. FIG. 2 is a view of the heat generating plate as viewed from the normal direction of the plate surface. 3 is a cross-sectional view of the heat generating plate of FIG. FIG. 4 is a plan view showing an example of the pattern shape of the conductive pattern of the heat generating plate. FIG. 5 is a plan view showing another example of the pattern shape of the conductive pattern of the heat generating plate. FIG. 6 is a cross-sectional view showing the cross-sectional shape of the conductive thin wire of the conductive pattern. FIG. 7 is a diagram for explaining an example of a method for manufacturing a heat generating plate. FIG. 8 is a diagram for explaining an example of a method for manufacturing a heat generating plate. FIG. 9 is a diagram for explaining an example of a method of manufacturing a heat generating plate. FIG. 10 is a diagram for explaining an example of a method for manufacturing a heat generating plate. FIG. 11 is a diagram for explaining an example of a method of manufacturing a heat generating plate. FIG. 12 is a diagram for explaining an example of a method of manufacturing a heat generating plate. FIG. 13 is a diagram for explaining an example of a method for manufacturing a heat generating plate. FIG. 14 is a diagram for explaining an example of a method of manufacturing a heat generating plate. FIG. 15 is a diagram for explaining a modification of the method for manufacturing the heat generating plate. FIG. 16 is a diagram for explaining a modification of the method for manufacturing the heat generating plate. FIG. 17 is a diagram for explaining a modification of the method for manufacturing the heat generating plate. FIG. 18 is a diagram for explaining a modification of the method for manufacturing the heat generating plate. FIG. 19 is a diagram for explaining a modification of the method for manufacturing the heat generating plate. FIG. 20 is a diagram for explaining another modification of the method for manufacturing the heat generating plate. FIG. 21 is a diagram for explaining another modification of the method for manufacturing the heat generating plate.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual product.

  In the present specification, the terms “plate”, “sheet”, and “film” are not distinguished from each other only based on the difference in names. For example, the “conductive pattern sheet” is a concept including a member that can be called a plate or a film. Therefore, the “conductive pattern sheet” is a “conductive pattern plate (substrate)” or “conductive pattern”. It cannot be distinguished from a member called “film” only by the difference in designation.

  In addition, “sheet surface (plate surface, film surface)” means a target sheet-like member (plate-like) when the target sheet-like (plate-like, film-like) member is viewed as a whole and globally. It refers to the surface that coincides with the plane direction of the member or film-like member.

  In this specification, “joining” includes not only “main joining” that completely completes joining but also so-called “temporary joining” for temporarily fixing before “main joining”.

  In addition, as used in the present specification, the shape and geometric conditions and the degree thereof are specified. For example, terms such as “parallel”, “orthogonal”, “identical”, and values of length and angle are strict. Without being bound by meaning, it should be interpreted including the extent to which similar functions can be expected.

  FIGS. 1-14 is a figure for demonstrating one Embodiment by this invention. Of these, FIG. 1 is a diagram schematically showing an automobile equipped with a heat generating plate, FIG. 2 is a view of the heat generating plate viewed from the normal direction of the plate surface, and FIG. 3 is a heat generating of FIG. It is a cross-sectional view of a board.

  As shown in FIG. 1, an automobile 1 as an example of a vehicle has window glasses such as a front window, a rear window, and a side window. Here, an example in which the front window 5 is composed of a heat generating plate 10 is illustrated. The automobile 1 has a power source 7 such as a battery.

  FIG. 2 shows the heat generating plate 10 viewed from the normal direction of the plate surface. Moreover, the cross-sectional view corresponding to the III-III line of the heat generating plate 10 of FIG. 2 is shown in FIG. In the example shown in FIG. 3, the heating plate 10 includes a pair of glass plates 11 and 12, a conductive pattern sheet 20 disposed between the pair of glass plates 11 and 12, and the glass plates 11 and 12 and the conductive plate 10. Bonding layers 13 and 14 for bonding the conductive pattern sheet 20 to each other. In the example shown in FIGS. 1 and 2, the heat generating plate 10 is curved. However, in other drawings, the heat generating plate 10 and the glass plates 11 and 12 are shown for simplification of illustration and easy understanding. Is shown in a flat plate shape.

  The conductive pattern sheet 20 includes a sheet-like base material 30, a conductive pattern 40 formed on the base material 30, a wiring part 15 for energizing the conductive pattern 40, a conductive pattern 40 and a wiring part. 15 and a connecting portion 16 (also called a bus bar or bus bar electrode).

  In the example shown in FIGS. 2 and 3, the conductive pattern 40 is energized from the power source 7 such as a battery through the wiring part 15 and the connection part 16 made of copper wire or the like, and the conductive pattern 40 is heated by resistance heating. Let The heat generated in the conductive pattern 40 is transmitted to the glass plates 11 and 12 through the bonding layers 13 and 14, and the glass plates 11 and 12 are warmed. Thereby, the cloudiness by the dew condensation adhering to the glass plates 11 and 12 can be removed. Moreover, when snow and ice adhere to the glass plates 11 and 12, this snow and ice can be melted. Therefore, a passenger | crew's visual field is ensured favorable. In addition, although illustration is omitted, normally, in the wiring part 15, a switch is inserted (connected in series) between the power supply 7 and the connection part (bus bar) 16 of the conductive pattern 40. Only when the heating plate 10 needs to be heated, the switch is closed and the conductor 30 is energized.

  In particular, when the glass plates 11 and 12 are used for a front window of an automobile, it is preferable to use a glass plate having a high visible light transmittance so as not to obstruct the sight of the passenger. Examples of the material of the glass plates 11 and 12 include soda lime glass (blue plate glass), borosilicate glass (white plate glass), quartz glass, soda glass, potash glass, and the like. The glass plates 11 and 12 preferably have a transmittance in the visible light region of 90% or more. Here, the visible light transmittance of the glass plates 11 and 12 is measured within a measurement wavelength range of 380 nm to 780 nm using a spectrophotometer (“UV-3100PC” manufactured by Shimadzu Corporation, JIS K 0115 compliant product). Is specified as an average value of transmittance at each wavelength. The visible light transmittance may be lowered by coloring a part or the whole of the glass plates 11 and 12. In this case, it is possible to block direct sunlight and to make it difficult to visually recognize the inside of the vehicle from outside the vehicle.

  Moreover, it is preferable that the glass plates 11 and 12 have a thickness of 1 mm or more and 5 mm or less. With such a thickness, the glass plates 11 and 12 excellent in strength and optical characteristics can be obtained.

  The glass plates 11 and 12 and the conductive pattern sheet 20 are bonded via bonding layers 13 and 14, respectively. As the bonding layers 13 and 14, layers made of materials having various adhesiveness or tackiness can be used. The bonding layers 13 and 14 preferably have a high visible light transmittance. As a typical joining layer, the layer which consists of polyvinyl butyral (PVB) can be illustrated. The thickness of the bonding layers 13 and 14 is preferably 0.15 mm or more and 0.7 mm or less, respectively.

  The heating plate 10 is not limited to the illustrated example, and may be provided with other functional layers expected to exhibit a specific function. In addition, one functional layer may exhibit two or more functions. For example, glass plates 11 and 12 of the heat generating plate 10, bonding layers 13 and 14, and a base material of the conductive pattern sheet 20 described later. A function may be given to at least one of 30. Examples of functions that can be imparted to the heating plate 10 include an antireflection (AR) function, a hard coat (HC) function having scratch resistance, an infrared shielding (reflection) function, an ultraviolet shielding (reflection) function, and a polarization function. An antifouling function and the like can be exemplified.

  Next, the conductive pattern sheet 20 will be described. The conductive pattern sheet 20 includes a sheet-like base material 30, a conductive pattern 40 formed on the base material 30, a wiring part 15 for energizing the conductive pattern 40, a conductive pattern 40 and a wiring part. 15 and a connecting portion 16 for connecting the terminal 15 to the terminal 15. The conductive pattern sheet 20 has substantially the same planar dimensions as the glass plates 11 and 12 and may be disposed over the entire heat generating plate 10, or on a part of the heat generating plate 10 such as the front portion of the driver's seat. May be arranged only.

  The sheet-like base material 30 functions as a base material that supports the conductive pattern 40. The base material 30 is an electrically insulating substrate that is transparent in general terms that transmits a wavelength in the visible light wavelength band (380 nm to 780 nm). In the example shown in FIGS. 2, 4, and 5, the base material 30 has substantially the same dimensions as the glass plates 11 and 12 and has a substantially trapezoidal planar shape.

  The resin contained in the substrate 30 may be any resin as long as it transmits visible light and can appropriately support the conductive pattern 40, but a thermoplastic resin can be preferably used. Examples of the thermoplastic resin include acrylic resins such as polymethyl methacrylate, polyvinyl chloride, polyester resins such as polyethylene terephthalate (PET), amorphous polyethylene terephthalate (A-PET), polyethylene naphthalate (PEN), polyethylene, and polypropylene. Polyester resin such as polymethylpentene and cyclic polyolefin, polyolefin resin such as polyethylene resin and polypropylene, cellulose resin such as triacetyl cellulose (cellulose triacetate), polystyrene, polycarbonate resin and AS resin. In particular, acrylic resin and polyvinyl chloride are preferable because they are excellent in etching resistance, weather resistance, and light resistance.

  Moreover, it is preferable that the base material 30 has a thickness of 0.03 mm or more and 0.3 mm or less in consideration of retainability of the conductive pattern 40, light transmittance, and the like.

  Next, the conductive pattern 40 will be described with reference to FIGS. 4 and 5. 4 and 5 are both plan views of the conductive pattern sheet 20 viewed from the normal direction of the sheet surface.

  The conductive pattern 40 is energized from the power source 7 such as a battery through the wiring portion 15 and the connection portion 16 and generates heat by resistance heating. And when this heat | fever is transmitted to the glass plates 11 and 12 through the joining layers 13 and 14, the glass plates 11 and 12 are warmed.

  FIG. 4 shows an example of the pattern shape of the conductive pattern 40. In the example shown in FIG. 4, a plurality of conductive thin wires 41 that connect the pair of connection portions 16 are provided. In the illustrated example, each of the plurality of conductive thin wires 41 extends from one connection portion 16 to the other connection portion 16 in a wavy line pattern. The plurality of conductive thin wires 41 are arranged away from each other in a direction non-parallel to the extending direction of the conductive thin wires 41. In particular, the plurality of conductive thin wires 41 are arranged in a direction orthogonal to the extending direction of the conductive thin wires 41. Each thin conductive wire 41 may extend between the pair of connecting portions 16 in a pattern such as a straight line, a broken line, or a sine wave in addition to the wavy line pattern.

  FIG. 5 shows another example of the pattern shape of the conductive pattern 40. In the example shown in FIG. 5, the conductive thin wires 41 of the conductive pattern 40 are arranged in a mesh pattern that defines a large number of opening regions 44. The conductive pattern 40 includes a plurality of connecting elements 45 extending between the two branch points 43 and defining an open area 44. That is, the conductive thin wires 41 of the conductive pattern 40 are configured as a collection of a large number of connection elements 45 that form branch points 43 at both ends.

  In the example shown in FIG. 5, the large number of opening regions 44 of the conductive pattern 40 are arranged in a shape and pitch that do not have repetitive regularity (periodic regularity). In particular, in the illustrated example, a large number of opening regions 44 are arranged to coincide with each Voronoi region in the Voronoi diagram. In other words, each connection element 45 of the conductive pattern 40 coincides with each boundary of the Voronoi region in the Voronoi diagram. Each branch point 43 of the conductive pattern 40 coincides with the Voronoi point in the Voronoi diagram. Since this Voronoi diagram is obtained by a known method as disclosed in, for example, Japanese Patent Laid-Open No. 2012-178556, detailed description of the Voronoi diagram creation method is omitted here.

  As yet another example, the conductive pattern 40 may be formed from the conductive thin wires 41 arranged in a pattern having a repeating regularity (periodic regularity) such as a square lattice arrangement or a honeycomb arrangement. Good.

  Next, the cross-sectional shape of the conductive thin wire 41 of the conductive pattern 40 will be described with reference to FIG. FIG. 6 is an enlarged view showing a cross section of the conductive pattern sheet 20 corresponding to the line AA in FIGS. 4 and 5.

  In the example shown in FIG. 6, the conductive thin wire 41 forming the conductive pattern 40 is a base material in a cross section (hereinafter also referred to as a main cut surface) orthogonal to the extending direction (longitudinal direction) of the conductive thin wire 41. A base end surface 41b forming a surface on the 30th side, a front end surface 41a facing the base end surface 41b, and side surfaces 41c and 41d connecting the front end surface 41a and the base end surface 41b, and has a substantially rectangular cross section as a whole. Yes.

  The width W of the conductive thin wire 41, that is, the width W of the conductive thin wire 41 along the sheet surface of the base material 30 is preferably 5 μm or more and 20 μm or less. According to the conductive thin wire 41 having such a width W, since the conductive thin wire 41 is sufficiently thinned, the conductive pattern 40 can be effectively invisible. Further, the height (thickness) H of the conductive thin wire 41, that is, the height (thickness) H of the conductive thin wire 41 along the normal direction to the sheet surface of the base material 30 is 5 μm or more and 20 μm or less. It is preferable. According to the conductive thin wire 41 having such a height (thickness) H, sufficient conductivity can be ensured while having an appropriate resistance value.

  As shown in FIG. 6, the conductive thin wire 41 forming the conductive pattern 40 includes a first metal layer 51 and a second metal layer 52 laminated adjacent to the first metal layer 51. It has a layer 50. In the example illustrated in FIG. 6, the conductive thin wire 41 further includes a first dark color layer 53 and a second dark color layer 54 that cover the conductive metal layer 50. The first dark color layer 53 covers the surface on the base material 30 side of the surface of the conductive metal layer 50, and forms a base end surface 41 b of the conductive metal layer 50. The second dark color layer 54 covers the surface opposite to the substrate 30 and both side surfaces of the surface of the conductive metal layer 50, and forms the front end surface 41 a and both side surfaces 41 c and 41 d of the conductive metal layer 50. doing.

  The conductive metal layer 50 is a layer for ensuring conductivity in the conductive thin wire 41. As a material for constituting the first metal layer 51 and the second metal layer 52 constituting the conductive metal layer 50, for example, gold, silver, copper, platinum, aluminum, chromium, molybdenum, nickel, titanium, palladium, indium, Tungsten and alloys thereof can be exemplified. On the other hand, the dark layers 53 and 54 may be layers having a lower visible light reflectance than the conductive metal layer 50, and are dark layers such as black. The dark color layers 53 and 54 make it difficult to visually recognize the conductive metal layer 50 having a generally high reflectivity, and can ensure a better view of the occupant.

  Next, an example of a method for manufacturing the heat generating plate 10 will be described with reference to FIGS. 7-14 is sectional drawing which shows an example of the manufacturing method of the heat generating plate 10 in order.

  First, the sheet-like base material 30 is prepared. The base material 30 is an electrically insulating resin base material that is transparent and is generally called transparent that transmits wavelengths in the visible light wavelength band (380 nm to 780 nm).

  Next, as shown in FIG. 7, a dark color film 63 is provided on the base material 30. For example, the dark color film 63 may be provided on the substrate 30 by a plating method including electroplating and electroless plating, a sputtering method, a CVD method, a PVD method, an ion plating method, or a combination of these two or more. it can. Note that various known materials can be used as the material of the dark color film 63. For example, copper nitride, copper oxide, nickel nitride and the like can be exemplified.

  Next, as shown in FIG. 8, a first metal film 61 is provided on the dark color film 63. The first metal film 61 is patterned to form the first metal layer 51 of the conductive metal layer 50. As described above, the first metal film 61 is made of metal such as gold, silver, copper, platinum, aluminum, chromium, molybdenum, nickel, titanium, palladium, indium, tungsten, nickel-chromium alloy, brass, bronze, or the like. It is a layer made of one or more of these metal alloys. The first metal film 61 is formed by vapor deposition, sputtering, CVD, PVD, ion plating, electroless plating, or a combination of two or more of these.

  The thickness t1 (see FIG. 6) of the first metal film 61 can be, for example, not less than 10 nm and not more than 100 nm. Even if the thickness of the first metal film 61 is reduced in this way, it can be sufficiently used as a base when the second metal layer 52 is formed by an electroplating method as will be described later.

  Next, as shown in FIG. 9, a resist pattern 65 is provided on the first metal film 61. The resist pattern 65 is a pattern corresponding to the pattern of the conductive pattern 40 to be formed. In the method described here, the resist pattern 65 is provided only in a region finally forming the conductive pattern 40. The resist pattern 65 can be formed by patterning using a known photolithography technique.

  Next, as shown in FIG. 10, the first metal film 61 and the dark color film 63 are etched using the resist pattern 65 as a mask. By this etching, the first metal film 61 and the dark color film 63 are patterned into a pattern substantially the same as the resist pattern 65. The etching method is not particularly limited, and a known method can be employed. Known methods include, for example, wet etching using an etchant, plasma etching, and the like. In the wet etching, it is possible to use a known corrosive solution appropriately selected according to the material of the gold foil and the dark color film (if a dark color film is present). For example, when the metal foil is copper and the dark color film is copper (II) oxide (CuO), ferric chloride aqueous solution is used for the metal foil and the dark color film, or the metal foil part (copper) is ferric chloride. It is found that dilute hydrochloric acid is used for the aqueous solution and the dark color film (copper (II) oxide) portion. Thereafter, as shown in FIG. 11, the resist pattern 65 is removed.

  Next, as shown in FIG. 12, a second metal layer 52 is formed on the first metal layer 51 by electroplating using the first metal layer 51 formed by patterning the first metal film 61 as an electrode. The second metal layer 52 formed by the electroplating method is formed only on the first metal layer 51. Thus, the conductive metal layer 50 composed of the first metal layer 51 and the second metal layer 52 is obtained.

  The thickness t2 (see FIG. 6) of the second metal layer 52 can be set such that the conductive metal layer 50 including the first metal layer 51 and the second metal layer 52 has sufficient conductivity. As an example, the thickness t2 (see FIG. 6) of the second metal layer 52 can be set to 1 μm or more and 10 μm or less.

  Thereafter, as shown in FIG. 13, the second dark color layer 49 is formed on the surface 41 a and the side surfaces 41 c and 41 d opposite to the base material 30 of the conductive metal layer 50. For example, the second dark color layer 49 is subjected to a darkening process (blackening process) on a part of the material forming the conductive metal layer 50, and the metal oxide or metal sulfide is formed from a part of the conductive metal layer 50. A second dark color layer 49 can be formed. Alternatively, the second dark color layer 49 may be provided on the surface of the conductive metal layer 50, such as a dark color coating film or a plating layer of nickel or chromium. Alternatively, the second dark color layer 49 may be provided by roughening the surface of the conductive metal layer 50.

  As described above, the conductive pattern sheet 20 shown in FIG. 13 is produced. The connecting portion 16 and the wiring portion 15 may be formed integrally with the conductive pattern 40 using the same material as the conductive pattern 40. Alternatively, the connection part 16 and the wiring part 15 prepared separately from the conductive pattern 40 may be provided on the substrate 30 so as to be electrically connected to the conductive pattern 40.

  Finally, the glass plate 11, the bonding layer 13, the conductive pattern sheet 20, the bonding layer 14, and the glass plate 12 are superposed in this order, and heated and pressurized. In the example shown in FIG. 14, first, the bonding layer 13 is temporarily bonded to the glass plate 11, and the bonding layer 14 is temporarily bonded to the glass plate 12. Next, the glass plate 11 and the conductive pattern sheet on which the bonding layer 13 is temporarily bonded so that the side on which the bonding layers 13 and 14 of the glass plates 11 and 12 are temporarily bonded faces the conductive pattern sheet 20 respectively. 20. The glass plate 12 to which the bonding layer 14 is temporarily bonded is superposed in this order, and heated and pressurized. Thereby, the glass plate 11, the electroconductive pattern sheet 20, and the glass plate 12 are joined via the joining layers 13 and 14, and the heat generating plate 10 shown in FIG. 3 is manufactured.

  In the present embodiment as described above, the manufacturing method includes a step of patterning the first metal film 61 and an electroplating method on the first metal layer 51 formed by patterning the first metal film 61. And a step of forming the second metal layer 52. When the second metal layer 52 is formed on the first metal layer 51 having a predetermined pattern using the electroplating method, the second metal layer 52 is formed on the first metal layer 51 in the same pattern as the first metal layer 51. It is formed. That is, the second metal layer 52 is provided with the material forming the second metal layer 52 only in a region necessary for forming the conductive metal layer 50. Therefore, the utilization efficiency of the material can be improved as compared with the case where the entire conductive metal layer 50 is formed by patterning the metal film. In the first place, the conductive pattern 40 formed by the conductive metal layer 50 is formed with an extremely high aperture ratio to ensure transparency. Therefore, according to the present embodiment, the material utilization efficiency can be dramatically improved. As a result, the manufacturing cost of the conductive pattern sheet 20 and the heat generating plate 10 can be significantly reduced.

  Moreover, according to this Embodiment, compared with forming the whole electroconductive metal layer 50 by patterning a metal film, the quantity of the process liquid used for patterning can be reduced significantly. In addition, since the amount of the treatment liquid used is reduced, the burden at the time of disposal of the treatment liquid can be reduced, and it is preferable from the viewpoint of environmental problems as well as a simple cost reduction.

  Furthermore, according to the electroplating method, the metal layer 52 is formed quickly and thickly as compared with a film forming method such as a vapor deposition method, a sputtering method, a CVD method, a PVD method, an ion plating method, or an electroless plating method. be able to. That is, the productivity of the conductive pattern sheet 20 and the heat generating plate 10 can be improved, and the conductive pattern sheet 20 and the heat generating plate 10 can be manufactured in a short time.

  Further, when the thickness of the second metal layer 52 is thicker than the thickness of the first metal layer 51, the above-described effects of the present embodiment, that is, the improvement of the utilization efficiency of the material used for the production of the conductive pattern 40, The effects of reducing the amount of the processing liquid used for manufacturing the conductive pattern 40 and shortening the time required for manufacturing the conductive pattern 40 become more prominent.

  The heat generating plate 10 manufactured by the manufacturing method described in the above embodiment and the conductive pattern 40 of the conductive pattern sheet 20 were laminated adjacent to the first metal layer 51 and the first metal layer 51. And a conductive thin wire 51 including a second metal layer 52. The first metal layer 51 is formed by patterning the first metal film. The second metal layer 52 is formed on the first metal layer 51 formed by patterning the first metal film 61 by electroplating. The heat generating plate 10 and the conductive pattern sheet 20 having such a conductive pattern 40 improve the utilization efficiency of the material used for manufacturing the conductive pattern 40 described above, and the treatment liquid used for manufacturing the conductive pattern 40. Based on the effect of reducing the amount and shortening the time required for producing the conductive pattern 40, it can be manufactured inexpensively and easily.

  Note that various modifications can be made to the above-described embodiment. Hereinafter, modified examples will be described with reference to the drawings as appropriate. In the following description and the drawings used in the following description, the same reference numerals as those used for the corresponding parts in the above embodiment are used for the parts that can be configured in the same manner as in the above embodiment. A duplicate description is omitted.

  With reference to FIGS. 15-19, the modification of the manufacturing method of the heat generating plate 10 is demonstrated. 15 to 19 are cross-sectional views sequentially showing modified examples of the method for manufacturing the heat generating plate 10.

  First, the conductive pattern sheet 20 is produced. The conductive pattern sheet 20 can be produced by the method described in the example of the method for producing the heating plate 10 described above.

  Next, the glass plate 11, the bonding layer 13, and the conductive pattern sheet 20 are superposed in this order, and heated and pressurized. In the example shown in FIG. 15, first, the bonding layer 13 is temporarily bonded to the glass plate 11. Next, the glass plate 11 on which the bonding layer 13 is temporarily bonded is disposed so that the side on which the bonding layer 13 of the glass plate 11 is temporarily bonded faces the conductive pattern sheet 20. Superposed from the pattern 40 side, heated and pressurized. Thereby, as shown in FIG. 16, the glass plate 11 and the conductive pattern sheet 20 are bonded (temporary bonding or main bonding) via the bonding layer 13.

  Next, as shown in FIG. 17, the base material 30 of the conductive pattern sheet 20 is removed. For example, when producing the conductive pattern sheet 20, a release layer is formed on the base material 30, and the conductive pattern 40 is formed on the release layer. This release layer is preferably a layer that is not removed in the step of etching the first metal film 61 and the dark color film 63 described above. In this case, the base material 30 and the conductive pattern 40 and the bonding layer 13 are bonded via the release layer. And in the process of removing the base material 30 of the electroconductive pattern sheet 20, the base material 30 of the electroconductive pattern sheet 20 is peeled from the electroconductive pattern 40 and the joining layer 13 using a peeling layer.

  As the release layer, for example, an interfacial release type release layer, an interlayer release type release layer, a cohesive release type release layer, or the like can be used. As the interfacial release type release layer, a release layer having a relatively low adhesiveness to the conductive pattern 40 and the bonding layer 13 as compared with the adhesiveness to the substrate 30 can be suitably used. Examples of such a layer include a silicone resin layer, a fluororesin layer, and a polyolefin resin layer. In addition, a release layer that has relatively low adhesion to the substrate 30 as compared with adhesion to the conductive pattern 40 and the bonding layer 13 can also be used. As the delamination type delamination layer, a delamination that includes a plurality of layers of film and has a relatively low adhesion between the plurality of delaminations compared to the adhesion between the conductive pattern 40 and the bonding layer 13 and the substrate 30. A layer can be illustrated. Examples of the cohesive release type release layer include a release layer in which a filler as a dispersed phase is dispersed in a base resin as a continuous phase.

  When an interfacial release type release layer having a layer having relatively low adhesion to the conductive pattern 40 and the bonding layer 13 as compared with the adhesion to the substrate 30 is used as the release layer, the release layer and the conductive layer are electrically conductive. The peeling phenomenon occurs between the conductive pattern 40 and the bonding layer 13. In this case, it is possible to prevent the release layer from remaining on the conductive pattern 40 and the bonding layer 13 side. That is, the base material 30 is removed together with the release layer. When the base material 30 and the release layer are removed in this manner, the bonding layer 13 is exposed in the opening region 43 of the conductive pattern 40.

  On the other hand, when an interfacial peeling type peeling layer having relatively low adhesion to the base material 30 is used as the peeling layer compared to the adhesion to the conductive pattern 40 and the bonding layer 13, the peeling layer A peeling phenomenon occurs between the layer and the substrate 30. A delamination type delamination that has a plurality of layers as a delamination layer and has relatively low adhesion between the plurality of layers compared to the adhesion between the conductive pattern 40 and the bonding layer 13 and the substrate 30. When a layer is used, a peeling phenomenon occurs between the plurality of layers. In the case of using an agglomerated exfoliation type release layer in which a filler as a dispersed phase is dispersed in a base resin as a continuous phase, an exfoliation phenomenon due to a cohesive failure occurs in the exfoliation layer.

  Finally, the glass plate 11, the bonding layer 13, the conductive pattern 40, the bonding layer 14, and the glass plate 12 are superposed in this order, and heated and pressurized. In the example shown in FIG. 18, first, the bonding layer 14 is temporarily bonded to the glass plate 12. Next, the glass plate 11, the conductive pattern 40, the bonding layer 13, and the bonding layer 14 are temporarily set so that the side on which the bonding layer 14 of the glass plate 12 is temporarily bonded faces the conductive pattern 40 and the bonding layer 13. The bonded glass plates 12 are superposed in this order, and heated and pressurized. Thereby, the glass plate 11, the conductive pattern 40, and the glass plate 12 are joined (main joining) via the joining layers 13 and 14, and the heat generating plate 10 shown in FIG. 19 is manufactured.

  According to the heat generating plate 10 shown in FIG. 19, the heat generating plate 10 can be made not to include the base material 30. Thereby, the thickness of the heat generating plate 10 as a whole can be reduced. In addition, the number of interfaces in the heat generating plate 10 can be reduced. Accordingly, it is possible to suppress a decrease in optical characteristics, that is, a decrease in visibility.

  Next, another modification of the method for manufacturing the heat generating plate 10 will be described with reference to FIGS. 20 and 21 are cross-sectional views sequentially showing another modification of the method for manufacturing the heat generating plate 10.

  First, the glass plate 11 and the conductive pattern sheet 20 are bonded (temporarily bonded) via the bonding layer 13 by the same process as that of the modified example of the method for manufacturing the heating plate 10 described above. The base material 30 is removed. That is, the glass plate 11, the conductive pattern 40, and the bonding layer 13 which are described with reference to FIG. 17 in the modification of the method for manufacturing the heating plate 10 are obtained.

  Next, as shown in FIG. 20, the glass plate 11, the bonding layer 13, the conductive pattern 40, and the glass plate 12 are superposed in this order, and heated and pressurized. As a result, the glass plate 11 and the conductive pattern 40 are bonded (main bonding) via the bonding layer 13, and the glass plate 14 and the glass plate 12 are bonded (main bonding) via the bonding layer 13. . Then, the heat generating plate 10 shown in FIG. 21 is manufactured.

  According to the heat generating plate 10 shown in FIG. 21, the heat generating plate 10 can be configured not to include the base material 30 and the bonding layer 14. Thereby, the thickness of the heat generating plate 10 as a whole can be further reduced. In addition, the number of interfaces in the heat generating plate 10 can be further reduced. Therefore, it is possible to more effectively suppress a decrease in optical characteristics, that is, a decrease in visibility. In addition, since the conductive pattern 40 and the glass plate 12 are in contact, the heating efficiency of the glass plate 12 by the conductive pattern 40 can be increased.

  Still another modification will be described. In the above-described embodiment, each of the plurality of connection elements 45 included in the conductive pattern 40 has a straight line shape (straight line portion) when viewed from the normal direction of the plate surface of the heat generating plate 10, but is not limited thereto. Instead, at least a part of the plurality of connection elements 45 may have a shape other than a straight line shape, for example, a curved line shape or a polygonal line shape when viewed from the normal direction of the plate surface of the heat generating plate 10. Specifically, it may have a shape such as an arc shape, a parabolic shape, a wavy shape, a zigzag shape, or a combination of a curve and a straight line. In particular, the connection element 45 connecting the two branch points 43 as a straight line (straight line segment) is less than 20% of the plurality of connection elements 45, that is, 80% or more of the plurality of connection elements 45. Preferably have a shape other than a straight line (straight line).

  According to the conductive pattern 40 including the connection element 45 having a shape other than a straight line (straight line), light incident on the side surface of the connection element 45 having a curved shape, a broken line shape, or the like is transmitted on the side surface. Diffuse reflection. Thereby, light incident on the side surface of the connection element 45 from a certain direction (light of the headlight of the oncoming vehicle, sunlight, etc.) may be reflected in a certain direction on the side surface corresponding to the incident direction. It is suppressed. Therefore, it can suppress that this reflected light is visually recognized by observers, such as a driver, and the conductive pattern 40 which has the connection element 45 is visually recognized by an observer. As a result, the deterioration of the visibility through the window glass by the observer due to the visual recognition of the conductive pattern 40 can be suppressed.

  The heat generating plate 10 may be used for a rear window, a side window, or a sunroof of the automobile 1. Moreover, you may use for the transparent part of windows or doors of vehicles, such as a railway vehicle other than a motor vehicle, an aircraft, a ship, and a spacecraft.

  In addition to the vehicle, the heat generating plate 10 can be used for parts that separate the interior and the exterior, such as buildings and stores, transparent windows or doors, windows or doors of buildings, refrigerators, display boxes, cupboards, etc. It can also be used for a window or a transparent part of a storage or storage facility.

  In addition, although the some modification with respect to embodiment mentioned above was demonstrated above, naturally, it is also possible to apply combining several modifications suitably.

DESCRIPTION OF SYMBOLS 1 Car 5 Front window 7 Power supply 10 Heat generating plate 11 Glass plate 12 Glass plate 13 Joining layer 14 Joining layer 15 Wiring part 16 Connection part 20 Conductive pattern sheet 30 Base material 40 Conductive pattern 41 Conductive thin wire 41a Tip surface 41b Base end face 41c side surface 41d side surface 43 branch point 44 opening region 45 connecting element 50 conductive metal layer 51 first metal layer 52 second metal layer 53 first dark color layer 54 second dark color layer 61 first metal film 63 dark color film 65 resist pattern

Claims (1)

A method for producing a conductive pattern sheet used for a heating plate that generates heat when a voltage is applied,
Patterning the first metal film laminated on the substrate;
Forming a second metal layer by electroplating on the first metal layer formed by patterning the first metal film. A method for producing a conductive pattern sheet.

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