JP6744979B2 - 電磁汚染無効化組成物、装置および方法 - Google Patents
電磁汚染無効化組成物、装置および方法 Download PDFInfo
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- JP6744979B2 JP6744979B2 JP2019500757A JP2019500757A JP6744979B2 JP 6744979 B2 JP6744979 B2 JP 6744979B2 JP 2019500757 A JP2019500757 A JP 2019500757A JP 2019500757 A JP2019500757 A JP 2019500757A JP 6744979 B2 JP6744979 B2 JP 6744979B2
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- 238000000034 method Methods 0.000 title claims description 9
- 239000000203 mixture Substances 0.000 title description 9
- 239000002086 nanomaterial Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 21
- 239000000843 powder Substances 0.000 claims description 20
- 230000000087 stabilizing effect Effects 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 230000005294 ferromagnetic effect Effects 0.000 claims description 16
- 239000002245 particle Substances 0.000 claims description 14
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 10
- 239000003302 ferromagnetic material Substances 0.000 claims description 8
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims description 2
- 239000004743 Polypropylene Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229920001903 high density polyethylene Polymers 0.000 claims description 2
- 239000004700 high-density polyethylene Substances 0.000 claims description 2
- 229910052744 lithium Inorganic materials 0.000 claims description 2
- 229920000515 polycarbonate Polymers 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- -1 polypropylene Polymers 0.000 claims description 2
- 229920001155 polypropylene Polymers 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 235000012773 waffles Nutrition 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 239000012812 sealant material Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 description 10
- 230000005855 radiation Effects 0.000 description 5
- 230000002939 deleterious effect Effects 0.000 description 4
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- 230000010287 polarization Effects 0.000 description 2
- 241001465754 Metazoa Species 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
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- 229920003023 plastic Polymers 0.000 description 1
- 239000012255 powdered metal Substances 0.000 description 1
- 125000005207 tetraalkylammonium group Chemical group 0.000 description 1
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Description
Claims (15)
- 表面を有する有形装置であって、
前記表面に凹部を形成することによってそれぞれ形成された少なくとも1つのワッフラーと、
前記少なくとも1つのワッフラーのそれぞれの安定化フィルムと、
ナノスケールの形態である場合に強磁性特性を有する第1ナノスケール材料であって、前記第1ナノスケール材料は、前記装置の前記表面上の前記少なくとも1つのワッフラーに塗布され、前記第1ナノスケール材料は粉末形態であり、前記第1ナノスケール材料の所定量は前記安定化フィルムに亘って広がっており、前記第1ナノスケール材料は金属であり、前記第1ナノスケール材料は40〜100ナノメートルの粒径を有する、第1ナノスケール材料と、
前記第1ナノスケール材料と混合された強磁性粉末と、
封止剤材料と、を備え、
前記第1ナノスケール材料、及び、前記強磁性粉末が前記少なくとも1つのワッフラーに含まれる、有形装置。 - 複数のワッフラーが前記有形装置内で使用される、請求項1に記載の装置。
- 第2ナノスケール材料が前記第1ナノスケール材料および前記強磁性粉末と混合される、請求項1に記載の装置。
- 前記第1または前記第2ナノスケール材料が粉末形態の金である、請求項3に記載の装置。
- 前記第1または前記第2ナノスケール材料が粉末形態のパラジウムである、請求項3に記載の装置。
- 前記第1または前記第2ナノスケール材料が粉末形態のチタンである、請求項3に記載の装置。
- 前記第1ナノスケール材料が97ナノメートルの粒径を有する、請求項1に記載の装置。
- 前記安定化フィルムは、以下のリスト、つまり、強化炭化ケイ素とのアルミニウム/リチウムの組み合わせ、高密度ポリエチレン、ポリプロピレン、ポリカーボネート、または石英由来の材料から作られる、請求項1に記載の装置。
- 前記表面はポリマーでできている、請求項1に記載の装置。
- 表面を有する有形装置を製造する方法であって、
a)前記有形装置を所定の寸法に切断することと、
b)前記有形装置内に凹部を形成することによって、前記有形装置の表面に所定の直径および深さの少なくとも1つのワッフラーを形成することと、
c)前記少なくとも1つのワッフラーに第1安定化フィルムを配置することと、
d)ナノスケールの強磁性特性を有する第1ナノスケール材料の所定量を前記第1安定化フィルムの上部に塗布することであって、前記第1ナノスケール材料は、金属であり、粉末形態であり、且つ、40〜100ナノメートルの粒径を有する、ことと、
e)所定量の強磁性材料を前記第1ナノスケール材料に塗布することと、
f)前記第1ナノスケール材料および前記強磁性材料の上に第2安定化フィルムを配置することと、
g)所定量のセラミック粉末を前記第2安定化フィルムの上に塗布することと、
h)前記第1および前記第2安定化フィルム、前記第1ナノスケール材料、前記セラミック粉末、および、前記強磁性材料をシーリング剤を用いて各ワッフラー内にシールすることと、
i)電磁汚染の無効化が所望されるユーザ選択領域に前記有形装置を配置すること、とを含む、方法。 - 第2ナノスケール材料が前記第1ナノスケール材料と混合される、請求項10に記載の方法。
- 前記第1または前記第2ナノスケール材料がパラジウムである、請求項11に記載の方法。
- 前記第1または前記第2ナノスケール材料がチタンである、請求項11に記載の方法。
- 前記第1または前記第2ナノスケール材料が金である、請求項11に記載の方法。
- 複数のワッフラーが前記有形装置内で使用される、請求項10に記載の方法。
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