JP6737675B2 - Package for mounting pressure sensing element, pressure sensing device and electronic module - Google Patents

Description

The present invention relates to a package for mounting a pressure detection element, a pressure detection device, and an electronic module that house a pressure detection element for detecting pressure.

BACKGROUND ART Conventionally, there is known a pressure detecting device that houses a pressure detecting element for detecting pressure. Some pressure sensing element mounting packages used in this pressure sensing device include, for example, a base including a hole penetrating in the thickness direction and having a recess in which the pressure sensing element is mounted.

JP 2008-89559 JP

However, depending on the external environment, water such as water droplets may be present, and for example, water such as external water droplets can easily be located on the upper surface of the package for mounting the pressure sensing element. If there is a hole penetrating in the direction, water droplets may block the hole and the pressure may not be normally detected.

A pressure-sensing element mounting package according to one aspect of the present invention is provided from a main surface having a recess in which a pressure-sensing element is mounted to a side surface opposite to a main surface, and a bonding material is provided so as to be bonded to the base body. A notch and a lid having a groove extending from the main surface to the other opposite side surface.

A pressure sensing device according to one aspect of the present invention is a package for mounting a pressure sensing element having the above structure, a pressure sensing element mounted in the package for mounting a pressure sensing element, and the base body of the package for mounting the pressure sensing element. And a bonding material for bonding the lid body.

An electronic module according to one aspect of the present invention includes a module substrate having a connection pad, and the pressure detection device having the above-described configuration connected to the connection pad via a brazing material.

According to the package for mounting a pressure sensing element according to one aspect of the present invention, a base material having a recess in which the pressure sensing element is mounted, and a bonding material that is provided from a main surface to a side surface opposite to each other, and is bonded to the base material. For mounting a pressure detecting element, which includes a notch provided and a lid having a groove provided from the main surface to another opposite side surface, so that the recess of the package for mounting the pressure detecting element communicates with the outside. The communication part formed by the base of the package and the groove of the lid is exposed on the side surface, and even if moisture such as external water droplets is located on the upper surface of the lid of the pressure sensing element mounting package, it is exposed on the side surface. The communication portion is less likely to be blocked by water droplets, and as a result, the pressure detection device equipped with the pressure detection element can detect pressure favorably.

A pressure detection device according to one aspect of the present invention includes a pressure detection element mounting package having the above-described configuration, a pressure detection element mounted in the pressure detection element mounting package, a base body and a lid of the pressure detection element mounting package. By having a joining material for joining and, it becomes a pressure detection device that can detect pressure satisfactorily.

An electronic module according to one aspect of the present invention includes a module substrate having a connection pad and the pressure detection device having the above-described configuration connected to the connection pad via a brazing material, so that a good pressure can be obtained. Will be detected.

(A) is a top view showing an example of a pressure sensing device excluding a lid in an embodiment of the present invention, and (b) is a lower surface (mainly showing an example of a lid in the embodiment of the present invention. FIG. 1A is a vertical cross-sectional view taken along the line AA of the pressure detection device including the lid in FIG. 1, and FIG. 1B is a cross-sectional view taken along the line BB of the pressure detection device including the lid in FIG. 1. It is a longitudinal cross-sectional view, (c) is a side view in the C direction of the pressure detection device including the lid body in FIG. FIG. 2 is a vertical cross-sectional view showing an electronic module in which a pressure detection device including the lid body in FIG. 1 is mounted on a module substrate. FIG. 1A is an enlarged bottom view (principal surface) of an essential part of a D part in FIG. 1B, and FIGS. 1B and 1C are views showing another example of a lid body according to an embodiment of the present invention. It is a partial enlarged lower surface (main surface) figure.

Exemplary embodiments of the present invention will be described with reference to the drawings.

A pressure detection device according to an embodiment of the present invention will be described with reference to FIGS. The pressure detection device according to the present embodiment is mounted on the pressure detection element mounting package, the base 1 and the lid 2, the bonding material 3 that joins the base 1 and the lid 2, and the pressure detection element mounting package. And a pressure detecting element 4. As shown in FIG. 3, the pressure detection device is connected to a module substrate 5 that constitutes an electronic module, for example, by using a brazing material 6 such as solder.

The package for mounting the pressure sensing element of the present embodiment has, for example, a base body 1 having a recess 1a in which the pressure sensing element 4 is mounted, and a lid 2.

The base 1 has a concave portion 11 on the bottom surface of which the pressure detecting element 4 is mounted.

The base 1 functions as a mounting member for mounting the pressure sensing element 4, and the pressure sensing element 4 is flip-chip mounted on the wiring conductor 12 provided on the bottom surface of the recess 11 by the bumps 4a and the like.

As the base 1, for example, a ceramic such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body can be used. The base 1 may be formed by laminating a plurality of insulating layers made of such a ceramic sintered body, or by pressing the ceramic green sheet using a mold that can be molded into a predetermined shape. It may be molded by.

When the base 1 is made of a resin material, for example, an epoxy resin, a polyimide resin, an acrylic resin, a phenol resin, a polyester resin, or a fluororesin such as a tetrafluoroethylene resin is used. it can.

When the substrate 1 is formed by laminating a plurality of insulating layers made of, for example, an aluminum oxide sintered body, an organic binder suitable for a raw material powder of aluminum oxide, silicon oxide, magnesium oxide, calcium oxide, or the like. And a solvent, etc. are added and mixed to form a slurry, which is then formed into a sheet by a doctor blade method, a calendar roll method, etc. to obtain a ceramic green sheet, and then the ceramic green sheet is appropriately punched and It is manufactured by stacking multiple sheets and firing at high temperature (about 1600°C). Alternatively, the ceramic green sheet may be molded by pressurizing it using a mold that can be molded into a predetermined shape, and then fired at a high temperature as described above.

The concave portion 11 is provided with a mounting portion serving as a mounting area for the pressure sensing element 4. In the example shown in FIGS. 1 to 4, the inner wall of the recess 11 has a surface perpendicular to the bottom surface, and the pressure detecting element 4 is mounted on the mounting portion.

Such recesses 11 are formed by forming through holes in the ceramic green sheets for the base body 1 into a plurality of ceramic green sheets by laser processing, punching with a die, or the like. It can be formed by stacking on a ceramic green sheet having no holes. Further, when the thickness of the substrate 1 is thin, it is preferable to form the through hole to be the recessed portion 11 by laminating ceramic green sheets and then performing laser processing, punching processing with a die, or the like because it can be accurately processed.

The lid body 2 has a notch 21 provided from the main surface (lower surface) to the opposite side surface, and a groove 22 provided from the main surface to the other opposite side surface.

The lid body 2 is provided so as to cover the concave portion 11 of the base body 1, and the bonding material 3 is provided in the notch 21 so as to be bonded to the base body 1.

Like the base body 1, the lid 2 may be made of a ceramic such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, or a glass ceramic sintered body. .. The lid body 2 may be formed of one insulating layer made of such a ceramic sintered body, or may be formed by laminating a plurality of insulating layers, or a metal that can be formed into a predetermined shape. It may be formed by pressing the ceramic green sheet using a mold.

When the lid body 2 is made of a resin material like the base body 1, for example, fluorine such as epoxy resin, polyimide resin, acrylic resin, phenol resin, polyester resin, or tetrafluoroethylene resin is used. A system resin or the like can be used.

When the lid body 2 is formed of a single insulating layer made of, for example, an aluminum oxide sintered body, raw material powders of aluminum oxide, silicon oxide, magnesium oxide, calcium oxide and the like, like the base body 1. Add a suitable organic binder and solvent to form a slurry and mold it into a sheet by the doctor blade method or calender roll method to obtain a ceramic green sheet.After that, cut out the ceramic green sheet. Press a jig having the same shape to form the groove 21 and the groove 22, or perform appropriate punching processing on the ceramic green sheet and stack multiple sheets, and bake at a high temperature (about 1600°C) Produced by. Alternatively, the ceramic green sheet may be molded by pressurizing it using a mold that can be molded into a predetermined shape, and then fired at a high temperature as described above.

The notch 21 has a function of holding the bonding material 3 provided so that the lid body 2 is joined to the base body 1. By having the above-described notch 21, for example, the lid body 2 and the base body 1 are separated from each other. At the time of joining, it is possible to suppress the joining material 3 from extending to the groove 22 side.

Such notches 21 are formed into a plurality of ceramic green sheets with through holes serving as the notches 21 by laser processing, punching with a die or the like on the ceramic green sheet for the lid body 2. Can be formed by stacking on a ceramic green sheet having no through holes. Further, when the lid body 2 is made of one insulating layer, or when the lid body 2 has a small thickness, the portion to be the notch 21 is subjected to laser processing, pressed by using a jig, or a mold is used. If used and pressed, it can be processed accurately.

The groove 22 is provided so that the lid body 2 covers the recess 11 of the base 1, and the communicating portion formed with the base 1 is exposed on the side surface. It can be in communication with the outside. Although the groove 22 has an inverted V-shape in a longitudinal sectional view, it may have a partial rectangular shape or an arc shape.

Similar to the notch 21, such a groove 22 can be processed with high precision by laser processing, pressing with a jig, or pressurizing with a mold.

When the groove 22 is provided so as to straddle the inner wall of the recess 11 in a plan view as in the example shown in FIGS. 1 to 4, it is assumed that the lid body 2 is displaced and joined to the base body 1. In addition, the communication portion is less likely to be blocked by the inner wall of the recess 11 and the main surface (lower surface) of the lid 2, and the recess 11 of the pressure sensing element mounting package and the outside can be well communicated. it can.

Note that, as in the example shown in FIGS. 4B and 4C, when the groove 22 has a branch portion 22a between both ends, the communication portion formed by the groove 22 and the base body 1 is formed. Even if the water enters, the water is divided by the branch portion 22, the upper portion of the communication portion is easily communicated, and the communication portion can be less likely to be blocked by the water. Further, for example, when the lid 2 and the base body 1 are joined together, even if the joining material 3 extends to the communicating portion, the joining material 3 is divided by the branch portion 22, and the upper portion of the communicating portion is easily communicated. Can be hard to be blocked by the bonding material 3. As a result, the pressure detection device equipped with the pressure detection element 4 can detect pressure favorably.

In addition, as in the example shown in FIG. 4C, when the groove 22 has the connecting portion 22b so as to connect with each other, moisture penetrates into the communicating portion formed by the groove 22 and the base 1. Even in this case, the water is extended to the adjacent communicating portion by the connecting portion 22b, the upper portion of the communicating portion is easily communicated, and the communicating portion is less likely to be blocked by the moisture. .. Further, for example, even when the joining material 3 extends to the communicating portion when the lid 2 and the base body 1 are joined, the joining material 3 is extended to the adjacent communicating portion by the connecting portion 22b, and the communicating portion The upper part of the part can be easily communicated, and the communication part can be prevented from being easily blocked by the bonding material 3. As a result, the pressure detection device equipped with the pressure detection element 4 can detect pressure favorably.

Note that, as in the example shown in FIG. 4B, when the number of end portions of the groove 22 is larger on the inner side than the outer edge side of the lid body 2, the communicating portion formed by the groove 22 and the base body 1 is formed. Even if water enters, the water is divided at the communication portion, the upper portion of the communication portion is easily communicated, and the communication portion can be more unlikely to be blocked by water. Further, for example, when the lid 2 and the base body 1 are joined together, even if the joining material 3 extends to the communicating portion, the joining material 3 is divided at the communicating portion, and the upper portion of the communicating portion is easily communicated, and the communicating portion is It is possible to make it difficult for the bonding material 3 to close the surface. As a result, the pressure detection device equipped with the pressure detection element 4 can detect pressure favorably.

The wiring conductor 12 is provided on the surface and inside of the base 1. One end of the wiring conductor 12 is led to the bottom surface of the recess 11, for example, and the other end of the wiring conductor 12 is led to the lower surface of the base 1. The wiring conductor 12 is for electrically connecting the pressure detecting element 4 mounted in the pressure detecting element mounting package and the module substrate 5. The wiring conductor 12 includes a wiring conductor provided on the surface or inside of the base body 1 and a penetrating conductor that penetrates the insulating layer forming the base body 1 and electrically connects the wiring conductors located above and below. ..

The wiring conductor 12 can be made of a metal material such as tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag), or copper (Cu). For example, when the base 1 is made of an aluminum oxide sintered body, a conductor for the wiring conductor 12 obtained by adding and mixing a suitable organic binder, a solvent and the like to a high melting point metal powder such as W, Mo or Mn. The paste is printed and applied in a predetermined pattern on the ceramic green sheet to be the base body 1 in advance by a screen printing method, and is fired at the same time as the ceramic green sheet to be the base body 1, so that the paste is formed at a predetermined position on the base body 1. .. When the wiring conductor 12 is a through conductor, a through hole is formed in the green sheet by punching or laser processing by a die or punching, and the through hole is filled with a conductor paste for the wiring conductor 12 by a printing method. It is formed by placing.

The exposed surface of the wiring conductor 12 is further coated with a plating layer by an electroplating method or an electroless plating method. The plating layer is made of a metal such as nickel, copper, gold, or silver that has excellent corrosion resistance and connectivity with the bumps 4a or the like connected to the electrodes of the pressure sensing element 4. For example, the nickel plating layer and the gold plating are used. Layers, or nickel and silver plated layers are deposited sequentially.

Further, a plating layer made of a metal other than the above, for example, a palladium plating layer or the like may be interposed.

In the package for mounting the pressure detecting element, the pressure detecting element 4 is mounted on the mounting portion of the recessed portion 11, and the base 1 and the lid 2 of the package for mounting the pressure detecting element are joined by the joining material 3 provided in the notch 21. By doing so, the pressure sensing device is manufactured. The pressure sensing element 4 is mounted on the pressure sensing element mounting package by electrically connecting the electrode of the pressure sensing element 4 and the wiring conductor 12 via the bump 4a or the like.

The pressure sensing element 4 is, for example, a silicon substrate having a pressure receiving surface, a pressure sensor of a so-called MEMS (Micro Electro Mechanical System), or the like.

In the concave portion 11, the lid 4 is joined via the sealing material 3 made of glass, resin or the like.

In the above description, as in the example shown in FIG. 3, the pressure detection device is connected to the connection pad 51 of the module substrate 5 via the brazing material 6 such as solder.

According to the pressure sensing element mounting package of the present embodiment, the bonding material 3 is provided from the main surface to the side surface opposite to the base body 1 having the recess 11 in which the pressure sensing element 4 is mounted, and is bonded to the base body 1. By including the notch 21 provided with and the lid body 2 having the groove 22 provided from the main surface to the other opposite side surfaces, the recess 11 of the pressure sensing element mounting package communicates with the outside, The communicating portion formed by the base 1 of the package for mounting the pressure sensing element and the groove 22 of the lid 2 is exposed on the side surface, and moisture such as external water droplets is exposed on the upper surface of the lid 2 in the package for mounting the pressure sensing element. Even if it is located, the communication portion exposed on the side surface is less likely to be blocked by water droplets, and as a result, the pressure detection device equipped with the pressure detection element 4 can detect pressure favorably.

According to the pressure detecting device of the present embodiment, the pressure detecting element mounting package having the above configuration, the pressure detecting element 4 mounted on the pressure detecting element mounting package, the base 1 and the lid of the pressure detecting element mounting package. By having the joining material 3 that joins 2 and 2, it becomes a pressure detection device which detects pressure satisfactorily.

According to the electronic module of the present embodiment, the module substrate 5 having the connection pad 51 and the pressure detection device having the above-mentioned configuration connected to the connection pad 51 via the brazing material 6 are preferable. It will detect pressure.

1... Base 2... Lid
21...
22....Groove
22a...Branching part
22b... Connection part 3... Bonding material 4... Pressure detection element 5... Module substrate
51... Connection pads 6... Brazing material

Claims (6)

A base body having a recess in which a pressure sensing element is mounted,
A notch which is provided from the main surface to the opposite side surface and in which a bonding material is provided so as to be joined to the base body, and a lid body having a groove provided from the main surface to the other opposite side surface. Characteristic package for mounting pressure sensing element. The package for mounting a pressure sensing element according to claim 1, wherein the groove has a branch portion between both end portions. The pressure sensing element mounting package according to claim 1, wherein the groove has a connecting portion so as to connect to each other. The package for mounting a pressure sensing element according to claim 1, wherein the number of end portions of the groove is larger on the inner side than on the outer edge side of the lid body. A package for mounting a pressure sensing element according to any one of claims 1 to 4,
A pressure detecting element mounted on the pressure detecting element mounting package,
A pressure detection device comprising: a bonding material that bonds the base body of the package for mounting the pressure detection element and the lid body. A module substrate having a connection pad,
An electronic module, comprising: the pressure detecting device according to claim 5, which is connected to the connection pad via a brazing material.

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