JP6736923B2 - 発光装置の製造方法 - Google Patents

発光装置の製造方法 Download PDF

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Publication number
JP6736923B2
JP6736923B2 JP2016053590A JP2016053590A JP6736923B2 JP 6736923 B2 JP6736923 B2 JP 6736923B2 JP 2016053590 A JP2016053590 A JP 2016053590A JP 2016053590 A JP2016053590 A JP 2016053590A JP 6736923 B2 JP6736923 B2 JP 6736923B2
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Japan
Prior art keywords
electrode
silicon oxide
semiconductor element
substrate
semiconductor
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JP2016053590A
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English (en)
Japanese (ja)
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JP2017168714A5 (enExample
JP2017168714A (ja
Inventor
優 東原
優 東原
健作 ▲濱▼田
健作 ▲濱▼田
健太 梅鶯
健太 梅鶯
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Nichia Corp
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Nichia Corp
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Priority to JP2016053590A priority Critical patent/JP6736923B2/ja
Publication of JP2017168714A publication Critical patent/JP2017168714A/ja
Publication of JP2017168714A5 publication Critical patent/JP2017168714A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

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  • Drying Of Semiconductors (AREA)
  • Wire Bonding (AREA)
  • Led Device Packages (AREA)
JP2016053590A 2016-03-17 2016-03-17 発光装置の製造方法 Active JP6736923B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016053590A JP6736923B2 (ja) 2016-03-17 2016-03-17 発光装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016053590A JP6736923B2 (ja) 2016-03-17 2016-03-17 発光装置の製造方法

Publications (3)

Publication Number Publication Date
JP2017168714A JP2017168714A (ja) 2017-09-21
JP2017168714A5 JP2017168714A5 (enExample) 2019-04-25
JP6736923B2 true JP6736923B2 (ja) 2020-08-05

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ID=59913586

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JP2016053590A Active JP6736923B2 (ja) 2016-03-17 2016-03-17 発光装置の製造方法

Country Status (1)

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JP (1) JP6736923B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12051771B2 (en) 2020-10-30 2024-07-30 Nichia Corporation Light emitting device and method of manufacturing light emitting device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5443827B2 (ja) * 2009-05-20 2014-03-19 ルネサスエレクトロニクス株式会社 半導体装置
JP5874051B2 (ja) * 2011-11-17 2016-03-01 パナソニックＩｐマネジメント株式会社 半導体発光装置の製造方法およびプラズマを利用したクリーニング方法
JP6068175B2 (ja) * 2013-02-12 2017-01-25 新光電気工業株式会社 配線基板、発光装置、配線基板の製造方法及び発光装置の製造方法

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JP2017168714A (ja) 2017-09-21

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