JP6735248B2 - 車載制御装置 - Google Patents
車載制御装置 Download PDFInfo
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- JP6735248B2 JP6735248B2 JP2017066633A JP2017066633A JP6735248B2 JP 6735248 B2 JP6735248 B2 JP 6735248B2 JP 2017066633 A JP2017066633 A JP 2017066633A JP 2017066633 A JP2017066633 A JP 2017066633A JP 6735248 B2 JP6735248 B2 JP 6735248B2
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- circuit board
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- heat
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
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- FUJCRWPEOMXPAD-UHFFFAOYSA-N lithium oxide Chemical compound [Li+].[Li+].[O-2] FUJCRWPEOMXPAD-UHFFFAOYSA-N 0.000 description 1
- 229910001947 lithium oxide Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
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- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
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- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
そして、電子部品(発熱素子)の端子部の上部及び周囲に熱放射性コーティング膜が厚膜で形成されることを特徴としている。また電子部品の端子部に形成された熱放射性コーティング膜は、電子部品の端子により凹凸形状が形成されることを特徴としている。
電子部品電子部品からの発熱を効率よく放熱することが可能な熱放射性コーティング膜を備えた車載制御装置を提供することができる。
特に電子部品11が実装された回路基板12には絶縁性が必要なため、熱放射性コーティング膜30には絶縁性が求められる。そのため、熱放射性コーティング膜30を形成する熱放射性コーティング時亜にはセラミックス粉末等の絶縁性を有する材料を配合することが好適である。無機材料の粒子形状は、従来公知のものを使用でき、特に限定されないが、球状、フレーク状、針状、直方体、立方体、四面体、六面体、多面体、筒状、チューブ状、核部から異なる4軸方向に伸びた三次元針状構造等が挙げられる。高熱放射性を有する粒子が二種類以上配合されている場合は、1200〜500cm−1の赤外吸収領域おいて吸光度0.5以上で重複していない組み合わせが好ましい。広領域の波長で電磁波を放出でき、熱放射性能が向上する。前記無機粒子を配合する場合、その平均粒子径は、特に限定されないが、0.001〜200μmとされる。平均粒子径が大きすぎる(200μmを超える)と、塗膜厚が厚くなり熱放射性の低下を招くとともに、塗膜の強度や被塗布体の接着強度及び密着力が低下する恐れがある。また、平均粒子径が小さすぎる(0.001μm未満)と、粒子とバインダーとの界面が増加し、熱放射性能が低下する嫌いがある。
電子部品11ははんだ等の接合部材により、回路基板12に実装される。コネクタ15ピンをコネクタ15ハウジングに組み付ける工程後、コネクタ15ピンと回路基板12がはんだによりスポットフロー工程で接合される。電子部品11及びコネクタ15が回路基板12に実装された後に、熱放射性コーティング材を塗布し、熱放射性コーティング膜30を備える。塗布法法としては、ハケ塗装、吹付塗装、浸漬塗装等での塗布が好ましいが、塗布する対象物により、静電塗装、カーテン塗装、電着塗装、粉体塗装等でもよい。熱放射性コーティング材塗布後、乾燥させコーティング膜化する方法として、好ましくは自然乾燥、焼付等の方法を用いる。
(比較材料)
・樹脂A:粘度60mPa・s
・熱硬化性樹脂+ナノシリカ(粒径12nm)5W%含有:粘度90mPa・s
放熱評価方法は次の通りである。
11 電子部品
12 回路基板
13 ベース
14 カバー
15 コネクタ
16 台座部
17 ネジ
18 車両搭載固定部
19 サーマルビア
22 接続部材
23 電子部品の端子
30、31、32 熱放射性コーティング膜
Claims (2)
- 回路基板と、
前記回路基板に実装される電子部品と、
前記電子部品の端子と前記回路基板とを接続する接続部材と、
前記回路基板及び端子を直接覆う熱放射性コーティング膜と、
を有する車載制御装置において、
前記電子部品が実装されていない前記回路基板の平坦部を覆う前記熱放射性コーティング膜の厚みを70μm以上かつ150μm以下とし、
前記端子上を覆う前記熱放射性コーティング膜の厚みを70μm以上かつ150μm以下とし、
前記熱放射性コーティング膜は、2つの前記端子の間では前記端子の頂点よりも低くなる凹形状となり、2つの前記端子の間の中央部では厚みを70μm以上かつ150μm以下とし、
前記熱放射性コーティング膜は、有機樹脂とナノシリカを含む無機粒子とを材料として、厚みを70μm以上かつ150μm以下としたときの放射率が室温下で0.85以上かつ0.92以下であり、
前記熱放射性コーティング膜を形成する熱放射性コーティング材は、前記回路基板に塗布時の粘度が90mPa・sであることを特徴とする車載制御装置。 - 請求項1に記載の車載制御装置において、
前記熱放射性コーティング膜の硬さは5.5N/mm2以上であることを特徴とする車載制御装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017066633A JP6735248B2 (ja) | 2017-03-30 | 2017-03-30 | 車載制御装置 |
PCT/JP2018/003903 WO2018179853A1 (ja) | 2017-03-30 | 2018-02-06 | 車載制御装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017066633A JP6735248B2 (ja) | 2017-03-30 | 2017-03-30 | 車載制御装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2018170401A JP2018170401A (ja) | 2018-11-01 |
JP2018170401A5 JP2018170401A5 (ja) | 2019-04-11 |
JP6735248B2 true JP6735248B2 (ja) | 2020-08-05 |
Family
ID=63675104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017066633A Expired - Fee Related JP6735248B2 (ja) | 2017-03-30 | 2017-03-30 | 車載制御装置 |
Country Status (2)
Country | Link |
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JP (1) | JP6735248B2 (ja) |
WO (1) | WO2018179853A1 (ja) |
Families Citing this family (1)
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JPWO2021059793A1 (ja) * | 2019-09-26 | 2021-04-01 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2590843B2 (ja) * | 1986-10-31 | 1997-03-12 | 株式会社デンソー | 電子回路基板用絶縁コーティング剤 |
JPH04261092A (ja) * | 1991-01-21 | 1992-09-17 | Mitsubishi Electric Corp | 電気部品の端子接続方法 |
JPH0575241A (ja) * | 1991-09-12 | 1993-03-26 | Toshiba Corp | 回路基板装置 |
JP2008251950A (ja) * | 2007-03-30 | 2008-10-16 | Matsushita Electric Ind Co Ltd | 配線基板 |
JP2009026982A (ja) * | 2007-07-20 | 2009-02-05 | Sit:Kk | 電子装置とその製造方法 |
JP6271164B2 (ja) * | 2013-06-17 | 2018-01-31 | 日立オートモティブシステムズ株式会社 | 箱型車載制御装置 |
JP6470004B2 (ja) * | 2014-09-29 | 2019-02-13 | 日立オートモティブシステムズ株式会社 | 車載制御装置 |
JP2017050399A (ja) * | 2015-09-02 | 2017-03-09 | 日立オートモティブシステムズ株式会社 | 車載制御装置 |
-
2017
- 2017-03-30 JP JP2017066633A patent/JP6735248B2/ja not_active Expired - Fee Related
-
2018
- 2018-02-06 WO PCT/JP2018/003903 patent/WO2018179853A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2018179853A1 (ja) | 2018-10-04 |
JP2018170401A (ja) | 2018-11-01 |
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