JP6718479B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法 Download PDF

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Publication number
JP6718479B2
JP6718479B2 JP2018052282A JP2018052282A JP6718479B2 JP 6718479 B2 JP6718479 B2 JP 6718479B2 JP 2018052282 A JP2018052282 A JP 2018052282A JP 2018052282 A JP2018052282 A JP 2018052282A JP 6718479 B2 JP6718479 B2 JP 6718479B2
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electrode
wiring terminal
metal layer
semiconductor
manufacturing
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Japanese (ja)
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JP2018129523A5 (https=
JP2018129523A (ja
Inventor
将嗣 市川
将嗣 市川
芳樹 井上
芳樹 井上
善之 粟飯原
善之 粟飯原
島津　武仁
武仁 島津
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Tohoku University NUC
Nichia Corp
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Tohoku University NUC
Nichia Corp
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Priority to JP2018052282A priority Critical patent/JP6718479B2/ja
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Publication of JP2018129523A5 publication Critical patent/JP2018129523A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors

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  • Wire Bonding (AREA)
  • Led Device Packages (AREA)
JP2018052282A 2018-03-20 2018-03-20 半導体装置の製造方法 Active JP6718479B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018052282A JP6718479B2 (ja) 2018-03-20 2018-03-20 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018052282A JP6718479B2 (ja) 2018-03-20 2018-03-20 半導体装置の製造方法

Related Parent Applications (1)

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JP2016058870A Division JP6315014B2 (ja) 2016-03-23 2016-03-23 半導体装置の製造方法

Publications (3)

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JP2018129523A JP2018129523A (ja) 2018-08-16
JP2018129523A5 JP2018129523A5 (https=) 2019-05-09
JP6718479B2 true JP6718479B2 (ja) 2020-07-08

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JP (1) JP6718479B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7616040B2 (ja) * 2021-12-20 2025-01-17 豊田合成株式会社 Ｌｅｄディスプレイとその製造方法

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JP2018129523A (ja) 2018-08-16

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