JP6713087B2 - Resin film forming method and resin film forming apparatus - Google Patents

Description

The present invention relates to a resin film forming method and a resin film forming apparatus capable of easily removing a resin material film formed on a mask in a reduced pressure atmosphere.
The present application claims priority based on Japanese Patent Application No. 2017-030321 filed in Japan on February 21, 2017, the contents of which are incorporated herein by reference.

A vapor deposition polymerization method and an ultraviolet curing method are widely used as a method for producing a resin film made of a high molecular organic material. In both of these two manufacturing methods, a low-molecular organic gas is introduced into a depressurized processing tank, the resin material supplied onto the object to be processed undergoes a polymerization reaction, and a polymer resin film is applied to the object to be processed. It is a method of forming on the surface of, and has a feature that the coverage (coverage) of the resin film on the surface of the object to be processed is good. Patent Document 1 discloses a film forming apparatus suitable for this.

FIG. 7 is a flowchart showing a conventional method of forming a resin film, showing a case where an acrylic resin film F is formed as a representative example of the resin film using the metal mask MY.
First, after performing a pretreatment such as forming an inorganic protective film on the substrate S, the substrate S is moved into the film forming chamber (SY1, SY2).

In the film formation chamber (reduced pressure atmosphere), as shown in FIGS. 8 to 11, a metal mask MY having a desired opening is arranged on the film formation surface of the substrate S (SY3). As a result, the film formation surface of the substrate S at the position of the opening is exposed as shown in FIG.
Next, as shown in FIG. 9, an acrylic material film f as a representative example of the resin material film is formed on the substrate S through the metal mask MY (SY4). The acrylic material film f is composed of a portion f1 that covers the substrate S and a portion f2 that covers the metal mask MY.

Next, as shown in FIG. 10, the acrylic material film f is irradiated with ultraviolet rays (UV) to cure the acrylic material film f to form an acrylic resin film F (SY5). Then, as shown in FIG. 11, by moving the metal mask MY in the direction of the arrow, the metal mask MY is separated from the substrate S (SY6). The metal mask MY is cleaned and reused after one-time film formation or after being used a plurality of times by exchanging substrates (a plurality of film formations have been performed).

Conventionally, the removal of the acrylic resin film F deposited on the metal mask MY has been performed by a method of removing the metal mask MY from the inside of the acrylic resin film forming apparatus to the outside and performing a wet etching process. Therefore, it has been expected to develop an acrylic resin film forming method and an acrylic resin film forming apparatus capable of easily removing the acrylic resin film formed on the mask inside the film forming apparatus in a reduced pressure atmosphere.

Japanese Patent No. 4112702

The present invention has been made in view of the above-mentioned circumstances, and a resin film forming method and a resin film in which a resin film is not formed on a metal mask and the metal mask can be repeatedly used without taking out from the film forming apparatus and cleaning. It is an object of the present invention to provide a film forming apparatus of the above. An object of the present invention is to provide a resin film forming method and a resin film forming apparatus in which a resin film is not formed on a mask inside a film forming apparatus in a reduced pressure atmosphere.

A method of forming a resin film according to a first aspect of the present invention is a method of forming a resin film on a substrate in a reduced pressure atmosphere using a mask whose mask body is made of a metal material and has a predetermined opening. In a depressurized atmosphere, the mask is provided so as to come into contact with the substrate (deposition surface) placed on a cooled support, and the vaporized resin material is supplied through the mask and condensed on the substrate. A first step (step α) of forming a liquid resin material film on the substrate, a second step (step β) of peeling the mask from the substrate, and a heat treatment of the resin material film on the mask, A third step (step γ) of evaporating the resin material film, and a fourth step (step of irradiating the resin material film remaining on the substrate with UV light to cure the resin material film to form a resin film) δ) and are provided in order.
In the method for forming a resin film according to the first aspect of the present invention, the heat treatment in the third step may be heating and temperature rise for the mask using a heating device.
In the method for forming a resin film according to the first aspect of the present invention, the heat treatment in the third step may be performed by a natural temperature rise due to the mask being separated from the support table.
In the resin film forming method according to the first aspect of the present invention, in the heat treatment in the third step, the mask may be separated from the support table and heated by radiant heat from a heated chamber or shower plate. Good.

A film forming apparatus for a resin film according to a second aspect of the present invention is an apparatus for forming a resin film on a substrate in a depressurized atmosphere using a mask whose main body is made of a metal material and has a predetermined opening. A support portion for the substrate, which has a temperature control device for keeping the substrate in a temperature range of zero degrees or less when the vaporized resin material that is the material of the resin film is supplied onto the substrate and condensed to form the resin material film. And a mechanism for, before irradiating the resin material film with UV light, peeling the mask from the substrate placed on the supporting portion and heat treating the resin material film on the mask. And a UV irradiation device that forms a resin film by irradiating the resin material film with UV light to cure the resin material film.
In the resin film forming apparatus according to the second aspect of the present invention, the mechanism for heat-treating the resin material film may be a heating device for promoting the temperature increase of the mask.
In the resin film forming apparatus according to the second aspect of the present invention, the mechanism for heat-treating the resin material film may be a moving device that separates the mask from the support base.
In the resin film forming apparatus according to the second aspect of the present invention, the mechanism for heat-treating the resin material film may be a heating device for a chamber that houses the substrate.

In the method of forming a resin film according to the aspect of the present invention, in the third step, before the resin material film formed on the substrate is irradiated with UV light, the resin material film is placed on a support table in a temperature range of zero degrees or less. The mask is peeled off from the substrate at, the resin material film on the mask is heat-treated, and the resin material film is evaporated. As a result, every time the resin material film is formed in the deposition chamber in the reduced pressure atmosphere, the resin material film covering the mask is completely removed from the mask. Therefore, even if UV irradiation is performed thereafter, the resin film is not formed on the mask. Therefore, in order to remove the resin film, the cleaning operation that has been indispensable in the past, that is, the operation of removing the mask from the inside of the film forming apparatus for the resin film to the outside and performing the wet etching process, etc. is an aspect of the present invention. According to, it is basically unnecessary.
Therefore, the aspect of the present invention provides a method for forming a resin film that can reduce the cost and simplify the work in forming the resin film using a mask.

A film forming apparatus for a resin film according to an aspect of the present invention, in a reduced pressure atmosphere, when a resin material film is formed, a support unit for the substrate, which incorporates a temperature control device for maintaining the substrate in a temperature range of zero degrees or less, and the resin. A mechanism for, before irradiating the material film with UV light, peeling the mask from the substrate placed on the supporting portion and heat-treating the resin material film on the mask. There is. Thus, the resin material film covering the mask can be removed from the mask each time the resin material film is formed in the film forming chamber in the reduced pressure atmosphere. Therefore, according to the present invention, the work of removing the mask from the inside of the film forming apparatus for the resin film to the outside and performing wet etching is basically unnecessary.
Further, in the film forming apparatus of the present invention, since the resin material film is removed from the mask every time during the series of operations for forming the resin film, when the resin film is formed next time, the mask in a clean state is used. Is available.
Therefore, the resin film forming apparatus according to the aspect of the present invention provides a resin film forming apparatus capable of reducing cost and simplifying work in forming a resin film using a mask.

As the application of such a resin film, for example, it is suitably used as a sealing film for an organic EL display or a flexible display.

6 is a flowchart showing a method for forming an acrylic resin film according to an embodiment of the present invention. It is sectional drawing which shows the state which has arrange|positioned the mask on the board|substrate in FIG. It is sectional drawing which shows the state which formed the acrylic material film on the board|substrate through the mask. It is sectional drawing which shows the state which peeled the mask from the board|substrate before UV irradiation. It is sectional drawing which shows the state which heat-processed the acrylic material film on a mask, and was evaporated. It is sectional drawing which shows the state which UV-irradiated the acrylic material film|membrane on a board|substrate, and hardened. It is sectional drawing which shows the state which UV-irradiated the acrylic material film|membrane on a board|substrate, and hardened. It is a flowchart which shows the formation method of the conventional acrylic resin film. FIG. 8 is a cross-sectional view before placing the mask on the substrate in FIG. 7. It is sectional drawing which shows the state which formed the acrylic material film on the board|substrate through the mask. FIG. 3 is a cross-sectional view showing a state where the acrylic material film is irradiated with UV and cured. It is sectional drawing which shows the state which peeled the mask from the board|substrate after UV irradiation. It is a schematic diagram which shows an example of the film-forming apparatus of the acrylic resin film which concerns on embodiment of this invention.

Hereinafter, a method for forming a resin film according to an embodiment of the present invention and a mask having a configuration effective in forming the resin film will be described with reference to the drawings. An acrylic resin is illustrated as an example of the resin film.

<Method of forming acrylic resin film>
FIG. 1 is a flow chart showing a process for producing an acrylic resin film according to an embodiment of the present invention, and a method for forming an acrylic resin film includes eight steps SB1 to SB8.
Steps SB1 to SB2 are operations related to pretreatment of the substrate and movement of the substrate. In steps SB3 to SB7, a metal mask is placed on the substrate before the acrylic material film is formed, the acrylic material film is formed, the metal mask is peeled from the substrate, only the metal mask is heated (evaporation of the acrylic material on the metal mask), These are the respective operations of irradiating the acrylic material film on the substrate with UV to form an acrylic resin film, and are performed in a film forming chamber (reduced pressure atmosphere). Step SB8 is to move the substrate to the outside of the film forming chamber.

Therefore, according to the embodiment of the present invention, the wet process for removing the acrylic resin adhering to the mask by removing the mask from the inside to the outside of the acrylic resin film forming apparatus, which is essential in the conventional manufacturing method. It is not necessary to perform an etching process or the like. Therefore, in the formation of the acrylic resin film using the mask, the cost can be reduced and the work can be simplified.

Hereinafter, each step (step SB1 to step SB8) shown in the flowchart of FIG. 1 will be described in detail with reference to FIGS. 2 to 6B.
FIG. 2 is a sectional view showing a state in which the metal mask MB used in the embodiment of the present invention is arranged on the substrate S. FIG. 3 is a cross-sectional view showing a state in which the acrylic material film f is formed on the substrate S via the metal mask MB. FIG. 4 is a cross-sectional view showing a state where the metal mask MB is peeled from the substrate S after the acrylic material film f is formed and before UV irradiation. FIG. 5 is a cross-sectional view showing a state in which after the acrylic material film f2 on the mask MB is evaporated, the acrylic material film f1 on the substrate S is irradiated with UV to cure the acrylic material film f1 and form the acrylic resin film F1. Is.

The mask body of the metal mask MB is made of, for example, a metal material such as Invar material or stainless steel. It is used to form an acrylic material film f on the substrate S by supplying the vaporized acrylic material to the substrate S through a predetermined opening W provided in the mask body and condensing it on the substrate S. Accordingly, in the case of the mask MB, basically, the acrylic resin film is not formed on the substrate S in the region where the mask body was present at the time of film formation, and the acrylic resin film was formed on the substrate S in the region where the opening W was present. The film is formed.

On the substrate S, a light emitting element and the like are formed, and a protective film such as an inorganic material is formed. This series of operations is a substrate pretreatment (step SB1). Next, the substrate which has undergone the pretreatment is moved into the film forming chamber in which the metal mask MB is previously arranged (step SB2).

The film forming chamber in which the substrate has moved is evacuated by a vacuum exhaust device. In this depressurized atmosphere, the substrate S is placed on a support table in a temperature range below the condensation temperature of the resin material, for example, below 0 degree, and then a metal mask MB is arranged so as to come into contact with the film formation surface of the substrate. (Step SB3). The vaporized acrylic material is supplied through the metal mask MB and condensed on the substrate S to form an acrylic material film f on the substrate S (step SB4). Step SB3 and step SB4 are step α and are performed in the film forming chamber (reduced pressure atmosphere). Here, the temperature zone below zero degree is a numerical value determined by the vaporization temperature of the acrylic material used. It is preferably zero degrees (0° C.) or less, for example, in the range of about −30° C. to 0° C.

Next, as shown in FIG. 4, the metal mask MB on which the acrylic material film f has been formed is peeled from the substrate S in the direction of the arrow without irradiating the acrylic material film f with UV light (step SB5). .. At this time, the metal mask MB is in a state in which the acrylic material film f2 is attached so as to cover the upper surface thereof. Since it is not irradiated with UV light, the acrylic material film f2 covering the upper surface of the metal mask MB is in an uncured state. This is step β, and is performed in the film forming chamber (reduced pressure atmosphere).

Next, as shown in FIG. 5, the support and the substrate placed on the support are not heated, but only the metal mask MB is heated. Here, "heating only the metal mask MB" means elevating the acrylic material film f2 on the metal mask and evaporating the acrylic material film f2 without raising the temperature of the substrate or the support on which the substrate is placed. Means (step γ).
This heating is performed by a mechanism for heat-treating the acrylic material film f2 on the metal mask MB.
In the embodiment of the present invention, as a mechanism for heat-treating the acrylic material film f2, one of a heating device that promotes a temperature increase of the metal mask MB and a moving device that separates the metal mask MB from the support base, or a combination thereof. Is preferably used.

Examples of the heating device that promotes the temperature increase (temperature increase) of the metal mask MB include a heater that directly contacts the metal mask MB, a lamp that indirectly irradiates the metal mask MB, and the like. When the heating device is used, there is an advantage that the amount of heat applied per unit time to the acrylic material film f2(f) covering the metal mask MB can be freely controlled. In the heating device, for example, the acrylic material film f2 covering the metal mask MB undergoes a phase transition from liquid to gas by adopting a temperature increase profile corresponding to the evaporation temperature of the substance forming the acrylic material film f. Therefore, the acrylic material film f2 is removed from the metal mask MB. At that time, the acrylic material film f1 remaining on the substrate S is not affected at all. When increasing the temperature of the metal mask MB, it is preferable to heat the substrate S away from the substrate S so as not to affect the temperature of the substrate S.

Examples of the moving device that separates the metal mask MB from the support include a lifting pin, a robot hand, and a suction device means that can operate in a reduced pressure atmosphere. In the embodiment of the present invention, since the substrate S on which the acrylic material film f is being formed is placed on the support table in the temperature range of 0° C. or less, the acrylic material film formed on the substrate S. The temperature of f is also kept in the temperature range of zero degrees or lower. As the substance forming the acrylic material film, for example, a substance that evaporates at a temperature of zero degree or higher is adopted. As a result, the acrylic material film f2 covering the metal mask MB undergoes a phase transition from liquid to gas simply by separating the metal mask MB from the support, so that the acrylic material film f2 is removed from the metal mask MB. At that time, the acrylic film F1 remaining on the substrate S is not affected at all.
In particular, the chamber of the film forming apparatus and the shower plate arranged to face the substrate S are heated so that the acrylic material does not adhere thereto. Therefore, the metal mask MB is heated by the radiant heat from the peripheral chamber and the shower plate only by separating it from the cooled substrate S.

That is, the “mechanism for heat-treating the acrylic material film f2” in the embodiment of the present invention is a mechanism for evaporating the substance forming the acrylic material film. Thus, the acrylic material film f2 covering the metal mask MB can be easily removed from the metal mask MB in the film forming chamber (reduced pressure atmosphere).
The above is the process γ, which is performed in the film forming chamber (reduced pressure atmosphere). Therefore, the metal mask MB from which the acrylic material film f2 has been removed can be placed on a new substrate in the next film forming batch without being taken out of the film forming chamber, and can be used for forming a new acrylic film. Become.

Next, as shown in FIG. 6A, in step δ, the acrylic material film f1(f) remaining on the substrate S is irradiated with UV light to cure the acrylic material film f1 to form an acrylic resin film F. (Step SB7). This step is performed in the film forming chamber (reduced pressure atmosphere). At that time, the acrylic material film f2 covering the metal mask MB previously peeled from the substrate S is evaporated from above the metal mask MB in the above step γ, and when the step δ is performed, the metal mask is removed. The acrylic material film f2 does not exist on the MB. Therefore, the acrylic resin film is not formed on the metal mask MB.

<Acrylic resin film forming device>
FIG. 12 shows that a liquid resin material film is formed on the substrate S by supplying the resin material to the substrate S by using the metal mask MB according to the above-described embodiment of the present invention, and the resin material film is polymerized. 1 is a configuration example of a film forming apparatus 100 that forms a resin film by using the above. Hereinafter, a case of forming an acrylic resin film, which is an example of the resin material film, will be described in detail.
The film forming apparatus 100 includes a chamber 110 whose internal space can be decompressed, and a vaporizer 300 which supplies the vaporized resin material to the chamber 110 (processing chamber).

The inner space of the chamber 110 is composed of an upper space 107 and a lower space 108, as will be described later.
An unillustrated vacuum exhaust device (vacuum exhaust means, vacuum pump, etc.) is connected to the chamber 110, and the vacuum exhaust device is capable of exhausting gas in the internal space of the chamber 110 so that the internal space becomes a vacuum atmosphere. Is configured.

As shown in FIG. 12, a shower plate 105 is arranged in the internal space of the chamber 110, and the upper side of the shower plate 105 in the chamber 110 constitutes an upper space 107. A top plate 120 made of a member capable of transmitting ultraviolet light is provided at the top of the chamber 110, and an ultraviolet light irradiation device 122 (UV irradiation device) is arranged above the top plate 120. Here, the shower plate 105 is also formed of a member capable of transmitting ultraviolet light, so that the ultraviolet light that has passed through the top plate 120 from the irradiation device 122 and is introduced into the upper space 107 further passes through the shower plate 105, It is possible to proceed to the lower space 108 located below the shower plate 105. Thereby, the acrylic material film formed on the substrate S, which will be described later, is irradiated with ultraviolet light after the film formation to cure the acrylic material film (resin material film) to form an acrylic resin film (resin film). It is possible.

The vaporized resin material adheres to the substrate S through the opening (not shown) of the metal mask MA arranged on the film formation surface of the substrate S. At that time, in the manufacturing apparatus according to the embodiment of the present invention, the temperature of the substrate S is controlled to be equal to or lower than the condensation temperature of the resin material by the cooling device 102a built in the stage 102 on which the substrate S is mounted. Therefore, the condensed liquid acrylic material film can be formed on the substrate S.
Therefore, in the manufacturing apparatus 100 according to the embodiment of the present invention, it is preferable that the stage 102, which is a support table on which the substrate S is placed, holds the substrate S in a temperature range of 0 degrees or less.

The film forming apparatus 100 shown in FIG. 12 is an example of the embodiment of the present invention. Other configurations may be adopted as long as the stage 102, which is a support table on which the substrate S is placed, has a built-in cooling device 102a that is a temperature control device that cools and holds the substrate S.
For example, if the vaporized resin material can be uniformly diffused in the surface toward the substrate S, it is not necessary to dispose the shower plate 105 in the internal space of the chamber 110.

The chamber 110 is provided with a heating device (not shown). The temperature of the inner wall surface of the chamber 110 forming the upper space 107 and the lower space 108 can be set to be equal to or higher than the dew point temperature of the resin material, preferably about 40 to 250° C., and controlled by the heating device.

In the lower space 108 located below the shower plate 105 in the chamber 110, the stage 102 (substrate holding portion) on which the substrate S on which the acrylic resin film is formed is placed is arranged.

In the stage 102, the position where the substrate is to be placed on the surface is predetermined. The stage 102 is arranged in the chamber 110 with its surface exposed. Reference symbol S indicates a substrate arranged at a predetermined position on the surface of the substrate stage 102. The stage 102 is provided with a substrate cooling device 102 a that cools the substrate S.

The substrate cooling device 102a supplies a coolant into the stage 102 to cool the substrate S on the upper surface of the stage 102. Specifically, the temperature of the substrate S is controlled by the cooling device 102a built in the stage 102 (substrate holding unit) on which the substrate S is mounted, and is equal to or lower than the vaporization temperature of the resin material, preferably equal to or lower than 0° C. For example, it is controlled at about -30°C to 0°C.

A shower plate 105 is provided above the stage 102 on the entire surface of the stage 102. The shower plate 105 is composed of a plate-shaped member made of an ultraviolet ray transmitting material such as quartz and provided with a large number of through holes, and divides the internal space of the chamber 110 into an upper space and a lower space.

A mask (not shown) is provided in the lower space 108, and the position of this mask can be set to a predetermined position during film formation. In the lower space 108, a mask lifting mechanism (not shown) is provided.

The upper space 107 of the chamber 110 communicates with the vaporizer 300 via a pipe 112 (resin material supply pipe) and a valve 112V. The vaporized resin material can be supplied to the upper space 107 of the chamber 110 via the resin material supply pipe 112.

One end of a resin material bypass pipe 113 (second pipe) having a valve 113V is connected to a position of the resin material supply pipe 112 (first pipe) closer to the vaporizer 300 than the valve 112V. The other end of the resin material bypass pipe 113 (second pipe) is connected to the outside via an exhaust pipe 114, and gas can be exhausted through the resin material bypass pipe 113.

Opening/closing drive of the valve 112V and the valve 113V is controlled by the control unit 400. The control unit 400 supplies the vaporized resin material from the vaporizer 300 into the chamber 110, and the control unit 400 exhausts the vaporized resin material from the vaporizer 300 to the outside and does not supply the vaporized resin material into the chamber 110. The film state and the film state are controlled to be switchable.

The valve 112V, the valve 113V, and the control unit 400 configure a switching unit that has a selection function of supplying a resin material to the inside of the chamber 110 or exhausting the resin material to the outside of the chamber 110.

The vaporizer 300 can supply the vaporized resin material to the chamber 110. As shown in FIG. 12, the vaporizer 300 includes a vaporization tank 130, a discharge part 132, and a resin material raw material container 150.

As shown in FIG. 12, the vaporization tank 130 has an internal space for vaporizing the liquid resin material, and a discharge part 132 for spraying the liquid resin material is arranged above the internal space. The vaporization tank 130 is formed in a substantially cylindrical shape, but may have another cross-sectional shape. The inner surface of the vaporization tank 130 can be made of, for example, SUS or aluminum.

One end of the resin material liquid supply pipe 140 connected to the resin material raw material container 150 via the valve 140V and a carrier gas supply pipe 130G for supplying a carrier gas such as nitrogen gas are connected to the discharge part 132. Has been done. The other end of the resin material liquid supply pipe 140 is connected to the resin material raw material container 150 and is located inside the liquid resin material stored in the resin material raw material container 150.

A pressurized gas supply pipe 150G for supplying a material liquid such as nitrogen gas is connected to the resin material raw material container 150, and the liquid resin material pressurized by increasing the internal pressure of the resin material raw material container 150 is a resin. Liquid can be sent to the material liquid supply pipe 140.

The discharge part 132 is configured to spray the liquid resin material supplied from the resin material liquid supply pipe 140 into the internal space of the vaporization tank 130 together with the carrier gas. The discharge part 132 is provided at a substantially central position of the top of the vaporization tank 130.

As shown in FIG. 12, the vaporization tank 130 is provided with a heating unit 135 at a position below the vaporization tank 130. The heating unit 135 is arranged so as to divide the internal space into an upper space and a lower space, a vaporization space is formed above the heating unit 135, and a storage unit is formed below the heating space.

The heating unit 135 is provided below the discharge unit 132, and heats and vaporizes the liquid resin material sprayed from the discharge unit 132.

The internal pressure of the resin material raw material container 150 is increased, and the liquid resin material supplied from the resin material liquid supply pipe 140 is sprayed from the discharge part 132 together with the carrier gas into the internal space of the vaporization tank 130. At this time, the resin material and the carrier gas supplied to the discharge part 132 can be further heated.

The resin material sprayed from the discharge unit 132 into the internal space of the vaporization tank 130 together with the carrier gas is vaporized inside the heated vaporization tank 130.

During the steady vaporization of the resin material, the control unit 400 opens the valve 112V so that gas can flow into the chamber 110 and closes the valve 113V. Then, the resin material bypass pipe 113 (second pipe) is in a state in which gas cannot flow. As a result, the vaporized resin material is supplied to the chamber 110, and the film forming process can be performed.

The organic material is supplied to the chamber 110 and the organic material bypass pipe 113 (second pipe) is supplied only by switching the open/closed states of the valve 112V and the valve 113V by driving the switching unit, that is, by the control unit 400. You can choose and. Therefore, the supply amount of the vaporized resin material supplied to the chamber 110 can be stabilized, so that the film formation rate can be prevented from varying and a resin material film having excellent film characteristics can be stably formed. Becomes Furthermore, since the resin material can be continuously vaporized without introducing the resin material into the chamber 110 when the substrates are replaced in the chamber 110 and the mask is aligned, the vapor generation can be stopped/started. The steam generation rate can be made substantially constant without repetition.

The film forming apparatus 100 performs, for example, film formation of a resin material which is an ultraviolet curable acrylic resin having a vaporization temperature of about 40° C. to 250° C., and ultraviolet irradiation for curing the film formed resin material. It is configured so as to be possible in the same chamber 110. As a result, it is possible to perform all processing steps with the same device configuration, and it is possible to improve productivity.

INDUSTRIAL APPLICABILITY The present invention can be widely applied to a method for forming a resin film and a manufacturing apparatus having a configuration effective in forming a resin. INDUSTRIAL APPLICABILITY The present invention is suitably used, for example, when a resin film is produced as a sealing film for organic EL displays and flexible displays.

f (f1, f2) Acrylic material film (resin material film), F (F1, F2) Acrylic resin film (resin film), MB metal mask, S substrate W opening.

Claims (8)

A method of forming a resin film on a substrate in a reduced pressure atmosphere, using a mask having a predetermined opening in a mask body made of a metal material,
In a depressurized atmosphere, the mask is provided so as to come into contact with the substrate placed on a cooled support, and the vaporized resin material is supplied through the mask to condense on the substrate and liquid on the substrate. A first step of forming a resin material film of
A second step of peeling the mask from the substrate,
A third step of heat-treating the resin material film on the mask to evaporate the resin material film;
A fourth step of irradiating the resin material film remaining on the substrate with UV light to cure the resin material film to form a resin film;
In order,
Method for forming resin film. The heat treatment in the third step is heating and heating of the mask using a heating device.
The method for forming a resin film according to claim 1. The heat treatment in the third step is performed by a natural temperature rise due to the mask being separated from the support table.
The method for forming a resin film according to claim 1. In the heat treatment in the third step, the mask is separated from the support table and heated by radiant heat from a heated chamber or shower plate,
The method for forming a resin film according to claim 1. An apparatus for forming a resin film on a substrate in a reduced pressure atmosphere, using a mask whose mask body is made of a metal material and has a predetermined opening,
When a vaporized resin material, which is a material of a resin film, is supplied onto a substrate and condensed to form a resin material film, a support portion for the substrate that incorporates a temperature control device that keeps the substrate in a temperature range of zero degrees or less. ,
A mechanism for, before irradiating the resin material film with UV light, peeling off the mask from the substrate placed on the supporting portion and heat treating the resin material film on the mask;
A UV irradiation device that irradiates the resin material film with UV light to cure the resin material film to form a resin film.
Deposition equipment for resin film. The mechanism for heat-treating the resin material film is a heating device for promoting the temperature increase of the mask,
The resin film forming apparatus according to claim 5. A mechanism for heat-treating the resin material film is a moving device that separates the mask from a support.
The resin film forming apparatus according to claim 5. The mechanism for heat-treating the resin material film is a heating device for a chamber that houses the substrate,
The resin film forming apparatus according to claim 5.

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