JP6709819B2 - Conductive element - Google Patents

Description

The present invention relates to a conductive element, a plate member for the conductive element, and a method for manufacturing the conductive element.

The mounting density of electronic device components increases with the sophistication of functions and performance, as seen in small portable electronic devices (smartphones and other mobile phones, so-called wearable terminals, digital cameras, game consoles, etc.). Is. Among these electronic devices, those having a wireless communication function require an antenna for transmitting and receiving radio waves. When it is difficult to secure a space for an antenna in a part of a small housing, a conductor pattern may be plated on the surface of the housing so that power can be supplied, and the housing may be used as an antenna.

The transmitting/receiving unit connected to the antenna is usually included in the printed wiring board unit mounted inside the housing. Therefore, a means for electrically connecting the antenna to the conductor pattern of the printed wiring board unit is required to feed power to the antenna plated on the surface of the housing. As such means, for example, a part (conductive element) called a pogo pin type connector has been conventionally used.

A typical pogo pin connector accommodates a contact called a pogo pin and a coil spring in a metal cylinder, and the elastic force of the coil spring allows the pogo pin to connect to the other side (in the antenna power feeding as described above, the antenna side). It is electrically connected by being pressed against the electrodes. However, such a structure has problems that the manufacturing process is complicated, there is a limit to downsizing (especially height reduction and height reduction), and reliability of electrical connection is insufficient.

For such a problem, for example, according to Patent Document 1, the pogo pin has a structure in which the flange portion at the rear end of the pogo pin is retained in the cylinder hole, and the contact is fixed to the envelope (housing). It is described that the contact spring piece and the connection terminal portion, which are constantly in pressure contact with each other, are integrated. According to Patent Document 2, a contact portion of a connector and a spring portion that gives an elastic force toward the contact portion are integrally formed by punching a metal plate, and the spring portion is oriented in a direction intersecting with the expansion/contraction direction. It is described that it is folded to reduce the volume of the envelope. According to Non-Patent Document 1, it has been described that the pogo pin type connector has a feature that a suction space is provided and automatic mounting is possible while changing the spring to change the contact pressure. ing.

However, even if the contactor portion of the pogo pin type connector and the spring portion can be integrated, it is difficult to integrate them with the envelope. Further, for example, in the case of the antenna power feeding as described above, the power is fed to the antenna through the spring portion, which tends to have a long electrical length, and therefore the high frequency characteristics may be deteriorated.

JP, 2011-96606, A JP, 11-162592, A

Author name unknown, "Stable contact reliability", [online], date unknown, SMK Co., Ltd., [September 11, 2014 search], Internet <URL: https://www.smk .co.jp/news/press_release/2012/966cs/〉

In the conductive element such as the conventional pogo pin type connector, there is a limit to the simplification of the structure and the reduction of the number of parts even after various improvements as shown in the above-mentioned prior art documents, and the high frequency characteristics. However, there is a problem that it may cause deterioration.

In order to solve the above-mentioned problems, the conductive element of the present invention has a displaceable convex contact portion that contacts a contact object, a connection portion that connects to a connection object, and the contact portion to the connection portion. A leaf spring portion which is a member forming at least a part of a conductive path extending therethrough, and which has at least one bent portion which is connected to the contact portion and biases the contact portion toward the contact object; A housing for housing a conductive element formed by bending a single conductive material,
To the connection portion through the tip portion of the contact portion, a current-carrying portion for forming a short conductive path whose electrical length is shorter than the conductive path is provided, and by pressing by the contact target object to the contact portion, At least the tip portion of the contact portion is in contact with the current-carrying portion.

In order to solve the above-mentioned problems, the plate-shaped member for a conductive element of the present invention is a plate-shaped member for a conductive element, which is processed so that the conductive element can be formed by bending, A portion corresponding to a current-carrying portion for forming a short conductive path that reaches the connection portion through the tip portion of the contact portion and has an electrical length shorter than that of the conductive path,
And a portion corresponding to the tip of the contact portion formed so as to come into contact with the current-carrying portion at least when the contact target presses the contact portion.

In order to solve the above-mentioned problems, the manufacturing method of the conductive element of the present invention, the shape of the developed view of the conductive element is shaped into a conductive plate-shaped material, from the plate-shaped material, the It is characterized in that the plate-shaped member is separated according to the shape, and is bent according to the positional relationship among the housing, the contact portion, the connection portion, the leaf spring portion, and the current-carrying portion of the conductive element based on the plate-shaped member.

According to the present invention, it is possible to further simplify the structure of the conductive element, reduce the number of components, and reduce the risk of deterioration of high-frequency characteristics.

3 is a perspective view of the conductive element of Example 1. FIG. FIG. 2 is a perspective view showing the conductive element shown in FIG. 1 rotated 180 degrees around the Y axis. FIG. 2 is a perspective view showing the conductive element shown in FIG. 1 rotated 180 degrees around the Z axis. 3 is a development view of a plate-like member formed by bending the conductive element of Example 1. FIG. 3 is a cross-sectional view showing an example of use of the conductive element of Example 1. FIG. 3 is a perspective view showing a cross section of the conductive element of Example 1. FIG. 5 is a plan view showing a state in which a plurality of plate-shaped members forming the conductive element of Example 1 are connected. FIG. FIG. 7 is a diagram illustrating a configuration of a second embodiment. It is a perspective view showing the section of the conductive element in the state where the protector of Example 2 was attached. 7 is a perspective view of a conductive element of Example 3. FIG. 7 is a development view of a plate-like member formed by bending a conductive element of Example 3. FIG. 9 is a perspective view of a conductive element of Example 4. FIG. It is the perspective view which looked at the electrically conductive element of Example 4 from the direction different from FIG. 9 is a perspective view showing a cross section of a conductive element of Example 4. FIG. FIG. 7 is a development view of a plate-like member formed by bending a conductive element of Example 4. It is sectional drawing which shows the initial state of the electrically conductive element of Example 4. FIG. 11 is a cross-sectional view showing a pressed state of a protruding portion of a conductive element of Example 4. 9 is a perspective view of a conductive element of Example 5. FIG. FIG. 19 is a perspective view of the conductive element of Example 5 viewed from a direction different from FIG. 18. It is a perspective view showing the cross section of the conductive element of Example 5. It is sectional drawing which shows the initial state of the electroconductive element of Example 5. It is sectional drawing which shows the pressing state of the protrusion part of the electroconductive element of Example 5. It is a perspective view of the conductive element of Example 6. FIG. 11 is a side view of the conductive element according to the sixth embodiment. It is a side surface sectional view of the conductive element of Example 6. It is a side surface sectional view of the conductive element about the modification of Example 6.

Embodiments of the present invention will be described below with reference to the drawings.

(Example 1)
First Embodiment A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a perspective view of the conductive element 100 according to the first embodiment as viewed from the back side. For convenience of explanation, a three-dimensional rectangular coordinate system is defined as shown in FIG. That is, the X axis is from the left to the right (front side of the drawing) of the figure, the Y axis is from the left to the right of the drawing (back side of the drawing), and the Z axis is from the bottom to the top of the drawing. Define each. The installation direction of the conductive element 100 will be described below assuming that the X-axis direction is the horizontal direction, the Y-axis direction is the front-back direction, and the Z-axis direction is the vertical direction.

FIG. 2 is a perspective view of the conductive element 100 shown in FIG. 1 as viewed from the front side, which is rotated 180 degrees around the Y axis. FIG. 3 is a perspective view of the conductive element 100 shown in FIG. 1 rotated 180 degrees around the Z axis. In the perspective views shown below, a common three-dimensional orthogonal coordinate system will be added.

The conductive element 100 is formed by bending a plate-shaped member 102 shown in FIG. 4 which is separated from one conductive plate-shaped material (for example, a metal plate) by, for example, shearing. FIG. 4 is a development view of the plate member 102. FIG. 4 shows the actual shape of the plate-shaped member 102 as a plan view with solid lines, and encloses each part of the plate-shaped member 102 corresponding to each configuration of the conductive element 100 described later with an ellipse made of broken lines. It shows with. As will be described later with reference to FIG. 7, a set of plate-shaped members can be composed of a plurality of plate-shaped members 102 connected and arranged via the carrier unit 130.

The configuration of the conductive element 100 will be described with reference to FIGS. 1 to 3. As shown in FIGS. 1 and 3, the conductive element 100 includes a box-shaped housing 101, a meandering plate spring portion 112a housed in the housing 101, and a housing 101 connected to the plate spring portion 112a. And a contact portion 114 having a convex shape protruding from. The housing 101 has a left wall portion 104 and a right wall portion 106 that form side walls, and further has a bottom wall portion 108 that connects the left wall portion 104 and the right wall portion 106, as shown in FIG. There is.

As shown in FIG. 3, the housing 101 has a front wall portion 110 forming a side wall. The front wall portion 110 is continuous from the left wall portion 104, and is positioned so as to intersect with the right wall portion 106. Two portions of the front wall portion 110 on the right side in FIG. 3 are formed in a protruding shape so as to engage with holes provided in two portions of the right wall portion 106 near the left end in FIG. That is, the left wall portion 104, the right wall portion 106, the bottom wall portion 108, and the front wall portion 110 are shaped so as to surround other components of the conductive element 100.

The positional relationship of the left wall portion 104, the right wall portion 106, the bottom wall portion 108, and the front wall portion 110 described above (that is, in the plate-shaped member 102) on the development view is as shown in FIG. 4. In this developed view, the plate member 102 is bent toward the front with respect to the plane of the paper in FIG. 4 by sandwiching a straight line (not shown) that abuts the boundary of each part, as shown in FIGS. It is apparent that the positional relationship among the left wall portion 104, the right wall portion 106, the bottom wall portion 108, and the front wall portion 110 is established.

The plate member 102 includes a portion (denoted by reference numeral 112) extending from the bottom wall portion 108 toward the upper side in FIG. 4. This part is a conductive part, and when the plate-like member 102 is bent as described above to form the conductive element 100, the plate spring part 112a shown in FIG. 1 or 2 and the contact part 114 connected to this are formed. Constitute.

An example of using the conductive element 100 will be described with reference to FIG. FIG. 5 is a cross-sectional view showing a state where the printed wiring board unit 400 having the conductive element 100 mounted therein is housed in the electronic device housing 402. The printed wiring board unit 400 has a transmitter/receiver 404 mounted therein, and a conductor pattern 406 connects between the transmitter/receiver 404 and the conductive element 100. The end of the conductor pattern 406 on the side closer to the conductive element 100 is the first electrode 408. The conductive element 100 is connected to the first electrode 408 which is a connection target, and this point will be described in more detail later.

A conductor pattern 410 used as an antenna is provided, for example, by plating on the inside of the electronic device housing 402 (the side facing the printed wiring board unit 400). The end of the conductor pattern 410 on the side closer to the conductive element 100 is the second electrode 412 that is the contact target. The printed wiring board unit 400 is accommodated in the electronic device housing 402 in a state where the convex contact portion 114 is pressed from the initial state, and the contact portion 114 is connected to the second electrode 412 (contact object) as shown in FIG. Are in contact.

In the state shown in FIG. 5, the conductive portion 112, which has a shape extending in the vertical direction in FIG. 4, has a meandering shape as shown in FIGS. 1 and 2 and has the left wall portion 104 and the right wall portion 106. It is housed in between. That is, the above-mentioned meandering portion that is connected to the contact portion 114 is the leaf spring portion 112a that exhibits the function of a spring, and a force that pushes the contact portion 114 upward (upward in FIGS. 1 and 5) is applied. Let it work. As a result, the contact portion 114 can be more stably brought into contact with the second electrode 412 (contact object). The leaf spring portion 112a of this embodiment is bent three times from one end of the bottom wall portion 108 at both ends in the Y-axis direction to form bent portions F, G, H, as shown in FIG. Has elastic force. The contact portion 114 is bent once to form a convex shape and forms an elastic force in the Y-axis direction.

FIG. 6 is a perspective view showing a cross section of the conductive element 100. The cross section of FIG. 6 is a plane obtained by cutting the front wall portion 110 in parallel with the YZ plane, as indicated by a chain line VI in FIG. FIG. 6 is a view showing the cross section (shown by hatching) of the conductive element 100 in the substantially same direction as FIG. The reference numerals shown in FIG. 6 are the same as those shown in FIGS. 1 to 3 except for 116 and 118.

As shown in FIG. 6, the tip portion 116 of the contact portion 114 is curved inward and its outer surface contacts the front wall portion 110. However, due to the spring function of the leaf spring portion 112a, it is necessary for the front wall portion 110. The contact pressure can be maintained and the contacts can be made. According to the actual design and actual measurement example by the inventor of the present application, the size of the conductive element 100 is 2.8 mm square or less on the bottom surface (upper and lower surfaces in FIG. 1) and 4 mm or less on the height (up and down direction in FIG. 1). The contact pressure obtained when formed by was less than 50 grams heavy. This value is well above the value generally considered to be necessary to secure electrical connection by pressure welding of the electrodes (20 gram weight in the case of gold plating), and realizes highly reliable contact. In addition, as shown in FIG. 5, the conductive element 100 of the present embodiment is configured to electrically connect the second electrode 412 and the first electrode 408 with the contact portion 114 protruding, and the contact in the height direction is performed. The vertical movement dimension of the portion 114 is reduced. Therefore, the contact pressure of the tip end portion 116 with the inner surface of the front wall portion 110 does not change much due to the vertical movement, and the required contact pressure is maintained even when the contact portion 114 is pushed down by the contact object (the second electrode 412). You can

The lowermost portion of the front wall portion 110 in FIG. 6 (enclosed by a dashed ellipse) is referred to as a counter electrode connection portion 118. When the conductive element 100 is mounted on the printed wiring board unit 400 on the outer surface (the upper surface in FIG. 2) of the bottom wall portion 108 as described above, the counter electrode connection portion 118 is provided on the printed wiring board unit 400. It is assumed that it is connected to the first electrode 408.

Then, the conductor pattern 410 formed by plating on the inside of the electronic device casing 402 and used as an antenna includes the second electrode 412, the contact portion 114, the tip portion 116, the front wall portion 110, the counter electrode connection portion 118, and the second electrode 412. It is electrically connected to the transmitting/receiving unit 404 via the one electrode 408 and the conductor pattern 406. The electrical length of such an antenna connection path depends on the height (mounting height) of the conductive element 100 in FIG. 1, and can be shortened by reducing the height of the conductive element 100. Since the electrical length can be significantly shortened compared to the conventional pogo pin type connector in which power is supplied to the antenna through the spring portion, it is particularly effective for high frequency applications such as antenna power supply. A portion from the front wall portion 110 with which the tip end portion 116 contacts to the counter electrode connection portion 118 forms an antenna connection path that has not existed in the past, and this portion serves as the conducting portion E. That is, as shown in FIG. 5, the conductive element 100 is in a state in which the second electrode 412 and the first electrode 408 are electrically connected, that is, the contact portion 114 is lowered, and the tip portion 116 is also lowered accordingly. The portion below the front wall portion 110 with which the tip portion 116 contacts is the conducting portion E. Thus, the energization path E in the state of being pressed by the contact target (the second electrode 412) is the shortest.

A method of manufacturing the conductive element 100 will be described with reference to FIGS. 4 and 7. FIG. 7 is a plan view showing a state in which a plurality of plate-shaped members 102 are connected. In FIG. 7, the actual shape as a plan view is shown by solid lines, and the portions corresponding to the plurality of plate-shaped members 102 are each surrounded by ellipses made of broken lines. A plurality of plate-shaped members 102 are formed on a conductive plate-shaped material (for example, a metal plate) and a carrier unit 130 is provided, and the formed plate-shaped members 102 are connected via the carrier unit 130. Separated from the plate material as a set of members.

As for the individual plate-shaped members 102, as described with reference to FIG. 4, a development view of portions corresponding to the left wall portion 104, the right wall portion 106, the bottom wall portion 108, the front wall portion 110, and the conductive portion 112, respectively. The shape of is shaped with respect to a plate-shaped material. These shaped portions are separated from the plate-shaped material together with the carrier portion 130 to form a member in which a plurality of plate-shaped members 102 are connected as shown in FIG. 7.

The individual plate-shaped members 102 are separated from the members having the connection configuration shown in FIG. 7, and the plates are formed according to the positional relationship among the left wall portion 104, the right wall portion 106, the bottom wall portion 108, the front wall portion 110, and the conductive portion 112. The conductive element 100 can be manufactured by bending the member 102. In the manufacturing method described above, for the separation and bending of the plate-shaped member 102 from the plate-shaped material, for example, a known method of sheet metal processing can be used, and thus the description thereof will be omitted.

As described above, according to the first embodiment, the conductive element is simply configured by bending the member separated from the single conductive plate material, and the contact target (for example, the second electrode 412) is formed. It is possible to maintain an appropriate contact pressure and shorten the electrical length of the electrical connection path.

(Example 2)
Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 8 is a diagram illustrating the configuration of the second embodiment. The protector 600 is shown in the upper left portion of FIG. When the conductive element 100 (the same as that according to the first embodiment) shown in the lower left portion of FIG. 8 is regarded as a substantially hexahedron, the protector 600 covers the four surfaces and exposes the contact portion 114. As described above, the conductive element 100 and the conductive element 100 are dimensioned. The protector 600 is made of a non-conductive material (for example, heat resistant resin).

FIG. 9 is a cross-sectional view showing the conductive element 100 with the protector 600 attached as shown in FIG. 8, similarly to FIG. 6. The reference numerals in the figure are common to the reference numerals shown in FIGS. 6 and 8.

The protector 600 can be attached to the conductive element 100 in the direction of the upper and lower block arrows in FIG. Then, as shown in the lower right portion of FIG. 8, the conductive element 100 is protected by the protector 600 except that the front wall portion 110 on the left side of the drawing and the contact portion 114 on the upper side of the drawing are exposed. It The protector 600 mainly serves to protect the conductive element 100 against a static load applied to the conductive element 100 from above in FIG. 8.

The protector 600 having the shape shown in FIG. 8 can be mounted after the conductive element 100 is mounted on the printed wiring board unit 100 by the bottom wall portion 108 (for example, mounted through a solder reflow process). Since the component mounting surface does not always face upward in the solder reflow step, if the protector 600 is attached to the conductive element 100 prior to the solder reflow step, the conductive element 100 will be caused by the load. The printed wiring board unit may fall off from the mounting position. In order to prevent this, a shape is adopted in which the protector 600 can be attached after the conductive element 100 is mounted on the printed wiring board unit.

According to the second embodiment of the present invention, the protector 600 receives the static load applied to the conductive element 100 while preventing the conductive element 100 from falling off in the mounting process of the conductive element 100 to the printed wiring board unit, and thus the conductive element is protected. 100 can be protected.

(Example 3)
Next, a third embodiment of the present invention will be described with reference to FIGS. FIG. 10 is a perspective view of the conductive element 300 according to the third embodiment. The configuration of the conductive element 300 is the same as that of the conductive element 100 shown in FIG. 1 except for the upper wall portion 310 (bridge portion) surrounded by a dashed ellipse in FIG. 10, and each is shown in FIG. The same reference numerals as those in No.

The conductive element 300 is formed by bending a plate-shaped member 302 separated from one conductive plate-shaped material (for example, a metal plate) by, for example, shearing. FIG. 11 is a development view of the plate member 302. The plate-shaped member 302 is configured in the same manner as the plate-shaped member 102 shown in FIG. 4 except for a portion corresponding to the upper wall portion 310 extending leftward from the left wall portion 104 in FIG.

The plate-shaped member 302 shown in FIG. 11 is a straight line (not shown) that touches the boundary of each part corresponding to the left wall portion 104, the right wall portion 106, the bottom wall portion 108, the front wall portion 110, and the upper wall portion 310. .) between the left wall portion 104 and the right wall portion 106 by bending the portion corresponding to the leaf spring portion 112a of the conductive portion 112 toward the front with respect to the paper surface in FIG. By doing so, the conductive element 300 can be formed as shown in FIG.

The upper wall portion 310 is formed by bending a part continuous from the left wall portion 104 toward the right wall portion 106 in a bridge shape. The upper wall portion 310 can function as a suction portion in an automated mounting process when the conductive element 300 is mounted on a printed wiring board unit (not shown).

The upper wall portion 310 may be formed by bending a part continuous from the right wall portion 106 toward the left wall portion 104 in a bridge shape. The protector 600 described in the second embodiment can be attached to the conductive element 300.

The method of manufacturing the plate member 302 and the conductive element 300 is the same as the method of manufacturing the plate member 102 and the conductive element 100 of the first embodiment. In the same manner as shown in FIG. 7, a plurality of plate-shaped members 302 may be configured as a set of plate-shaped members connected via a carrier part. According to the third embodiment of the present invention, the conductive element is provided with the suction portion, which is suitable for the automated mounting, and the production efficiency can be further enhanced.

(Example 4)
Next, a fourth embodiment of the present invention will be described with reference to FIGS. For convenience of description, the same parts as those in the first and third embodiments shown in FIGS. 1 to 7 and 10 described above are designated by the same reference numerals. 12 and 13 are perspective views of the conductive element 320 according to the fourth embodiment as viewed from the front side and the back side, respectively. FIG. 14 is a perspective view of the front wall portion 110 of the conductive element 320 taken along a cross section parallel to the YZ plane.

12 to 14, a conductive element 320 includes a box-shaped housing 321, a meandering leaf spring portion 112a housed in the housing 321, and a protrusion connected to the leaf spring portion 112a and protruding from the housing 321. A contact portion 114 in the shape of a circle. The housing 321 has a left wall portion 104 and a right wall portion 106 that form a side wall, a front wall portion 110, and further has a bottom wall portion 108 that connects the left wall portion 104 and the right wall portion 106. ing. Further, the upper wall portion 310 of the housing 321 is a portion that is continuous from the left wall portion 104 as shown in FIG. 15, and is formed by bending it toward the right wall portion 106 in a bridge shape. The upper wall portion 310 can function as a suction portion in an automated mounting process when the conductive element 320 is mounted on a printed wiring board unit (not shown).

That is, the conductive element 320 is different from the conductive element 300 of the third embodiment in that the support piece 310a and the inclined portion 110a are provided. Further, the leaf spring portion 112a is bent twice from one end of the bottom wall portion 108 at both ends in the Y-axis direction to provide bent portions G and H to form an elastic force in the Z-axis direction. Further, the width dimension of the taper portion 114a (see FIG. 13) facing the apex of the contact portion 114 is almost the same as that of the leaf spring portion 112a as shown in the development view of FIG. The width dimension of the reaching portion is formed to be narrower than the width of the tapered portion 114a. Therefore, the elastic force of the contact portion 114 is smaller than that of the leaf spring portion 112a and easily deforms when the same external force is applied. Other parts are the same as in the third embodiment.

The support piece 310a is formed by bending one end of the upper wall portion 310 inward. In the initial state, the support piece 310a supports the leaf spring portion 112a against the elastic force and restricts the extension of the leaf spring portion 112a. At this time, the bending depth of the support piece 310a can be adjusted by adjusting the angle and the length of the support piece 310a. Thereby, the amount of protrusion and the load of the contact portion 114 in the initial state can be adjusted.

That is, the amount of protrusion of the contact portion 114 decreases when the bending depth of the support piece 310a is large, and increases when the bending depth of the support piece 310a is small. The initial elastic force of the contact portion 114 increases when the bending depth of the support piece 310a is large, and decreases when the bending depth of the support piece 310a is small.

The initial projection amount and load standard (permissible range) of the contact portion 114 of the conductive element 320 may vary depending on product specifications and applications, connection target arrangement procedures, user requirements, and the like. By adjusting the bending depth of the support piece 310a of the conductive element 320, it is possible to meet each standard.

The inclined portion 110a is formed by making a U-shaped cut in the central portion of the front wall portion 110 and raising it inwardly. The rear surface, which is the facing surface of the front wall portion 110, faces toward the bottom wall portion 108 side. Incline to 120, that is, to the right in FIG. A rectangular hole 109 is formed in the lower portion of the inclined portion 110a of the front wall portion 110. The tip portion 116 of the contact portion 114 is in contact with the inner surface of the upper portion of the front wall portion 110 as shown in FIG. Move.

FIG. 15 is a plan view showing a state in which a plurality of plate-shaped members 102 are connected. Similar to the first embodiment, a set of members formed by forming a plurality of plate-shaped members 322 on a conductive plate-shaped material (for example, a metal plate) and connected via the carrier unit 130 is separated from the plate-shaped material. It Next, the individual plate-shaped members 322 are separated from the carrier portion 130, and the plate-shaped members 102 are bent to form the conductive elements 320.

16 and 17 are sectional views showing the initial state of the conductive element 320 and the state where the contact portion 114 is pressed. In the initial state of the conductive element 320, the leaf spring portion 112a contacts the support piece 310a, and the tip end portion 116 of the contact portion 114 contacts the inner surface of the front wall portion 110.

When the contact part 114 is pressed by the contact object, the tip part 116 slides down on the inner surface of the front wall part 110 and reaches the inclined part 110a. At this time, the leaf spring portion 112a bends in the vertical direction, and the bent portion H on the back side also slightly descends, but the tip end portion 116 mainly descends while drawing an arc with the bent portion H as the center of rotation. Therefore, if the front wall portion 110 is a vertical surface without the inclined portion 110a, the lower the tip portion 116 is, the more the tip portion 116 moves away from the inner surface of the front wall portion 110, and the contact pressure decreases.

That is, in the initial state, the tip end portion 116 is pressed against the inner surface of the front wall portion 110 by applying an elastic force based on the contact portion 114 formed in a mountain shape. However, when the tip portion 116 and the inner surface of the front wall portion 110 move away from each other, the contact portion 114 expands (the compressed state decreases) and the elastic force weakens, so that the contact pressure also decreases.
For this reason, in this embodiment, the inclined portion 110a inclined inward is provided to follow the movement of the tip portion 116 to maintain or increase the contact pressure.

In the initial state of FIG. 16, the tip end portion 116 is in pressure contact with the inner surface of the front wall portion 110, but in this state, it is set to be slightly smaller than a predetermined contact pressure for performing stable energization. This is because if the contact pressure is high, the contact friction also increases, which may make it difficult for the tip 116 to move up and down, and the tip 116 once lowered may not return to the initial state. Therefore, in the present embodiment, when the contact portion 114 starts to descend a little due to the pressure contact of the contact object, the tip portion 116 exerts a large contact pressure on the front wall portion 110 due to the elastic action of the leaf spring portion 112a and the contact portion 114. The above phenomenon and the contact pressure with the inner surface of the front wall portion 110 is set to a predetermined contact pressure by projecting the inner surface of the inclined portion 110a inward of the inner surface of the front wall portion 110. Therefore, in the state of FIG. 17, when the pressing state by the contact object is released, even if the contact pressure is large, the tip end portion 116 has the restoring force of the leaf spring portion 112a and the force in the returning direction due to the inclination of the inclined portion 110a. By moving, the contact pressure can be moved upward and the contact pressure can be returned to the state shown in FIG.

If the contact portion 114 is pushed to the position shown in FIG. 17 by the contact object without the inclined portion 110a, the contact pressure between the tip portion 116 and the inner surface of the front wall portion 110 is naturally higher than the contact pressure in the initial state. Will also be lower. In this state, unless the tip portion 116 returns to the initial state due to factors such as sliding friction with the inner surface of the front wall portion 110, it is difficult to return to the original state because the contact pressure in the initial state is larger. Is. If the conductive element 320 whose leaf spring portion 112a has not returned to the initial state is attached to the electronic device housing 402, a contact failure of the conductive element 320 may occur.

On the other hand, in the conductive element 320 of the present embodiment, as described above, since the inclined portion 110a is provided on the front wall portion 110, the contact pressure of the tip portion 116 can be made smaller in the initial state. Therefore, it is possible to secure a predetermined contact pressure when pressing the contact portion 114 and prevent the leaf spring portion 112a from returning to the initial state.

According to the present embodiment, similarly to Embodiments 1 to 3, the tip end portion 116 of the leaf spring portion 112a extending from the bottom wall portion 108 contacts the front wall portion 110 having the counter electrode connection portion 118. As a result, the electrical length between the first electrode 408 (see FIG. 5) connected to the counter electrode connection portion 118 and the second electrode 412 (see FIG. 5) contacting the contact portion 114 can be shortened. In this case, in the front wall portion 110, the portion below the portion where the inclined portion 110a is formed is the conducting portion E. The tip 116 of the contact portion 114 is arranged so as to face above the counter electrode connecting portion 118 (connecting portion) and the same side end portion of the housing 321, so that the tip portion 116 is different from the case where it is provided at another position. As a result, the electrical length between the counter electrode connecting portion 118 can be further shortened.

Further, since the support piece 310a supporting the leaf spring portion 112a is provided by bending from the upper wall portion 310 facing the bottom wall portion 108, the initial protrusion amount and load of the contact portion 114 are determined by the bending depth of the support piece 310a. It can be easily adjusted.

(Example 5)
Next, a fifth embodiment of the present invention will be described with reference to FIGS. For convenience of explanation, the same parts as those in the fourth embodiment shown in FIGS. 12 to 17 are given the same reference numerals. 18 and 19 are perspective views of the conductive element 340 according to the fifth embodiment. 20 is a perspective view of the front wall portion 110 of the conductive element 340 taken along a cross section parallel to the YZ plane.

The conductive element 340 has a thin box-shaped housing 341 corresponding to the housing 321 of the fourth embodiment, and the support element 310a, the inclined portion 110a, and the contact portion 114 are different in structure from the conductive element 320. different. Further, the leaf spring portion 112a is bent once from one end of the bottom wall portion 108 to provide the bent portion G, and an elastic force in the Z-axis direction is formed. Other parts are the same as in the fourth embodiment.

The support piece 310a is formed by cutting and bending from one end portion of the upper wall portion 310 toward the center portion and bending. In the initial state, the support piece 310a supports the leaf spring portion 112a against the elastic force and restricts the extension of the leaf spring portion 112a. Accordingly, the initial protrusion amount and load of the contact portion 114 can be easily adjusted by the bending depth of the support piece 310a.

The inclined portion 110 a is formed by bending the front wall portion 110 and inclines the bottom wall portion 108 side toward the facing surface 120 of the front wall portion 110. Further, the front wall portion 110 is provided with a protrusion 110b that protrudes toward the inner surface and extends in the sliding direction (Z-axis direction) of the tip portion 116. The outer surface shape of the protrusion 110b is formed in a curve or a mountain shape in a cross section perpendicular to the Z axis, and makes a point contact with the tip 116.

The conductive element 340 is formed by bending a plate member similar to the plate member 322 of FIG. 15 described above. At this time, in the plate member, the tip end portion of the leaf spring portion 112a extending from one end of the bottom wall portion 108, that is, the contact portion 114 is formed of a thin profile member. The thin portion 112b can reduce the elastic force of the contact portion 114 in the Y-axis direction.

21 and 22 are sectional views showing the initial state of the conductive element 320 and the state where the contact portion 114 is pressed. In the initial state of the conductive element 320, the leaf spring portion 112a contacts the support piece 310a, and the tip end portion 116 of the contact portion 114 contacts the inner surface of the front wall portion 110.

When the contact portion 114 is pressed, the leaf spring portion 112a separates from the support piece 310a and is compressed in the vertical direction (vertical direction in FIG. 22). At this time, the tip portion 116 slides on the protrusion 110b of the front wall portion 110 including the inclined portion 110a, and the contact state with the front wall portion 110 is maintained.

The pressing force of the tip end portion 116 against the front wall portion 110 can be made smaller in the initial state because the contact portion 114 is thin, and can be made larger than the initial state when the contact portion 114 is pressed and lowered by the inclined portion 110a. Further, since the tip 116 and the projection 110b are in point contact with each other, a predetermined contact pressure can be obtained between the tip 116 and the projection 110b even if the pressing force of the tip 116 is small.

In addition, in the manufacturing process of the conductive element 340 or when the conductive element 340 is attached to the electronic device housing 402, the number of times of expansion and contraction of the leaf spring portion 120a may increase. At this time, the projection 110b that makes point contact with the tip 116 may be worn and a predetermined contact pressure may not be obtained.

Therefore, the protrusion 110b may or may not be provided depending on the state at the time of manufacturing or the like. Providing the protrusion 110b when the number of times of expansion and contraction of the leaf spring 120a is small makes it possible to reduce the pressing force of the tip 116. If the protrusion 110b is omitted when the leaf spring 120a expands and contracts a large number of times, fluctuations in contact pressure due to wear can be prevented.

According to this embodiment, the same effect as that of the fourth embodiment can be obtained. Further, since the contact portion 114 on the front end side of the leaf spring portion 112a is made thin, the pressing force of the front end portion 116 in the initial state can be reduced. Moreover, the pressing force of the tip end portion 116 when the contact portion 114 is pressed can be made larger than that in the initial state by the inclined portion 110a.

Further, since the front wall 110 is provided with the protrusion 110b extending in the sliding direction of the tip 116, a predetermined contact pressure can be obtained even if the pressing force of the tip 116 is small. Therefore, the reliability of the conductive element 340 can be ensured. In this case, the conducting portion E of the front wall portion 110 is a portion below the inclined portion 110a.

(Example 6)
Next, a sixth embodiment of the present invention will be described with reference to FIGS. For convenience of explanation, the same parts as those in the fifth embodiment shown in FIGS. 23 and 24 are a perspective view and a side view of the conductive element 360 according to the sixth embodiment. FIG. 25 is a side sectional view of the conductive element 360.

The conductive element 360 has a thin box-shaped housing 361 corresponding to the housing 341 of the fifth embodiment, and is formed on the tip side of the leaf spring portion 112a with respect to the conductive element 340 of the fifth embodiment. The inner surface of the tip end portion 116 of the protruding contact portion 114 that is in contact with and separates from the upper end of the front wall portion 110. Along with this, the inclined portion 110a and the protruding portion 110b of Embodiment 5 (both see FIG. 20) are omitted. The other parts are the same as in the fifth embodiment.

A notch 110c is recessed at the upper end of the front wall 110. The length (width) dimension of the cutout portion 110c in the X-axis direction is larger than the width dimension of the contact portion 114. On the other hand, the tip portion 116 is formed in a tapered shape from the contact portion 114, as shown in FIG. The front end portion 116 in the initial state projects from the outer surface of the front wall portion 110 and is arranged above the notch portion 110c and apart from it. When the contact portion 114 is pressed, the tip end portion 116 first comes into contact with the bottom portion of the cutout portion 110c, and further slides on the bottom portion in accordance with the pressing force to move forward as shown by the dotted line D in FIG. Extend. That is, the convex shape of the contact portion 114 is elastically deformed such that the height is lowered and the skirt portion is widened, and a force to return to the state before the deformation is generated. Therefore, the contact force between the tip portion 116 and the notch 110c is also applied, and a sufficient contact pressure can be secured. Further, since the operation of the tip portion 116 is guided to both side portions of the cutout portion 110c, the widthwise blurring is prevented and the contact state is stabilized. As a result, the first electrode 408 (see FIG. 5) contacting the counter electrode connection portion 118 and the second electrode 412 (see FIG. 5) contacting the contact portion 114 are electrically connected via the front wall portion 110. The portion below the cutout portion 110c of the front wall portion 110 is the conducting portion E.

According to this embodiment, the same effect as that of the fifth embodiment can be obtained. Further, since the tip portion 116 comes into contact with and separates from the front wall portion 110, when the pressure on the contact portion 114 is released, the tip portion 116 side is returned to the initial state while floating upward due to the elastic force of the leaf spring portion 112a. Since it tries to try, a force such as a frictional force that prevents the return to the initial state is not generated between the tip end portion 116 and the notch portion 110c. Therefore, it is possible to prevent a problem that the leaf spring portion 112a does not return to the initial state. Note that, in the initial state of this embodiment, the tip portion 116 is separated from the cutout portion 110c, but as shown in FIG. 26, the state in which the tip portion 116 is in contact with the cutout portion 110c may be the initial state. When the contact part 114 is pressed, the tip part 116 slides on the bottom part according to the pressing force and extends forward as shown by the dotted line D′ in FIG.

The configuration, shape, and manufacturing method of the conductive element described as each of the above embodiments are examples, and various modifications can be made without departing from the scope of the present invention. Although the application of the conductive element to the antenna feeding has been described as an example, the conductive element according to the present invention can be applied to various electrical connection applications other than the antenna feeding.

100, 300, 320, 340, 360 Conductive element 101, 321, 341, 361 Housing 102, 302, 322 Plate member 104 Left wall part (side wall)
106 right wall (side wall)
108 Bottom wall (connecting part)
110 Front wall (side wall)
110a inclined part 110b protruding part 110c notch part 112 conductive part 112a leaf spring part E energizing part F, G, H bending part 114 contact part 116 tip part 118 counter electrode connection part (connection part)
130 carrier part 310 upper wall part
310a Supporting piece 400 Printed wiring board unit 402 Electronic device housing 404 Transmitting/receiving section 406, 410 Conductor pattern 408 First electrode (connection target)
412 2nd electrode (contact object)
600 protector

Claims (3)

A box-shaped housing having at least a bottom wall portion , left and right side wall portions , and a front wall portion , a convex contact portion protruding from an opening provided in an upper portion of the housing and contacting a contact object, and a bottom portion of the housing. A connecting portion that is provided on the side and that is connected to the connection target; and a leaf spring portion that is integrally continuous with the contact portion and that biases the contact portion above the housing and that has the bottom wall as a fixed end. In a conductive element formed by bending a single conductive material,
The front wall portion is provided with a current-carrying portion that forms a conductive path to the connection portion via the tip portion that is the free end side of the contact portion,
The leaf spring portion has at least one bent portion, and the bent portion positioned on the back surface side which is the facing surface of the front wall portion does not contact the housing,
In addition, the contact portion is elastically deformed in response to the pressing by the contact object, and the tip end portion of the contact portion is pressed against the inner surface of the front wall portion serving as the current-carrying portion by the elastic force of the leaf spring portion. Yes ,
Conductive elements, wherein a front end portion of the front SL contact portion is adapted to slide along the inner surface of the front wall portion to be the conducting portion. The conductive element according to claim 1, wherein the conductive element is for high frequency. The conductive element according to claim 1, wherein the leaf spring portion is formed in a meandering shape .

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