JP3162354B2 - Conductive material - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive member, and more particularly, to a conductive member which is surface-mounted on a wiring board and pressed against a ground conductor to ground a wiring formed on the wiring board to the ground conductor. Things.

[0002]

2. Description of the Related Art Conventionally, there has been known a technique in which a conductive member is surface-mounted on a printed wiring board, and the conductive member is pressed against a ground conductor in that state to ground the printed wiring to the ground conductor via the conductive member. ing.

FIG. 6 is a plan view showing the state of use of such a conventional conductive member. FIG. 7 is a sectional view taken along line AA in FIG.
It is a line sectional view. The conductive member 100 is surface-mounted by soldering with a solder 202 to a printed wiring (conductive pattern) 201 formed on a printed wiring board (substrate) 200. In this state, the conductive member 100 is pressed against the ground conductor 300 and the conductive member 10
0, the printed wiring 201 is grounded to the ground conductor 300.

In FIG. 6, a ground conductor 300 is not shown to avoid complicating the drawing. The state where the conductive member 100 is not pressed against the ground conductor 300 is shown by a two-dot chain line. Conductive member 100
Is formed by bending a thin plate-like metal material having a width α (for example, 0.8 mm), and has a flat joining portion 101 having a longitudinal length β (for example, 3.5 mm).
The lower surface side of 1 is a bonding surface 101a to be soldered to the printed wiring 201. Further, both ends in the longitudinal direction of the joint portion 101 are bent to the opposite side of the joint surface 101a,
The portion folded at the folded portion γ at one end of the joining surface 101a forms a gentle curve to form the contact portion 102, and the portion folded at the other end of the joining surface 101a has a U-shaped cross section. The upper surface thereof forms a suction surface 103 which is flat and parallel to the bonding surface 101a.

In order to use the conductive member 100 configured as described above, the conductive member 100 is surface-mounted on a printed wiring board 200, and in this state, a flat ground conductor 300 is opposed to the printed wiring board 200. Printed wiring board 200
Are arranged close to the ground conductor 300. Then, the conductive member 1
00 contacts the grounding conductor 300, and the pressing force from the grounding conductor 300 elastically deforms the conductive member 100 around the folded portion γ. The surface 102a is pressed against the ground conductor 300. As a result, conduction between the ground conductor 300 and the printed wiring 201 is conducted via the conductive member 100, and the printed wiring 201 is reliably grounded to the ground conductor 300.

Incidentally, the work of surface-mounting the conductive member 100 on the printed wiring board 200 is automatically performed by an automatic mounting machine in order to increase work efficiency. The automatic mounting machine (not shown) includes a vacuum suction device, a moving device for moving the vacuum suction device, and a reflow soldering device.

Then, the automatic mounting machine first vacuum-adsorbs and lifts the suction surface 103 of the conductive member 100 using a vacuum suction device, and then moves the conductive member 100 together with the vacuum suction device using a moving device. By doing so, the conductive member 100 is moved onto the soldered portion of the printed wiring 201,
At that position, the conductive member 100 is detached from the vacuum suction device, and the conductive member 100 is placed at the soldering location. Finally, the conductive member 100 is soldered to the printed wiring 201 using a reflow soldering device.

When reflow soldering is performed, an appropriate amount of solder is supplied in advance to a soldering portion of the printed wiring 201, and the conductive member 100 is temporarily fixed to the soldering portion, and an external heat source is used. Melt the solder.

[0009]

The conventional conductive member 100 described above has the following problems. (A) The center of gravity G of the conductive member 100 is located at a substantially intermediate position between the contact portion 102 and the suction surface 103. Therefore, the conductive member 1
When the suction surface 103 is sucked and lifted by a vacuum suction device, the contact portion 102 is tilted downward, and when the conductive member 100 is mounted on the soldering position of the printed wiring 201, the mounting position is In some cases, the desired position was deviated.

To avoid this problem, the suction surface 103 is formed large, and the center of gravity G of the conductive member 100 is
May be located in the vicinity of. With this configuration, when the suction surface 103 of the conductive member 100 is suctioned and lifted by the vacuum suction device, the bonding portion 101 becomes horizontal.
When 0 is placed, the placement position can be prevented from deviating from a desired position.

However, when the suction surface 103 is enlarged, the outer dimensions of the conductive member 100 become large, and it is not possible to satisfy the demand for miniaturization of the conductive member 100 which has been increasing in recent years with the miniaturization of electronic equipment. (B) When an external force is applied from the lateral direction to the longitudinal direction of the conductive member 100, the contact portion 102 is permanently deformed in the lateral direction, and the function of the conductive member 100 may be hindered. Such permanent deformation of the contact portion 102 may cause the conductive member 10
0, the contact portion 102
However, the defective conductive member 100 that has been permanently deformed must be removed, and only the excellent conductive member 100 must be selected and surface-mounted, resulting in a reduction in work efficiency. Further, when the permanent deformation of the contact portion 102 occurs after surface mounting on the printed wiring board 200, the contact portion 102 may come into contact with other electronic components on the printed wiring board 200 to cause a short circuit failure.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to ensure that only predetermined wirings formed on a wiring board are securely installed on a ground conductor. A conductive member is provided , and the conductive member is
When mounting on a lint wiring board and when
When the printed wiring board is transported after
To prevent the tip of the device from being caught on something .

[0013]

Means for Solving the Problems and Effects of the Invention According to the first aspect of the present invention, which has been made to achieve the above object, there is provided a long cable having a joint surface to be soldered to a wiring formed on a wiring board. A scale-shaped joint, a folded part folded from the joint to the opposite side of the joint surface, a support connected to the folded part, and a contact joined to the distal end of the support, A conductive member provided on the opposite side of the joining surface from the joining portion and having a wall disposed on a side of the support portion, wherein the joining portion, the folded portion, and the support A bending spring having conductivity, which is constituted by a portion and the contact portion, and the joining is performed when the bending spring is elastically deformed by a predetermined amount around the folded portion.
A contact portion for restricting elastic deformation of the bending spring , wherein the contact portion is opposite to the support portion;
A regulating portion formed on the side, and a protection portion standing upright from the end of the joining portion opposite to the folded portion on the side opposite to the joining surface to protect the regulating portion, the conductive member When viewed from the side of the protection unit, the gist is that the upper end of the protection unit and the lower end of the regulation unit overlap each other.

To use the conductive member according to the first aspect of the present invention, first, the conductive member is surface-mounted on the wiring board by soldering a bonding surface to a wiring formed on the wiring board. Then, with the conductive member mounted on the surface of the wiring board, the ground conductor is opposed to the wiring board, and the wiring board is arranged close to the ground conductor. Then, the contact portion of the conductive member contacts the ground conductor, and the pressing force from the ground conductor causes the thin plate bending spring to be elastically deformed around the folded portion of the conductive member, and a repulsive force (spring force) due to the elastic deformation. )
The contact portion is pressed against the ground conductor. As a result, the ground conductor is electrically connected to the wiring via the conductive member, and the wiring is reliably grounded to the ground conductor.

According to the first aspect of the present invention, the wall is provided on the opposite side of the joining surface from the joining portion, and is provided on the side of the supporting portion. Therefore, when an external force is applied from the lateral direction to the longitudinal direction of the conductive member, the external force acts on the wall. As a result, the external force applied from the lateral direction of the conductive member is hindered by the wall portion, and the external force is not applied to the support portion. Therefore, it is possible to reliably prevent the support portion from being deformed by the external force. Therefore, it is possible to solve the problem (B), and it is possible to prevent the reduction in the work efficiency and the occurrence of the short-circuit failure. And said bent spring around the folded portion is when only elastically deformed a predetermined amount, and a regulating portion for regulating the elastic deformation of abutting said bending springs to the junction. Therefore, when a pressing force is applied to the contact portion from the ground conductor and the thin plate bending spring is elastically deformed by a predetermined amount around the folded portion, the amount of elastic deformation of the thin plate bending spring is regulated by the restricting portion. Here, the predetermined amount of elastic deformation of the thin plate bending spring is:
The amount of elastic deformation is such that the stress generated in the thin plate bending spring (particularly the stress generated in the folded portion) does not exceed the elastic limit. Therefore, even when a large pressing force acts on the contact portion from the ground conductor, it is possible to prevent the members (particularly, the folded portion) constituting the thin plate bending spring from being permanently deformed . Further, a protection portion is provided upright on an opposite side of the joining surface from an end of the joining portion opposite to the folded portion to protect the regulating portion,
The lower end portion of the regulating portion and the upper end portion of the protection portion are arranged so as to overlap when viewed from the protection portion direction. Thereby, the restricting portion is protected by the protective portion, and when the conductive member is surface-mounted on the wiring board or when the wiring board on which the conductive member is surface-mounted is conveyed, the tip portion of the restricting portion is particularly caught on something. Can be prevented.

Next, a second aspect of the present invention is the first aspect.
3. The conductive member according to claim 1, further comprising: a suction portion connected to an upper end portion of the wall portion and having a flat suction surface disposed in parallel with the joining surface, wherein a center of gravity of the conductive member is set to the suction position. The gist is to be located between the surface and the joining surface.

Here, the work of surface-mounting the conductive member on the wiring board is automatically performed by an automatic mounting machine in order to improve work efficiency. This automatic mounting machine includes a vacuum suction device, a moving device for moving the vacuum suction device, and a reflow soldering device. Then, the automatic mounting machine first vacuum-adsorbs and lifts the suction surface of the conductive member using a vacuum suction device, and then moves the conductive member together with the vacuum suction device using a moving device, thereby soldering the wiring. The conductive member is moved to the mounting position, the conductive member is detached from the vacuum suction device at that position, the conductive member is placed at the soldering position, and finally, the conductive member is connected to the wiring using a reflow soldering device. Solder. When performing the reflow soldering, an appropriate amount of solder is supplied in advance to the soldering location of the wiring, and the solder is melted by an external heat source while the conductive member is temporarily fixed to the location.

According to the second aspect of the invention, the center of gravity of the conductive member is located between the suction surface and the bonding surface. for that reason,
When the suction surface of the conductive member is suctioned and lifted by the vacuum suction device, the joining portion can be held horizontally. Therefore, when the conductive member is placed on the soldered portion of the wiring, it is possible to reliably prevent the placement position from deviating from a desired position. In addition, since the suction portion is disposed substantially at the center of the conductive member, the provision of the suction portion does not increase the outer dimensions of the conductive member. Therefore, the problem (A) can be solved, and the position of the conductive member with respect to the wiring can be accurately determined, and the demand for miniaturization of the conductive member, which has been increasing in recent years with the miniaturization of electronic devices, is satisfied. be able to.

In addition, since the upper end of the wall is connected to the suction portion and the lower end of the wall is connected to the joint, the box having a rectangular cross section is formed by the joint, the wall, and the suction portion. Even if an external force acts on the wall portion from the lateral direction, the rectangular box portion is not easily deformed, and the wall portion can be prevented from being deformed. Therefore, according to the present invention, claim 1
The operation and effect of the invention described in (1) can be more reliably obtained.

Next, the invention according to claim 3 is based on claim 2
In the conductive member according to (1), the gist is that the support portion is disposed so as to pass between the joining portion and the suction portion. Therefore, in the invention described in claim 3,
The support portion is disposed so as to pass obliquely through the internal space of the box portion surrounded by the joining portion, the wall portion, and the suction portion. Therefore, even if the external dimensions of the conductive member are reduced, the length of the support portion can be sufficiently ensured, and the spring property of the thin plate bending spring can be improved. As a result, even when the size of the conductive member is reduced, it is possible to increase the pressure contact force of the contact portion with the ground conductor,
The grounding of the wiring via the conductive member can be performed more reliably.

[0021]

[0022]

[0023]

[0024]

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a front view of the conductive member 1 of the present embodiment. FIG. 2 is a rear view of the conductive member 1. FIG. 3 is a bottom view of the conductive member 1. FIG. 4 is a plan view showing a use state of the conductive member 1. FIG.
3 is a sectional view taken along line AA in FIG.

The conductive member 1 has a thin plate shape (for example, a plate thickness:
It is formed by bending a metal material (0.12 mm), and has a joint portion 2, a lower surface 2a, joint surfaces 3a to 3c, a protection portion 4, a folded portion 5, a support portion 6, a contact portion 7, a contact portion 7, a regulation portion 8, and a wall portion. 9a to 9d, suction unit 10, suction surface 10a, connection unit 1
1, a box section 12.

The length β in the longitudinal direction (for example, 4.3 mm)
On the lower surface 2a of the long flat joining portion 2, there are provided three joining surfaces 3a to 3c to be soldered to the printed wiring. The joining surfaces 3a and 3c are provided at both ends in the longitudinal direction of the joining portion 2, the joining surface 3b is provided at a substantially central portion of the joining portion 2, and the width α of each joining surface 3a to 3c (for example, 0.
8 mm) is formed wider than other portions of the lower surface 2a of the joint 2.

Both ends in the longitudinal direction of the joining portion 2 are bent substantially perpendicularly to the opposite side of the lower surface 2a, and the portion folded at one end (the joining surface 3a side) of the lower surface 2a has a height h (for example,
1.0 mm) of the protection portion 4, and the portion folded back at the other end side (the joining surface 3 c side) of the lower surface 2 a is connected to the folded portion 5 having a radius R (for example, 0.4 mm). ing. That is, the protection part 4 is provided upright on one end side (the bonding surface 3a side) of the bonding part 2.

The opposite side of the joint 2 in the folded portion 5 is a support 6 extending at an acute angle to the joint 2.
Is linked to Note that the support portion 6 does not need to form an acute angle with the joint portion 2 and may be disposed substantially parallel to the joint portion 2. The opposite side (tip side) of the folded part 5 in the support part 6 is connected to the contact part 7 raised in the opposite direction of the joint part 2. The opposite side of the support portion 6 at the contact portion 7 has a radius r (for example, 0.
25 mm), and the folded portion constitutes a regulating portion 8 which is substantially perpendicular to the joining portion 2.

Both end portions in the width direction between the joint surfaces 3a and 3b in the joint portion 2 are bent substantially perpendicularly to the opposite side of the lower surface 2a to form respective wall portions 9a and 9b. Further, both end portions in the width direction between the joint surfaces 3b and 3c in the joint portion 2 are each bent substantially perpendicularly to the opposite side of the lower surface 2a to form the respective wall portions 9c and 9d. That is, each of the wall portions 9 a to 9 d is erected on the opposite side of the lower surface 2 a from the joint portion 2 and is arranged on the side of the support portion 6.

The opposite side of the wall 9a, 9c from the joint 2 is bent parallel to the joint 2 to form a flat suction portion 10. The upper surface of the suction unit 10 forms a suction surface 10a to be suctioned by the vacuum suction device.
The opposite sides of the joints 2 in the wall portions 9b and 9d are connected to form a connection portion 11, and the upper end of the connection portion 11 is connected to the lower surface side of the suction portion 10 (the side opposite to the suction surface 10a). Have been. The joint portion 2, the respective wall portions 9 a to 9 d, the suction portion 10, and the connection portion 11 constitute a non-deformable box portion 12 having a rectangular cross section.

The supporting portion 6 is composed of the joining portion 2 and each of the wall portions 9a to 9a.
9d, box part 1 surrounded by suction part 10, connection part 11
2 is disposed so as to pass obliquely through the internal space. The joining portion 2, the folded portion 5, the support portion 6, and the contact portion 7 formed by bending form a thin plate bending spring.

The center of gravity G of the conductive member 1 is located substantially below the center of the suction surface 10 a in the box portion 12, and is located between the suction surface 10 a and the lower surface 2 a of the joint 2. When the conductive member 1 in FIG. 1 is viewed from the right side, the upper end of the protection part 4 and the lower end of the restriction part 8 slightly overlap each other.

Next, the conductive member 1 configured as described above
A method of manufacturing the device will be described. In order to manufacture the conductive member 1, first, a thin plate-shaped metal material is punched and formed into a shape obtained by expanding the conductive member 1 on a plane, and then, the protection portion 4, the folded portion 5, the support portion 6, the contact portion 7, the regulation Each of the portions 8 is formed by bending, and then each of the wall portions 9a to 9d is formed by bending.
Finally, the suction section 10 is moved so that the support section 6 passes through the inside of the box section 12.
Is formed to complete the conductive member 1.

As described above, the conductive member 1 can be easily and easily manufactured by using the punching process (pressing process) and the bending process of a thin metal material. In addition, as a thin metal material for forming the conductive member 1, a thin metal material having a high spring property (for example, beryllium copper, phosphor bronze, steel, or the like) may be used. A plated material (for example, gold plating with nickel plating as a base, rhodium plating, tin plating, or the like) for enhancing wettability may be used.

Next, a method of using the conductive member 1 will be described. As shown in FIG. 4 and FIG. 5, the conductive member 1 is connected to a printed wiring (conductive pattern) 201 formed on a printed wiring board (substrate) 200 by solders 202 a to 202 a.
Each of the bonding surfaces 3a to 3c is soldered by 202c to be surface-mounted.

Here, since the joining surfaces 3a to 3c are arranged at both ends and substantially at the center in the longitudinal direction of the joining portion 2, the conductive member 1 can be securely fixed to the printed wiring 201. . In addition, since each of the joining surfaces 3a to 3c is formed to be wide, it is possible to obtain a sufficient contact area with each of the solders 202a to 202c, and to obtain reliable conduction between the conductive member 1 and the printed wiring 201. be able to.

Then, the conductive member 1 is connected to the printed wiring board 20.
0, the flat ground conductor 300 is opposed to the printed wiring board 200 in a state where the printed wiring board 200 is mounted on the printed wiring board 200.
Are arranged close to the ground conductor 300. Then, the conductive member 1
Contact portion 7 abuts on the ground conductor 300 and the ground conductor 300
The thin plate bending spring is elastically deformed around the folded portion 5 of the conductive member 1 by the pressing force from the contact member 7, and the contact portion 7 is pressed against the ground conductor 300 by the repulsive force (spring force) due to the elastic deformation. . As a result, the ground conductor 300 is electrically connected to the printed wiring 201 via the conductive member 1, and the printed wiring 201 is reliably grounded to the ground conductor 300.

Incidentally, the ground conductor 300 is composed of, for example, a shield case that covers the printed wiring board 200, a housing of an electronic device in which the printed wiring board 200 is housed, and the like. In FIG. 4, the ground conductor 300 is not shown in order to avoid complicating the drawing. The state where the conductive member 1 is not pressed against the ground conductor 300 is shown by a two-dot chain line.

Next, the operation and effect of this embodiment will be described. (1) The work of surface mounting the conductive member 1 on the printed wiring board 200 is automatically performed by an automatic mounting machine in order to increase work efficiency. The automatic mounting machine (not shown) includes a vacuum suction device, a moving device for moving the vacuum suction device,
And a reflow soldering device.

The automatic mounting machine first vacuum-adsorbs and lifts the suction surface 10a of the conductive member 1 using a vacuum suction device, and then moves the conductive member 1 together with the vacuum suction device using a moving device. Thereby, the conductive member 1 is moved to the soldering position of the printed wiring 201, the conductive member 1 is detached from the vacuum suction device at that position, and the conductive member 1 is placed at the soldering position. The conductive member 1 is soldered to the printed wiring 201 using a soldering device.

When reflow soldering is performed, an appropriate amount of solder
a to 202c are supplied, and the conductive member 1 is temporarily fixed to the corresponding portions, and the solder 202a is supplied by an external heat source.
To 202c are melted. Here, the solders 202a to 202a
If cream solder is used as paste by mixing the solder powder and the vehicle as 2c, the temporary fixing of the conductive member 1 can be reliably performed by utilizing the adhesiveness of the cream solder.

The reflow soldering apparatus includes various methods (for example, a total heating method (for example, infrared heating, vaporization latent heat heating, hot air circulation method, hot plate, etc.) and a local heating method (for example, heating tool, light beam, laser, Air heater, etc.), but any method may be used. The operation of the reflow soldering is well known, and the description is omitted here.

In this embodiment, the center of gravity G of the conductive member 1 is
Is located between the suction surface 10a and the lower surface 2a of the joint portion 2, and is located substantially below the center of the suction surface 10a in the box portion 12. Therefore, when the suction surface 10a of the conductive member 1 is suctioned and lifted by the vacuum suction device, the bonding portion 2 can be held horizontally. Therefore, when the conductive member 1 is placed on the soldered portion of the printed wiring 201, it is possible to reliably prevent the placement position from deviating from a desired position.

Further, since the box portion 12 is disposed substantially at the center of the conductive member 1, the provision of the box portion 12 does not increase the outer dimensions of the conductive member 1. Therefore, it is possible to solve the problem (A), accurately position the conductive member 1 with respect to the printed wiring 201, and reduce the size of the conductive member 1 which has been increasing in recent years with the miniaturization of electronic devices. Can meet your requirements.

(2) The support portion 6 includes the joint portion 2 and each wall portion 9a.
9 d, the suction section 10, and the connection section 11 are disposed so as to pass obliquely through the internal space of the box section 12. Therefore, when an external force is applied from the lateral direction to the longitudinal direction of the conductive member 1, the external force acts on each of the wall portions 9a to 9d. Here, since the upper ends of the walls 9a to 9d are connected to the suction unit 10, and the lower ends of the walls 9a to 9d are connected to the joint 2, the walls 9a to 9d are laterally connected to the walls 9a to 9d. Even if an external force acts, the box portion 12 having a rectangular cross section is not easily deformed, so that the wall portions 9a to 9d can be prevented from being deformed. As a result, the external force applied from the lateral direction of the conductive member 1 is hindered by the walls 9a to 9d, and the external force is not applied to the support portion 6, so that the support portion 6 is surely prevented from being deformed by the external force. can do.

Therefore, it is possible to solve the problem (B), and it is possible to prevent the above-mentioned reduction in work efficiency and occurrence of short-circuit failure. (3) The support part 6 is disposed so as to pass obliquely through the internal space of the box part 12 surrounded by the joint part 2, each of the wall parts 9a to 9d, the suction part 10, and the connection part 11. The joining portion 2, the folded portion 5, the support portion 6, and the contact portion 7 formed by bending form a thin plate bending spring.
Therefore, even if the outer dimensions of the conductive member 1 are reduced, the length of the support portion 6 can be sufficiently secured, and the spring property of the thin plate bending spring can be improved. Therefore, even when the conductive member 1 is downsized, the pressing force of the contact portion 7 against the ground conductor 300 can be increased, and the grounding of the printed wiring 201 via the conductive member 1 can be performed more reliably. it can.

(4) The opposite side of the contact part 7 from the support part 6 is folded in the direction of the joint part 2, and the folded part constitutes a regulating part 8 which is substantially perpendicular to the joint part 2. Therefore, when a pressing force is applied to the contact portion 7 from the ground conductor 300 and the thin plate bending spring is elastically deformed by a predetermined amount around the folded portion 5, the tip portion of the regulating portion 8 is opposite to the lower surface 2 a of the joint portion 2. And restricts the amount of elastic deformation of the thin plate bending spring. Here, the predetermined amount of elastic deformation of the thin plate bending spring is:
The elastic deformation is such that the stress generated in the thin plate bending spring (particularly the stress generated in the folded portion 5) does not exceed the elastic limit. Therefore, from the ground conductor 300 to the contact portion 7
Even when a large pressing force is applied to each member, it is possible to prevent each member (particularly, the folded portion 5) constituting the thin plate bending spring from being permanently deformed.

[0049] (5) Whether the conductive member 1 in FIG.
From the upper end of the protection part 4 and below the restriction part 8
The edges are slightly overlapped. Also,
As shown in FIG. 5, pressing is performed from the ground conductor 300 to the contact portion 7.
A force is applied, and the tip of the regulating portion 8 is
In a state where it is close to the surface opposite to the lower surface 2a,
The control unit 8 overlaps the protection unit 4. That
Therefore, surface mounting of the conductive member 1 on the printed wiring board 200
Or printed wiring board 20 on which conductive member 1 is surface-mounted.
For example, in the case of transporting the zero, the tip of the regulating part 8 is a protective part.
4 is protected by the
It can be prevented from getting stuck.

The height h of the protection portion 4 is set such that the contact portion 7 is kept from the upper end of the protection portion 4 even when the tip portion of the regulation portion 8 is in contact with the surface of the joining portion 2 opposite to the lower surface 2a. It is set to protrude. Thereby, the contact between the contact portion 7 and the ground conductor 300 can be prevented from being hindered by the protection portion 4.

(6) The opposite side of the contact portion 7 from the support portion 6 is bent in a radius r in the direction of the joint 2. Therefore, by appropriately setting the radius r, it is possible to increase the pressure contact force of the contact portion 7 with the ground conductor 300, and it is possible to more reliably ground the printed wiring 201 via the conductive member 1. it can.

(7) The folded portion 5 has a radius R. Therefore, by appropriately setting the radius R, the spring force of the thin plate bending spring is adjusted,
The press-contact force of the contact portion 7 to the ground conductor 300 can be appropriately set, and the grounding of the printed wiring 201 via the conductive member 1 can be performed more reliably.

As described in detail above, according to the present embodiment, the conductive member 1 can reliably ground only the predetermined printed wiring 201 formed on the printed wiring board 200 to the ground conductor 300. Can be obtained. still,
The present invention is not limited to the above-described embodiment, and may be appropriately changed without departing from the gist of the present invention. For example, each of the walls 9a to 9d, the suction unit 10, and the connection unit 11 may be connected to each other. Alternatively, it may be attached to the joint 2 after being formed as a member different from the member 2. Further, the protection section 4 may be formed of a member different from the joining section 2 and then attached to the joining section 2.

[Brief description of the drawings]

FIG. 1 is a front view of a conductive member according to an embodiment of the present invention.

FIG. 2 is a rear view of the conductive member according to the embodiment;

FIG. 3 is a bottom view of the conductive member according to the embodiment;

FIG. 4 is a plan view showing a use state of the conductive member according to the embodiment.

FIG. 5 is a sectional view taken along line AA in FIG. 4;

FIG. 6 is a plan view showing a usage state of a conventional conductive member.

FIG. 7 is a sectional view taken along line AA in FIG. 6;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Conductive member 2 ... Joint part 2a ... Lower surface 3a-
3c: joining surface 4: protective part 5: folded part 6: support part 7:
Contact part 8 ... Control part 9a-9d ... Wall part 10 ... Suction part 10a ... Suction surface 200 ... Printed wiring board 201 ... Printed wiring
300… ground conductor

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H05K 5/02 H01R 4/48 H01R 13/24

Claims (3)

(57) [Claims] An elongated joint having a joint surface to be soldered to a wiring formed on a wiring board; a folded portion folded from the joint to an opposite side of the joint surface; A support portion connected to the folded portion; a contact portion connected to the distal end side of the support portion; and a standing portion erected from the joint portion on the side opposite to the joint surface, and disposed on a side of the support portion. A conductive member having a wall portion, wherein the bent portion spring is formed by the joining portion, the folded portion, the support portion, and the contact portion, and has a conductivity. When elastically deforming by a predetermined amount around the folded portion, the elastically deformable spring is brought into contact with the joining portion to regulate the elastic deformation of the bending spring.
A regulating portion formed on the opposite side of the support portion in the portion, and a protection portion that stands upright on the opposite side of the joining surface from an end of the joining portion opposite to the folded portion to protect the regulating portion. Wherein the upper end portion of the protection portion and the lower end portion of the regulating portion overlap each other when the conductive member is viewed from the protection portion side. 2. The conductive member according to claim 1, further comprising: a suction portion connected to an upper end portion of the wall portion and having a flat suction surface disposed parallel to the joining surface. A conductive member, wherein a center of gravity of the conductive member is located between the suction surface and the bonding surface. 3. The conductive member according to claim 2, wherein the support portion is disposed so as to pass between the joining portion and the suction portion .