JP6704839B2 - Vacuum suction member - Google Patents

Description

The present invention relates to a technique for holding a substrate such as a wafer by vacuum suction.

There has been proposed a substrate suction device capable of sucking and fixing a substrate that is warped or undulated in a flat state (see, for example, Patent Document 1).

This substrate adsorption device has a main body in which a vacuum space is formed inside, a main body having a communication hole that communicates between the vacuum space and the outside and extends in a direction perpendicular to the support surface, and a suction unit. Is equipped with. The suction part has a support part slidably and airtightly supported along the communication hole of the main body, and a suction pad connected to the support part and projecting backward from the support surface of the main body. Suction holes are formed in the support portion and the suction pad to connect the outside and the vacuum space of the main body. Accordingly, the substrate can be attracted to the main body side while being attracted by the suction pad of the suction unit and brought into contact with the support surface of the main body.

JP 2012-146783A

However, in addition to the suction holes of the suction section, suction holes that connect the opening and the vacuum space are formed in the upper wall member of the main body. Therefore, when the vacuum space of the main body is decompressed, a force that is simultaneously pulled toward the main body acts on the portions of the substrate corresponding to the suction portion and the opening. When the substrate is restrained by this force, it may be sucked and held by the main body in a state where the bending or warping remains.

Therefore, it is an object of the present invention to provide a vacuum suction member that can further improve the flatness when sucking and holding a substrate such as a wafer having a large degree of bending or warping.

A vacuum suction member according to a first aspect of the present invention is a vacuum suction member including: a base having an upper surface; and a partition wall portion formed on the upper surface and partitioning the upper surface into a plurality of regions. Is provided with at least an internal space extending along the designated direction inside thereof and a first air passage communicating from the outside to the internal space, and is movable in the designated direction and a side opposite to the designated direction. A sub-member disposed in the internal space in such a state, and a biasing member disposed in the internal space for biasing the sub-member in the designated direction, and a position in the designated direction in the internal space. A plurality of mutually independent second air passages that extend from a plurality of different locations and communicate with the outside through a plurality of openings provided in each of the plurality of regions on the upper surface of the base body. Is formed inside the base body, and the first ventilation path is in each of the first to N-th designated states (N is 2 or more) sequentially transitioned by the sub-member being displaced in the direction opposite to the designated direction. And at least one of the plurality of second ventilation passages are communicated with each other, and in the i+1th designated state (i is 1 or more and N-1 or less), the communication is made with the first ventilation passage rather than the i-th designated state. A sub-ventilation passage for increasing the number of the second ventilation passages is formed in the sub-member.

According to the vacuum suction member of the first aspect of the present invention, the internal space of the base body is vacuum-sucked or depressurized through the first ventilation path, so that the sub member resists the biasing force of the biasing member in the internal space. It is displaced in the opposite direction to the designated direction, and the transition from the i-th designated state to the (i+1)th designated state is realized. In the "first designated state", the first ventilation passage and a part of the second ventilation passages of the plurality of second ventilation passages communicate with each other via the sub-ventilation passage of the sub member. The plurality of second ventilation passages are mutually independent ventilation passages that communicate with the outside through each of the plurality of openings provided in each of the plurality of regions on the upper surface of the base body. For this reason, the second ventilation path, which is defined by the substrate placed on the upper surface side of the base body, the upper surface of the base body, and the side surface of the partition wall, and communicates with the first ventilation path among the plurality of spaces corresponding to the plurality of regions, respectively. A part of the space is decompressed through the opening of the substrate, and a downward force or a force toward the substrate can be locally applied to the substrate.

Further, in the "second designated state", the sub member is displaced from the first designated state in the opposite direction to the designated direction, so that the sub member communicates with the first ventilation passage via the sub ventilation passage of the sub member as compared with the first designated state. The number of the 2nd ventilation passages to increase increases. As a result, the number of decompressed spaces among the plurality of spaces can be increased, and the range in which the downward force is applied to the substrate can be expanded. That is, a downward force can be applied to each of the plurality of regions of the substrate corresponding to each of the plurality of regions on the upper surface of the substrate with a time lag to expand the region in which the force acts. As a result, unlike the case where a downward force is simultaneously applied to the plurality of regions, the substrate is sucked and held by the base so that the bending or undulation of the substrate is sequentially corrected. It is possible to improve the sex.

In the vacuum suction member, according to a sequential transition from the i-th designated state to the i+1-th designated state among the first to Nth designated states in the process of displacement of the sub-member in the internal space. The region in which the opening of the second ventilation passage, which is newly communicated with the sub-ventilation passage, is sequentially transitioned from one region of the plurality of regions to another region adjacent thereto. It is preferable that it is configured as follows.

According to the vacuum suction member having the above configuration, a downward force is applied to one region of the substrate in the i-th designated state, and then the one region of the substrate and this in the (i+1)-th designated state are applied. A downward force can be applied to another area adjacent to. As a result, the substrate is sucked and held by the base so that the bending or waviness of the substrate is sequentially corrected from one region to another region adjacent thereto, so that the flatness of the substrate is improved.

In the vacuum suction member, it is preferable that the partition portion is formed on the upper surface of the base so that the plurality of regions include a reference region and one or a plurality of annular regions that surround the reference region in a single or multiple manner. ..

According to the vacuum suction member having the configuration, in the i-th designated state, the reference region on the upper surface of the substrate and the one or more annular regions are provided on one region of the substrate corresponding to the one region (for example, the outer peripheral region of the substrate). It is possible to apply a downward force to the other area of the substrate (for example, a reference area of the substrate) in the subsequent i+1-th designated state. As a result, the substrate is adsorbed and held by the base so that the bending or undulation of the substrate is sequentially corrected, for example, from the outer side to the inner side or from the inner side to the outer side, so that the flatness of the substrate is improved.

In the vacuum suction member, in each of the first to Nth designated states, the second ventilation passage formed inside the base body in the circumferential direction of the sub member and the inside of the sub member are formed. It is preferable that the sub-member and the internal space are configured such that the sub-ventilation path that is positioned is aligned with the sub-ventilation path.

With the vacuum suction member having the above configuration, it is possible to avoid a situation in which the positions of the second ventilation passage of the base body and the auxiliary ventilation passage of the sub member are displaced in the circumferential direction of the sub member. Therefore, in the i-th designated state, the second air passage of the base body and the sub air passage of the sub member can be surely communicated with each other.

In the vacuum suction member, the sub-member is composed of a cylindrical first element and a second element protruding in a radial direction from a part of a side surface of the first element, and the internal space is It is configured by a cylindrical first internal space corresponding to the first element of the sub member, and a second internal space that is continuous with the first internal space and guides the second element of the sub member. Preferably.

According to the vacuum suction member having the above configuration, the second element of the sub member is guided along the second internal space of the base body, so that the first element rotates about the axis in the first internal space and the first element of the base body is rotated. It is possible to avoid a situation in which the positions of the two ventilation paths and the sub ventilation path of the sub member are displaced in the circumferential direction of the first element of the sub member. Therefore, in the i-th designated state, the second air passage of the base body and the sub air passage of the sub member can be surely communicated with each other.

A vacuum suction member according to a second aspect of the present invention is a vacuum suction member including a base having an upper surface, and a partition wall portion formed on the upper surface and partitioning the upper surface into a plurality of regions. Is provided with at least an internal space extending along the designated direction inside thereof and a first air passage communicating from the outside to the internal space, and is movable in the designated direction and a side opposite to the designated direction. A sub-member disposed in the internal space in such a state, and a biasing member disposed in the internal space for biasing the sub-member in the designated direction, and a position in the designated direction in the internal space. A plurality of mutually independent second air passages that extend from a plurality of different locations and communicate with the outside through a plurality of openings provided in each of the plurality of regions on the upper surface of the base body. Is formed inside the base body, and in each of the first to Nth designated states (N is 2 or more) sequentially transitioned by the sub-member being displaced in the direction opposite to the designated direction, the first ventilation is performed. A sub-ventilation passage that connects the passage and the second ventilator passage is formed in the sub-member, and in each of the first to Nth designated states, the second ventilator passage that is different from the plurality of second vent passages. Communicate with the first air passage.

According to the vacuum suction member of the second aspect of the present invention, the internal space of the base body is vacuum-sucked or depressurized through the first ventilation path, so that the sub member resists the biasing force of the biasing member in the internal space. The displacement from the designated direction to the opposite direction realizes the transition from the i-th designated state to the (i+1)-th designated state. In each of the first to Nth designated states, a different second ventilation passage of the plurality of second ventilation passages communicates with the first ventilation passage via the sub ventilation passage of the sub member.

Therefore, a downward force can be applied to each of the plurality of regions of the substrate corresponding to each of the plurality of regions on the upper surface of the base with a time lag, so that the action region of the force can be changed. As a result, unlike the case where a downward force is simultaneously applied to the plurality of regions, the substrate is sucked and held by the base body so that the bending or undulation of the substrate is sequentially corrected. The flatness is improved. In the Nth designated state, the substrate is adsorbed and held on the substrate by the force acting on the region of the substrate corresponding to at least one region on the upper surface of the substrate on which the second air passage communicating with the first air passage is provided. To be done.

The structure explanatory drawing of the vacuum suction member as 1st Embodiment of this invention. FIG. 3 is a configuration explanatory view of a sub member and a base. FIG. 3 is a configuration explanatory view of an internal space of a sub member and a base. Explanatory drawing regarding the 1st designated state of a sub member. Explanatory drawing regarding the 2nd designated state of a sub member. Explanatory drawing regarding the 3rd designated state of a sub member. Explanatory drawing regarding the initial stage of wafer adsorption holding. Explanatory drawing regarding the 1st step of wafer adsorption holding. Explanatory drawing regarding the 2nd step of wafer adsorption holding. Explanatory drawing regarding the 3rd step of wafer adsorption holding. The structure explanatory view of the vacuum adsorption member as other embodiment of the present invention. Explanatory drawing regarding the 1st designated state of a sub member. Explanatory drawing regarding the 2nd designated state of a sub member. Explanatory drawing regarding the 3rd designated state of a sub member. The structure explanatory drawing of the sub member of the modification of this invention. The structure explanatory drawing of the sub member of the modification of this invention. The structure explanatory drawing of the vacuum suction member of the modification of this invention.

(First embodiment)
(Constitution)
The vacuum suction member as the first embodiment of the present invention shown in FIG. 1 includes a substantially disk-shaped substrate 1 for sucking and holding a wafer W (substrate). On the upper surface of the base body 1, a plurality of pin-shaped convex portions 11 and a substantially annular first partition wall portion 121, a second partition wall portion 122, and a third partition wall portion 123 which are arranged concentrically in order from the inside are formed. Has been done. In order to clarify the structure of the vacuum suction member, the constituent elements such as the convex portion 11 and the partition portions 121 to 123 are deformed in the drawing, and in addition to the aspect ratio in the cross-sectional view of each constituent element, the width and the height are mutually different. The ratio with the interval is different from the actual one.

The plurality of convex portions 11 are regularly arranged in other modes such as a triangular lattice shape and a square lattice shape, and are locally irregular so that differences in density are locally generated in the circumferential direction or the radial direction. May be located at. The interval or pitch of the convex portions 11 is designed to be, for example, 8 [mm] or less, preferably 6 [mm], and more preferably 4 [mm] or less. The amount of protrusion of the protrusion 11 from the upper surface of the base 1 is designed to fall within a range of 10 to 200 [μm], for example.

The convex portion 11 has a columnar shape such as a cylindrical shape or a prismatic shape, a truncated cone shape such as a truncated cone shape or a truncated pyramid shape, or a stepped columnar shape or a truncated cone shape having a smaller cross-sectional area at the upper portion than at the lower portion. Formed into a shape. The diameter of the upper end portion (contact portion with the wafer W) of the convex portion 11 is designed to be 500 [μm] or less. The surface roughness Ra of the upper end portion (contact portion with the wafer W) of the convex portion 11 is designed to fall within the range of 0.01 to 0.50 [μm].

Each of the first partition wall portion 121, the second partition wall portion 122, and the third partition wall portion 123 is formed such that the upper end thereof is at the same height position as the upper end of the convex portion 11, and more than the upper end of the convex portion 11. It may be formed in a lower position. The upper surface of the base body 1 is formed by the first partition wall 121, the second partition wall 122, and the third partition wall 123, and has a substantially circular reference region R1 and a substantially annular shape that is adjacent to the reference region R1 via the first partition wall 121. Is divided into an inner annular region R2 and a substantially annular outer annular region R3 that is adjacent to the inner annular region R1 via the second partition 122. The sectional shape of each of the partition walls 121 to 123 along the radial direction of the base 1 may be various shapes such as a rectangular shape, a trapezoidal shape, a semicircular shape, or a semielliptic shape.

The mode of forming the partition wall and the mode of partitioning the plurality of regions on the upper surface of the base 1 may be variously changed. The number of annular regions surrounding the reference region is not 2 but may be 1 or any number of 3 or more. The partition wall may be formed on the upper surface of the base 1 so that the annular region is divided into a plurality of regions in the circumferential direction. The partition wall portion may be formed on the upper surface of the substrate 1 so that a plurality of regular hexagonal regions are arranged like a honeycomb structure.

An inner space 10 is formed inside the peripheral portion of the base body 1 so as to extend in a substantially linear shape along a designated direction (FIG. 1/upward direction) or a direction parallel to the upper surface. The base body 1 extends from each of a first ventilation path 13 that communicates from the outer surface of the base body 1 to the rear end of the internal space 10 and a plurality of locations in the internal space 10 that differ in the designated direction. A plurality of independent second ventilation paths 141, 142, and 143 communicating with the outside through the plurality of openings provided in the plurality of regions R1 to R3 are formed on the upper surface of the. The first ventilation passage 13 is connected to a vacuum suction device (not shown). Each of the second ventilation paths 141, 142, and 143 extends laterally along the upper surface of the base body 1 from the internal space 10 and then extends upward to the upper surface of the base body 1. The extension mode may be variously changed, such as extending obliquely upward. The base 1 may be formed with a plurality of through holes through which lift pins for raising and lowering the wafer W and adjusting the distance between the upper surface of the base 1 and the lower surface of the wafer W pass (not shown).

In the internal space 10, the sub member 2 is arranged in a movable state in a designated direction and in a direction opposite to the designated direction, and a biasing member 4 for biasing the sub member 2 in the designated direction is arranged. A sub-ventilation passage 20 is formed in the sub-member 2. The sub-ventilation passage 20 extends substantially linearly in the radial direction and the first sub-ventilation passage 21 that penetrates the center of the sub-member 2 in the axial direction, and connects the first sub-ventilation passage 21 to the outside of the sub-member 2. It is configured by the second auxiliary air passage 22.

In the present embodiment, the sub-ventilation passage 20 communicates with the second ventilation passage 141 that communicates with the reference region R1 in a state where the tip of the sub member 2 is in contact with the base body 1 at the tip of the internal space 10. 1 designated state" is realized. In the state where the tip of the sub member 2 is in contact with the base body 1 at the tip of the internal space 10, the respective communicating portions of the second ventilation passage 141 and the second sub ventilation passage 22 are connected so that the first designated state is not yet realized. The position or extension manner of may be changed.

The number and arrangement of the internal spaces 10, the number of the second ventilation passages 141, 142 and 143 corresponding to each internal space 10 and the number of openings thereof, and the arrangement of the openings are different from those of the above-described embodiment. May be changed to. For example, when the base body 1 is sufficiently thick, the internal space 10 is formed not to extend parallel to the upper surface of the base body 1 but to extend perpendicularly to the upper surface of the base body 1. May be done.

The sub member 2 is made of, for example, ceramics such as silicon carbide or alumina, and its outer surface and the inner surface of the internal space 10 are formed so that airtightness is maintained when the sub member 2 moves up and down. The surface roughness Ra is included in the range of 0.001 to 0.2 [μm], and the clearance between the sub member 2 and the inner surface of the internal space 10 is included in the range of 1 to 10 [μm]. Is being adjusted.

As shown in FIG. 3, the sub-member 2 radially protrudes from a cylindrical first element 2A and a part of the side surface of the first element 2A, and the sub-member 2 extends in the axial direction of the first element 2A. And a second element 2B extending over half (or the entire length). The second element 2B may project in the radial direction not only at one location but also at a plurality of locations in the circumferential direction of the first element 2A. The second element 2B may locally project in the radial direction at one or more locations instead of the entire length in the axial direction of the first element 2A. The second element 2B is on the opposite side of the second auxiliary air passage 22 with respect to the central axis of the first element 2A. The position of the second element 2B with respect to the second auxiliary air passage 22 may be variously changed.

Similarly, as shown in FIG. 3, the internal space 10 is continuous with the cylindrical first internal space 10A corresponding to the first element 2A of the auxiliary member 2 and the first internal space 10A. The second inner space 10B that guides the second element 2B of the second direction 2 in the designated direction and the opposite direction.

(Production method)
The vacuum suction member having the above structure is manufactured, for example, by the following procedure. That is, a substantially disk-shaped molded body is manufactured from the raw material powder, and the molded body is fired to manufacture a substantially disk-shaped sintered body as the substrate 1. As the raw material powder, for example, silicon carbide having a purity of 97% or more, and a mixed raw material powder in which an appropriate amount of a sintering aid is added as necessary are used. In addition, other ceramic powder such as alumina powder may be used as the raw material powder. In addition, the internal space 10, the plurality of convex portions 11, the plurality of partition portions 121, 122 and 123, the first ventilation passage 13 and the plurality of second ventilation passages 141, 142 and 143 in the base body 1 are blasted or milled. It is formed according to an appropriate processing method. Here, the spaces such as the second ventilation paths 141, 142, and 143 can be formed by joining a plurality of substantially disk-shaped members (molded bodies or sintered bodies). In this case, the internal space 10 and the first ventilation passage 13 are formed by performing machining after joining a plurality of substantially disk-shaped members. However, at this stage, the internal space 10 communicates with the outside through the side surface opening of the base 1 in the designated direction.

A substantially cylindrical shaped body is produced from the same raw material powder as described above, and the substantially cylindrical sintered body is produced as the sub member 2 by firing the formed body. Then, the first sub-ventilation passage 21 and the second sub-ventilation passage 22 are formed in the sub-member 2 by an appropriate processing method such as milling.

Then, a biasing member 4 such as a spring (for example, a coil spring or a leaf spring) is arranged in the internal space 10 of the base body 1 through the opening, and the sub member 2 is further arranged or inserted. Then, the opening of the internal space 10 is closed by a closing member made of a ceramics sintered body, and the closing member is joined to the base body 1 without a gap by an appropriate method such as glass joining. Through the steps described above, the vacuum suction member having the above configuration is manufactured.

(function)
According to the vacuum suction member having the above structure, the internal space 10 of the base body 1 is vacuumed or depressurized through the first ventilation passage 13. As a result, the sub member 2 is displaced in the inner space 10 in the direction opposite to the designated direction against the biasing force of the biasing member 4, and the first designated state (see FIG. 4A) → the second designated state (see FIG. 4B). )→state transition of the third designated state (see FIG. 4C) is realized.

In the “first designated state”, as shown in FIG. 4A, the first ventilation passage 13 and the second ventilation passage 141 communicating with the reference region R1 are disposed at the rear end portion of the internal space 10 and the auxiliary member 2. The first auxiliary air passage 21 and the second auxiliary air passage 22 communicate with each other. Therefore, as shown in FIG. 5A, the wafer W placed on the upper surface side of the base body 1, the upper surface of the base body 1 and the three spaces S1 to S3 (closed) defined by the plurality of partition walls 121 to 123 are closed. In the space S1), the space S1 is depressurized, and the downward force (see the black arrow) can be locally applied to the wafer W.

In the “second designated state”, as shown in FIG. 4B, the first ventilation passage 13 and the second ventilation passage 141 communicating with the reference region R1 are disposed in the rear end portion of the internal space 10 and the sub member 2. The first sub-ventilation passage 21 and the inner space 10 are communicated with each other via the tip portion. Further, the first ventilation passage 13 and the second ventilation passage 142 communicating with the inner annular region R2 form the rear end portion of the internal space 10 and the first auxiliary ventilation passage 21 and the second auxiliary ventilation passage 22 of the sub member 2. Communicate with each other. That is, in the second designated state, the number of the second vent passages 141 and 142 communicating with the first vent passage 13 via the sub vent passage 20 of the sub member 2 is from "1" to "1" compared to the first designated state. 2". As a result, as shown in FIG. 5B, the number of depressurized spaces S1 and S2 among the plurality of spaces S1 to S3 is increased, and a downward force (see a black arrow) is applied to the wafer W. It is possible to extend the range of operation.

In the “third designated state”, as shown in FIG. 4C, the first ventilation passage 13 and the second ventilation passages 141 and 142 communicating with the reference region R1 and the inner annular region R2, respectively, are internally formed. It communicates with the rear end of the space 10, the first sub-ventilation passage 21 of the sub member 2, and the tip of the internal space 10. Further, the first ventilation passage 13 and the second ventilation passage 143 communicating with the outer annular region R3 form the rear end portion of the internal space 10 and the first auxiliary ventilation passage 21 and the second auxiliary ventilation passage 22 of the sub member 2. Communicate with each other. That is, in the third designated state, the number of the second vent passages 141, 142, 143 communicating with the first vent passage 13 via the sub vent passage 20 of the sub member 2 is “2” in comparison with the second designated state. It increases from "3". As a result, as shown in FIGS. 5C and 5D, the number of decompressed spaces S1, S2, S3 among the plurality of spaces S1 to S3 is increased, and a downward force (black) is exerted on the wafer W. It is possible to expand the range in which (see arrow) acts.

When the vacuum suction of the first ventilation path 13 is stopped, the sub member 2 moves in the designated direction by the urging force of the urging member 4, and moves from the third designated state to the second designated state to the first designated state. (See FIG. 4A). This makes it possible to transition each of the plurality of spaces S1 to S3 from the depressurized state to the atmospheric pressure state and separate the wafer W from the base body 1.

(effect)
According to the vacuum suction member as the first embodiment of the present invention, the downward force is applied to each of the plurality of regions of the wafer W corresponding to each of the plurality of regions R1 to R3 on the upper surface of the substrate 1 with a time lag. It is possible to cause the action to expand the action area of the force (see FIGS. 5A to 5C). As a result, unlike the case where a downward force is simultaneously applied to the plurality of regions, the wafer W is sucked and held by the base 1 so that the bending or waviness of the wafer W is sequentially corrected. The flatness of the wafer W is improved (see FIG. 5B).

(Second embodiment)
(Constitution)
In the vacuum suction member according to the second embodiment of the present invention, the first sub-ventilation passage 21 (see FIGS. 2 and 3) of the sub-member 2 is closed on the tip side without penetrating the sub-member 2 in the axial direction. (Not shown). The vacuum suction member according to the second embodiment of the present invention has the same configuration as the vacuum suction member according to the first embodiment of the present invention in other respects, and thus the description of the same configuration is omitted.

(function)
According to the vacuum suction member having the above structure, the internal space 10 of the base body 1 is vacuumed or depressurized through the first ventilation passage 13. As a result, the sub member 2 is displaced in the inner space 10 in the direction opposite to the designated direction against the biasing force of the biasing member 4, and the first designated state (see FIG. 4A) → the second designated state (see FIG. 4B). )→state transition of the third designated state (see FIG. 4C) is realized.

In the “first designated state”, the first ventilation passage 13 and the second ventilation passage 141 communicating with the reference region R1 are arranged such that the rear end portion of the internal space 10, the first auxiliary ventilation passage 21 of the sub member 2, and the second It communicates via the sub-ventilation passage 22 (see FIG. 4A). Therefore, the space S1 of the three spaces S1 to S3 (which may or may not be a closed space) is decompressed, and a downward force can be locally applied to the wafer W. The first designated state is almost the same as in the first embodiment.

In the “second designated state”, the first ventilation passage 13 and the second ventilation passage 142 communicating with the inner annular region R2 are arranged such that the rear end portion of the internal space 10 and the first sub-ventilation passage 21 of the sub member 2 and the first sub-ventilation passage 21. It communicates with each other via two auxiliary air passages 22. On the other hand, the first ventilation passage 13 and the second ventilation passage 141 communicating with the reference region R1 are blocked by the sub member 2. Therefore, in the second designated state, as compared with the first designated state, the second ventilation passage communicating with the first ventilation passage 13 via the sub-ventilation passage 20 of the sub-member 2 is the second ventilation passage 141 to the second ventilation passage. Change to path 142. As a result, the depressurized space of the plurality of spaces S1 to S3 is changed from the space S1 to the space S2, and the range in which the downward force is applied to the wafer W can be changed.

In the “third designated state”, the first ventilation passage 13 and the second ventilation passage 143 communicating with the outer annular region R3 are arranged such that the rear end portion of the internal space 10 and the first sub-ventilation passage 21 of the sub member 2 and It communicates with each other via two auxiliary air passages 22. On the other hand, the first ventilation passage 13 and the second ventilation passages 141 and 142 communicating with the reference region R1 and the inner annular region R2, respectively, are blocked by the sub member 2. Therefore, in the third designated state, as compared with the second designated state, the second ventilation passage 143 communicating with the first ventilation passage 13 via the sub ventilation passage 20 of the sub member 2 is provided from the second ventilation passage 142 to the second ventilation passage 142. It changes to the ventilation path 143. As a result, the depressurized space of the plurality of spaces S1 to S3 is changed from the space S2 to the space S3, and the range in which the downward force is applied to the wafer W can be changed.

(effect)
According to the vacuum suction member as the second embodiment of the present invention, a downward force is applied with a time difference to each of the plurality of regions of the wafer W corresponding to each of the plurality of regions S1 to S3 on the upper surface of the substrate 1. Then, the action area of the force can be changed. As a result, unlike the case where a downward force is simultaneously applied to the plurality of regions, the wafer W is sucked and held by the substrate 1 so that the bending or waviness of the wafer W is sequentially corrected. The flatness of the wafer W can be improved.

Unlike the first embodiment, in the third designated state, the wafer W is a substrate by the force acting on the region (peripheral region) of the wafer W corresponding to the outer annular region R3 communicating with the first ventilation passage 13. 1 is adsorbed and held.

(Other Embodiments of the Present Invention)
In the first embodiment of the present invention, the one second sub-ventilation passage 22 communicating with each of the plurality of second ventilation passages 141, 142 and 143 is formed in the sub-member 2, but another embodiment. As a plurality of second ventilation passages 141, 142 and 143, a plurality of second auxiliary ventilation passages may be formed in the sub member 2 so as to communicate with each other. For example, as shown in FIG. 6, a plurality of second auxiliary air passages 221, 222 and 223 may be formed in the auxiliary member 2.

According to the vacuum suction member having the above structure, the internal space 10 of the base body 1 is vacuumed or depressurized through the first ventilation passage 13. As a result, the sub member 2 is displaced in the inner space 10 in the direction opposite to the designated direction against the biasing force of the biasing member 4, and the first designated state (see FIG. 7A)→the second designated state (see FIG. 7B). )→The state transition of the third designated state (see FIG. 7C) is realized.

In the “first designated state”, as shown in FIG. 7A, the first ventilation passage 13 and the second ventilation passage 141 communicating with the reference region R1 are disposed at the rear end portion of the internal space 10 and the auxiliary member 2. The first auxiliary air passage 21 and the second auxiliary air passage 221 communicate with each other. Therefore, as shown in FIG. 5A, of the three spaces S1 to S3 (which may or may not be closed spaces), the space S1 is decompressed, and the wafer W has a downward force (black arrow). (See) can be applied locally.

In the “second designated state”, as shown in FIG. 7B, the first ventilation passage 13 and the second ventilation passage 142 communicating with the inner annular region R2 are provided at the rear end portion of the internal space 10 and the sub member 2. The first sub-ventilation passage 21 and the second sub-ventilation passage 222 communicate with each other. At this time, the first ventilation passage 13 and the second ventilation passage 141 communicating with the reference region R1 connect the rear end portion of the internal space 10 and the first sub ventilation passage 21 and the second sub ventilation passage 221 of the sub member 2. It still communicates through. That is, in the second designated state, the number of the second vent passages 141 and 142 communicating with the first vent passage 13 via the sub vent passage 20 of the sub member 2 is from "1" to "1" compared to the first designated state. 2". As a result, as shown in FIG. 5B, the number of depressurized spaces S1 and S2 among the plurality of spaces S1 to S3 is increased, and a downward force (see a black arrow) is applied to the wafer W. It is possible to extend the range of operation.

In the “third designated state”, as shown in FIG. 7C, the first ventilation passage 13 and the second ventilation passage 143 communicating with the outer annular region R3 are arranged so that the rear end portion of the internal space 10 and the sub member 2 are separated from each other. The first sub-ventilation passage 21 and the second sub-ventilation passage 223 communicate with each other. The first ventilation passage 13 and each of the second ventilation passages 141 and 142 communicating with the reference region R1 and the inner annular region R2 respectively include the rear end portion of the internal space 10 and the first auxiliary ventilation passage 21 of the sub member 2. And the second auxiliary air passages 221 and 222, respectively. That is, in the third designated state, the number of the second vent passages 141, 142, 143 communicating with the first vent passage 13 via the sub vent passage 20 of the sub member 2 is “2” in comparison with the second designated state. It increases from "3". As a result, as shown in FIGS. 5C and 5D, the number of decompressed spaces S1, S2, S3 among the plurality of spaces S1 to S3 is increased, and a downward force (black) is exerted on the wafer W. It is possible to expand the range in which (see arrow) acts.

An airtight member such as an O-ring may be arranged on the outer surface of the sub member 2 in order to maintain airtightness with the inner surface of the internal space 10. In this case, a groove 202 for mounting the airtight member is formed on the outer surface of the sub member 2 over the entire circumference of the sub member 2 as shown in FIG. 8, and the airtight member is arranged in the groove 202. It According to this, even if the clearance between the outer side surface of the sub member 2 and the inner side surface of the internal space 10 is larger than 10 [μm], the airtightness can be maintained.

Further, as shown in FIG. 9, a groove portion 204 is formed on the outer surface of the sub member 2 over the entire circumference of the sub member, and an opening portion of the second sub air passage 22 is formed on the bottom surface of the groove portion 204. May be. According to this, even if the sub member 2 rotates in the internal space 10, the second sub air passage 22 and the second air passages 141, 142, and 143 can be surely communicated with each other via the groove portion 204. ..

Further, as shown in FIG. 10, a plurality of groove portions 1041 to 1043 are formed on the inner surface of the internal space 10 over the entire circumference thereof, and the second ventilation passage 141 is formed on the bottom surface of each of the groove portions 1041 to 1043. , 142 and 143 may be formed. According to this, similarly to the embodiment shown in FIG. 9, even if the sub member 2 rotates in the internal space 10, the second sub air passage 22 and the second air passages 141, 142, and 143 can be surely passed through the groove 104. Can communicate with each.

The sub member 2 and the internal space 10 do not have a cylindrical shape capable of rotating around the axis, but when the sub member 2 is arranged in the internal space 10 such as a prismatic shape, the positional deviation in the circumferential direction is not caused. The sub member 2 may be formed in a shape that prevents it. With this, also in each of the first, second, and third designated states, the second ventilation passages 141, 142, and 143 of the base body 1 and the second auxiliary ventilation passage of the sub-member 2 in the circumferential direction of the sub-member 2 respectively. 22 is surely aligned.

In the above-described embodiment, the region of the wafer W on which the force acting on the substrate 1 is applied is expanded or changed in order from the inner side to the outer side (see FIGS. 5A to 5C). The order in which the area on which the oncoming force acts is expanded or changed may be changed. This order is changed, for example, by changing the area in which the openings of the plurality of second ventilation paths 141, 142, and 143 are provided. For example, the space S1 corresponding to the reference region R1→the space S2 corresponding to the inner annular region R2→the space S3 corresponding to the outer annular region R3 is not in the order of S3→S2→S1, S2→S1→S3, S3→S1. The areas in which the openings of the plurality of second ventilation paths 141, 142, and 143 are provided may be changed so that the pressure is reduced in the order of →S2 or S1 →S3 →S2.

In the above-described embodiment, a single space among the plurality of spaces S1 to S3 is newly communicated with the first ventilation passage 13 in accordance with the designated state transition, but as another embodiment, a designation among the plurality of spaces S1 to S3 is provided. A plurality of spaces may be newly communicated with the first ventilation path 13 in the state transition. For example, in the first designated state, only the space S2 corresponding to the inner annular region R2 is depressurized, and in the second designated state, in addition to or instead of this, it corresponds to the space S1 corresponding to the reference region R1 and the outer annular region R3. The space S3 may be decompressed simultaneously or almost simultaneously through the common second ventilation path 142.

In the above embodiment, an elastically deformable member such as a spring element can be applied as the urging member 4, and the sub member 2 can be moved in the designated direction and the opposite direction in the inner space 10 by an external force such as an actuator. What was constituted so that it could be applied can also be applied. In that case, a transmission member as a biasing member may be inserted into the first ventilation passage 13 and connected to the sub member 2 to move the sub member 2 from the outside of the base body 1.

DESCRIPTION OF SYMBOLS 1... Base|substrate, 10... Internal space, 10A... 1st internal space, 10B... 2nd internal space, 11... convex part, 121... 1st partition part, 122... 2nd partition part, 123... 3rd partition part, 13 First air passage, 141, 142, 143 Second air passage, 2nd auxiliary member, 2A First element, 2B Second element, 4... Energizing member, 20 Second auxiliary air passage, 21... First Sub-ventilation passage, 22... Second sub-ventilation passage, 221, 222, 223... Second sub-ventilation passage, R1... Reference region, R2... Inner annular region, R3... Outer annular region, S1... First space, S2. 2 space, S3... 3rd space, W... wafer (substrate).

Claims (6)

A vacuum suction member comprising: a base body having an upper surface; and a partition portion formed on the upper surface and partitioning the upper surface into a plurality of regions.
The base body includes at least an internal space extending along the designated direction in the interior thereof, and a first ventilation path communicating with the internal space from the outside,
A sub member disposed in the internal space in a movable state on the designated direction and on the side opposite to the designated direction;
A biasing member that is disposed in the internal space and that biases the sub member in the designated direction,
Mutually extending from each of a plurality of locations in the internal space having different positions in the designated direction and communicating with the outside through each of a plurality of openings provided in each of the plurality of regions on the upper surface of the base body. A plurality of independent second ventilation passages are formed inside the base body,
In each of the first to N-th designated states (N is 2 or more) that are sequentially transitioned by the sub-member being displaced in the opposite direction to the designated direction, the first ventilation passage and the plurality of second ventilation passages are The number of the second ventilation passages communicating with at least one of the second ventilation passages in the i+1th designated state (i is 1 or more and N−1 or less) is greater than that in the ith designated state. A vacuum suction member, characterized in that an auxiliary air passage to be increased is formed in the auxiliary member. The vacuum suction member according to claim 1,
In the process in which the sub member is displaced in the internal space, the sub air passage is responsive to a sequential transition from the i th designated state among the 1 st to N th designated states to the i+1 th designated state. The area in which the opening of the second ventilation path, which is newly communicated with, is provided so as to sequentially transition from one area of the plurality of areas to another area adjacent thereto. A vacuum suction member characterized by the above. The vacuum suction member according to claim 1 or 2,
The vacuum suction member, wherein the partition wall portion is formed on the upper surface of the base so that the plurality of regions include a reference region and one or a plurality of annular regions surrounding the reference region in a single or multiple manner. The vacuum suction member according to any one of claims 1 to 3,
In each of the first to N-th designated states, the second ventilation passage formed inside the base body in the circumferential direction of the sub member, and the sub ventilation passage formed inside the sub member. The sub-member and the internal space are configured so that and are aligned with each other. The vacuum suction member according to claim 4,
The sub member is composed of a cylindrical first element and a second element protruding in a radial direction from a part of a side surface of the first element,
A cylindrical first inner space corresponding to the first element of the sub member and a second inner part that is continuous with the first inner space and guides the second element of the sub member. A vacuum suction member comprising a space. A vacuum suction member comprising: a base body having an upper surface; and a partition portion formed on the upper surface and partitioning the upper surface into a plurality of regions.
The base body includes at least an internal space extending along the designated direction in the interior thereof, and a first ventilation path communicating with the internal space from the outside,
A sub member disposed in the internal space in a movable state on the designated direction and on the side opposite to the designated direction;
A biasing member that is disposed in the internal space and that biases the sub member in the designated direction,
Mutually extending from each of a plurality of locations in the internal space having different positions in the designated direction and communicating with the outside through each of a plurality of openings provided in each of the plurality of regions on the upper surface of the base body. A plurality of independent second ventilation passages are formed inside the base body,
In each of the first to N-th designated states (N is 2 or more) that are sequentially transitioned by the sub-member being displaced in the opposite direction to the designated direction, the first ventilation passage and the second ventilation passage are connected to each other. A sub-ventilation path communicating with the sub-member is formed,
In each of the first to Nth designated states, the different second ventilation passages of the plurality of second ventilation passages communicate with the first ventilation passages.