WO2017104732A1

WO2017104732A1 - Substrate holding device, substrate holding member, and substrate holding method

Info

Publication number: WO2017104732A1
Application number: PCT/JP2016/087331
Authority: WO
Inventors: 智浩石野; 菊地　真哉
Original assignee: 日本特殊陶業株式会社
Priority date: 2015-12-18
Filing date: 2016-12-15
Publication date: 2017-06-22

Abstract

Provided are a substrate holding device and a substrate holding method for improving the shape accuracy of a held substrate. The substrate holding device is provided with a first holding member 1 equipped with a plate-shaped first base 10, and a second holding member 2 equipped with a thin plate-shaped second base 20. A ventilation passage 102 is formed on the first base 10, said ventilation passage 102 communicating to the top surface of the first base 10. A through hole 202 having the center location extending in the thickness direction is formed on the second base 20. On the top surface of the second base 20, there are formed a plurality of convex parts 211 projecting upward, and an annular convex part 212 projecting upward in a substantially annular form similarly with the first base 10 as the center, said part 212 surrounding the top side opening of the through hole 202 and the plurality of convex parts 211.

Description

Substrate holding device, substrate holding member, and substrate holding method

The present invention relates to a substrate holding apparatus that holds a substrate such as a semiconductor wafer by suction on a substrate.

An annular first support portion for supporting the outer edge portion of the substrate on the upper surface of the base, a plurality of projecting second support portions disposed in a region surrounded by the first support portion, and disposed in the region A cylindrical portion that forms a region that does not adsorb the formed substrate, and air suction inside the first support portion formed by the substrate and the base is started from a suction port close to the cylindrical portion. A substrate holding device configured as described above has been proposed (see, for example, Patent Document 1). As a result, the occurrence of a phenomenon in which wrinkles of the substrate are concentrated on the non-adsorbed portion is avoided, so that the overall flatness of the substrate is improved.

Japanese Patent No. 4348734

However, since the line width of the light source of the semiconductor exposure apparatus has been miniaturized in order to manufacture a fine circuit pattern, and the nanometer-sized line width is becoming mainstream, the requirement standard for the flatness of the substrate has increased. ing. *

Further, in the coater / developer process associated with the semiconductor exposure process, the required standard for the flatness of the substrate is increasing. *

Accordingly, an object of the present invention is to provide a substrate holding apparatus and a substrate holding method capable of improving the shape accuracy of a substrate in a holding state in a process other than room temperature as well as in a process other than room temperature.

In the substrate holding device of the present invention, a first holding member including a plate-like first base body in which a ventilation path communicating to the upper surface is formed, and a through hole extending in the thickness direction are formed. A plate-like second substrate that is thinner than the first substrate; and a plurality of convex portions projecting upward on the upper surface of the second substrate, and projecting upward to enclose the through hole and the plurality of convex portions. A second holding member on which an annular convex portion is formed, and the substrate is placed on the second holding member, and the second holding member is placed on the first holding member. It is configured. *

A first holding member including the first base including a heating mechanism; and a second holding member. The second holding member has a substrate placed thereon, and the first holding member. It is configured to be placed on a member. *

The substrate holding method of the present invention is a method for holding a substrate by suction using the first holding member and the second holding member that constitute the substrate holding apparatus of the present invention, wherein the substrate is placed on the second holding member. A step of placing the second holding member on the first holding member, and a step of depressurizing the ventilation path. *

According to the substrate holding device and the substrate holding method using the same according to the present invention, the substrate is placed on the second holding member. Even when the substrate is warped or bent relatively large, at this stage, the shape of the substrate can be at least partially adapted to the shape of the upper surface of the second base constituting the second holding member. That is, even if the substrate is relatively warped or bent, the shape of the substrate is corrected or corrected so that it abuts at least a part of the upper end surface of the plurality of convex portions formed on the upper surface of the second base. It is corrected. *

In this state, the heating mechanism built in the first holding member is activated, or the heating mechanism is activated in advance, so that the shape of the substrate is corrected to be equivalent to that at room temperature even at a temperature other than room temperature. Can do. *

In this state, the second holding member is placed on the first holding member, and the ventilation path is decompressed by the vacuum suction device. Thereby, the first space formed between the first holding member and the second holding member is decompressed through the ventilation path formed in the first base, and the second holding member is sucked and held by the first holding member. . In addition, the second space formed between the second holding member and the substrate is decompressed through the through hole formed in the second base, and the substrate is sucked and held by the second holding member. At this stage, the substrate is in contact with all the upper end surfaces of the plurality of convex portions formed on the upper surface of the second holding member. *

Thus, even if the substrate is relatively warped or bent, its shape matches with the shape determined by all the upper end surfaces or contact surfaces of the plurality of convex portions formed on the upper surface of the second substrate with high accuracy. The substrate can be sucked and held by the second holding member. *

In the substrate holding apparatus of the present invention, it is preferable that the second base is formed in a curved shape, and the second holding member is configured to be deformable into a flat shape in a state where the second holding member is sucked and held by the first holding member. . *

According to the substrate holding device of the configuration, even when the substrate is warped or bent relatively large, the shape of the substrate is changed to the shape of the second holding member when it is placed on the second holding member. Can be easily adapted. *

In the substrate holding device of the present invention, a plurality of convex portions projecting upward and an annular convex portion projecting upward and surrounding the opening of the ventilation path and the plurality of convex portions are formed on the upper surface of the first base. It is preferable that Instead, in the substrate holding device of the present invention, a plurality of convex portions protruding downward and an annular convex portion surrounding the plurality of convex portions are formed on the lower surface of the second base. preferable. *

In the substrate holding apparatus of the present invention, a plurality of the annular protrusions are formed so that the outer annular protrusions surround the inner annular protrusions on the upper surface of the second base, and the plurality of annular protrusions It is preferable that the other annular convex portions excluding the outermost annular convex portion are formed so that the amount of upward projection is less than the plurality of convex portions. *

In the substrate holding device of the present invention, a plurality of the annular protrusions are formed so that the outer annular protrusions surround the inner annular protrusions on the upper surface of the second base, and each of the plurality of annular protrusions. Corresponding to each of the plurality of spaces defined by the plurality of annular projections between the second holding member and the substrate. It is preferable that the through hole is formed in the second base.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a configuration explanatory view of a substrate holding device as a first embodiment of the present invention. The structure explanatory view of the substrate holding device as a 2nd embodiment of the present invention. Explanatory drawing regarding the board | substrate adsorption | suction holding state by the board | substrate holding apparatus of this invention. The top view of the substrate holding device as one embodiment of the present invention. The structure explanatory view of the substrate holding device as other embodiments of the present invention.

First Embodiment (Structure) A substrate holding apparatus as a first embodiment of the present invention shown in FIG. 1 includes a first substrate 10 having a substantially disc shape made of a ceramic sintered body. 1 holding member 1, and 2nd holding member 2 provided with the substantially disk-shaped 2nd base | substrate 20 which consists of a ceramic sintered compact. The second base 20 is designed to have the same diameter as the first holding member 1 or within ± 5%, and its thickness is thinner than the first holding member 1 (for example, about 0.5 to 1.5 [mm]). Has been. As the ceramic sintered body, for example, a SiC sintered body or an Al ₂ O ₃ sintered body is employed.

The first base 10 is formed with a ventilation path 102 that communicates with the upper surface of the first base 10. In the present embodiment, the ventilation path 102 penetrates the first base 10 in the thickness direction, and is, for example, a position corresponding to each vertex of a regular polygon (for example, a regular triangle) having the center of the first base 10 as the center of gravity. Is formed. The number and arrangement of the upper openings of the ventilation path 102 are such that one opening is formed at the center of the first base 10 or a plurality of openings are formed at arbitrary locations separated from the center of the first base 10. Various changes may be made. The ventilation path 102 may be formed so as to extend laterally from the side opening of the first base 10 and then extend upward to communicate with the upper surface of the first base 10. A groove is formed on the lower surface of the first base 10, and the first base 10 is fixed to the base so that the lower surface of the first base 10 abuts the upper surface of the base (not shown). A part of the ventilation path 102 may be constituted by a passage surrounded by. *

A plurality of convex portions 111 projecting upward on the upper surface of the first base body 10, and projecting upward in a substantially annular shape having the same center as that of the first base body 10 to surround the upper opening of the ventilation path 102 and the plurality of convex portions 111. A single annular protrusion 112 is formed. Each convex portion 111 has a flat upper end surface such as a columnar shape, a prismatic shape, a truncated cone shape or a truncated pyramid shape, or a multistage cylindrical shape having a lower upper portion, a multistage prismatic shape, a multistage truncated cone shape, or a multistage truncated pyramid shape. It is formed in any arbitrary shape. The plurality of convex portions 111 are regularly (or periodically) arranged in a lattice shape (square lattice shape or hexagonal lattice shape). The height of the annular protrusion 112 or the amount of protrusion from the upper surface of the first base 10 may be the same as or less than that of each protrusion 111. *

A plurality of convex portions 121 projecting downward on the lower surface of the first base body 10, and projecting downward in a substantially annular shape having the same center as the first base body to surround the lower opening of the ventilation path 102 and the plurality of convex portions. A single annular protrusion 122 is formed. Each convex part 121 is formed in an arbitrary shape having a flat bottom end surface such as a columnar shape. The plurality of convex portions 121 are regularly arranged in a lattice shape or the like. The height of the annular protrusion 122 or the amount of protrusion from the lower surface of the first base 10 may be the same as or less than that of each protrusion 121. The positions of the convex portions 111 on the upper surface side of the first base body 10 and the positions of the convex portions 121 on the lower surface side of the first base body 10 are symmetrical with respect to a plane that is intermediate between the upper surface and the lower surface of the first base body 10. It may be asymmetric. At least a part of the plurality of convex portions 121 may be omitted on the lower surface side of the first base 10, and all of the plurality of convex portions 121 and the annular convex portion 122 may be omitted. *

The second base body 20 is formed with a through hole 202 that extends in the thickness direction at the center. A plurality of convex portions 211 projecting upward on the upper surface of the second base 20, and an upper opening of the through-hole 202 and a plurality of convex portions 211 projecting upward in a substantially annular shape having the same center as the first base 10. A single annular convex portion 212 is formed. Each convex portion 211 is formed in an arbitrary shape having a flat upper end surface. The plurality of convex portions 211 are regularly arranged in a lattice shape or the like. The height of the annular protrusion 212 or the amount of protrusion from the upper surface of the second substrate 20 may be the same as or less than that of each protrusion 211. *

(Function) According to the substrate holding apparatus as the first embodiment of the present invention, the substrate W is placed on the second holding member 2. Even when the substrate W is warped or bent relatively large, at this stage, the shape of the substrate W can be at least partially adapted to the shape of the upper surface of the second base member 20 constituting the second holding member 2. . That is, even if the substrate W is relatively warped or bent, the substrate W may be in contact with at least some of the upper end surfaces of the plurality of convex portions 211 formed on the upper surface of the second base 20. The shape is corrected or corrected. *

In this state, the second holding member 2 is placed on the first holding member 1, and the ventilation path 102 is decompressed by a vacuum suction device (not shown). As a result, the first space formed between the first holding member 1 and the second holding member 2 is depressurized through the ventilation path 102 formed in the first base 10, and the second holding member 2 becomes the first holding member. 1 (see FIG. 3). In addition, the second space formed between the second holding member 2 and the substrate W is decompressed through the through hole 202 formed in the second base 20, and the substrate W is sucked and held by the second holding member 2 ( (See FIG. 3). At this stage, the substrate W is in contact with all the upper end surfaces of the plurality of convex portions 211 formed on the upper surface of the second base body 20. As described above, even if the substrate W is relatively warped or bent, its shape is increased to a shape determined by all the upper end surfaces or contact surfaces of the plurality of convex portions 211 formed on the upper surface of the second base body 20. The substrate W can be sucked and held on the second holding member 2 while being matched with accuracy. *

(
Second Embodiment (Configuration) In the substrate holding apparatus according to the second embodiment of the present invention shown in FIG. 2, the second substrate 20 causes warping or distortion of the wafer W to some extent (for example, about 1/2). ) It is formed in a curved shape corresponding to a part of the sphere surface, a part of the ellipsoidal surface, or a part of the cylindrical side surface to such an extent that it can be relaxed. Since other configurations are the same as those of the substrate holding apparatus (see FIG. 1) of the first embodiment, the same reference numerals are used and description thereof is omitted.

The second base body 20 has a curved shape such that a positional deviation between the center and the outer edge is, for example, 0.1 to 1.0 [mm] with respect to the upper surface normal direction at the center. The second base 20 can be deformed into a flat shape (a shape that substantially matches the normal shape of the second base 20 in the first embodiment) with the second holding member 2 being sucked and held by the first holding member 1. It is configured (see FIG. 3). *

When the second base body 20 is deformed into a flat shape, the plurality of convex portions 211 are formed so as to be inclined so that the upper end surfaces of the convex portions 211 close to the outer edge portions face inward so that the upper end surfaces of the plurality of convex portions 211 are located in the same plane. May be. In order to facilitate the deformation of the second base body 20, the second base body 20 may be partially formed thin. When the second base body 20 is deformed into a flat shape, the protrusions 211 that are present in the thin portion are more protruding than the protrusions 211 that are present in the other portions so that the heights of the plurality of protrusions 211 are uniform. A plurality of convex portions 211 may be formed so as to increase. *

(Function) According to the substrate holding apparatus as the second embodiment of the present invention, even when the substrate W is warped or bent relatively large, when the substrate W is placed on the second holding member 2. The shape of the substrate W can be easily adapted to the shape of the second holding member 2. *

(Other Embodiments of the Present Invention) In the first and second embodiments, a single annular protrusion 212 is formed on the upper surface of the second substrate 20 (see FIGS. 1 and 2). As a form, as shown in FIG. 4, a plurality of (11 in the example of FIG. 4) annular protrusions 212 are formed so that the outer annular protrusion 212 surrounds the inner annular protrusion 212 on the upper surface of the second base body 20. May be formed, and at least one of the plurality of annular protrusions 212 may be formed such that the amount of upward protrusion is less than the plurality of protrusions 211. For example, the outermost annular projection 212 of the plurality of annular projections 212 is formed so that the amount of upward projection is equal compared to the plurality of projections 211, while the annular projection on the inner side of it is formed. The convex portion 212 may be formed so that the amount of upward protrusion is smaller than the plurality of convex portions 211. In addition, at least the first and second annular projections 212 counted from the outside are formed so as to reduce the upward projection amount compared to the plurality of projections 211, and the first annular projection counted from the outside The convex portion 212 may be formed so that the amount of upward protrusion is smaller than that of the second annular convex portion 212 counted from the outside in at least a part of the circumferential direction. *

(Third Embodiment) (Structure) The substrate holding apparatus as the first embodiment of the present invention shown in FIG. 5 is made of an AlN sintered body in which a heating resistor 131 made of molybdenum mesh is built in by simultaneous firing. A first holding member 1 having a substantially disc-shaped first base 10 and a second holding member 2 having a substantially disc-shaped second base 20 made of a ceramic sintered body are provided. . The second base 20 is designed to have the same diameter as the first holding member 1 or within ± 5%, and its thickness is thinner than the first holding member 1 (for example, about 0.5 to 1.5 [mm]). Has been. *

When used at a temperature other than room temperature, the ceramic sintered body constituting the first base 10 of the first holding member 1 is preferably an Al ₂ O ₃ sintered body, an AlN sintered body, or a SiC sintered body. This is because the processing accuracy is improved and the thermal conductivity is high, so that the substrate W can be uniformly heated through the second holding member 2. In order to incorporate the heating resistor 131 in the first holding member 1, a method of simultaneous firing by hot pressing, a method of stacking another green sheet on a green sheet on which the heating resistor is printed, a method of simultaneous firing, or ceramic sintering It is possible to use a method of joining the heating resistor 131 after the body is manufactured.

When used at a temperature other than room temperature, the first holding part is preferably an Al ₂ O ₃ sintered body, an AlN sintered body, or a SiC sintered body. This is because the processing accuracy is improved and the thermal conductivity is high, so that the substrate can be uniformly heated through the second holding member. The heating resistor is built in the first holding member. Simultaneous heating by hot pressing, printing of the heating resistor on the green sheet and further firing by stacking the green sheets, and the heating resistor built in by bonding after the firing body is manufactured. It is possible to make it.

(Function) According to the substrate holding apparatus as the third embodiment of the present invention, the substrate W is placed on the second holding member 2 in use at a temperature other than room temperature. Even when the substrate W is warped or bent relatively large, at this stage, the shape of the substrate W can be at least partially adapted to the shape of the upper surface of the second base member 20 constituting the second holding member 2. . That is, even if the substrate W is relatively warped or bent, the substrate W may be in contact with at least some of the upper end surfaces of the plurality of convex portions 211 formed on the upper surface of the second base 20. The shape is corrected or corrected. *

In the other embodiment, each of the plurality of annular protrusions 212 is formed so that the amount of upward protrusion is equal to the plurality of protrusions 211, and the plurality of annular protrusions are formed between the second holding member 2 and the substrate W. A through-hole 202 extending in the axial direction of the second base 20 may be formed in the second base 20 corresponding to each of the plurality of spaces defined by the portion 212. The plurality of spaces are configured by a substantially circular space defined by the innermost annular convex portion 212 and a substantially annular space surrounding the substantially circular shape in a single or multiple manner.

DESCRIPTION OF SYMBOLS 1 ... 1st holding member, 2 ... 2nd holding member, 10 ... 1st base | substrate, 20 ... 2nd base | substrate, 102 ... Air flow path, 111 ... Convex part, 112 ... Annular convex part, 121 ... Convex part, 122 ... Annular Protrusions 131... Heating resistors 202. Through-holes 211. Protrusions 212.

Claims

A first holding member including a plate-like first base body in which a ventilation path communicating to the upper surface is formed;

A plate-shaped second base that is thinner than the first base, in which a through-hole extending in the thickness direction is formed, and a plurality of convex portions protruding upward on the upper surface of the second base; A second holding member that protrudes upward and is formed with an annular convex portion that surrounds the through hole and the plurality of convex portions,

A substrate holding apparatus, wherein the second holding member is configured such that a substrate is placed thereon and placed on the first holding member.
The substrate holding apparatus according to claim 1, wherein

The substrate holding apparatus, wherein the second base is formed in a curved shape, and is configured to be deformable into a flat shape in a state where the second holding member is sucked and held by the first holding member.
The substrate holding apparatus according to claim 1 or 2,

A plurality of convex portions projecting upward and an annular convex portion projecting upward and surrounding the opening of the ventilation path and the plurality of convex portions are formed on the upper surface of the first base. Substrate holding device.
The substrate holding apparatus according to any one of claims 1 to 3,

A plurality of the annular projections are formed so that the outer annular projections surround the innermost annular projection on the upper surface of the second base in a single or multiple manner, and at least one of the plurality of annular projections The substrate holding apparatus, wherein the annular convex portion is formed so that an amount of upward projection is less than the plurality of convex portions.
The substrate holding apparatus according to any one of claims 1 to 3,

The plurality of annular projections are formed so that the outer annular projections surround the innermost annular projection on the upper surface of the second base in a single or multiple manner, and each of the plurality of annular projections is the plurality of annular projections. Are formed so that the amount of protrusion upward is equal to the amount of protrusion

The substrate holding, wherein the through hole is formed in the second base corresponding to each of a plurality of spaces defined by the plurality of annular protrusions between the second holding member and the substrate. apparatus.
The substrate holding apparatus according to any one of claims 1 to 5,

A substrate holding apparatus comprising a heating mechanism built in the first base.
A substrate holding member as a second holding member placed on a first holding member provided with a plate-like first base in which a ventilation path that passes to the upper surface is formed, and extends in the thickness direction. A plurality of protrusions protruding upward on the upper surface of the substrate on which the substrate is placed, and the through holes and the protrusions protruding upward. A substrate holding member formed with an enclosing annular convex portion.
A base having a through hole extending in the thickness direction is provided, and a plurality of convex portions projecting upward are formed on an upper surface of the base, and the through hole and the plurality of convex portions are projecting upward. A substrate holding member formed with an annular convex portion,

A substrate holding member, wherein the substrate is formed in a curved shape and is deformable into a flat shape.
The substrate holding member according to claim 7 or 8,

A plurality of the annular projections are formed so that the outer annular projections surround the innermost annular projection on the upper surface of the base in a single or multiple manner, and at least one annular projection of the plurality of annular projections is formed. The substrate holding member is characterized in that the portion is formed so that an amount of protrusion upward is smaller than the plurality of convex portions.
The substrate holding member according to claim 7 or 8,

A plurality of the annular projections are formed so that the outer annular projections surround the innermost annular projection on the upper surface of the base in a single or multiple manner, and each of the plurality of annular projections is the plurality of projections. Formed so that the amount of protrusion upward is equal to the part,

The substrate holding member, wherein the through hole is formed in the base corresponding to each of a plurality of spaces defined by the plurality of annular protrusions between the second holding member and the substrate.
A first holding member including a plate-like first base body in which a ventilation path communicating to the upper surface is formed;

A plate-shaped second base that is thinner than the first base, in which a through-hole extending in the thickness direction is formed, and a plurality of convex portions protruding upward on the upper surface of the second base; A method of adsorbing and holding a substrate using a second holding member that protrudes upward and is formed with an annular convex portion that surrounds the through hole and the plurality of convex portions,

Placing the substrate on the second holding member;

Placing the second holding member on the first holding member;

And a step of reducing the pressure of the ventilation path.