JP2013219113A - Semiconductor element carrier device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor element carrier device which can easily remove a foreign material accumulated in a vacuum route in a suction hole for vacuum suction of a semiconductor element in a simple configuration to exert stable suction capability.SOLUTION: A semiconductor element carrier device: comprises a control part which controls a selector valve, a nozzle cylinder and a dust collector 34; switches to a second mode for a tray 2 positioned on a cleaning stage, of connecting a high-pressure source to an air route 24 in a suction hole 21 of the tray 2 by the selector valve; connects a dust collector nozzle 25 to the suction hole 21 of the tray 2 by the nozzle cylinder; blows foreign materials 6 off in the air route 24 in the suction hole 21 by high-pressure air from the high-pressure source; and collects blown-off foreign materials 7 by the dust collector 34 through the dust collector nozzle 25 to clean the suction hole 21 and the air route 24 of the tray 2.

Description

  The present invention relates to a semiconductor element transfer apparatus, and more particularly to a semiconductor element transfer apparatus that stabilizes transfer of a semiconductor element in a semiconductor element production facility.

  Conventionally, in semiconductor element production equipment, rotary table type equipment has used a method of chucking semiconductor elements as a method of fixing and transporting semiconductor elements. Simultaneous processing is required.

  In the above chucking method, it is possible to process one or two semiconductor elements at the same time. However, in the case of three or more semiconductor elements, the chucking structure is complicated and the operation speed is hindered from being increased. It becomes.

  7A and 7B show a chucking structure in which two semiconductor elements are simultaneously processed. After the bearings 118 and 118 are pushed by the pusher 119, the movable plates 116 and 116 are opened, and the semiconductor element 120 is set. The pusher 119 is pulled back, and the movable plates 116 and 116 are closed. Then, the movable plates 116 and 116 are pulled toward the fixed plate 115 by the springs 117 and 117, and the semiconductor element 120 is sandwiched between the fixed plate 115 and the movable plates 116 and 116 and fixed by the biasing force of the springs 117 and 117. Is done. If an attempt is made to simultaneously process four semiconductor elements with this chucking structure, the mechanism is doubled and the structure becomes complicated.

  Therefore, in the case of processing three or more semiconductor elements at the same time, the structure can be simplified and the speed can be increased by using a vacuum suction method as a method of fixing and transporting the semiconductor elements. .

  However, in the above vacuum suction method, since the semiconductor element is held by vacuum suction, the resin powder dropped from the semiconductor element, the resin waste, the resin powder floating in the air, and the resin waste are sucked into the suction hole, and the sucked resin Powder and resin debris adhere to and accumulate on the vacuum path of the suction hole, reducing the cross-sectional area of the vacuum path, reducing the suction capacity, lowering the holding power of the semiconductor element, There is a problem of falling.

  In addition, since cleaning is performed manually, the rotary table system has a plurality of pipes, which is very time consuming. At the time of such cleaning, the pipes were pulled out one by one, and air was injected into the suction holes with high-pressure air to remove the resin powder and resin waste, but the removed resin powder and resin waste were in the air. The resin powder and the resin waste soared up are sucked into the suction holes again. For this reason, the facility was stopped for a long time, and there was a problem that productivity was lowered.

  Therefore, in order to solve such a problem, a semiconductor element transfer device has been proposed in which a suction nozzle is cleaned by irradiating a suction hole with a laser beam (for example, Japanese Patent Application Laid-Open No. 2004-014931 (Patent). Reference 1)).

  The conventional semiconductor element transfer device irradiates the suction holes with laser light, which requires high-precision positioning and safety measures (such as a cover), and thus has a problem that the cleaning mechanism becomes complicated. The conventional semiconductor element transfer apparatus is expensive because the laser irradiation system is expensive.

JP 2004-014931 A

  Accordingly, an object of the present invention is to provide a semiconductor device transport apparatus that can easily remove foreign matter accumulated in a vacuum path of a suction hole for vacuum-sucking a semiconductor element with a simple configuration and can exhibit a stable suction capability. It is to provide.

In order to solve the above problems, a transport device for a semiconductor element of the present invention is
A rotary table for transporting semiconductor elements by vacuum suction;
A tray disposed in the circumferential direction on the rotary table and having a suction hole for vacuum-sucking the semiconductor element;
A vacuum source for creating a negative pressure or vacuum in the air path of the suction hole of the tray;
A high pressure source for increasing the pressure in the air path of the suction hole of the tray;
At least one of a first mode in which the vacuum source is connected to the air path of the suction hole of the tray during transport of the semiconductor element, and a second mode in which the high pressure source is connected to the air path of the suction hole. A switching valve to switch to
In a cleaning stage for cleaning the suction hole of the tray, a dust collecting nozzle connected to the suction hole of the tray;
A nozzle driver for connecting the dust collection nozzle to the suction hole of the tray;
A dust collector that collects foreign matter in the suction hole via the dust collection nozzle;
The rotary table, the switching valve, the nozzle drive unit, and a control unit for controlling the dust collector,
The control unit controls the switching valve, the nozzle driving unit, and the dust collector, and the high pressure is applied to the air path of the suction hole of the tray by the switching valve with respect to the tray positioned on the cleaning stage. Switch to the second mode for connecting the source, connect the dust collecting nozzle to the suction hole of the tray by the nozzle driving unit, and blow the blow-off air with the high-pressure air from the high-pressure source. The foreign matter in the air path is collected by the dust collector through the dust collecting nozzle, thereby cleaning the suction hole and the air path of the tray.

  According to the above configuration, the control unit controls the switching valve, the nozzle driving unit, and the dust collector, and connects the high pressure source to the air path of the suction hole of the tray by the switching valve with respect to the tray located on the cleaning stage. The mode is switched to 2 mode, and the dust collecting nozzle is connected to the suction hole of the tray by the nozzle driving unit. By doing so, the high-pressure air from the high-pressure source blows off the foreign matter in the suction hole, and the dust is collected by the dust collector through the dust collection nozzle, thereby cleaning the suction hole and the air path of the tray. Resin powder, resin, or the like that enters the air path of the suction hole can be easily removed with high-pressure air because the adhesion is weak even if it adheres to the inner wall of the air path. As a result, foreign matter accumulated in the vacuum path of the suction hole for vacuum-sucking the semiconductor element with a simple configuration can be easily removed, and stable suction capability can be exhibited.

Further, in the semiconductor device transfer apparatus of one embodiment,
An operation unit for setting the number of operations or operation time of the rotary table;
A recording unit for recording the number of operations or operation time of the rotary table set by the operation unit;
An operation determining unit that determines whether the actual operation time or the actual operation time of the rotary table is equal to or greater than the operation frequency or the operation time of the rotary table recorded in the recording unit;
When the operation determination unit determines that the actual number of operations or actual operation time of the rotary table is equal to or greater than the number of operations or operation time of the rotary table recorded in the recording unit, The nozzle driver and the dust collector are controlled to clean the suction holes and the air path of the tray.

  According to the above embodiment, when the operation determination unit determines that the actual operation number or actual operation time of the rotary table is equal to or greater than the operation number or operation time of the rotary table recorded in the recording unit, the control unit By controlling the nozzle drive unit and the dust collector and cleaning the suction holes and the air path of the tray, cleaning maintenance is facilitated, and stable suction capability can be reliably maintained.

Further, in the semiconductor device transfer apparatus of one embodiment,
An adsorption capacity detection unit for detecting an adsorption capacity for vacuum adsorption of the semiconductor element by the adsorption hole of the tray;
An adsorption capacity determination unit that determines whether the adsorption capacity of the tray detected by the adsorption capacity detection unit is less than a preset adsorption capacity determination value;
The control unit controls the switching valve and the dust collector when the adsorption capacity determination unit determines that the adsorption capacity of the tray detected by the adsorption capacity detection unit is less than the adsorption capacity determination value. Then, the suction hole and the air path of the tray are cleaned.

  According to the above embodiment, when the suction capacity determination unit determines that the tray suction capacity detected by the suction capacity detection unit is less than the set suction capacity, the control unit controls the switching valve and the dust collector, By cleaning the suction holes and the air path of the tray, it is possible to reliably maintain a stable suction capacity, and to prevent a semiconductor element from being poorly sucked due to a decrease in the suction capacity.

Further, in the semiconductor device transfer apparatus of one embodiment,
The trays arranged in the circumferential direction on the turntable sequentially move to a plurality of work stages as the turntable rotates, and at least one of the work stages is the cleaning stage.

  According to the embodiment, the trays arranged in the circumferential direction on the rotary table sequentially move to the plurality of work stages as the rotary table rotates, and at least one of the plurality of work stages is a cleaning stage. As a result, cleaning can be performed in the middle of the production work process, and it can be resumed from the middle of the production work process after cleaning, thereby improving productivity.

  As is clear from the above, according to the present invention, a semiconductor that can easily remove foreign matters accumulated in the vacuum path of the suction hole for vacuum-sucking the semiconductor element with a simple configuration and can exhibit stable suction capability. An element transfer device can be realized.

FIG. 1A is a schematic configuration diagram of a transport device with a cleaning function according to an embodiment of the present invention. FIG. 1B is a detailed view of the rotary table of the transport device with the cleaning function. FIG. 2 is a diagram showing a configuration of a control block of the transport device with a cleaning function. FIG. 3A is a perspective view of a tray of the transport device with a cleaning function of the embodiment. FIG. 3B is a cross-sectional view of the tray. FIG. 4A is a perspective view showing a state before the dust collection nozzle is mounted on the tray. FIG. 4B is a perspective view showing a state where a dust collecting nozzle is mounted on the tray. FIG. 4C is a cross-sectional view showing a state where the tray and the dust collecting nozzle are mounted. FIG. 5A is a structural diagram when the port A of the air path switching valve of the transport apparatus with a cleaning function of the above embodiment is connected to the port D. FIG. 5B is a structural diagram when port B of the air path switching valve is connected to port D. FIG. 5C is a structural diagram when port C of the air path switching valve is connected to port D. FIG. 6 is an air connection diagram of the transport device with a cleaning function according to the embodiment. FIG. 7A is a diagram showing a holding state of a semiconductor element by a chucking method of a conventional semiconductor element transfer apparatus. FIG. 7B is a diagram showing a state where the semiconductor element is not held by the chucking method.

  Hereinafter, a transport device with a cleaning function as an example of a transport device for a semiconductor element according to an embodiment of the present invention will be described with reference to the drawings. In addition, the conveyance apparatus with a cleaning function shown below is only one embodiment of the conveyance apparatus of the semiconductor element of the present invention, and the conveyance apparatus of the semiconductor element of the present invention is compared with the conveyance apparatus with a cleaning function of the embodiment. It can be realized with various modifications.

  In the following, for the sake of concrete explanation, a transport device with a cleaning function for inspecting a semiconductor element of an SOP (Small Outline Package) will be exemplified, but the transport device with a cleaning function of the present invention is an SOP. Other elements can be transported. It is preferable to use one corresponding to the type of semiconductor element to be transported.

  FIG. 1A shows a schematic configuration diagram of a transport device with a cleaning function according to an embodiment of the present invention, and FIG. 1B shows a detailed view of a rotary table of the transport device with a cleaning function.

  In the transport apparatus with a cleaning function shown in FIG. 1A and FIG. 1B, the respective operations are performed in parallel at each portion of the tray 2 (12 divisions) arranged circumferentially at equal intervals on the circular rotary table 1. After each operation is completed, the turntable 1 rotates by one pitch (rotation angle of 30 degrees in FIG. 1), and the trays 2 arranged in the circumferential direction on the turntable 1 each move to the next as the turntable 1 rotates. Move to work stage.

In FIG. 1A, 36 is a supply unit that receives semiconductor elements from the outside, 37 is a product presence / absence detection unit that detects the presence / absence of semiconductor elements on the tray 2, 38 is a position correction unit that corrects the position of the semiconductor elements on the tray 2, Reference numeral 39 denotes an electrical characteristic inspection unit that makes an electrical characteristic inspection by bringing a probe into contact with an electrode of the semiconductor element, 40 denotes an external appearance inspection unit that performs an external inspection of the semiconductor element, 41 denotes a marking unit that prints on the semiconductor element, 42 Is a mark inspection unit that inspects the printed state of the semiconductor element printed by the marking unit 41, 43 is a classification A unit that classifies A based on the inspection result of the electrical property inspection unit 39, and 44 is based on the inspection result of the electrical property inspection unit A classification B section for performing classification of B, a classification C section for performing classification of C based on an inspection result of the electrical characteristic inspection section, and a cleaning section for cleaning the tray 2. Reference numeral 50 denotes an element supply unit that supplies the semiconductor element to the supply unit 36, 51 denotes a storage unit that stores the semiconductor elements classified by the classification A unit 43, and 52 denotes a semiconductor element classified by the classification B unit 44. A storage unit 53 is a storage unit that stores the semiconductor elements classified by the classification C unit 45. As shown in FIG. 1B, the transfer device with a cleaning function includes a rotary table having a rotary shaft 1a (shown in FIG. 2). 1, 12 trays 2 arranged on the surface of the rotary table 1, 12 air path switching valves 3 as an example of a switching valve for switching the air path (air path) of each tray 2, and negative pressure (Vacuum) / air supply valve 4 for supplying high pressure. Further, a pressure sensor 5 as an example of an adsorption capacity detection unit is connected to the air path switching valve 3 of each tray 2.

  1A and 1B has a structure in which the semiconductor element 20 is horizontally transported and the semiconductor element 20 is supplied to the tray 2 from above, but the semiconductor element is not necessarily from above. Instead of a structure for supplying the air, a suspension type (180 degree rotation) or a vertical conveyance (90 degree rotation) may be used. Further, the transport direction is not necessarily the rotation direction, and may be a transport direction such as a horizontal direction or a vertical (up and down) direction.

  FIG. 2 shows the configuration of the control block of the conveying device with a cleaning function. As shown in FIG. 2, the transport device with a cleaning function includes a rotary table drive unit 11 that drives the rotary shaft 1 a of the rotary table 1, an operation unit 12 that receives an operator's operation, and a notification that notifies the worker. The unit 13, the recording unit 14 that records data necessary for the operation of the transport device with a cleaning function, the operation determination unit 15, the suction capacity determination unit 16, and the operator's instruction input via the operation unit 12 And a controller 10 that controls the overall operation of the transport device with a cleaning function.

  The control unit 10 controls the air path switching valve 3 to connect the vacuum source 61 (shown in FIG. 6) to the air path 24 (shown in FIG. 3B) of the tray 2 when the semiconductor element 20 is transported. Alternatively, the mode is switched to the second mode in which the high pressure source 62 (shown in FIG. 6) is connected to the air path 24 of the tray 2.

  In the above transport device with a cleaning function, if cleaning is neglected or the foreign material is accumulated for a long period of time with the foreign matter accumulated, the foreign matter will block the suction holes 21 and the air path 24 (shown in FIG. 3B) of the tray 2, It becomes necessary to remove the resin powder. For this reason, it is necessary to determine the cleaning period and perform cleaning periodically.

<Operation in cleaning mode>
Based on the operator's instruction input via the operation unit 12, the control unit 10 shifts to the cleaning mode, and all the semiconductor elements 20 on the turntable 1 are classified into a class A unit 43, a class B unit 44, and a class C unit. To 45.

  Then, after discharging the semiconductor element 20, the dust collection nozzle 25 (shown in FIGS. 4A and 4B) of the cleaning unit 33 is lowered and the dust collection nozzle 25 is set on the tray 2.

  Next, the dust collector 34 is turned on to start collecting dust. Then, the air path switching valve 3 is switched from negative pressure (vacuum) to high pressure, the high pressure side electromagnetic valve (not shown) of the air supply valve 4 is turned on, and the air path 24 of the suction hole 21 of the tray 2 is pressurized. Blow air. At this time, the high-pressure air may be supplied continuously or intermittently.

  Next, after cleaning the tray 2, the solenoid valve on the high pressure side of the air supply valve 4 is turned off and the dust collecting nozzle 25 is raised, then the rotary shaft 1 a of the rotary table 1 is operated, and the rotary table 1 is set to 1 The pitch is fed and the next tray 2 is cleaned. In this way, in order to clean the tray 2 one by one, all the trays 2 are cleaned in a similar manner from the setting of the dust collection nozzle 25 on the tray 2.

<Automatic operation>
First, the number of operations (or operation time) of the rotary table 1 is set based on the operator's instruction input via the operation unit 12. Then, the set number of operations (or operation time) of the rotary table 1 is recorded in the recording unit 14.

  Next, when the operation determination unit 15 determines that the actual number of operations (or actual operation time) of the turntable 1 is equal to or greater than the number of operations (or operation time) of the turntable 1 recorded in the recording unit 14, the control is performed. The unit 10 shifts to the cleaning mode, cleans the tray 2, and automatically resumes production after the cleaning is completed.

<Monitoring adsorption capacity>
In the production work process, when each tray 2 vacuum-sucks and transports the semiconductor element 20, the suction capacity is monitored by the pressure sensor 5 connected to the air path switching valve 3 of each tray 2. That is, if the suction capacity determination unit 16 determines that the pressure of the air path connected to the air path switching valve 3 detected by the pressure sensor 5 is less than a preset pressure determination value, the suction capacity decreases. As a result, the control unit 10 shifts to the cleaning mode and cleans the tray 2.

  FIG. 3A shows a perspective view of the tray of the transport apparatus with a cleaning function of the embodiment, and FIG. 3B shows a cross-sectional view of the tray.

  In FIG. 3A and FIG. 3B, the four semiconductor elements 20 are positioned in the pockets (digging) 22 in the tray 2 that simultaneously processes the four semiconductor elements 20, and the negative pressure ( It is sucked in the suction hole 21 by a vacuum).

  3A and 3B are examples, and the number of semiconductor elements is not necessarily four, and one to a plurality of semiconductor elements can be vacuum-sucked on one tray.

  The same applies to the pocket (digging) 22 for positioning the semiconductor element 20, and it is not always necessary, and the suction surface of the tray may be flat.

  4A shows a state before the dust collection nozzle 25 is mounted on the tray 2, FIG. 4B shows a state where the dust collection nozzle 25 is mounted on the tray 2, and FIG. 4C shows the tray 2 and the dust collection nozzle. Sectional drawing of the state to which the nozzle 25 for an attachment was mounted | worn is shown.

  As shown in FIGS. 4A and 4B, the cleaning unit 33 (shown in FIGS. 1A and 1B) includes a dust collection nozzle 25 that collects foreign matter and a nozzle drive unit that sets the dust collection nozzle 25 on the tray 2. And a nozzle cylinder 9 as an example. Foreign matter sucked from the dust collecting nozzle 25 is collected by a dust collector 34 (shown in FIG. 4C).

  As shown in FIG. 4A, the dust collecting nozzle 25 normally stands by on the upper side of the tray 2, and as shown in FIG. 4B, the piston 9a of the nozzle cylinder 9 descends and is provided at the lower end of the piston 9a. The tip of the dust collection nozzle 25 of the dust collection duct 26 is connected to the suction hole 21 of the tray 2.

  Then, as shown in FIG. 4C, high pressure from the high pressure source 62 (shown in FIG. 6) is blown into the tray 2 through the pipe 23 while collecting dust through the dust collection duct 26 by the dust collector 34. By doing so, the foreign matter 6 accumulated in the air path 24 is blown off and removed, and the removed foreign matter 7 is sucked into the dust collector 34 via the dust collection nozzle 25, the dust collection duct 26, and the pipe 27. Thereby, the tray 2 is cleaned.

  Next, after the cleaning of the tray 2 is completed, the blowing of air from the high pressure source 62 (shown in FIG. 6) and the collection of dust by the dust collector 34 are stopped, and the piston 9a of the nozzle cylinder 9 is raised to raise the dust collecting nozzle. Raise 25.

  FIG. 5A shows a structural diagram when the port A of the air path switching valve 3 of the transport device with the cleaning function is connected to the port D (tray 2 side), and FIG. 5B shows the port B of the air path switching valve 3 connected to the port D. FIG. 5C shows a structural diagram when the port C of the air path switching valve 3 is connected to a port D (tray 2 side).

  As shown in FIG. 5A, the air path switching valve 3 is arranged in a cylindrical housing 30, a spool 31 slidably accommodated in the housing 30, and the housing 30, and the spool 31 is attached to one side. It has a spring 32 to be energized and a switching valve cylinder 8. A rod 31 a partially protruding from the housing 30 is provided at one end of the spool 31 opposite to the spring 32.

  5A, the vacuum source 61 (shown in FIG. 6) is connected to the port A, the port B is not connected to the atmosphere, the high pressure source 62 (shown in FIG. 6) is connected to the port C, and the port D is connected. The tray 2 is connected via the pipe 23. Further, the piston 8a of the switching valve cylinder 8 is immersed in the switching valve cylinder 8, and is located away from the rod 31a of the air path switching valve 3.

  In the normal state shown in FIG. 5A, the spool 31 is in a negative pressure (vacuum) position due to the force of the spring 32 in the air path switching valve 3, and the negative pressure (vacuum) / atmosphere is depending on the amount of pushing of the rod 31a. Switch between three positions: open and high.

  In the negative pressure (vacuum) position of FIG. 5A, the port A and the port D communicate with each other, and the negative pressure (vacuum) from the vacuum source 61 is supplied to the tray 2 via the port A and the port D.

  5B, the piston 8a of the switching valve cylinder 8 is protruded and the rod 31a of the air path switching valve 3 is pushed to a predetermined intermediate position, so that the port B and the port D communicate with each other, and the tray The second air path 24 is open to the atmosphere.

  In the high pressure position of FIG. 5C, the piston 8a of the switching valve cylinder 8 is further protruded, and the rod 31a of the air path switching valve 3 is pushed to a predetermined high pressure position, so that the ports C and D communicate with each other. The high pressure from the source 62 is supplied to the tray 2 via the port A and the port D.

  Moreover, FIG. 6 has shown the air connection figure of the conveying apparatus with a cleaning function of the said embodiment.

  As shown in FIG. 6, the transport device with a cleaning function includes a vacuum source 61 and a high-pressure source 62. The vacuum source 61 is connected to the port A of each air path switching valve 3 via a filter 5a. The pressure sensor 5 is connected to the vacuum source 61 side of the filter 5a. The high pressure source 62 is connected to the port C of the air path switching valve 3, and the port B of each air path switching valve 3 is not connected. Each port D of each air path switching valve 3 is connected to the tray 2.

  According to the conveying device with a cleaning function having the above-described configuration, the control unit 10 controls the air path switching valve 3, the nozzle cylinder 9, and the dust collector 34, so that the air path switching valve with respect to the tray 2 positioned on the cleaning stage. 3 is switched to the second mode in which the high pressure source 62 is connected to the air path 24 of the tray 2, and the dust collecting nozzle 25 is connected to the suction hole 21 of the tray 2 by the nozzle cylinder 9. By doing so, the high-pressure air from the high-pressure source 62 blows off the foreign matter in the suction hole 21 and collects the dust in the dust collector 34 through the dust collection nozzle 25, so that the suction hole 21 and the air path 24 of the tray 2 are collected. Clean. Resin powder, resin, or the like that enters the air path 24 of the tray 2 can be easily removed by high-pressure air because the adhesive force is weak even if it adheres to the inner wall of the air path 24. Thereby, the foreign matter accumulated in the suction hole 21 and the air path 24 for vacuum-sucking the semiconductor element 20 can be easily removed, and a stable suction capability can be exhibited.

  When the operation determination unit 15 determines that the actual operation number or actual operation time of the rotary table 1 is equal to or greater than the operation number or operation time of the rotary table 1 recorded in the recording unit, the control unit 10 By cleaning the suction hole 21 and the air path 24 of the tray 2 by controlling the path switching valve 3, the nozzle cylinder 9 and the dust collector 34, cleaning maintenance is facilitated, and stable suction capacity is reliably maintained. Can do.

  Further, when the adsorption capacity determination unit 16 determines that the pressure of the air path connected to the air path switching valve 3 detected by the pressure sensor 5 is less than a preset pressure determination value, the control unit 10 Can control the air path switching valve 3 and the dust collector 34 to clean the suction hole 21 and the air path 24 of the tray 2 so that the stable suction capacity can be reliably maintained, and the semiconductor due to the decrease in the suction capacity. Adsorption failure of the element 20 can be prevented in advance.

  The trays 2 arranged in the circumferential direction on the rotary table 1 sequentially move to a plurality of work stages as the rotary table 1 rotates, and at least one of the plurality of work stages is a cleaning stage. Thus, the cleaning can be performed in the middle of the production work process, and the cleaning can be resumed from the middle of the production work process after the cleaning, thereby improving the productivity.

  According to the semiconductor device transfer apparatus of the present invention, the vacuum suction force can be stabilized, and the production facility can be stably operated.

  Although specific embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and various modifications can be made within the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Rotary table 1a ... Rotating shaft 2 ... Tray 3 ... Air path switching valve 4 ... Air supply valve (negative pressure (vacuum) / high pressure supply valve)
DESCRIPTION OF SYMBOLS 5 ... Pressure sensor 5a ... Filter 6 ... Accumulated foreign matter 7 ... Removed foreign matter 8 ... Switch valve cylinder 8a ... Piston 9 ... Nozzle cylinder 10 ... Control part 11 ... Rotary table drive part 12 ... Operation part 13 ... Information Section 14 ... Recording section 15 ... Operation determination section 16 ... Suction capacity determination section 20 ... Semiconductor element 21 ... Suction hole 22 ... Pocket (digging)
DESCRIPTION OF SYMBOLS 23 ... Piping 24 ... Air path 25 ... Dust collection nozzle 26 ... Dust collection duct 30 ... Housing 31 ... Spool 31a ... Rod 32 ... Spring 33 ... Cleaning part 34 ... Dust collector 36 ... Supply part 37 ... Product presence detection part 38 ... Position Correction section 39 ... Electrical characteristic inspection section 40 ... Appearance inspection section 41 ... Marking section 42 ... Mark inspection section 43 ... Classification A section 44 ... Classification B section 45 ... Classification C section 51, 52, 53 ... Storage section 61 ... Vacuum source 62 ... High pressure source 115 ... Fixed plate 116 ... Movable plate 117 ... Spring 118 ... Bearing 119 ... Pusher A ... Port (tray side)
B ... Port (Vacuum pressure supply)
C ... Port (standby open)
D ... Port (positive pressure supply)

Claims (4)

A rotary table for transporting semiconductor elements by vacuum suction;
A tray disposed in the circumferential direction on the rotary table and having a suction hole for vacuum-sucking the semiconductor element;
A vacuum source for creating a negative pressure or vacuum in the air path of the suction hole of the tray;
A high pressure source for increasing the pressure in the air path of the suction hole of the tray;
At least one of a first mode in which the vacuum source is connected to the air path of the suction hole of the tray during transport of the semiconductor element, and a second mode in which the high pressure source is connected to the air path of the suction hole. A switching valve to switch to
In a cleaning stage for cleaning the suction hole of the tray, a dust collecting nozzle connected to the suction hole of the tray;
A nozzle driver for connecting the dust collection nozzle to the suction hole of the tray;
A dust collector that collects foreign matter in the suction hole via the dust collection nozzle;
The rotary table, the switching valve, the nozzle drive unit, and a control unit for controlling the dust collector,
The control unit controls the switching valve, the nozzle driving unit, and the dust collector, and the high pressure is applied to the air path of the suction hole of the tray by the switching valve with respect to the tray positioned on the cleaning stage. Switch to the second mode for connecting the source, connect the dust collecting nozzle to the suction hole of the tray by the nozzle driving unit, and blow the blow-off air with the high-pressure air from the high-pressure source. A semiconductor device transport apparatus, wherein the foreign material in the air path is collected by the dust collector through the dust collecting nozzle, thereby cleaning the suction holes and the air path of the tray. In the conveyance apparatus of the semiconductor element of Claim 1,
An operation unit for setting the number of operations or operation time of the rotary table;
A recording unit for recording the number of operations or operation time of the rotary table set by the operation unit;
An operation determining unit that determines whether the actual operation time or the actual operation time of the rotary table is equal to or greater than the operation frequency or the operation time of the rotary table recorded in the recording unit;
When the operation determination unit determines that the actual number of operations or actual operation time of the rotary table is equal to or greater than the number of operations or operation time of the rotary table recorded in the recording unit, A transport device for a semiconductor element, wherein the nozzle drive unit and the dust collector are controlled to clean the suction hole and the air path of the tray. In the conveyance device of the semiconductor element according to claim 1 or 2,
An adsorption capacity detection unit for detecting an adsorption capacity for vacuum adsorption of the semiconductor element by the adsorption hole of the tray;
An adsorption capacity determination unit that determines whether the adsorption capacity of the tray detected by the adsorption capacity detection unit is less than a preset adsorption capacity determination value;
The control unit controls the switching valve and the dust collector when the adsorption capacity determination unit determines that the adsorption capacity of the tray detected by the adsorption capacity detection unit is less than the adsorption capacity determination value. A semiconductor element transfer apparatus for cleaning the suction hole and the air path of the tray. In the conveyance device of the semiconductor element according to any one of claims 1 to 3,
The trays arranged in the circumferential direction on the turntable sequentially move to a plurality of work stages as the turntable rotates, and at least one of the plurality of work stages is the cleaning stage. A semiconductor device transport apparatus.

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