JP6690458B2 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP6690458B2 JP6690458B2 JP2016153975A JP2016153975A JP6690458B2 JP 6690458 B2 JP6690458 B2 JP 6690458B2 JP 2016153975 A JP2016153975 A JP 2016153975A JP 2016153975 A JP2016153975 A JP 2016153975A JP 6690458 B2 JP6690458 B2 JP 6690458B2
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- semiconductor module
- region
- cooler
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004065 semiconductor Substances 0.000 title claims description 97
- 239000000945 filler Substances 0.000 claims description 50
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 9
- 239000004519 grease Substances 0.000 description 13
- 239000003507 refrigerant Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 125000006850 spacer group Chemical group 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 239000002826 coolant Substances 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
3…冷却器
4a…冷媒供給管
4b…冷媒排出管
5a、5b…連結パイプ
6…伝熱板
7a…電極端子
10…半導体モジュール
10a、10b…平坦面
14…スペーサ
16a、16b、16c、16d、17a、17b、17c、17d…放熱板
18…樹脂
29…制御端子
31…ケース
32…板バネ
36…フィン
61…第1領域
62…第2領域
Da、Db…ダイオード
FI…伝熱フィラー
Ta、Tb…トランジスタ
Claims (1)
- 半導体素子を封止した半導体モジュールと、冷却器と、が積層されているとともに積層方向に荷重されている半導体装置であって、
前記半導体モジュールは、積層方向に沿って前記半導体素子に対向する放熱板を有し、
前記半導体モジュールと前記冷却器との間に伝熱板が挟まれており、
前記伝熱板は、
細長い複数の伝熱フィラーがその長手方向を特定方向に向けて分布しており前記特定方向の熱伝導率が他の方向の熱伝導率より高い異方性を有する異方性材料で作られており、
前記放熱板に対向する範囲内に設けられ、前記長手方向が前記積層方向に沿っているとともに、前記伝熱板の前記積層方向における両面で露出している第1領域と、
前記第1領域の周囲に設けられ、前記長手方向が前記積層方向と交差する方向に沿っている第2領域と、を有しており、
前記第1領域の前記積層方向における一方の面が前記放熱板と当接しており、前記第1領域の前記積層方向における他方の面が前記冷却器と当接している、半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016153975A JP6690458B2 (ja) | 2016-08-04 | 2016-08-04 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016153975A JP6690458B2 (ja) | 2016-08-04 | 2016-08-04 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018022799A JP2018022799A (ja) | 2018-02-08 |
JP6690458B2 true JP6690458B2 (ja) | 2020-04-28 |
Family
ID=61165802
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016153975A Expired - Fee Related JP6690458B2 (ja) | 2016-08-04 | 2016-08-04 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6690458B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112193055B (zh) * | 2020-10-13 | 2021-09-21 | 西安电子科技大学芜湖研究院 | 一种高效散热的汽车热管理系统 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITVI20130077A1 (it) * | 2013-03-20 | 2014-09-21 | St Microelectronics Srl | Un materiale riempitivo a base di grafene con una elevata conducibilita' termica per il collegamento di chips in dispositivi a microstruttura |
US9700968B2 (en) * | 2013-12-26 | 2017-07-11 | Terrella Energy Systems Ltd. | Apparatus and methods for processing exfoliated graphite materials |
JP6233257B2 (ja) * | 2014-04-15 | 2017-11-22 | トヨタ自動車株式会社 | 電力変換器 |
JP2016054223A (ja) * | 2014-09-03 | 2016-04-14 | トヨタ自動車株式会社 | 半導体装置 |
-
2016
- 2016-08-04 JP JP2016153975A patent/JP6690458B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2018022799A (ja) | 2018-02-08 |
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