JP6689696B2 - Package and piezoelectric device - Google Patents

Description

  The present invention relates to a package on which a piezoelectric vibrating piece is placed, and a piezoelectric device having the package.

  The piezoelectric device is formed, for example, by mounting a piezoelectric vibrating piece in a cavity of a ceramic package and sealing the cavity with a lid. For example, Patent Document 1 discloses various bonding methods of a package and a lid. As an example of a method of joining the package and the lid, for example, there is a method of joining the lid to a joining surface formed around the cavity of the package via solder. In this case, a metal film having high solder wettability is formed on the joint surface of the package, so that the package and the solder are joined.

JP 2004-104766 A

  However, although Patent Document 1 discloses that solder or the like is formed on the entire bonding surface, when the outer shape of the lid is smaller than the outer shape of the package, the area on the bonding surface that is not significantly related to the bonding is also affected. Since solder is formed, the amount of solder required for joining the package and the lid is reduced, and the airtight guarantee of the piezoelectric device may be deteriorated.

  Therefore, it is an object of the present invention to provide a package and a piezoelectric device in which deterioration of airtightness is prevented.

  The package according to the first aspect has a cavity in which the piezoelectric vibrating piece is placed, and the cavity is formed of a ceramic in which the cavity is sealed by solder with a rectangular lid having a curved outer circumference. It is a package. The package has a rectangular outer shape of the joint surface around the cavity where the lid is joined, the gold metallization pattern for soldering is formed on the joint surface, and the corners of the gold metallization pattern are the corners of the lid. It is formed in the same shape as the part.

  In the package according to the second aspect, in the first aspect, the outer peripheral shape of the gold metallized pattern is larger than the outer peripheral shape of the lid and is formed in the same shape as the outer peripheral shape of the lid.

  In the package according to the third aspect, in the first aspect, the outer peripheral shape at the center of the long side of the bonding surface of the gold metallized pattern is recessed toward the cavity at the center of the long side of the bonding surface.

  In the package according to the fourth aspect, in the first to third aspects, in the central portion of the long side of the bonding surface, the inner peripheral shape at the central portion of the long side of the bonding surface of the gold metallized pattern is the outer peripheral side of the gold metallized pattern. It is recessed in.

  In the package according to the fifth aspect, in the first aspect and the second aspect, the gold metallized pattern is formed on the first pattern including the outer peripheral shape of the gold metallized pattern and on the inner peripheral side of the first pattern away from the first pattern. And a second pattern.

  A piezoelectric device according to a sixth aspect includes a package according to the first to fifth aspects, a piezoelectric vibrating piece, and a lid.

  In the piezoelectric device according to a seventh aspect, in the sixth aspect, the lid includes a base material and a plating layer formed on the surface of the base material. The surface to be joined to the package is formed in contact with the outermost periphery of the surface and is formed in a ring shape so as to surround the periphery of the surface, and is formed in contact with the first region to which the solder is joined and the inner peripheral side of the first region. And a second region that has been subjected to a modification treatment in which the plating layer has been removed or the adhesiveness of the solder has deteriorated is formed, and the outer periphery of the second region is recessed toward the inner peripheral side at the corner of the base material. Be done

  A piezoelectric device according to an eighth aspect is the piezoelectric device according to the seventh aspect, wherein the plating layer is formed by a nickel plating layer and a gold plating layer formed on the surface of the nickel plating layer, and the gold plating layer is removed in the second region to perform nickel plating. The layer is exposed.

  According to the package and the piezoelectric device of the present invention, it is possible to prevent deterioration of airtightness guarantee.

3 is a perspective view of the piezoelectric device 100. FIG. FIG. 6A is a perspective view of the package 110. FIG. 3B is a top view of the package 110 on which the piezoelectric vibrating piece 140 is placed. It is a top view of a ceramic sheet C110 in which a plurality of packages 110 are formed. FIG. 7A is a sectional view of the lid 120. FIG. 7B is a plan view of the lid 120. 6 is a flowchart showing a method for manufacturing the lid 120 and the piezoelectric vibrator 100. (A) is a cross-sectional view of the lid 120 in which a part of the gold plating layer 123 is laser-trimmed. FIG. 6B is a cross-sectional view of the lid 120 on which the solder ring 131 is placed. (C) is a cross-sectional view of the lid 120 to which the solder 130 is joined. FIG. 3D is a sectional view of the package 110 on which the lid 120 is placed. 3A is a top view of the piezoelectric device 100. FIG. FIG. 7B is a sectional view taken along line BB of FIG. FIG. 7C is a sectional view taken along line CC of FIG. 7A is a top view of the package 210. FIG. FIG. 6B is a partial side view of the package 210 on which the lid 120 is placed. FIG. 6C is a partial side view of the package 210 on which the lid 120 is placed while the solder 130 is being melted again. FIG. 3D is a partial side view of the piezoelectric device 200. 9A is a top view of the package 310. FIG. FIG. 7B is a top view of the package 410. FIG. 3C is a schematic partial cross-sectional view of the piezoelectric device 400. FIG. 7A is a plan view of the lid 220. FIG. 7B is a plan view of the lid 320. 7A is a plan view of the lid 420. FIG. (B) is a side view of the lid 420 to which the solder 130 is joined. (C) is a side view of the package 110 on which the lid 420 to which the solder 130 is joined is placed. FIG. 7A is a plan view of the lid 520. (B) is a cross-sectional view of the lid 520 having the solder 130 formed on the surface.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the scope of the present invention is not limited to these forms unless otherwise specified in the following description.

(First embodiment)
<Structure of Piezoelectric Device 100>
FIG. 1 is a perspective view of the piezoelectric device 100. The piezoelectric device 100 mainly includes a piezoelectric vibrating piece 140 (see FIG. 2B) that vibrates at a predetermined frequency and a package in which the piezoelectric vibrating piece 140 is placed in the cavity 113 (see FIG. 2A). 110 and a lid 120 that seals the cavity 113 in which the piezoelectric vibrating piece 140 is placed. The lid 120 is joined to the package 110 via the solder 130. The outer shape of the piezoelectric device 100 is formed into a substantially rectangular parallelepiped shape. In the following description, the X axis extends parallel to the long side of the piezoelectric device 100, the Z axis extends parallel to the short side, and the Y axis extends perpendicular to the X axis and the Z axis.

<Structure of Package 110>
FIG. 2A is a perspective view of the package 110. The package 110 is made of, for example, ceramic. A cavity 113, which is a space for mounting the piezoelectric vibrating piece 140, is formed inside the package 110. The cavity 113 is open to the + Y axis side of the package 110. Further, the periphery of the cavity 113 on the + Y-axis side surface of the package 110 is a bonding surface 115 that is bonded to the lid 120. A gold metallized pattern 112 is formed on the bonding surface 115.

  A pair of mounting terminals 111 are formed on the −Y-axis side surface of the package 110. A pair of wiring electrodes 114 to which the piezoelectric vibrating piece 140 is electrically connected is formed on the bottom surface of the cavity 113. The pair of wiring electrodes 114 are electrically connected to the pair of mounting terminals 111.

  FIG. 2B is a top view of the package 110 on which the piezoelectric vibrating piece 140 is placed. The piezoelectric vibrating piece 140 placed in the cavity 113 of the package 110 is electrically connected to the wiring electrode 114 by the conductive adhesive 132 and is fixed in the cavity 113. The outer shape of the package 110 is formed in a rectangular shape, and the gold metallized pattern 112 formed on the joint surface 115 is not formed on the corner portion 116 of the joint surface 115. The corners of the gold metallized pattern 112 are formed in a curved shape, and the shape of the outer periphery of the gold metallized pattern 112 is substantially similar to the shape of the outer periphery of the lid 120, and is formed larger than the shape of the outer periphery of the lid 120.

  FIG. 3 is a top view of a ceramic sheet C110 having a plurality of packages 110 formed therein. FIG. 3 shows a state in which a plurality of castellations 113, wiring electrodes 114, gold metallized patterns 112, etc. are formed on one ceramic sheet C110. In addition, in FIG. 3, a scribe line 171 indicating a portion where the ceramic sheet C110 is cut is shown, and one package 110 is formed in one region divided by the scribe line 171. As shown in FIG. 3, the packages 110 are formed by forming a plurality of packages 110 on a single ceramic sheet C110 and then cutting the packages 110 by scribe lines 171 to form individual packages 110. Further, since the package 110 is formed by such a forming method, the outer shape of each package 110 in a plan view is formed in a rectangular shape. In the ceramic sheet C110, through holes (not shown) penetrating the ceramic sheet C110 are formed at intersections of scribe lines 171 parallel to the X axis and the Z axis, and castellations (not shown) are formed at four corners of each package 110. May be.

<Structure of lid 120>
FIG. 4A is a cross-sectional view of the lid 120. FIG. 4A corresponds to an AA cross-sectional view of FIG. 4B described later. The lid 120 is mainly formed by a base material 121, a nickel plating layer 122 formed so as to cover the surface of the base material 121, and a gold plating layer 123 formed on the surface of the nickel plating layer 122. There is. The base material 121 is formed of Kovar, which is an alloy of iron, nickel, cobalt, or the like. A second region 125, which is a region where the gold plating layer 123 is removed and the nickel plating layer 122 is exposed, is formed on a part of the −Y-axis side surface of the lid 120. The area on the outer peripheral side of the second area 125 is the first area 124 to which the solder 130 is joined. The inner region of the second region 125 is the third region 126.

  FIG. 4B is a plan view of the lid 120. The lid 120 is formed in a substantially rectangular shape, but the corner portion 127 of the lid 120 is rounded and chamfered. The second region 125 is formed in a ring shape with a substantially constant width at a position distant from the outermost circumference of the lid 120 toward the inner circumference side. Since the first region 124 is formed along the outer periphery of the lid 120 as shown in FIG. 4B, the solder 130 formed in the first region 124 is formed along the outer periphery of the lid 120. It will be.

<Method of Manufacturing Lid 120 and Piezoelectric Device 100>
FIG. 5 is a flowchart showing a method for manufacturing the lid 120 and the piezoelectric device 100. Hereinafter, a method of manufacturing the lid 120 and the piezoelectric device 100 will be described with reference to FIG.

  In step S101, the base material 121 of the lid 120 is prepared. The base material 121 is formed of, for example, Kovar, which is an alloy of iron, nickel, cobalt, or the like, and a substantially rectangular base material 121 is prepared by press-pressing a flat plate formed of Kovar. The base material 121 suppresses the occurrence of burrs and the like due to the press punching process, and also makes it easy to cover the lid end portion with solder even at the corner 127 (makes fillets easy to occur). As shown in, the corner 127 is formed in a curved shape.

  In step S102, the nickel plating layer 122 is formed on the base material 121. In step S102, the base material 121 formed in step S101 is nickel-plated, and the nickel plating layer 122 is formed on the entire surface of the base material 121.

  In step S103, the gold plating layer 123 is formed on the surface of the nickel plating layer 122. In step S103, the gold plating layer 123 is formed on the entire surface of the nickel plating layer 122 formed in step S102.

  In step S104, the gold plating layer 123 is laser-trimmed. Step S104 is a step of irradiating a region corresponding to the second region 125 with laser by laser trimming to remove the gold plating layer 123. In step S104, the gold plating layer 123 is partially laser-trimmed to form the second region 125 and the first region 124 and the third region 126.

  FIG. 6A is a cross-sectional view of the lid 120 in which a part of the gold plating layer 123 is laser trimmed. FIG. 6A shows a cross-sectional view of a portion corresponding to the AA cross section of FIG. 4B. The second region 125 is formed to have a substantially constant width W1 as a whole. In the laser trimming of step S104, the gold plating layer 123 may be removed by laser trimming of the entire portion that is the third region 126 in FIG. 6A, but the laser trimming takes time and the manufacturing cost increases. Therefore, it is desirable that the formation of the second region 125 is performed within the minimum necessary range. That is, it is preferable that the width W1 of the second region 125 is formed to be the minimum in a range in which the solder 130 bonded to the first region 124 does not spread beyond the second region 125.

  The second region 125 has the wettability of the solder 130 lower than that of the first region 124 in which the gold plating layer 124 is formed by removing the gold plating layer 123 by laser trimming. Therefore, the solder 130 bonded to the first region 124 is prevented from spreading to the second region 125. As the formation form of the second region 125, not only the removal of the gold plating layer 123 but also another form can be considered. For example, the gold plating layer 123 is removed, an oxide film is formed on the surface of the nickel plating layer 122 by the heat of the laser, the gold plating layer 123 is not completely removed, and is left in a striped pattern. Alternatively, the surface of the nickel plating layer 122 is roughened by laser trimming, a part of the nickel plating layer 122 or the base material 121 is repelled by a laser and attached to the surface of the gold plating layer 123, and so on. It is also possible to make the wettability of the solder 130 lower than that of the surface of the gold plating layer 123.

  In step S105, the solder 130 is joined to the lid 120. In step S105, first, the solder ring 131 is placed on the lid 120, and the solder ring 131 is melted to bond the solder 130 to the lid 120. The solder 130 is made of, for example, a gold-tin eutectic metal.

  FIG. 6B is a sectional view of the lid 120 on which the solder ring 131 is placed. The solder ring 131 is formed, for example, by press-pressing a flat plate made of solder similarly to the base material 121. The solder ring 131 is formed such that the outer circumference of the solder ring 131 has the same size and shape as the outer circumference of the lid 120, and is placed on the first region 124 of the lid 120 along the outer circumference of the lid 120. The solder ring 131 is formed so that the thickness T1 and the width W2 are substantially constant.

  FIG. 6C is a cross-sectional view of the lid 120 to which the solder 130 is joined. The joining of the solder 130 and the lid 120 is performed by melting the solder ring 131 placed on the lid 120. FIG. 6C shows a state in which the solder 130 is joined to the lid 120 by melting and then solidifying the solder ring 131, and the height of the solder 130 joined to the lid 120 is T2. It is shown.

  In step S106, the lid 120 is placed on the package 110. In step S106, the lid 120 is placed on the gold metallization pattern 112 formed on the bonding surface 115 of the package 110 to seal the cavity 113 of the package 110.

  FIG. 6D is a cross-sectional view of the package 110 on which the lid 120 is placed. The piezoelectric vibrating piece 140 is placed in the cavity 113 of the package 110, and the lid 120 is placed on the cavity 113. The piezoelectric vibrating piece 140 is electrically connected to the wiring electrode 114 by a conductive adhesive 132. The lid 120 is placed so that the solder 130 contacts the gold metallized pattern 112.

  In step S107, the lid 120 and the package 110 are joined. In step S107, the solder 130 is melted again, and the lid 120 and the package 110 are joined to each other via the solder 130. The bonding in step S107 is performed in a vacuum, an inert gas, or the like.

  FIG. 7A is a top view of the piezoelectric device 100. When the solder 130 is melted again in the step S107 from the state of FIG. 6D, the solder 130 spreads so as to cover the surface of the gold metallized pattern 112 formed on the bonding surface 115 of the package 110, and the solder 130 spreads over the outer periphery of the lid 120. The space between the lid 120 and the package 110 is sealed over the whole. Since the solder 130 spreads over the surface of the gold metallized pattern 112, the solder 130 does not spread over the corners 116 of the joint surface 115 where the gold metallized pattern 112 is not formed.

  FIG. 7B is a sectional view taken along line BB of FIG. When the solder 130 is firmly bonded to the lid 120 and the gold metallized pattern 112, a fillet having a shape in which the solder 130 extends like a skirt of a mountain is formed on the solder 130. In FIG. 7B, the fillet 130 a extending from the gold metallization pattern 112 to the side surface of the lid 120 on the outer peripheral side of the piezoelectric device 100 and the surface of the cavity 120 side of the piezoelectric device 100 from the gold metallization pattern 112 to the −Y axis side of the lid 120. A fillet 130b extending to the right is shown. The fillet 130a is formed in a substantially constant shape by forming a width W3 between the outer circumference of the lid 120 and the outer circumference of the gold metallized pattern 112 to be substantially constant over the entire outer circumference of the lid 120, and thus the fillet 130a is formed. The bonding strength between 120 and the package 110 can be made uniform.

  FIG.7 (c) is CC sectional drawing of FIG.7 (a). FIG. 7C shows a partial cross-sectional view including the corners of the piezoelectric device 100. The solder 130 is not formed on the corners 116 of the joint surface 115 where the gold metallized pattern 112 is not formed.

  Since the package 110 is formed in a rectangular shape and the lid 120 is rounded and rounded at the corner, the corner of the joint surface 115 has a width W4 between the outer periphery of the lid 120 and the outer periphery of the joint surface 115. Becomes larger than the width W3. Therefore, when the gold metallized pattern is formed on the entire surface of the bonding surface 115, the solder 130 is also formed on the corners of the bonding surface 115 where the solder 130 does not need to be formed, forming a fillet. In some cases, it may not be possible to secure a sufficient amount of solder. At this time, the bonding between the lid and the package may become insufficient, and the airtightness guarantee of the piezoelectric device may deteriorate.

  In the package 110, by forming the outer shape of the corner of the gold metallized pattern 112 to be the same as the outer shape of the lid 120, it is possible to prevent the solder 130 from being formed in an unnecessary portion and to sufficiently form a fillet. A sufficient amount of solder is secured. Therefore, deterioration of the airtightness guarantee of the piezoelectric device is prevented. Further, the shape of the fillet depends not only on the amount of solder but also on the size of the width between the outer periphery of the lid and the outer periphery of the gold metallized pattern, but in the piezoelectric device 100, substantially the entire outer periphery of the lid 120 is the outer periphery of the lid 120. Since the width is the same between the outer periphery of the gold metallized pattern 112 and the outer periphery of the gold metallized pattern 112, uniform bonding can be performed over the entire outer periphery of the lid 120, and unevenness in the strength of the bonding is prevented.

(Second embodiment)
The gold metallized pattern can be formed in various shapes. Hereinafter, modified examples of the gold metallized pattern will be described.

<Structure of package 210>
FIG. 8A is a top view of the package 210. The package 210 is different from the package 110 only in the shape of the gold metallized pattern, and the other configurations are the same as the package 110. A gold metallized pattern 212 is formed on the bonding surface 115 of the package 210. The gold metallized pattern 212 has a recess 215 in which the inner circumference of the gold metallized pattern 112 on the cavity 113 side is recessed toward the outer peripheral side in the gold metallized pattern 112 of the package 110 at approximately the center of the long side extending in the X-axis direction. . If the region where the depression 215 of the gold metallized pattern 112 is formed is the depression region 216, the width of the gold metallized pattern 212 is formed in the depression region 216 smaller than the width of the other regions.

  FIG. 8B is a partial side view of the package 210 on which the lid 120 is placed. When joining the lid 120 to the package 210, first, the lid 120 is placed on the gold metallized pattern 212. From this state, heat is applied to melt the solder 130 again.

  FIG. 8C is a partial side view of the package 210 on which the lid 120 is placed while the solder 130 is being melted again. The solder 130 spreads over the gold metallization pattern 112 while it is melting again. At this time, since the solder 130 flows particularly in the area where the gold metallization pattern 112 has a large area, the solder 130 on the recessed area 216 flows to both sides of the recessed area 216 where the area of the gold metallized pattern 112 is larger than that of the recessed area 216 ( The arrow 217 in FIG. 8C). As a result, the gap 218 of the solder 130 is temporarily formed on the recessed region 216. When the solder 130 is melted, a gas is generated from the solder 130, but when the gas is sealed in the cavity 113, it may cause a defect such as changing the oscillation frequency of the piezoelectric device. . When the package 210 is used, the gap 218 of the solder 130 is formed in the process of joining the lid 120 and the package 210, so that the gas generated from the solder 130 is eliminated from the inside of the cavity 113 through the gap 218. You can

  FIG. 8D is a partial side view of the piezoelectric device 200. The piezoelectric device 200 is formed by joining the lid 120 to the package 210. FIG. 8D shows a partial side view of the state where the lid 120 is joined to the package 210 and the piezoelectric device 200 is formed. In the piezoelectric device 200, as shown in FIG. 8C, when the solder 130 is melted, the lid 120 is pressed against the package 210 side to close the gap 218 and seal the cavity 113. The fillet 130a is formed, and the lid 120 and the package 210 are joined. As described above, according to the package 210, the gas generated from the solder 130 can be discharged from the inside of the cavity 113 immediately before joining the lid 120 and the package 210, so that the gas is less likely to be accumulated in the cavity 113, which is preferable.

<Structure of Package 310>
FIG. 9A is a top view of the package 310. The package 310 is different from the package 210 only in the gold metallization pattern, and other configurations are the same as the package 210. The gold metallization pattern 312 formed on the package 310 is further formed with a recess 315 on the outer peripheral side of the recess 215 of the gold metallization pattern 212 formed on the package 210. That is, in the gold metallized pattern 312, the recess 215 and the recess 315 are formed so as to face each other, and the region in which the recess 215 and the recess 315 of the gold metallized pattern 312 are formed has a width other than that of the gold metallized pattern 312. The recessed region 316 is formed to be narrower than the above.

  Since the recessed region 316 is formed in the package 310, as in the package 210, a gap of the melted solder 130 is formed in the recessed region 316 in the process of joining the lid 120 to the package 310, and the cavity of the package 310 is formed. The gas generated when the solder 130 is melted can be removed from the 113.

  In the package 210 and the package 310, the recess 215 and the recess 315 are formed at the center of the long side of the package, but they may be formed at the center of the short side of the package, or at the center of both the short side and the long side. May be done.

<Structure of Package 410>
FIG. 9B is a top view of the package 410. The package 410 is different from the package 110 only in the shape of the gold metallization pattern, and the other configurations are the same as the package 110. A gold metallized pattern 412 is formed on the bonding surface 115 of the package 410. The gold metallized pattern 412 is formed of a first pattern 412a formed on the outer peripheral side of the bonding surface 115 and a second pattern 412b formed on the inner peripheral side of the bonding surface 115. The shapes of the outer circumference and the inner circumference of the gold metallized pattern 412 are the same as those of the gold metallized pattern 112. The first pattern 412a and the second pattern 412b are formed apart from each other without making contact with each other.

  FIG. 9C is a schematic partial cross-sectional view of the piezoelectric device 400. The piezoelectric device 400 is formed by joining the lid 120 to the package 410. FIG. 9C is a cross-sectional view including the DD cross section of FIG. 9B. In FIG. 9C, the fillet 130a and the fillet 130b are formed on the inner peripheral side and the outer peripheral side of the solder 130, respectively, and the space 413 in which the solder 130 is not formed is formed between the first pattern 412a and the second pattern 412b. The state is shown. In the piezoelectric device 400, the space 413 can be expected to be formed, the solder 130 filling the space 413 can be expected to be used for forming the fillet 130a and the fillet 130b, and the pressure resistance of the piezoelectric device can be improved. In addition, it is possible to enhance the airtightness guarantee of the piezoelectric device.

(Third Embodiment)
The packages shown in the first embodiment and the second embodiment may be combined with various lids other than the lid 120 to form a piezoelectric device. The lid and the piezoelectric device that can be used in combination with the packages shown in the first and second embodiments will be described below.

<Structure of lid 220>
FIG. 10A is a plan view of the lid 220. The outer shape of the lid 220 is the same as that of the lid 120 (see FIG. 4B), and the nickel plating layer 122 and the gold plating layer 123 are formed on the surface of the base material 121 like the lid 120. It is formed by. The surface of the lid 220 on the −Y axis side is a region in which the first region 224 to which the solder 130 is joined and the gold plating layer 123 are removed and the nickel plating layer 122 is exposed. A second region 225 formed in a ring shape with a substantially constant width and a third region 226 formed on the inner peripheral side of the second region 225 are formed at positions distant from each other. The shape of the second region of the lid 220 is different from that of the lid 120, and accordingly, the shapes of the first region and the second region are also different. In FIG. 10A, a portion having a constant width from the outer circumference to the inner circumference of the lid 220 is shown by a dotted line 227. The second region 225 is formed such that the outer periphery 225 a of the second region 225 is along the dotted line 227 in the region along the long side and the short side of the lid 220, but is inside the dotted line 227 at the corner of the lid 220. It is formed to be recessed on the circumferential side. The second region 225 at the corner of the lid 220 is formed so as to linearly block the center of the lid 220 and the corner on the outer peripheral side, that is, the second region 225 has a chamfered corner. There is. Therefore, the first region 224 at the corner portion of the lid 220 is formed wider than the region formed along the long side and the short side of the lid 220, and the dotted line 227 and the outer periphery of the second region 225 are formed. The area is formed to be wide only by the region 224a surrounded by 225a.

  When the solder 130 is formed on the lid (see S105 in FIG. 5), even if the first region is formed so as to have the same width over the entire lid, the solder 130 is not formed at the corners of the lid due to the influence of the surface tension. Collectively, the height of the solder 130 at the corner of the lid may be higher than the height of the solder 130 in the region along the short side and the long side of the lid. That is, the height T2 (see FIG. 6C) of the solder 130 bonded to the lid is not constant, and the height T2 at the corner of the lid is in a region along the short side and the long side of the lid 130. May be higher than the height T2. When the lid is placed on the package in this state (see FIG. 6D), the contact area between the solder 130 and the gold metallized pattern is biased, and the solder 130 is not melted when the lid and the package are joined. There is a possibility that leakage occurs in the piezoelectric device due to non-uniformity and insufficient bonding between the lid and the package.

  In the lid 220, as shown in FIG. 10A, the width of the first region 224 at the corner of the lid 220 is formed wider than the width of the first region 224 along the short side and the long side of the lid 220. As a result, the solder 130 gathered at the corners of the lid 220 is dispersed, and the height T2 of the solder 130 bonded to the lid 220 can be made uniform. As a result, when the lid 120 is placed on the package 110 (see FIG. 6D), the area of the solder 130 bonded to the lid 120 in contact with the gold metallization pattern 112 is widened and the solder 130 and the gold metallization are formed. The unevenness of the contact area with the pattern 112 is eliminated, the solder 130 is evenly melted when the lid and the package are joined, the joining of the lid and the package is uniform, and leakage occurs in the piezoelectric device. Can be prevented.

<Structure of lid 320>
FIG. 10B is a plan view of the lid 320. The lid 320 has a first region 324 joined to the solder 130, a second region 325 in which the gold plating layer 123 is removed, and a third region 326 formed on the inner peripheral side of the second region 325. is doing. In the lid 320, the shape of the second region 225 at the corner of the lid 220 is different from that of the lid 220, and the outer periphery 225a of the second region 225 is formed in a fan-shaped recess inside the lid 220. As a result, like the lid 220, the corners of the first region 324 are formed wider than the regions along the short sides and the long sides of the first region 324, and the corners of the lid 320 are separated from the dotted line 227 and the first line 227. The first region 324 is formed wider by the area of the portion 324a surrounded by the outer periphery 325a of the second region 325. As a result, as in the case where the lid 220 is used, the height T2 of the solder 130 formed on the lid 320 has a substantially constant value like the lid 220, and the entire solder 130 is easily melted. It is possible to prevent leakage from occurring in the piezoelectric device.

<Structure of lid 420>
FIG. 11A is a plan view of the lid 420. The lid 420 has a first region 424 to which the solder 130 is joined, a second region 425 from which the gold plating layer 123 has been removed, and a third region 426 formed on the inner peripheral side of the second region 425. . In the lid 220 (see FIG. 10A), the second region 425 formed in the lid 420 projects from the outer periphery 225a of the second region 225 toward the outer periphery of the lid 220 from the center of the long side of the second region 225. It is formed by forming the protrusion 428. The lid 420 has the same structure as the lid 220 except for the protrusion 428.

  The protruding portion 428 is formed by the region of the width W5 of the second region 425 protruding to the outer peripheral side of the lid 420. When the width of the region along the long side of the first region 424 is W6 and the width of the first region 424 of the portion where the protrusion 428 is projected is W7, the width W7 is narrower than the width W6 and is larger than the width W7. Is formed so that the value does not become zero. In FIG. 11A, the region having the width W7 of the first region 424 is shown as the protrusion region 424a.

  FIG. 11B is a side view of the lid 420 to which the solder 130 is joined. In FIG. 11B, the base material 121, the nickel plating layer 122, and the gold plating layer 123 are indicated by dotted lines. Further, the position of the protruding region 424a is shown by a dotted line. Although the solder 130 is formed to have a substantially constant height as a whole, the solder 130 on the protrusion region 424a is pulled to both sides of the protrusion region 424a due to the narrow width of the first region 424 in the protrusion region 424a. A recess 429 is formed on the surface of 130.

  FIG. 11C is a side view of the package 110 on which the lid 420 to which the solder 130 is joined is placed. In step S106 of FIG. 5, the lid 420 to which the solder 130 is bonded is placed on the gold metallized pattern 112 of the bonding surface 115 of the package 110, but the solder 130 is bonded to the gold metallized pattern 112 in the region where the recess 429 is formed. Do not touch.

  When the solder 130 is melted and the lid 420 and the package 110 are bonded to each other, gas is generated from the solder 130, but this gas may adversely affect the vibration of the piezoelectric vibrating piece 140. When the lid 420 is joined to the package 110, the solder 130 is not in contact with the gold metallization pattern 112 in the recess 429, so that the melting of the solder 130 in this portion is delayed, and the solder 130 is removed from the gap formed by the recess 429. The generated gas can be released, which prevents the vibration of the piezoelectric vibrating piece 140 from being adversely affected.

  In the lid 420, the protrusion 428 is formed at the center of the second region 425 along the long side of the lid 420, but it may be formed at the center of the short side of the second region 425. It may be formed in the center of both. Further, when the lid 420 is used together with the package 210, the gap of the solder 130 is easily formed, so that the width W7 of the protruding region 424a can be made wider, and the piezoelectric device can be formed in a state in which the hermetic guarantee is stronger. You can

<Structure of lid 520>
FIG. 12A is a plan view of the lid 520. The lid 520 is formed by changing only the configuration of the first region in the lid 120 (see FIG. 4B). The lid 520 has a first region 524, a second region 125, and a third region 126 formed on the inner peripheral side of the second region 125. The first region 524 has a first pattern 524a formed on the outermost periphery of the lid 520 and a second pattern 524b formed on the innermost periphery of the first region 524. In addition, a third pattern 524c is formed so as to block between the first pattern 524a and the second pattern 524b. The gold plating layer 123 is formed on the surfaces of the first pattern 524a and the second pattern 524b, and the nickel plating layer 122 is formed on the surface of the third pattern 524c. In the third pattern 524c, similarly to the second region 125, the gold plating layer 123 on the surface is deleted.

  FIG. 12B is a cross-sectional view of the lid 520 having the solder 130 formed on the surface. FIG. 12B includes the EE cross section of FIG. In the lid 520, when the solder 130 is formed on the first region 524 in step S105 of FIG. 5, the solder 130 is formed on the first pattern 524a and the second pattern 524b, but the third pattern 524c is formed. The solder 130 is not formed on the surface. Therefore, a space 513 surrounded by the solder 130 is formed on the third pattern 524c.

  When the lid 520 is used, the space 513 is formed similarly to the package 410 of FIG. 9B, so that the solder 130 filling the space 513 can be used to form the fillets 130a and 130b. Since it is possible to improve the pressure resistance of the piezoelectric device, it is possible to increase the airtightness guarantee of the piezoelectric device. Further, when the lid 520 is used for the package 410, this effect can be exerted more strongly.

  Further, the shape of the first region of the lid may be formed in the same shape as the shape of the gold metallized pattern of the package 210 and the package 310 and used together with the package 210 and the package 310. Thereby, the effects described in the package 210 and the package 310 can be exerted more strongly.

  Although the optimum embodiment of the present invention has been described in detail above, it will be apparent to those skilled in the art that the present invention can be carried out by making various changes and modifications to the embodiment within the technical scope thereof.

  For example, a material other than Kovar may be used for the base material, and solder other than gold-tin alloy may be used for solder. Further, although the plating layer formed on the base material is an example formed by two layers of a nickel plating layer and a gold plating layer, another layer may be further added to form three or more layers, or It may be only one layer.

  Further, the above embodiments may be implemented in various combinations.

100, 200, 400 ... Piezoelectric device 110, 210, 310, 410 ... Package 111 ... Mounting terminal 112, 212, 312, 412 ... Gold metallization pattern 113 ... Cavity 114 ... Wiring electrode 115 ... Bonding surface 116 ... Corner of bonding surface 120, 220, 320, 420, 520 ... Lid 121 ... Base material 122 ... Nickel plating layer 123 ... Gold plating layer 124, 224, 324, 424, 524 ... 1st area | region 125, 225, 325, 425 ... 2nd area 126 226, 326, 426 ... Third region 127 ... Lid corner 130 ... Solder 130a, 130b ... Fillet 131 ... Solder ring 132 ... Conductive adhesive 140 ... Piezoelectric vibrating piece 171 ... Scribe line 215, 315, 429 ... Recess 216, 16 ... Recessed region 225a ... Outer periphery of second region 225 412a ... First pattern 412b ... Second pattern 413, 513 ... Space 424a ... Projection region 428 ... Projection part 524a ... First pattern 524b ... Second pattern 524c ... Third pattern C110 ... Ceramic sheet

Claims (5)

A rectangular lid in which the outer periphery of the corner is formed in a curved shape,
Has a cavity in which the piezoelectric vibrating reed is mounted, junction surface said cavity by said lid is a package formed by a ceramic which is sealed via a solder, wherein the lid surrounds around the cavity is joined In the piezoelectric device , the outer shape is formed in a rectangular shape, and the package has a gold metallized pattern to which the solder is joined ,
Corners of the gold metallized pattern are formed in the same shape as the corners of the lid ,
A piezoelectric device, wherein in the central part of the long side of the bonding surface, the inner peripheral shape of the central part of the long side of the bonding surface of the gold metallized pattern is recessed toward the outer peripheral side of the gold metallized pattern . The piezoelectric device according to claim 1, wherein an outer peripheral shape of the gold metallized pattern is larger than an outer peripheral shape of the lid and is formed in the same shape as the outer peripheral shape of the lid. At the center of the long side of the joint surface,
The piezoelectric device according to claim 1, wherein an outer peripheral shape of a central portion of a long side of the bonding surface of the gold metallized pattern is recessed toward the cavity side. The lid has a base material, and a plating layer formed on the surface of the base material,
A first region, which is formed in a ring shape so as to contact the outermost periphery of the surface and surrounds the periphery of the surface, and to which the solder is bonded, and an inner periphery of the first region, on the surface bonded to the package. A second region that is formed in contact with the side and has the plating layer removed, or has undergone a modification treatment that reduces the adhesiveness of the solder, and
The piezoelectric device according to any one of claims 1 to 3 , wherein the outer periphery of the second region is formed so as to be recessed toward the inner peripheral side at a corner portion of the base material. The plating layer is formed by a nickel plating layer and a gold plating layer formed on the surface of the nickel plating layer,
The piezoelectric device according to claim 4 , wherein the gold plating layer is removed and the nickel plating layer is exposed in the second region.