JP6680271B2 - プラズマ源 - Google Patents
プラズマ源 Download PDFInfo
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- JP6680271B2 JP6680271B2 JP2017123084A JP2017123084A JP6680271B2 JP 6680271 B2 JP6680271 B2 JP 6680271B2 JP 2017123084 A JP2017123084 A JP 2017123084A JP 2017123084 A JP2017123084 A JP 2017123084A JP 6680271 B2 JP6680271 B2 JP 6680271B2
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- Prior art keywords
- chamber
- insulator
- antenna
- conductor
- plasma source
- Prior art date
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- 239000012212 insulator Substances 0.000 claims description 72
- 239000004020 conductor Substances 0.000 claims description 47
- 230000002093 peripheral effect Effects 0.000 claims description 12
- 150000002500 ions Chemical class 0.000 claims description 10
- 238000007599 discharging Methods 0.000 claims 1
- 238000000605 extraction Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 229910052582 BN Inorganic materials 0.000 description 8
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 4
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 3
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- RBFQJDQYXXHULB-UHFFFAOYSA-N arsane Chemical compound [AsH3] RBFQJDQYXXHULB-UHFFFAOYSA-N 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000070 arsenic hydride Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000005405 multipole Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
- H01J37/08—Ion sources; Ion guns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J27/00—Ion beam tubes
- H01J27/02—Ion sources; Ion guns
- H01J27/16—Ion sources; Ion guns using high-frequency excitation, e.g. microwave excitation
- H01J27/18—Ion sources; Ion guns using high-frequency excitation, e.g. microwave excitation with an applied axial magnetic field
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32192—Microwave generated discharge
- H01J37/32211—Means for coupling power to the plasma
- H01J37/3222—Antennas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/3244—Gas supply means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32467—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/03—Mounting, supporting, spacing or insulating electrodes
- H01J2237/032—Mounting or supporting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/03—Mounting, supporting, spacing or insulating electrodes
- H01J2237/038—Insulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/06—Sources
- H01J2237/08—Ion sources
- H01J2237/0815—Methods of ionisation
- H01J2237/0817—Microwaves
Description
箱状であり、内側で生成されたイオンまたは電子を外へ放射するための開口部を有するチャンバと、
前記チャンバの周壁を貫通する供給路を通じて前記チャンバ内へ気体を導入する気体導入部と、
前記周壁における前記開口部に対向する位置に設けられたコネクタと、
基端部が前記コネクタに接続され、前記チャンバ内において前記開口部に向かって延在するアンテナと、
前記アンテナにおける前記チャンバ内に位置する先端部側の第1部位を覆う第1絶縁体部と、
前記アンテナにおける前記チャンバ内に位置する前記基端部側の第2部位を覆う第2絶縁体部と、
前記第2部位を覆い且つ前記第1部位を覆わない導体部と、を備える。
Claims (5)
- 箱状であり、内側で生成されたイオンまたは電子を外へ放射するための開口部を有するチャンバと、
前記チャンバの周壁を貫通する供給路を通じて前記チャンバ内へ気体を導入する気体導入部と、
前記周壁における前記開口部に対向する位置に設けられたコネクタと、
基端部が前記コネクタに接続され、前記チャンバ内において前記開口部に向かって延在するアンテナと、
前記アンテナにおける前記チャンバ内に位置する先端部側の第1部位を覆う第1絶縁体部と、
前記アンテナにおける前記チャンバ内に位置する前記基端部側の第2部位を覆う第2絶縁体部と、
前記第2部位を覆い且つ前記第1部位を覆わない導体部と、を備える、
プラズマ源。 - 前記第1絶縁体部の内側および前記第2絶縁体部の内側には、永久磁石が配置されていない、
請求項1に記載のプラズマ源。 - 前記コネクタは、
長尺のピンと、
絶縁体から形成され前記ピンの長手方向における中央部を保持する保持部と、
導電性材料から円筒状に形成され、外壁に雄螺子部が設けられるとともに、内側に前記ピンが配置される筒状部と、を有し、
前記導体部は、筒状であり、内壁に前記雄螺子部に螺合する雌螺子部が設けられている、
請求項1または2に記載のプラズマ源。 - 前記コネクタは、前記アンテナが接続される側とは反対側に同軸ケーブルが接続され、
前記第2部位と前記導体部との間のインピーダンスは、前記同軸ケーブルの内部導体と外部導体との間のインピーダンスに等しい、
請求項1から3のいずれか1項に記載のプラズマ源。 - 前記供給路に嵌入され、前記気体導入部から気体を吸入する吸入口と吸入した前記気体を排出する排出口とを有する嵌合部材を更に備え、
前記チャンバの内側から前記供給路を臨む第1方向から見たときに、前記排出口と前記吸入口とは、互いに前記第1方向に直交する第2方向へずれている、
請求項1から4のいずれか1項に記載のプラズマ源。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017123084A JP6680271B2 (ja) | 2017-06-23 | 2017-06-23 | プラズマ源 |
CN201810036200.0A CN109119314B (zh) | 2017-06-23 | 2018-01-15 | 等离子体源 |
KR1020180008651A KR102136454B1 (ko) | 2017-06-23 | 2018-01-24 | 플라즈마원 |
US15/902,009 US10199201B2 (en) | 2017-06-23 | 2018-02-22 | Plasma source |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017123084A JP6680271B2 (ja) | 2017-06-23 | 2017-06-23 | プラズマ源 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019008965A JP2019008965A (ja) | 2019-01-17 |
JP6680271B2 true JP6680271B2 (ja) | 2020-04-15 |
Family
ID=64692664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017123084A Active JP6680271B2 (ja) | 2017-06-23 | 2017-06-23 | プラズマ源 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10199201B2 (ja) |
JP (1) | JP6680271B2 (ja) |
KR (1) | KR102136454B1 (ja) |
CN (1) | CN109119314B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102431354B1 (ko) | 2017-07-11 | 2022-08-11 | 삼성디스플레이 주식회사 | 화학기상 증착장치 및 이를 이용한 표시 장치의 제조 방법 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0831358A (ja) * | 1994-07-12 | 1996-02-02 | Nissin Electric Co Ltd | Ecrイオンラジカル源 |
JPH08287857A (ja) * | 1995-04-18 | 1996-11-01 | Kobe Steel Ltd | マイクロ波イオン源 |
JP2959508B2 (ja) * | 1997-02-14 | 1999-10-06 | 日新電機株式会社 | プラズマ発生装置 |
KR100862658B1 (ko) * | 2002-11-15 | 2008-10-10 | 삼성전자주식회사 | 반도체 처리 시스템의 가스 주입 장치 |
JP4109213B2 (ja) * | 2004-03-31 | 2008-07-02 | 株式会社アドテック プラズマ テクノロジー | 同軸形マイクロ波プラズマトーチ |
JP4992885B2 (ja) * | 2008-11-21 | 2012-08-08 | 日新イオン機器株式会社 | プラズマ発生装置 |
TW201105183A (en) * | 2009-07-21 | 2011-02-01 | Delta Electronics Inc | Plasma generating apparatus |
KR101310753B1 (ko) * | 2012-04-26 | 2013-09-24 | 한국표준과학연구원 | 유도 안테나 |
US9082590B2 (en) * | 2012-07-20 | 2015-07-14 | Applied Materials, Inc. | Symmetrical inductively coupled plasma source with side RF feeds and RF distribution plates |
JP6283797B2 (ja) * | 2014-01-30 | 2018-02-28 | ノベリオンシステムズ株式会社 | プラズマ発生装置 |
US20160372306A1 (en) * | 2015-06-18 | 2016-12-22 | Tokyo Electron Limited | Method for Controlling Plasma Uniformity in Plasma Processing Systems |
-
2017
- 2017-06-23 JP JP2017123084A patent/JP6680271B2/ja active Active
-
2018
- 2018-01-15 CN CN201810036200.0A patent/CN109119314B/zh active Active
- 2018-01-24 KR KR1020180008651A patent/KR102136454B1/ko active IP Right Grant
- 2018-02-22 US US15/902,009 patent/US10199201B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
KR20190000774A (ko) | 2019-01-03 |
KR102136454B1 (ko) | 2020-07-21 |
CN109119314B (zh) | 2020-10-09 |
JP2019008965A (ja) | 2019-01-17 |
US20180374676A1 (en) | 2018-12-27 |
US10199201B2 (en) | 2019-02-05 |
CN109119314A (zh) | 2019-01-01 |
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