JP6673246B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP6673246B2
JP6673246B2 JP2017019663A JP2017019663A JP6673246B2 JP 6673246 B2 JP6673246 B2 JP 6673246B2 JP 2017019663 A JP2017019663 A JP 2017019663A JP 2017019663 A JP2017019663 A JP 2017019663A JP 6673246 B2 JP6673246 B2 JP 6673246B2
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JP
Japan
Prior art keywords
switching element
side switching
arm
low
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2017019663A
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English (en)
Japanese (ja)
Other versions
JP2018129336A5 (https=
JP2018129336A (ja
Inventor
雅由 西畑
雅由 西畑
植田　展正
展正 植田
裕貴 清瀬
裕貴 清瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Priority to JP2017019663A priority Critical patent/JP6673246B2/ja
Priority to PCT/JP2017/042497 priority patent/WO2018142735A1/ja
Publication of JP2018129336A publication Critical patent/JP2018129336A/ja
Publication of JP2018129336A5 publication Critical patent/JP2018129336A5/ja
Priority to US16/395,481 priority patent/US10985636B2/en
Application granted granted Critical
Publication of JP6673246B2 publication Critical patent/JP6673246B2/ja
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K3/00—Details of windings
    • H02K3/46—Fastening of windings on the stator or rotor structure
    • H02K3/50—Fastening of winding heads, equalising connectors, or connections thereto
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
    • H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
    • H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/461—Leadframes specially adapted for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K2203/00—Specific aspects not provided for in the other groups of this subclass relating to the windings
    • H02K2203/09—Machines characterised by wiring elements other than wires, e.g. bus rings, for connecting the winding terminations
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H02M1/0067—Converter structures employing plural converter units, other than for parallel operation of the units on a single load
    • H02M1/008—Plural converter units for generating at two or more independent and non-parallel outputs, e.g. systems with plural point of load switching regulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inverter Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2017019663A 2017-02-06 2017-02-06 半導体装置 Active JP6673246B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017019663A JP6673246B2 (ja) 2017-02-06 2017-02-06 半導体装置
PCT/JP2017/042497 WO2018142735A1 (ja) 2017-02-06 2017-11-28 半導体装置
US16/395,481 US10985636B2 (en) 2017-02-06 2019-04-26 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017019663A JP6673246B2 (ja) 2017-02-06 2017-02-06 半導体装置

Publications (3)

Publication Number Publication Date
JP2018129336A JP2018129336A (ja) 2018-08-16
JP2018129336A5 JP2018129336A5 (https=) 2019-03-14
JP6673246B2 true JP6673246B2 (ja) 2020-03-25

Family

ID=63039682

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017019663A Active JP6673246B2 (ja) 2017-02-06 2017-02-06 半導体装置

Country Status (3)

Country Link
US (1) US10985636B2 (https=)
JP (1) JP6673246B2 (https=)
WO (1) WO2018142735A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018008424A1 (ja) * 2016-07-08 2018-01-11 三菱電機株式会社 半導体装置および電力変換装置
JP6776923B2 (ja) 2017-02-06 2020-10-28 株式会社デンソー 半導体装置
CN116093091A (zh) * 2021-11-02 2023-05-09 立锜科技股份有限公司 散热结构以及高热传元件

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5272191B2 (ja) * 2007-08-31 2013-08-28 三菱電機株式会社 半導体装置および半導体装置の製造方法
JP5435286B2 (ja) * 2009-06-24 2014-03-05 株式会社デンソー 駆動装置
JP2011029262A (ja) * 2009-07-22 2011-02-10 Daikin Industries Ltd 電力変換装置
JP5532984B2 (ja) * 2010-02-04 2014-06-25 株式会社デンソー 車両用回転電機
JP5516187B2 (ja) * 2010-07-27 2014-06-11 日産自動車株式会社 電力変換機
JP5970668B2 (ja) * 2010-11-02 2016-08-17 三菱電機株式会社 電動式パワーステアリング用パワーモジュールおよびこれを用いた電動式パワーステアリング駆動制御装置
JP5586671B2 (ja) 2012-09-28 2014-09-10 三菱電機株式会社 パワーモジュール及びこれを用いた駆動装置
JP6072667B2 (ja) * 2013-11-12 2017-02-01 三菱電機株式会社 半導体モジュールとその製造方法
CN105874596B (zh) * 2014-07-30 2019-03-08 富士电机株式会社 半导体模块
JP2016058505A (ja) * 2014-09-09 2016-04-21 日本インター株式会社 パワーモジュール及びパワーユニット
JP6234393B2 (ja) * 2015-03-03 2017-11-22 三菱電機株式会社 電力用半導体装置および電力変換装置
JP6326038B2 (ja) * 2015-12-24 2018-05-16 太陽誘電株式会社 電気回路装置
JP6776923B2 (ja) 2017-02-06 2020-10-28 株式会社デンソー 半導体装置

Also Published As

Publication number Publication date
WO2018142735A1 (ja) 2018-08-09
US20190252954A1 (en) 2019-08-15
JP2018129336A (ja) 2018-08-16
US10985636B2 (en) 2021-04-20

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