JP6672632B2 - Image sensor module - Google Patents

Description

  The present invention relates to an image sensor module. In particular, the present invention relates to an image sensor module using a solid-state imaging device built in a portable electronic device or a tablet terminal.

  2. Description of the Related Art Solid-state imaging devices are widely known as image sensors built in portable electronic devices and tablet terminals. The solid-state imaging device has a light receiving surface on which pixels having photoelectric conversion elements are arranged on a semiconductor chip or the like. When the light emitted from the subject is imaged on the light receiving surface by an optical system such as a lens, the light of the image is converted into a charge amount corresponding to the light and dark, and an output signal is obtained by obtaining an electric signal. it can.

  In recent years, miniaturization, high quality, and high functionality of portable electronic devices have been advanced, and miniaturization, high quality, and high accuracy of solid-state imaging devices mounted on these electronic devices have been strongly demanded. I have.

  For example, Patent Document 1 discloses a solid-state imaging device mounted on a substrate, a bonding wire for electrically connecting a pad formed on the solid-state imaging device and a lead formed on the substrate, and a side portion of the solid-state imaging device. An enclosing frame-shaped frame member, and an optical member attached to the frame member facing the imaging surface of the solid-state imaging device having light transmissivity, wherein the frame member extends from the optical member side toward the imaging surface. There is disclosed a solid-state imaging device in which a frame member and a solid-state imaging device are integrally fixed in a state where the frame member has a leg and an end of a bonding wire connected to a pad is covered by the leg.

JP 2012-222546 A

  In order to form a subject image on the same focal plane over the entire light receiving surface of the solid-state imaging device, it is necessary that the optical axis of the lens group included in the lens unit coincides with the normal line of the solid-state imaging device. However, in the above configuration, the same substrate is used as a reference mounting surface for the lens unit and the solid-state imaging device, but the flatness of the substrate is not mentioned. When a glass epoxy substrate is used as the substrate, for example, in consideration of the flatness of the surface, the accuracy of the parallelism of the light receiving surface of the semiconductor chip, which is a solid-state imaging device adhered and fixed to the substrate, is secured, and the lens unit is At the time of fixing, the precision of the optical axis verticality of the lens system is secured with reference to the substrate surface, and assembling requires a complicated process, and the optical axis of the lens group included in the lens unit and the normal of the solid-state imaging device are shifted. It is concerned.

  The present invention has been made in view of the above circumstances, and has as its object to provide a structure of an image sensor module that enables easy and accurate assembly of an optical system.

  An image sensor module according to an embodiment of the present invention includes an interposer substrate having a plurality of through-holes and a lighting unit, a fixed arrangement disposed on a first surface side of the interposer substrate, an exposure by the lighting unit, and a plurality of photoelectric conversion units. An image sensor having a light receiving surface on which an element is arranged and connected to an external circuit through a plurality of through holes, and a lens fixedly arranged on a second surface of the interposer substrate opposite to the first surface And a unit.

  By having such a configuration, the normal line of the light receiving surface of the image sensor and the optical axis of the imaging lens group arranged in the lens unit can be matched with high accuracy.

  The lens unit has at least three columns, and each of the at least three columns is inserted into any of the plurality of through holes.

  With such a configuration, the lens unit can be stably fixed to the interposer substrate, and the mechanical strength of the image sensor module is improved.

  The lens unit includes an imaging lens group, an imaging lens interior case that fixes and houses the imaging lens group, and an imaging lens exterior case that houses the imaging lens interior case via a plurality of springs. At least three columns are provided. , And is fixed to the imaging lens exterior case.

  With such a configuration, the normal line of the light receiving surface of the image sensor and the optical axis of the imaging lens group can be matched with high accuracy by having such a configuration.

  The imaging lens inner case is surrounded by a coil, and at least three of the columns have conductivity, at least two of which are connected to both ends of the coil.

  With such a configuration, the column can also serve as the wiring connected to the coil, and the wiring structure is simplified.

  The through hole into which at least two columns are inserted has a conformal conductor.

  With such a configuration, the connection between the coil and the external wiring can be improved.

  The interposer substrate has a light-transmitting property, and the lens unit has a light-shielding portion that covers a side wall of the daylighting portion.

  With such a configuration, intrusion of light into the interposer substrate can be suppressed, and occurrence of flare can be suppressed.

  The interposer substrate has a light-transmitting property, and further includes a light absorbing layer formed on a surface and side surfaces of the interposer substrate and side walls of the plurality of through holes.

  With such a configuration, intrusion of light into the interposer substrate can be suppressed, and occurrence of flare can be suppressed.

  The light absorbing layer is a metal having a light shielding property.

  With such a configuration, intrusion of light into the interposer substrate can be suppressed, and occurrence of flare can be suppressed.

  The light absorbing layer is a black resin.

  With such a configuration, intrusion of light into the interposer substrate can be suppressed, and occurrence of flare can be suppressed.

The interposer substrate is made of a silicon substrate.
With such a configuration, light does not enter the interposer substrate, so that flare does not occur.

  The interposer substrate further includes a plurality of through-electrodes, which are provided in the through-holes connected to the image sensor among the plurality of through-holes, and the end on the first surface side is located on the same plane parallel to the second surface. Is characterized by being located closer to the second surface than the same plane.

  With such a configuration, the image sensor and the interposer substrate are arranged in parallel with high precision, and the alignment of the two in the manufacturing process is facilitated.

  The interposer substrate has a projection on the second surface side that surrounds the side wall of the plurality of through electrodes.

  With such a configuration, the image sensor and the interposer substrate are arranged in parallel with high precision, and the alignment of the two in the manufacturing process is facilitated.

  ADVANTAGE OF THE INVENTION According to this invention, the structure of the image sensor module which enables easy and highly accurate assembly of an optical system can be provided.

FIG. 1 is a cross-sectional view illustrating a configuration of an image sensor module according to an embodiment of the present invention. FIG. 1 is an exploded cross-sectional view illustrating a configuration of an image sensor module according to an embodiment of the present invention. It is a perspective view explaining the composition of the interposer board concerning one embodiment of the present invention. It is a top view explaining the composition of the interposer board concerning one embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating an interposer substrate portion of the image sensor module according to one embodiment of the present invention. FIG. 1 is a cross-sectional view illustrating a configuration of an image sensor module according to an embodiment of the present invention. It is a perspective view explaining the composition of the interposer board concerning one embodiment of the present invention. FIG. 1 is a cross-sectional view illustrating a configuration of an image sensor module according to an embodiment of the present invention. FIG. 1 is a cross-sectional view illustrating a configuration of an image sensor module according to an embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating an interposer substrate portion of the image sensor module according to one embodiment of the present invention. FIG. 1 is a cross-sectional view illustrating a configuration of an image sensor module according to an embodiment of the present invention. FIG. 3 is a cross-sectional view illustrating an interposer substrate portion of the image sensor module according to one embodiment of the present invention. FIG. 9 is a diagram illustrating an example of an application product on which the image sensor module according to the embodiment of the present invention can be mounted.

  Hereinafter, a configuration of an image sensor module 100 according to an embodiment of the present invention and a method of manufacturing the same will be described in detail with reference to the drawings. The embodiment described below is an example of an embodiment of the present invention, and the present invention is not construed as being limited to these embodiments. Note that, in the drawings referred to in this embodiment, the same portions or portions having similar functions are denoted by the same reference numerals or similar reference numerals, and repeated description thereof may be omitted. Further, the dimensional ratios in the drawings may be different from the actual ratios for convenience of description, or some of the components may be omitted from the drawings.

<First embodiment>
The configuration of the image sensor module 100 according to the present embodiment will be described in detail with reference to FIGS. FIG. 1 is a sectional view illustrating the configuration of the image sensor module 100 according to the present embodiment. FIG. 2 is an exploded cross-sectional view illustrating a configuration of the image sensor module 100 according to the present embodiment.

  The image sensor module 100 according to the present embodiment includes at least an interposer substrate 102, an image sensor 104, and a lens unit 106. The image sensor module 100 according to the present embodiment may further include a heat radiating member 134, a module outer case 136, a metal cover 138, and a permanent magnet 140.

  The interposer substrate 102 has a plurality of through holes 108 and 109 and a lighting part 102c. The image sensor 104 is fixedly disposed on the first surface 102a side of the interposer substrate 102, has a light receiving surface 104a that is exposed by the light receiving unit 102c, and has a plurality of photoelectric conversion elements disposed therein. Connected to an external circuit. The lens unit 106 is fixedly disposed on the second surface 102b side of the interposer substrate 102 opposite to the first surface 102a.

  With such a configuration, the normal line of the light receiving surface 104a of the image sensor 104 and the optical axis of the imaging lens group 120 arranged in the lens unit 106 can be matched with high accuracy.

  If the normal line of the light receiving surface 104a of the image sensor 104 does not coincide with the optical axis of the imaging lens group 120, an image of a subject is favorably formed, for example, near the center of the effective light receiving surface 104a of the image sensor 104. Even if it is performed, there is a concern that a display defect may occur such that an image cannot be satisfactorily formed in a region distant from the center of the effective light receiving surface.

  The heat radiating member 134 is fixed to the surface of the image sensor 104 opposite to the light receiving surface 104a. The module exterior case 136 has a concave portion, and at least the image sensor 104 and the heat radiating member 134 are disposed in the concave portion, and are fixed to the interposer substrate 102. The metal cover 138 has a permanent magnet 140 fixed and disposed inside, and houses the lens unit 106.

  FIG. 3 is a perspective view illustrating the configuration of the interposer substrate 102 according to the present embodiment. FIG. 4 is a plan view illustrating the configuration of the interposer substrate 102 according to the present embodiment.

  In order to make the normal line of the light receiving surface 104a of the image sensor 104 and the optical axis of the imaging lens group 120 arranged in the lens unit 106 coincide with each other with high precision, the interposer substrate 102 has high surface flatness. It is desirable to use a substrate having a high surface parallelism. The interposer substrate 102 may be a substrate having a light-transmitting property or a substrate having no light-transmitting property.

  As the light-transmitting substrate, for example, a glass substrate can be used. As the glass substrate, for example, quartz glass, alkali-free glass, borosilicate glass, aluminum silicate glass, soda glass, titanium-containing silicate glass, or the like can be used.

  As the substrate having no light-transmitting property, for example, a semiconductor substrate such as a silicon (Si) substrate, a silicon carbide (SiC) substrate, or a gallium arsenide (GaAs) substrate can be used. As the substrate having no light-transmitting property, a resin substrate obtained by processing an epoxy resin, a phenol resin, a polyester, a polyimide, or the like without a light-transmitting property can be used. As the substrate having no light transmitting property, a fiber reinforced resin such as a glass fiber reinforced epoxy resin and an aramid fiber reinforced epoxy resin can be used.

  In this embodiment, a glass substrate is used. Thus, the image sensor module 100 can be provided at a lower cost than when a silicon substrate is used.

  A through electrode 110 is formed in a part of the plurality of through holes 108 of the interposer substrate 102. Further, it has a lighting part 102c that opens an area where the light receiving surface 104a of the image sensor 104 is arranged in a plan view. In the present embodiment, a part of the through holes 108 and 109 is arranged around the light receiving surface 104a of the image sensor 104, and a through electrode 110 is formed in a part 108 of the through hole. Furthermore, through holes 109 are provided near the four corners of the interposer substrate 102, respectively. These through holes 109 are used for inserting a support 118 of the lens unit 106 described later and fixing the lens unit 106 to the interposer substrate 102. Further, as described later, the number of through holes 109 for inserting the support columns 118 is not limited to four, and it is sufficient that at least three through holes 109 are provided.

  FIG. 5 is a cross-sectional view illustrating an interposer substrate 102 of the image sensor module 100 according to the present embodiment. In particular, when the interposer substrate 102 has a light-transmitting property, the light absorbing layer 112 formed on the surface and side surfaces of the interposer substrate 102 and the side walls of the plurality of through holes 108 and 109 and exposing the light receiving surface 104a of the image sensor 104 May be further provided. Here, the surface and the side surface of the interposer substrate 102 include the side wall of the lighting unit 102c. In other words, the light absorbing layer 112 may be further provided on all surfaces and side surfaces of the interposer substrate 102. The metal such as the plurality of through electrodes 110 and the wirings 142 disposed on both surfaces of the interposer substrate 102 are not disposed in contact with the transposable substrate 102 having a light-transmitting property. 102. That is, in the manufacturing process, after forming the light absorption layer 112 covering the entire surface of the interposer substrate 102, the through-electrode 110 and the wiring 142 are formed on the light absorption layer 112.

  With such a configuration, intrusion of light into the interposer substrate 102 can be suppressed, and occurrence of flare can be suppressed. If the light absorbing layer 112 is not provided, there is a concern that light may enter the interposer substrate 102. In this case, there is a concern that stray light may be generated due to irregular reflection by the metal such as the penetrating electrode 110 and the wiring 142 and flare may occur.

  An example of a material of the light absorbing layer 112 is a metal having a light-blocking property. As the metal, for example, nickel (Ni), lead (Pb), gold (Au), copper (Cu), or the like can be used.

  An example of a method for forming the light absorption layer 112 using a metal having the above light-blocking properties will be described. First, through holes 108 and 109 and a lighting part 102c arranged on each interposer substrate 102 are formed on a substrate from which the plurality of interposer substrates 102 are cut out.

  As a method of forming the through hole 108, laser irradiation, wet etching, dry etching, or the like can be used. As laser irradiation, an excimer laser, an Nd: YAG laser (a fundamental wave (wavelength: 1064 nm), a second harmonic wave (wavelength: 532 nm), a third harmonic wave (wavelength: 355 nm), or the like) can be used, and femto. A second laser or the like can be used. As the wet etching, wet etching using hydrogen fluoride (HF) or the like can be used. Further, the above-described laser irradiation and wet etching can be appropriately combined. As dry etching, dry etching using plasma, DRIE (Deep Reactive Ion Etching) using a Bosch process, or the like can be used.

  Next, individual interposer substrates 102 are diced by dicing. Next, a catalyst is adsorbed on the individualized interposer substrate 102 as a pretreatment step of the electroless plating method. Next, it is immersed in a predetermined plating solution to form a metal film. Next, it is immersed in a resist stripping solution, and is flowed. Through the above steps, the light absorption layer 112 using a metal having a light-blocking property can be formed.

  Another example of the material of the light absorbing layer 112 is black resin.

  The black resin contains at least a photosensitive resin composition, a photopolymerization initiator, a pigment, and a solvent, and these compositions are appropriately combined to form a black resin composition. As the photosensitive resin composition, a negative photosensitive resin composition can be used. As the photosensitive resin composition, for example, a photosensitive resin composition containing an acrylic monomer, oligomer, or polymer can be used. Examples of the pigment include carbon black, titanium black such as titanium oxide and titanium oxynitride, metal oxides such as iron oxide, and other mixed organic pigments.

  In addition, as the black resin, a resin in which a pigment is dispersed in a non-photosensitive resin composition can be used. As the non-photosensitive resin composition, for example, a polyimide resin can be used. Pigments in which carbon black is dispersed can be used. Further, aniline black, acetylene black, phthalocyanine black, titanium black or the like may be dispersed as a pigment.

  An example of a method for forming the light absorption layer 112 using a black resin will be described. First, through holes 108 and 109 and a lighting part 102c arranged on each interposer substrate 102 are formed on a substrate from which the plurality of interposer substrates 102 are cut out. Next, individual interposer substrates 102 are diced by dicing. Next, the singulated interposer substrate 102 is immersed in black resin to be blackened. Next, it is immersed in a stripping solution to remove the protective layer. Through the steps described above, the light absorption layer 112 using the black resin can be formed.

  After the light absorption layer 112 is formed, a through electrode 110 that conducts through both surfaces of the interposer substrate 102 through the through hole 108 is formed. As the formation of the through electrode 110, for example, a method such as filling plating, sputtering or vapor deposition, conformal plating, or the like can be used.

  In the filling plating, a seed layer is formed on one surface of the interposer substrate 102, and a plating layer is grown on the seed layer by an electrolytic plating method. At this time, after forming the plugging layer (cover plating) on the one surface, a plating layer filling the through hole 108 is grown from the one surface to the other surface.

  According to the sputtering rig or the vapor deposition, a metal layer can be formed on the side wall of the through hole 108. At this time, if these processes are performed from both surfaces of the interposer substrate 102, the through electrodes 110 can be formed even in the through holes 108 having a large aspect ratio as compared with the process on only one surface. Further, a metal layer can be formed on the side wall of the through hole 108 by an electroless plating method.

  In the conformal plating, a metal layer formed on the side wall of the through hole 108 by the above-described sputtering or vapor deposition is used as a seed layer, and a plating layer is grown thereon by an electrolytic plating method.

  In the through electrode 110 formed by conformal plating, the through hole 108 may be filled with a resin or the like since the inside of the through hole 108 is hollow.

  In the present embodiment, the plurality of through electrodes 110 are connected to the wiring 142 of the image sensor 104 via the solder balls 116 disposed at the end of the interposer substrate 102 on the first surface 102a side. That is, the image sensor 104 is flip-chip connected to the interposer substrate 102.

  The lens unit 106 may have at least three columns 118. Each of the at least three columns 118 may be inserted into any of the plurality of through holes 109.

  With such a configuration, the lens unit 106 can be stably fixed to the interposer substrate 102, and the mechanical strength of the image sensor module 100 is improved. If the number of the columns 118 is two or less, the lens unit 106 cannot be fixed stably with the second surface 102b of the interposer substrate 102 as a reference surface, resulting in poor mechanical strength.

  Further, the lens unit 106 may include an imaging lens group 120, an imaging lens inner case 122, an imaging lens outer case 124, a transparent resin substrate 126, and an infrared filter 128.

  The imaging lens interior case 122 fixes and houses the imaging lens group 120. Further, the imaging lens interior case 122 is surrounded by the coil 130. The coil 130 is provided to control the position of the imaging lens group 120. By controlling the current supplied to the coil 130, the position of the imaging lens group 120 is controlled by the interaction between the magnetic field induced by the current and the permanent magnet 140. The at least three columns 118 have at least two conductive members, and are connected to both ends of the coil 130.

  With such a configuration, the column 118 can also serve as the wiring connected to the coil 130, and the wiring structure is simplified.

  The through-hole 109 into which at least two columns 118 are inserted may have a conformal conductor. The conformal conductor is a through electrode 110 formed on the side wall of the through hole 109, and the inside of the through hole 109 becomes hollow. The columns 118 are inserted into the plurality of hollow through holes 109.

  With such a configuration, the connection between the coil 130 and the external wiring can be improved.

  The imaging lens exterior case 124 houses the imaging lens interior case 122 via a plurality of springs 132. That is, the imaging lens interior case 122 is connected to the imaging lens interior case 122 via the spring 132 and arranged. Thus, the imaging lens interior case 122 is swingably disposed by controlling the current supplied to the coil 130. At least three columns 118 may be fixed to the imaging lens exterior case 124.

  In the present embodiment, the infrared filter 128 is disposed inside the lens unit 106 and is fixed and disposed below the imaging lens group 120. However, the arrangement of the infrared filter 128 is not limited to this. That is, it is only necessary that the light from the subject passes through the imaging lens group 120 and then passes through the infrared filter 128. As another example, it may be fixed and arranged on the first surface 102a side of the interposer substrate 102.

  The configuration of the image sensor module 100 according to the embodiment has been described above. In the image sensor module 100 according to the present embodiment, the image sensor 104 and the lens unit 106 are both fixedly arranged with the interposer substrate 102 as an attachment reference plane.

  In other words, the image sensor module 100 according to the present embodiment has the above configuration so that the normal line of the light receiving surface 104a of the image sensor 104 and the optical axis of the imaging lens group 120 can be matched with high accuracy. Can be. Therefore, control can be performed such that an image of the subject is uniformly formed over the entire effective light receiving surface 104a of the image sensor 104.

  If the normal line of the light receiving surface 104a of the image sensor 104 does not coincide with the optical axis of the imaging lens group 120, an image of a subject is favorably formed, for example, near the center of the effective light receiving surface 104a of the image sensor 104. Even so, there is a concern that a display defect such as poor image formation may occur in a region distant from the center of the effective light receiving surface 104a.

<Second embodiment>
The configuration of the image sensor module 200 according to the present embodiment will be described in detail with reference to FIGS. FIG. 6 is a cross-sectional view illustrating the configuration of the image sensor module 200 according to the present embodiment. The image sensor module 200 according to the present embodiment differs from the image sensor module 100 according to the first embodiment only in the configuration of the interposer substrate 102. FIG. 7 is a perspective view illustrating an interposer substrate 102 portion of the image sensor module 200 according to the present embodiment.

  The interposer substrate 102 included in the image sensor module 200 according to the present embodiment uses a non-transmissive substrate, and differs from the image sensor module 100 according to the first embodiment in that a silicon substrate is used.

  With such a configuration, light does not enter the interposer substrate 102, so that flare does not occur.

  When a light-transmitting substrate is used as the interposer substrate 102, there is a concern that light may enter the interposer substrate 102. In this case, the metal such as the through-electrode 110 and the wiring 142 irregularly reflects light to generate stray light, and flare is reduced. There are concerns that may arise. To cope with such a problem, the image sensor module 100 according to the first embodiment includes the light absorption layer 112.

  However, in the image sensor module 200 according to the present embodiment, it is not necessary to form the light absorption layer 112, and the manufacturing process is simplified.

<Third embodiment>
The configuration of the image sensor module 300 according to the present embodiment will be described in detail with reference to FIG. FIG. 8 is an overall sectional view illustrating the image sensor module 300 according to the present embodiment.

  The image sensor module 300 according to the present embodiment differs from the image sensor module 100 according to the first embodiment only in the configuration of the lens unit 106. The lens unit 106 included in the image sensor module 300 according to the present embodiment is different from the image sensor module 100 according to the first embodiment in having a light shielding unit 146 that covers a side wall of the lighting unit 102c. The light-shielding portion 146 extends from the imaging lens exterior case 124 of the lens unit 106 and is arranged so as to fit into the light-receiving portion 102 c of the interposer substrate 102. The light absorbing layer 112 formed on the interposer substrate 102 may or may not be provided, but is not provided in this embodiment.

  With such a configuration, intrusion of light into the interposer substrate 102 can be suppressed, and occurrence of flare can be suppressed. Further, there is no need to form the light absorbing layer 112, and the manufacturing process is simplified. If the light-shielding portion 146 is not provided, there is a concern that light may enter the interposer substrate 102. In this case, stray light may be generated due to irregular reflection by the metal such as the through electrode 110 and the wiring 142, which may cause flare.

<Fourth embodiment>
The configuration of the image sensor module 400 according to the present embodiment will be described in detail with reference to FIGS. 9 and 10. FIG. 9 is a cross-sectional view illustrating the configuration of the image sensor module 400 according to the present embodiment. The image sensor module 400 according to the present embodiment is different from the image sensor module 100 according to the first embodiment only in the configuration of the interposer substrate 102. FIG. 10 is a cross-sectional view illustrating an interposer substrate 102 portion of the image sensor module 400 according to the present embodiment.

  The image sensor module 400 according to the present embodiment is provided in the through hole 108 connected to the image sensor 104 among the plurality of through holes 108 and 109, and the end on the first surface 102a side is connected to the second surface 102b. A plurality of through electrodes 110 are provided on the same plane in parallel, and the first surface 102a of the interposer substrate 102 is located closer to the second surface 102b than the same plane.

  In other words, the image sensor module 400 according to the present embodiment is provided in the through hole 108 connected to the image sensor 104 out of the plurality of through holes 108 and 109, and the end on the first surface 102a side is the interposer substrate. A plurality of penetrating electrodes 110 protruding from 102 and located on the same plane parallel to the second surface 102b are provided.

  That is, in the flip-chip connection between the interposer substrate 102 and the image sensor 104, both are connected by only a plurality of projecting through electrodes, and the first surface 102a of the interposer substrate 102 does not contact the image sensor 104.

  With such a configuration, the image sensor 104 and the interposer substrate 102 are arranged in parallel with high accuracy, and the alignment of the two in the manufacturing process becomes easy.

  In the case of connection between surfaces, for example, in the connection step, if an air layer or the like is formed between the two, control for alignment becomes difficult, and there is a concern that the yield may decrease.

  An example of a method for forming the through electrode 110 included in the image sensor module 400 according to the embodiment will be described. First, the light absorption layer 112 is formed on at least the side walls of the through holes 108 and 109 by using the above-described method. Here, it is desirable that the through electrode 110 be formed so that its end is filled up to the opening end of the through hole 108 and that the interposer substrate 102 on which the through electrode 110 is formed is as flat as possible. Next, only the first surface 102a of the interposer substrate 102 is protected by the through electrode 110, and only the interposer substrate 102 is thinned by etching.

  Through the above steps, the through electrodes 110 included in the image sensor module 400 according to the present embodiment can be formed. Thereby, although the flatness of the first surface 102a of the interposer substrate 102 is deteriorated, it is maintained that the ends of the plurality of through electrodes 110 related to the connection with the image sensor 104 are present on the same plane. According to this method, the solder ball 116 used for flip chip connection is not required. Further, since the through electrode 110 is formed in a self-aligned manner without requiring patterning using a photomask or the like, the manufacturing process is simplified.

  Although the description has been made in comparison with the image sensor module 100 according to the first embodiment, the interposer substrate 102 is not limited to a glass substrate, and a silicon substrate may be used as in the second embodiment. Furthermore, the image sensor module 400 according to the third embodiment having the light blocking portion 146 can be combined with the image sensor module 400 according to the present embodiment.

<Fifth embodiment>
The configuration of the image sensor module 500 according to the present embodiment will be described in detail with reference to FIGS. FIG. 11 is a cross-sectional view illustrating a configuration of the image sensor module 500 according to the present embodiment. The image sensor module 500 according to the present embodiment is different from the image sensor module 400 according to the fourth embodiment only in the configuration of the interposer substrate 102. FIG. 12 is a cross-sectional view illustrating an interposer substrate 102 of the image sensor module 500 according to the present embodiment.

  The image sensor module 500 according to the fourth embodiment is different from the image sensor module 500 according to the fourth embodiment in that the interposer substrate 102 has, on the first surface 102a side, a convex portion surrounding the side wall of the plurality of through electrodes 110. This is different from the module 400.

  In other words, of the plurality of through-holes 108 and 109, the through-hole 108 connected to the image sensor 104 is provided, and the end on the first surface 102a side is located on the same plane parallel to the second surface 102b. A plurality of through electrodes 110, and a region of the first surface 102 a of the interposer substrate 102, which is separated by a predetermined distance from an opening end of the plurality of through holes 108, is located on the second surface more than the same plane. It is different in that it is located on the 102b side.

  That is, in flip-chip connection between the interposer substrate 102 and the image sensor 104, both are connected via only a plurality of projecting through electrodes, and the first surface 102a of the interposer substrate 102 does not contact the image sensor 104.

  With such a configuration, the image sensor 104 and the interposer substrate 102 are arranged in parallel with high accuracy, and the alignment of the two in the manufacturing process becomes easy. Further, since the side wall of the through electrode 110 is protected by the interposer substrate 102, the mechanical strength of the interposer substrate 102 on which the through electrode 110 is formed is improved.

  In the case of connection between surfaces, for example, in the connection step, if an air layer or the like is formed between the two, control for alignment becomes difficult, and there is a concern that the yield may decrease.

  An example of a method for forming the through electrode 110 included in the image sensor module 500 according to the embodiment will be described. First, the light absorption layer 112 is formed on at least the side walls of the through holes 108 and 109 by using the above-described method. Here, it is desirable that the through electrode 110 be formed so that its end is filled up to the opening end of the through hole 108 and that the interposer substrate 102 on which the through electrode 110 is formed is as flat as possible. Next, only the first surface 102a of the interposer substrate 102 is formed with a resist that protects the through electrode 110 and its peripheral portion, and is thinned by etching.

  Through the above steps, the through electrodes 110 included in the image sensor module 500 according to the present embodiment can be formed. Thereby, although the flatness of the first surface 102a of the interposer substrate 102 is deteriorated, it is maintained that the ends of the plurality of through electrodes 110 related to the connection with the image sensor 104 are present on the same plane. A region of the interposer substrate 102 that is protected without being etched in the peripheral region of the through hole 108 also exists on the same plane. According to this method, the solder ball 116 used for flip chip connection is not required. Further, since the side wall of the through electrode 110 is protected by the interposer substrate 102, the mechanical strength of the interposer substrate 102 on which the through electrode 110 is formed is improved.

  Although the description has been made in comparison with the image sensor module 400 according to the fourth embodiment, the interposer substrate 102 is not limited to a glass substrate, and a silicon substrate may be used as in the second embodiment. Furthermore, the image sensor module 500 according to the third embodiment having the light blocking portion 146 can be combined with the image sensor module 500 according to the present embodiment.

  FIG. 13 is a diagram illustrating an example of an application product on which the image sensor module according to the embodiment of the present invention can be mounted. The image sensor modules 100 to 500 manufactured as described above are mounted on various application products. For example, it is mounted on a notebook personal computer 1000, a tablet terminal 2000, a mobile phone 3000, a smartphone 4000, a digital video camera 5000, a digital camera 6000, and the like.

  The present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the gist.

100, 200, 300, 400, 500: Image sensor module 102: Interposer substrate 102a: First surface 102b: Second surface 102c: Lighting unit 104: Image sensor 106: Lens units 108 and 109: Through hole 110: Through electrode 112 : Light absorbing layer 116: solder ball 118: support column 120: imaging lens group 122: imaging lens interior case 124: imaging lens exterior case 126: transparent resin substrate 128: infrared filter 130: coil 132: spring 134: heat dissipation member 136: module Outer case 138: Metal cover 140: Permanent magnet 142: Wiring 144: FPC
146: Shading unit 1000: Notebook type personal computer 2000: Tablet terminal 3000: Mobile phone 4000: Smartphone 5000: Digital video camera 6000: Digital camera

Claims (5)

An interposer substrate having a plurality of through holes and a lighting part,
A light-receiving surface, which is fixed to and disposed on the first surface side of the interposer substrate, is exposed by the light-receiving portion, and has a plurality of photoelectric conversion elements disposed thereon, is connected to an external circuit through the plurality of through holes. Image sensor
A lens unit fixedly disposed on a second surface side of the interposer substrate opposite to the first surface ;
The lens unit is
An imaging lens group;
An imaging lens interior case that fixes and houses the imaging lens group,
An imaging lens exterior case that houses the imaging lens interior case via a plurality of springs,
And at least three pillars fixed to the imaging lens outer case,
The imaging lens interior case is surrounded by a coil,
Each of the at least three struts is inserted into any of the plurality of through holes,
Wherein the at least two of the at least three struts, has conductivity, an image sensor module that wherein each is connected to both ends of the coil. The image sensor module according to claim 1 , wherein the through hole into which the at least two columns are inserted has a conformal conductor.   An interposer substrate having a plurality of through holes and a lighting part,
  A light-receiving surface, which is fixed to and disposed on the first surface side of the interposer substrate, is exposed by the light-receiving portion, and has a plurality of photoelectric conversion elements disposed thereon, is connected to an external circuit through the plurality of through holes. Image sensor
  A lens unit fixedly disposed on a second surface side of the interposer substrate opposite to the first surface;
  The interposer substrate has translucency,
  A light-absorbing layer formed on a surface and side surfaces of the interposer substrate and side walls of the plurality of through holes;
  The image sensor module, wherein the light absorption layer is a black resin.   An interposer substrate having a plurality of through holes and a lighting part,
  A light-receiving surface, which is fixed to and disposed on the first surface side of the interposer substrate, is exposed by the light-receiving portion, and has a plurality of photoelectric conversion elements disposed thereon, is connected to an external circuit through the plurality of through holes. Image sensor
  A lens unit fixedly disposed on a second surface side of the interposer substrate opposite to the first surface;
  Of the plurality of through holes, the first surface side end is provided in a through hole connected to the image sensor, and further includes a plurality of through electrodes located on the same plane parallel to the second surface. Prepared,
  The image sensor module, wherein the first surface of the interposer substrate is located closer to the second surface than the same plane. 5. The image sensor module according to claim 4 , wherein the interposer substrate has, on the first surface side, a protrusion that surrounds sidewalls of the plurality of through electrodes. 6.