JP3977104B2 - Solid-state imaging device and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a solid-state imaging device and a manufacturing method thereof.
[0002]
[Prior art]
CCDs and C-MOSs are frequently used as solid-state image sensors used in digital still cameras, digital video cameras, mobile phone terminals, and the like. FIG. 1 is a front view of the configuration of a conventional solid-state imaging device as seen from the bottom, and FIG. 2 is a cross-sectional view thereof. In the front view, the bottom of the casing is indicated by a dotted line.
[0003]
1 is a solid-state image sensor, 2 is a circuit board for driving a solid-state image sensor, and a window 2a is provided. The light receiving surface of the solid-state image sensor 1 faces the window 2a on one surface of the circuit board 2 for driving the solid-state image sensor, and is mounted via the adhesive 3 by a flip chip method. A housing 5 to which an infrared cut filter 4 necessary for a color solid-state imaging device is attached is fixed to the other surface of the solid-state imaging device driving circuit board 2 with an adhesive 6. An integrally formed guide pin 7 is provided on the bottom 5a of the housing. The solid-state imaging device driving circuit board 2 is provided with a hole 8 corresponding to the guide pin 7. The guide pin 7 is positioned by being inserted into the punched hole 8 and fixed.
[0004]
A lens holder 10 to which a lens 9 is attached is fixed to the upper portion facing the bottom portion 5a of the housing using a screw mechanism 11 or the like, or although not shown, the housing 5 and the lens holder 10 are integrally molded to form a lens. 9 is fixed to constitute a solid-state imaging device.
[0005]
[Problems to be solved by the invention]
In recent years, digital still cameras, mobile phone terminals, and the like have been developed to be smaller and less expensive, and solid-state imaging devices that are a part of them have been required to be smaller and less expensive.
[0006]
In the conventional solid-state imaging device, when the solid-state imaging device 1 is mounted on one surface of the circuit board 2 for driving the solid-state imaging device, heating is performed while pressing (flip chip method). Often protrudes. In order to avoid this, the guide pins 7 and the punched holes 8 have to be arranged, and the housing 5 and the solid-state imaging device driving circuit board 2 have to be enlarged.
[0007]
In the subsequent process, when the casing 5 is fixed to the other surface of the solid-state image sensor driving circuit board 2 via the adhesive 6, it is heated and fixed while pressing from the lower surface of the solid-state image sensor driving circuit board 2. Let Therefore, the bottom portion 5a of the housing must be arranged away from the protrusion of the solid-state imaging device 1 and the adhesive 3, and a space equivalent to the bottom portion 5a of the housing is pressed on the lower surface of the solid-state imaging device driving circuit board 2. Was necessary.
[0008]
For these reasons, it has been difficult to reduce the size of the solid-state imaging device. Further, the process of mounting the solid-state image sensor 1 on one surface of the circuit board 2 for driving the solid-state image sensor and the process of fixing the housing 5 to the other surface of the circuit board 2 for driving the solid-state image sensor are separate processes. Care must be taken in handling, and the manufacturing cost was high.
[0009]
[Means for Solving the Problems]
In a solid-state imaging device including at least a casing, a solid-state imaging element driving circuit board, a solid-state imaging element, and a lens, a lens is fixed to one end of the casing, and a solid-state imaging element and a solid are fixed to the other end facing the lens. A recess for positioning and storing a part of a circuit board for driving a solid-state image sensor on which an image sensor is mounted is provided . The bottom surface of the recess, the upper surface of the circuit board for driving a solid-state image sensor, and the inner wall of the recess and driving of the solid-state image sensor The solid-state imaging device is positioned by the side surface of the circuit board.
[0010]
Arrange the inner wall of the concave portion of the housing close to the solid-state image sensor mounting position, and simultaneously attach the solid-state image sensor driving circuit board and the housing to the solid-state image sensor driving circuit board. .
[0011]
A solid-state imaging device including at least a housing, a solid-state imaging device driving circuit board, a solid-state imaging device, and a lens, wherein a lens is fixed to one end of the housing and a solid-state imaging device is disposed to the other end facing the lens In a method for manufacturing a solid-state imaging device having a recess for positioning and storing a part of a circuit board for driving a solid-state image sensor on which the solid-state image sensor is mounted, a step of storing the circuit board for driving a solid-state image sensor in at least the recess; A step of applying an adhesive to the driving circuit board, a step of mounting the solid-state imaging element on the circuit board for driving the solid-state imaging element coated with the adhesive, and pressing the solid-state imaging element against the circuit board for driving the solid-state imaging element. And a method for manufacturing a solid-state imaging device having a heating step.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 3 is a front view of the solid-state imaging device according to an embodiment of the present invention as viewed from the bottom surface, and FIG. 4 is a cross-sectional view thereof. FIG. 5 is a perspective view thereof.
[0013]
An infrared cut filter 12 that is a component of the solid-state imaging device is attached to the housing 13. A recess 14 is provided at the other end of the housing 13 facing the lens holder 19 having the lens 18. Positioning is performed by the bottom surface of the recess 14 and the top surface of the circuit board 15 for driving the solid-state image sensor, and the inner wall of the recess 14 and the side surface of the circuit board 15 for driving the solid-state image sensor. It is stored in the body 13. Since the positioning with respect to the circuit board 15 for driving the solid-state imaging device is performed without providing the guide pins on the housing 13, the solid-state imaging device can be downsized.
[0014]
An adhesive 16 is applied to the surface facing the lens holder 19 of the solid-state image sensor driving circuit board 15 positioned and accommodated in the recess 14 of the housing 13, and the solid-state image sensor driving circuit board 15 applied with the adhesive 16 is applied. The solid-state imaging device 17 is mounted, and the solid-state imaging device driving circuit board 15 is heated while pressing the solid-state imaging device 17 against the solid-state imaging device driving circuit board 15. Bonding is performed via the adhesive 16. Since a space for pressing the solid-state image sensor driving circuit board 15 and the bottom of the housing 13 on the lower surface of the solid-state image sensor driving circuit board 15 is not required, the solid-state imaging device can be downsized. .
[0015]
Further, since the step of mounting the solid-state image sensor 17 on the circuit board 15 for driving the solid-state image sensor and the step of fixing the circuit board 15 for driving the solid-state image sensor 15 and the housing 13 can be performed in the same process, the manufacturing cost can be reduced. Can be suppressed.
[0016]
【The invention's effect】
According to the first aspect of the present invention, since the solid-state image sensor driving circuit board is positioned and housed in the housing having the recess, positioning with the guide pins of the housing, which has been a conventional drawback, is not required. The device can be downsized.
[0017]
According to the second aspect of the present invention, the space for fixing the solid-state imaging device driving circuit board 15 and the housing 13 which is a conventional defect is not necessary, and thus the size of the solid-state imaging device can be reduced.
[0018]
According to the invention of claim 3, since the step of mounting the solid-state image pickup device on the circuit board for driving the solid-state image pickup device and the step of fixing the circuit board for driving the solid-state image pickup device and the housing are performed at the same time, manufacturing is inexpensive. it can.
[Brief description of the drawings]
FIG. 1 is a front view showing a configuration of a conventional solid-state imaging device as viewed from the bottom surface. FIG. 2 is a cross-sectional view of the solid-state imaging device. ] Cross-sectional view [Fig. 5] Perspective view [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Solid-state image sensor 2 Solid-state image sensor drive circuit board 2a Window 3 Adhesive 4 Infrared cut filter 5 Case 5a Case bottom 6 Adhesive 7 Guide pin 8 Open hole 9 Lens 10 Lens holder 11 Screw mechanism 12 Infrared cut filter DESCRIPTION OF SYMBOLS 13 Case 14 Cavity 15 of a case Solid-state image sensor drive circuit board 16 Adhesive 17 Solid-state image sensor 18 Lens 19 Lens holder

Claims (3)

In a solid-state imaging device including at least a casing, a solid-state imaging element driving circuit board, a solid-state imaging element, and a lens, a lens is fixed to one end of the casing, and a solid-state imaging element and the other end are opposed to the lens. A recess for positioning and storing a part of a circuit board for driving a solid-state image sensor mounted with a solid-state image sensor; and a bottom surface of the recess, an upper surface of the circuit board for driving the solid-state image sensor, and an inner wall of the recess. A solid-state imaging apparatus, wherein positioning is performed by a side surface of the circuit board for driving the solid-state imaging element.   2. The solid-state image pickup device according to claim 1, wherein the circuit board for driving the solid-state image pickup element, the solid-state image pickup element, and the housing are bonded simultaneously.   A solid-state imaging device including at least a housing, a circuit board for driving a solid-state imaging device, a solid-state imaging device, and a lens, wherein a lens is fixed to one end of the housing and a solid-state imaging device is disposed to the other end facing the lens In a method for manufacturing a solid-state imaging device having a recess that positions and stores a part of a circuit board for driving a solid-state image sensor on which the solid-state image sensor is mounted, a step of storing the circuit board for driving a solid-state image sensor in at least the recess; A step of applying an adhesive to the circuit board for driving, a step of mounting the solid-state imaging element on the circuit board for driving the solid-state imaging element coated with the adhesive, and pressing the solid-state imaging element against the circuit board for driving the solid-state imaging element. A method for manufacturing a solid-state imaging device, comprising a step of heating while heating.

Images