JP6659160B2 - 半導体素子のパワーサイクル評価試験制御装置 - Google Patents

半導体素子のパワーサイクル評価試験制御装置 Download PDF

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JP6659160B2
JP6659160B2 JP2016049120A JP2016049120A JP6659160B2 JP 6659160 B2 JP6659160 B2 JP 6659160B2 JP 2016049120 A JP2016049120 A JP 2016049120A JP 2016049120 A JP2016049120 A JP 2016049120A JP 6659160 B2 JP6659160 B2 JP 6659160B2
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temperature
heat
chip
power
power cycle
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JP2017166824A5 (https=
JP2017166824A (ja
Inventor
馬殿　進路
進路 馬殿
祐樹 奥東
祐樹 奥東
石川　裕之
裕之 石川
松村　圭
圭 松村
真嗣 高田
真嗣 高田
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/381—Auxiliary members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2016049120A 2016-03-14 2016-03-14 半導体素子のパワーサイクル評価試験制御装置 Active JP6659160B2 (ja)

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JP2016049120A JP6659160B2 (ja) 2016-03-14 2016-03-14 半導体素子のパワーサイクル評価試験制御装置

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JP2016049120A JP6659160B2 (ja) 2016-03-14 2016-03-14 半導体素子のパワーサイクル評価試験制御装置

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JP2017166824A JP2017166824A (ja) 2017-09-21
JP2017166824A5 JP2017166824A5 (https=) 2018-10-04
JP6659160B2 true JP6659160B2 (ja) 2020-03-04

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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7056318B2 (ja) * 2018-03-30 2022-04-19 日本電気株式会社 冷却評価システムおよび冷却評価方法
CN111238669B (zh) * 2018-11-29 2022-05-13 拓荆科技股份有限公司 用于半导体射频处理装置的温度测量方法
CN110502842B (zh) * 2019-08-26 2023-05-30 阳光电源股份有限公司 功率半导体模块的热模型建模方法及其应用方法和装置
KR20210133375A (ko) * 2020-04-28 2021-11-08 현대자동차주식회사 파워 모듈의 전력 반도체 소자 정션 온도 추정 방법 및 장치
CN113721122B (zh) * 2020-05-25 2024-04-05 中车永济电机有限公司 焊层寿命失效的测试方法
CN112285595B (zh) * 2020-10-15 2023-10-10 深圳市南北半导体有限责任公司 一种led灯珠的循环测试方法
CN113113370A (zh) * 2021-03-31 2021-07-13 杭州芯耘光电科技有限公司 一种双循环散热系统及其控制方法
CN114152863B (zh) * 2021-11-27 2023-12-08 北京工业大学 一种智能可控温的GaN功率循环实验装置
CN115015723A (zh) * 2022-04-22 2022-09-06 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） GaN功率器件的状态监测方法、装置、计算机设备和介质
CN115656604B (zh) * 2022-10-25 2026-04-07 辽宁省检验检测认证中心 快速选择温升试验电流的方法
CN118191550B (zh) * 2024-05-15 2024-07-19 天津海瑞电子科技有限公司 功率模块循环测试方法
CN118330271A (zh) * 2024-06-14 2024-07-12 浙江杭可仪器有限公司 一种测试平台外置的igbt功率循环测试设备
CN121302893B (zh) * 2025-10-13 2026-04-24 大唐东北电力试验研究院有限公司 一种电力变压器温度监测方法、装置及设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4418772B2 (ja) * 2005-04-28 2010-02-24 富士通マイクロエレクトロニクス株式会社 温度制御装置
JP4321539B2 (ja) * 2006-03-28 2009-08-26 住友電気工業株式会社 デバイス評価装置およびデバイス評価方法
JP6047474B2 (ja) * 2013-09-25 2016-12-21 エスペック株式会社 環境試験装置

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