JP6657001B2 - プリント配線板 - Google Patents
プリント配線板 Download PDFInfo
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- JP6657001B2 JP6657001B2 JP2016083902A JP2016083902A JP6657001B2 JP 6657001 B2 JP6657001 B2 JP 6657001B2 JP 2016083902 A JP2016083902 A JP 2016083902A JP 2016083902 A JP2016083902 A JP 2016083902A JP 6657001 B2 JP6657001 B2 JP 6657001B2
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- 239000002184 metal Substances 0.000 claims description 127
- 229910052751 metal Inorganic materials 0.000 claims description 127
- 239000011347 resin Substances 0.000 claims description 49
- 229920005989 resin Polymers 0.000 claims description 49
- 230000017525 heat dissipation Effects 0.000 claims description 22
- 230000005855 radiation Effects 0.000 description 27
- 230000004048 modification Effects 0.000 description 17
- 238000012986 modification Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7811—Vertical DMOS transistors, i.e. VDMOS transistors with an edge termination structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/46—Accumulators structurally combined with charging apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
- H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the printed circuit board [PCB] as high-current conductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
図1は、第1の実施形態に係るプリント配線板1の構成を示す斜視図である。実施形態に係るプリント配線板1は、たとえば車両に搭載される電子制御装置、特にモーター制御など大電力・高負荷の制御に用いられる電子制御装置に用いられるプリント配線板に特に有効である。一方で、実施形態に係るプリント配線板1の用途は、電子制御装置に限られるものではない。
図4は、第1の実施形態の変形例1に係るプリント配線板1Aの構成を示す断面図である。なお、図4は、第1の実施形態に係る図3に対応した図である。
図5は、第1の実施形態の変形例2に係るプリント配線板1Bの構成を示す断面図である。なお、図5は、第1の実施形態に係る図3に対応した図である。
図6は、第2の実施形態に係るプリント配線板1Aの構成を示す上面図である。
図11は、第2の実施形態の変形例3に係るプリント配線板1Dの構成を示す断面図である。なお、図11は、第2の実施形態に係る図10に対応した図である。
2 金属板
2a、2b 電流経路部
2c、2d 放熱部
2a1、2b1、2c1、2d1 突出部
2a2、2b2、2c2、2d2 貫通孔
3 配線部材
3a 配線層
3b 樹脂層
4 被覆部材
5 高放熱樹脂層
6 金属層
7 樹脂
8 金属接続部
9 導電板
9a 導電突出部
9b 貫通孔
10 ビア
20、20a、20b、20c、20d 電子部品
21 端子
22 導電接合材
30 筐体
31 外部端子
32 ナット
Claims (12)
- おもて面側に搭載される電子部品の主電流経路である電流経路部と、前記電子部品から発生する熱を放熱する放熱部と、を有する金属板と、
前記金属板の裏面側に配置される配線部材と、を備え、
前記電流経路部および前記放熱部は、同一層内で前記配線部材に一体に形成されており、
前記金属板は、平面視で前記配線部材から突出する突出部を有し、
前記突出部は、外部装置と直接接続可能な形状を有し、
前記配線部材は、矩形状であり、
前記電流経路部の前記突出部と前記放熱部の前記突出部とは、前記配線部材の異なる辺から突出していること
を特徴とするプリント配線板。 - おもて面側に搭載される電子部品の主電流経路である電流経路部と、前記電子部品から発生する熱を放熱する放熱部と、を有する金属板と、
前記金属板の裏面側に配置される配線部材と、
前記金属板のおもて面上の前記電子部品が搭載される位置に設けられる高放熱樹脂層と、
前記高放熱樹脂層上に設けられる金属層と、を備え、
前記電流経路部および前記放熱部は、同一層内で前記配線部材に一体に形成されており、
前記高放熱樹脂層には、前記金属板と前記金属層との間を金属で接続する金属接続部が設けられること
を特徴とするプリント配線板。 - おもて面側に搭載される電子部品の主電流経路である電流経路部と、前記電子部品から発生する熱を放熱する放熱部と、を有する金属板と、
前記金属板の裏面側に配置される配線部材と、
前記配線部材の前記金属板と向かい合う面とは反対の面側に設けられ、前記電子部品の主電流経路である導電板と、を備え、
前記電流経路部および前記放熱部は、同一層内で前記配線部材に一体に形成されていること
を特徴とするプリント配線板。 - 前記電流経路部は、平面視で前記放熱部と離間して配置されること
を特徴とする請求項1〜3のいずれか一つに記載のプリント配線板。 - 前記放熱部は、平面視で前記電子部品が搭載される位置を含んで配置されること
を特徴とする請求項1〜4のいずれか一つに記載のプリント配線板。 - 前記金属板は、平面視で前記配線部材から突出する突出部を有し、
前記突出部は、外部装置と直接接続可能な形状を有すること
を特徴とする請求項2または3に記載のプリント配線板。 - 前記突出部は、前記金属板のおもて面側および裏面側の一方または双方に折れ曲がっていること
を特徴とする請求項6に記載のプリント配線板。 - 前記配線部材は矩形状であり、
前記電流経路部の前記突出部と前記放熱部の前記突出部とは、前記配線部材の異なる辺から突出していること
を特徴とする請求項6または7に記載のプリント配線板。 - 前記金属板のおもて面上の前記電子部品が搭載される位置に高放熱樹脂層を備えること
を特徴とする請求項1または3に記載のプリント配線板。 - 前記高放熱樹脂層上に金属層を備え、
前記高放熱樹脂層に、前記金属板と前記金属層との間を金属で接続する金属接続部が設けられること
を特徴とする請求項9に記載のプリント配線板。 - 前記配線部材の前記金属板と向かい合う面とは反対の面側に、前記電子部品の主電流経路である導電板を備えること
を特徴とする請求項1または2に記載のプリント配線板。 - 前記導電板は、平面視で前記配線部材から突出する導電突出部を有し、
前記導電突出部は、外部装置と直接接続可能な形状を有すること
を特徴とする請求項3または11に記載のプリント配線板。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016083902A JP6657001B2 (ja) | 2016-04-19 | 2016-04-19 | プリント配線板 |
US15/477,589 US10573619B2 (en) | 2016-04-19 | 2017-04-03 | Printed wiring board |
CN201710251071.2A CN107305871B (zh) | 2016-04-19 | 2017-04-17 | 印刷接线板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016083902A JP6657001B2 (ja) | 2016-04-19 | 2016-04-19 | プリント配線板 |
Publications (2)
Publication Number | Publication Date |
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JP2017195252A JP2017195252A (ja) | 2017-10-26 |
JP6657001B2 true JP6657001B2 (ja) | 2020-03-04 |
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Application Number | Title | Priority Date | Filing Date |
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JP2016083902A Active JP6657001B2 (ja) | 2016-04-19 | 2016-04-19 | プリント配線板 |
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US (1) | US10573619B2 (ja) |
JP (1) | JP6657001B2 (ja) |
CN (1) | CN107305871B (ja) |
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JP3174393B2 (ja) | 1992-04-24 | 2001-06-11 | シチズン時計株式会社 | 電子部品搭載用基板の製造方法 |
JPH0750761B2 (ja) * | 1993-06-28 | 1995-05-31 | 株式会社東芝 | 樹脂封止型半導体装置の平面実装形態 |
US6762118B2 (en) * | 2000-10-10 | 2004-07-13 | Walsin Advanced Electronics Ltd. | Package having array of metal pegs linked by printed circuit lines |
JP2006332449A (ja) * | 2005-05-27 | 2006-12-07 | Cmk Corp | 多層プリント配線板及びその製造方法 |
JP4882562B2 (ja) * | 2006-07-13 | 2012-02-22 | パナソニック株式会社 | 熱伝導基板とその製造方法及び電源ユニット及び電子機器 |
JP2006352175A (ja) * | 2006-10-02 | 2006-12-28 | Renesas Technology Corp | 半導体集積回路装置 |
CN101252157A (zh) * | 2007-11-30 | 2008-08-27 | 和谐光电科技(泉州)有限公司 | 一种发光二极管(led)光源的封装结构 |
CN101908510B (zh) * | 2009-06-03 | 2012-05-09 | 钰桥半导体股份有限公司 | 具有散热封装结构的半导体装置及其制作方法 |
CN101635291B (zh) * | 2009-08-21 | 2011-06-15 | 乐山-菲尼克斯半导体有限公司 | 一种微型封装引线框架的工艺方法 |
TW201123410A (en) * | 2009-12-25 | 2011-07-01 | Bright Led Electronics Corp | LED light-emitting module and its manufacturing method thereof. |
KR20120062457A (ko) * | 2010-12-06 | 2012-06-14 | 삼성전자주식회사 | 솔더 접합 신뢰도를 높이는 반도체 패키지용 인쇄회로기판 및 이를 포함하는 반도체 패키지 |
JP2013033914A (ja) * | 2011-06-27 | 2013-02-14 | Toshiba Corp | 半導体装置 |
US20160005675A1 (en) * | 2014-07-07 | 2016-01-07 | Infineon Technologies Ag | Double sided cooling chip package and method of manufacturing the same |
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2016
- 2016-04-19 JP JP2016083902A patent/JP6657001B2/ja active Active
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2017
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