JP6649773B2 - 発光構造及びマウント - Google Patents

発光構造及びマウント Download PDF

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Publication number
JP6649773B2
JP6649773B2 JP2015562452A JP2015562452A JP6649773B2 JP 6649773 B2 JP6649773 B2 JP 6649773B2 JP 2015562452 A JP2015562452 A JP 2015562452A JP 2015562452 A JP2015562452 A JP 2015562452A JP 6649773 B2 JP6649773 B2 JP 6649773B2
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light emitting
led
contact
orientation
mount
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Japanese (ja)
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JP2016510180A (ja
JP2016510180A5 (https=
Inventor
ヘンリー チョイ，クォン−ヒン
ヘンリー チョイ，クォン−ヒン
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ルミレッズ ホールディング ベーフェー
ルミレッズ ホールディング ベーフェー
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Publication of JP2016510180A publication Critical patent/JP2016510180A/ja
Publication of JP2016510180A5 publication Critical patent/JP2016510180A5/ja
Priority to JP2020005552A priority Critical patent/JP6928128B2/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H10H20/831—Electrodes characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

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  • Led Device Packages (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Devices (AREA)
JP2015562452A 2013-03-15 2014-03-05 発光構造及びマウント Active JP6649773B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2020005552A JP6928128B2 (ja) 2013-03-15 2020-01-17 発光構造及びマウント

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361798858P 2013-03-15 2013-03-15
US61/798,858 2013-03-15
PCT/IB2014/059466 WO2014141009A1 (en) 2013-03-15 2014-03-05 Light emitting structure and mount

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020005552A Division JP6928128B2 (ja) 2013-03-15 2020-01-17 発光構造及びマウント

Publications (3)

Publication Number Publication Date
JP2016510180A JP2016510180A (ja) 2016-04-04
JP2016510180A5 JP2016510180A5 (https=) 2017-05-18
JP6649773B2 true JP6649773B2 (ja) 2020-02-19

Family

ID=50390146

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015562452A Active JP6649773B2 (ja) 2013-03-15 2014-03-05 発光構造及びマウント
JP2020005552A Active JP6928128B2 (ja) 2013-03-15 2020-01-17 発光構造及びマウント

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020005552A Active JP6928128B2 (ja) 2013-03-15 2020-01-17 発光構造及びマウント

Country Status (7)

Country Link
US (2) US9478712B2 (https=)
EP (1) EP2973714B1 (https=)
JP (2) JP6649773B2 (https=)
KR (1) KR101991960B1 (https=)
CN (1) CN105190893B (https=)
TW (1) TWI627739B (https=)
WO (1) WO2014141009A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017087116A1 (en) * 2015-11-20 2017-05-26 Koninklijke Philips N.V. Die bond pad design to enable different electrical configurations
JP6927970B2 (ja) * 2015-11-20 2021-09-01 ルミレッズ ホールディング ベーフェー 異なる電気的構成を可能にするダイボンドパッド設計
JP7114854B2 (ja) * 2020-04-28 2022-08-09 日亜化学工業株式会社 発光装置
EP3905326B1 (en) 2020-04-28 2023-01-04 Nichia Corporation Light-emitting device
CN111987200B (zh) * 2020-08-20 2022-07-01 厦门三安光电有限公司 发光二极管模组、背光模组和显示模组
WO2024129810A1 (en) * 2022-12-16 2024-06-20 Lumileds Llc Die metallization for dense packed arrays

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6547249B2 (en) 2001-03-29 2003-04-15 Lumileds Lighting U.S., Llc Monolithic series/parallel led arrays formed on highly resistive substrates
JP4254141B2 (ja) * 2001-07-30 2009-04-15 日亜化学工業株式会社 発光装置
JP4438492B2 (ja) * 2003-09-11 2010-03-24 日亜化学工業株式会社 半導体装置およびその製造方法
EP2280430B1 (en) 2005-03-11 2020-01-01 Seoul Semiconductor Co., Ltd. LED package having an array of light emitting cells coupled in series
CN101846249B (zh) * 2005-06-28 2013-01-16 首尔Opto仪器股份有限公司 用于交流电力操作的发光装置
WO2007018360A1 (en) * 2005-08-09 2007-02-15 Seoul Opto Device Co., Ltd. Ac light emitting diode and method for fabricating the same
JP4856463B2 (ja) 2005-10-17 2012-01-18 株式会社 日立ディスプレイズ 液晶表示装置
US7910395B2 (en) * 2006-09-13 2011-03-22 Helio Optoelectronics Corporation LED structure
US10295147B2 (en) * 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
TWI419360B (zh) 2008-08-11 2013-12-11 璨圓光電股份有限公司 Solid crystal light-emitting device having an insulating layer and a method for manufacturing the same
US8648359B2 (en) * 2010-06-28 2014-02-11 Cree, Inc. Light emitting devices and methods
JP2012028749A (ja) * 2010-07-22 2012-02-09 Seoul Opto Devices Co Ltd 発光ダイオード
TWI472058B (zh) * 2010-10-13 2015-02-01 英特明光能股份有限公司 發光二極體裝置
US9053958B2 (en) * 2011-01-31 2015-06-09 Cree, Inc. Light emitting diode (LED) arrays including direct die attach and related assemblies
EP2745289A1 (en) * 2011-09-06 2014-06-25 Koninklijke Philips N.V. Topology of distributing and connecting leds in a large area matrix
US8760068B1 (en) * 2011-09-07 2014-06-24 Iml International Driving LEDs in LCD backlight
JP2013118292A (ja) * 2011-12-02 2013-06-13 Citizen Electronics Co Ltd Ｌｅｄ発光装置
US9039746B2 (en) * 2013-02-08 2015-05-26 Cree, Inc. Solid state light emitting devices including adjustable melatonin suppression effects

Also Published As

Publication number Publication date
TW201503339A (zh) 2015-01-16
JP2016510180A (ja) 2016-04-04
JP2020057821A (ja) 2020-04-09
US20150380610A1 (en) 2015-12-31
CN105190893A (zh) 2015-12-23
TWI627739B (zh) 2018-06-21
EP2973714A1 (en) 2016-01-20
KR101991960B1 (ko) 2019-06-25
US20170025470A1 (en) 2017-01-26
KR20150132410A (ko) 2015-11-25
US10134805B2 (en) 2018-11-20
JP6928128B2 (ja) 2021-09-01
US9478712B2 (en) 2016-10-25
EP2973714B1 (en) 2019-05-08
WO2014141009A1 (en) 2014-09-18
CN105190893B (zh) 2018-11-13

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