JP6646110B2 - 複合材料を修理するための方法及び装置 - Google Patents
複合材料を修理するための方法及び装置 Download PDFInfo
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- JP6646110B2 JP6646110B2 JP2018132804A JP2018132804A JP6646110B2 JP 6646110 B2 JP6646110 B2 JP 6646110B2 JP 2018132804 A JP2018132804 A JP 2018132804A JP 2018132804 A JP2018132804 A JP 2018132804A JP 6646110 B2 JP6646110 B2 JP 6646110B2
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- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
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Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Textile Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Description
ットは、既存の複合材料の損傷箇所に、局所的に(すなわち、その場で)母材を硬化させるものである。しかし、ヒートブランケットを使用することに関しては、例えば、加熱が均一でない、加熱位置がずれる、加熱速度が遅い、硬化時間が長い、熱暴走が発生する、十分な温度制御ができない、などの様々な問題がある。
材料を接合するための装置及び方法の様々な実施形態が、以下に説明されるととも関連する図に示されている。他に特に指定がない限り、装置又は方法、及び/又は、それらの様々な部品又は工程は、必須ではないが、本明細書に記載、図示、及び/又は組み込まれた構造、コンポーネント、機能、及び/又は変形例の少なくとも1つを含んでいればよい
。また、装置及び方法に関連させて本明細書に記載、図示、及び/又は組み込まれた構造、コンポーネント、機能、及び/又は変形例は、必須ではないが、他の同様の装置又は方法に含まれてもよい。様々な実施形態の以下の説明は、事実上、単に例示のためのものであり、決して本開示やその適用例又は用途を限定することを意図するものではない。また、実施形態によってもたらされる利点を以下に説明しているが、これらは、事実上例示的なものであり、すべての実施形態が同じ利点や同じ程度の利点をもたらすとは限らない。[具体的な実施例、主要要素、及び、代替例]
具30と接合界面32との間に適切な間隔を設けることができる。例えば、器具30から出射されるマイクロ波放射線の波長がλである場合、機構34によって設けられる適切な間隔は、例えば少なくともλ/4である。いくつかの実施形態において、機構34によって設けられる間隔は、λ/4未満であってもよい。ただし、マイクロ波加熱は、通常、λ/4の奇数倍(例えば、λ/4、3λ/4、5λ/4、など)の距離において最大となる。従って、設けられた間隔が波長の四分の一より小さい(例えばλ/5)場合、接合界面32を適切な程度まで加熱するには、器具30をより長時間作動させたり、より大きな振幅の放射線を出射したりする必要が生じうる。
料によって形成してもよい。いくつかの実施形態において、遮蔽機構36は、器具30と接合界面32との間に間隔を設けるハウジングであってもよい。
が欠陥46に接触するようにする。次に、パッチ120を、欠陥46に配置する(例えば、これによってパッチ120が層132に接触するようにする)ことによって、図3Cに示すように、パッチ120と複合材料100との間に接合界面140を規定する。フィルム128は、層132に浸透することによってパッチ120に接触してもよいし、層136に浸透することによって複合材料100に接触してもよい。
ってもよい。例えばワイヤーメッシュの目は、放射線216の波長よりも小さい。
選択的に作動させるように構成されている。例えば、制御部252は、センサー248からの温度測定値に基づいて、電源256からエミッター208に供給される電力を調節し、これによって、接合界面140の加熱速度を調節するように構成される。エミッターに供給される電力を調節することは、エミッターのうちの1つ又は複数のデューティサイクルを調節する(例えば、エミッター208の1つ又は複数をオンオフする周波数を調節することによって加熱速度を調節する)こと、放射線216の出射周波数を調節する(例えば、放射線216の周波数を調節することによって加熱速度を調節する)こと、及び/又は、放射線216の振幅を調節する(例えば、放射線216の振幅を調節することによって加熱速度を調節する)こと、を含んでいてもよい。
えば、パッチ120に近接する、表面44と面一でない隆起部など)を除去してもよい。
ート、建物などの、別の対象物を修理してもよい。図4Aには、部分80は、欠陥として示している。しかし、他の例において、表面部分は欠陥でなくてもよく、新しい製造部品を加えるために複合材料接合界面を加熱(及び/又は硬化)することが望まれる、対象物上(又は内)の位置であってもよい。
留め具を用いることによって、装置のいずれか一方を材料300に連結してもよい。
(又は、材料300における表面302の反対側の、装置400が連結された表面)を直接加熱することなく、接合界面312、316、332、336、354を非伝熱的に加熱するよう作動する。例えば、エミッター208、408は、パッチ304、308が材料300に適切に接合されるまで、接合領域380a、380bに対して、マイクロ波放射線を出射することができる。いくつかの実施形態において、回路412と回路212とは、互いに通信しており、これによって装置のフィードバック制御を改善することができる。
、その一例を図7に示している。ただし、装置200は、ハウジング204の再構成及び/又はモジュール化を可能にする他の構造又は機構、例えば、パネルを互いに摺動可能とする機構、を含んでいてもよい。
べて、又は、エミッター208aなどの一部)からのマイクロ波放射線の出射を、第1温度に基づいて調節し、且つ、パネル232に連結されたアレイ状のエミッター208(例えば、これらのエミッターのすべて、又は、エミッター208bなどの一部)からのマイクロ放射線の出射を、第2温度に基づいて調節するように構成されている。
る1つ又は複数のホットスポット又はコールドスポットの発生をもたらす場合がある。このような干渉を低減するために、1つ又は複数のディスクを回転させることによって、出射された放射線の方向性を変更することができる。例えば、隣接するスロット734a、734bを、図示のように、それぞれの長手方向(すなわち長さ)が互いに実質的に垂直となるように互いに対して配向することによって、スロット734aから出射された放射線が、スロット734bから出射された放射線の方向性に対して実質的に直交する方向性を有するようにする。これによって、エミッター208c、208dから接合界面への位相ずれに起因する接合界面での干渉を低減することができる。
サイクル900は、加熱段階904、保持段階908、及び、冷却段階912を含む。
ジングなどの遮蔽機構を含む。
フィードバックループは、装置の回路で実行することができる。
位置での加熱効果を調節する工程1406を含む。例えば、工程1406は、温度センサーによって接合界面の温度を測定し、当該測定温度に基づいてマイクロ波エミッターの少なくとも一部からのマイクロ波の出射を調節することを含む。
され、プロセッサユニット1604によって実行することができる。様々な実施形態のプロセスは、プロセッサユニット1604によって、コンピューター実行可能な命令を用いて実行することができ、これらの命令は例えばメモリ1606などのメモリに配置してもよい。
ピュータ、クライアントコンピュータ、又は、プログラムコード1618を格納および送信することができる他のデバイスであってもよい。
対象物の表面における硬化領域内で2つの材料間に接合界面を規定することと、
前記硬化領域の外側における前記表面を直接加熱することなく、前記接合界面を非伝熱的に加熱すること、とを含む方法。
対象物における、修理すべき変形部を含む表面に接合領域を規定することと、
前記変形部に隣接させてパッチ材料を設けることと、
前記接合領域にハウジングを配置することとを含み、当該ハウジングは、内面に設けられた少なくとも1つのマイクロ波エミッターを有し、前記エミッターは、前記接合領域に向けられており、前記ハウジングは、マイクロ波エミッターによる放射が、前記接合領域の外側における前記表面に到達するのを防ぐように構成されており、
前記パッチが前記対象物に適切に接合されるまで、前記接合領域にマイクロ波放射線を出射すること、をさらに含む、方法。
内面及び開口を有するハウジングと、
前記ハウジングの前記内面に設けられた1つ又は複数のマイクロ波エミッターとを含み、
前記ハウジングは、修理を必要とする欠陥を有する表面に取り付けるように構成されており、前記ハウジングの前記開口は、前記表面に隣接し且つ前記欠陥を囲み、前記ハウジング及び前記表面は、実質的に閉鎖されたチャンバーを形成する、装置。
一実施例において、航空機、自転車などの対象物または他の対象物の複合材料の表面において、損傷した領域が特定される。この損傷領域を形成している複合材料の一部を除去することによって、損傷領域に対して修理のための準備を施す。準備が施された損傷領域にパッチを配置する。真空バッグを用いて、パッチ及び準備が施された損傷領域が置かれた空間を真空にする。ハウジングと、ハウジングの内面に設けられた1つ又は複数のマイクロ波エミッターとを含む装置を、対象物の表面に取り付け、ハウジングの内側に通じる開口が上記表面に隣接し欠陥を囲み、ハウジングと対象物の表面が実質的に閉鎖されたチャンバーを形成するようにする。装置を作動させることによって、マイクロ波エミッターの1つ又はそれ以上から、パッチと準備が施された損傷領域との間の接合界面に、マイクロ波放射線が出射される。ハウジングは、出射された放射線を閉鎖チャンバー内に実質的に閉じ込めるように構成されている。装置の回路は、出射された放射線を調節することによって、加熱段階、保持段階、及び冷却段階における接合界面の温度を制御し、これによって、準備が施された損傷表面にパッチを適切に接合する。回路は、冷却段階が完了すると技術者に知らせてもよい。技術者は、表面から装置を取り除き、真空バッグを取り除き、パッチと対象物との間の接合を検査する。
本明細書に記載した様々な実施形態は、材料を接合するための周知の方法に対して、いくつかの利点を有する。例えば、本明細書に記載した例示的な実施例は、対象物の既存の表面部分と、新設の表面部分との間の接合界面をマイクロ波放射線を当てるによって、伝熱的ではなく直接加熱することを可能にし、これによって、接合界面の温度制御を改善したり、接合界面に沿った熱分散を実現したり、誤った位置を加熱することを抑制したり、加熱速度を高めたり、硬化時間を短縮したり、熱暴走を防いだりすることができる。ただし、本明細書に記載したすべての実施形態が、同じ利点又は同じ程度の利点を有するとは限らない。
上述の開示は、独自の有用性を持つ複数の別個の開示を包含しうる。これらの開示のそれぞれを、その好ましい形態で開示しているが、本明細書に開示及び図示されたそれらの具体的な実施形態は、限定的な意味でとらえられるべきではなく、多くの変形例が存在しうる。本開示の要旨は、本明細書に開示された様々な要素、特徴、機能、及び/又は特性の、すべての新規且つ非自明の組み合わせ及びサブコンビネーションを含む。以下の特許請求の範囲は、新規且つ非自明とみなされる、いくつかの組み合わせ及びサブコンビネーションを特に示している。特徴、機能、要素、及び/又は特性の、その他の組み合わせ及びサブコンビネーションにおいて実施される開示は、本願又は関連出願による優先権を主張する出願において、特許請求の範囲に記載されうる。このような特許請求の範囲は、異なる開示を対象としたもの、同じ開示を対象としたもの、元の特許請求の範囲よりも広いもの、狭いもの、均等のもの、または異なるもの、のいずれであろうとも、本開示の要旨に含まれるものとみなされる。
Claims (6)
- 対象物(22)の表面部分(26)を加熱するための装置であって、
内面及び開口を有するハウジング(204)と、
前記ハウジングの前記内面に設けられた1つ又は複数のマイクロ波エミッター(208)と、を含み、
前記ハウジングは、前記対象物の表面に取り付けるように構成されており、前記ハウジングの前記開口は、前記対象物の表面に隣接し且つ前記表面部分(26)を囲み、前記ハウジングは、当該ハウジングを囲む空間から前記表面部分を隔離するとともに、前記開口の大きさを選択的に調節できるように構成されている、装置。 - 前記ハウジング(204)は、1つ又は複数の可撓性のパネル部分(220b/224b)を含み、前記パネル部分は、前記対象物の表面に可撓性をもって係合することによって、前記1つ又は複数のマイクロ波エミッター(208)から出射されたマイクロ波放射線(216)が前記ハウジングから外部に漏れることを防ぐように構成されている、請求項1に記載の装置。
- 前記ハウジング(204)は、少なくとも第1のパネル及び第2のパネルを含み、前記第1のパネルは、前記1つ又は複数のマイクロ波エミッターのうちの第1のマイクロ波エミッター(208)を含み、前記第2のパネルは、前記1つ又は複数のマイクロ波エミッターのうちの第2のマイクロ波エミッターを含み、前記装置は、前記第2のパネルに対する前記第1のパネルの配向を変更するための再構成装置をさらに含む、請求項1又は2に記載の装置。
- 前記1つ又は複数のマイクロ波エミッターを選択的に作動させるための制御部(252)をさらに含む、請求項1〜3のいずれかに記載の装置。
- 前記表面部分(26)に隣接する第1の位置の第1温度、及び、前記表面部分に隣接する第2の位置の第2温度、を測定するよう構成された1つ又は複数の熱センサー(248)をさらに含み、前記第1の位置は前記第2の位置から離間している、請求項1〜4のいずれかに記載の装置。
- 前記第1のマイクロ波エミッター(208)は前記第1の位置に隣接しており、前記第2のマイクロ波エミッターは前記第2の位置に隣接しており、前記装置は、前記第1温度に基づいて前記第1のマイクロ波エミッターからのマイクロ波放射線(216)の出射を調節するため、及び、前記第2温度に基づいて前記第2のマイクロ波エミッターからの出射を調節するための、1つ又は複数のフィードバックループをさらに含む、請求項5に記載の装置。
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US20150328877A1 (en) | 2015-11-19 |
CN105082582A (zh) | 2015-11-25 |
AU2015200381A1 (en) | 2015-12-03 |
EP2944456A1 (en) | 2015-11-18 |
CN105082582B (zh) | 2019-05-28 |
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