JP6646060B2 - センサ配列を備えた装置およびその製造方法 - Google Patents
センサ配列を備えた装置およびその製造方法 Download PDFInfo
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- JP6646060B2 JP6646060B2 JP2017549073A JP2017549073A JP6646060B2 JP 6646060 B2 JP6646060 B2 JP 6646060B2 JP 2017549073 A JP2017549073 A JP 2017549073A JP 2017549073 A JP2017549073 A JP 2017549073A JP 6646060 B2 JP6646060 B2 JP 6646060B2
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Description
1.銅箔などの金属触媒箔の両面にグラフェンをCVD成長させる。
2.PMMAなどの保護高分子層でグラフェン/Cu箔の片面をコーティングする。
3.グラフェン/Cu箔のもう一方の面からグラフェンを取り除く。
4.湿式化学エッチングで銅を取り除き、洗浄して洗い流す。
5.湿った状態で対象基板に保護層/グラフェンを生成して、乾かす。
6.アセトンなどの溶媒を用いて、または、熱処理によって保護層を取り除く。
7.対象基板上のグラフェンを熱アニール処理して、密着性をよくする。
Claims (13)
- 各電極対がソース電極とドレイン電極とを含む、アレイ状に配列された複数の電極対と、
前記アレイ状の複数の電極対全体に延在するように配列され、各電極対の前記ソース電極および前記ドレイン電極と電気的に接し、複数のセンサからなるアレイを作成する共通導電層または共通半導電層とを備え、
前記共通導電層または前記共通半導電層は途切れがなく前記複数のセンサにわたって実質的にパターン化されておらず、
各センサがソース電極とドレイン電極と前記共通導電層または共通半導電層の一部で形成されたチャネルとを有し、前記ソース電極および前記ドレイン電極のいずれか一方が前記チャネルに注入する荷電キャリアの流れを受け取り、他方が前記チャネルからの前記荷電キャリアの流れに対する電流シンクとなり、前記ソース電極と前記ドレイン電極とは細長く、前記チャネルのチャネル幅は前記ソース電極および/または前記ドレイン電極の長手方向範囲で定義され、前記チャネルのチャネル長は前記ソース電極と前記ドレイン電極との間隔によって定義され、
各センサの前記ソース電極および前記ドレイン電極のいずれか一方が、実質的に途切れのないセンサ境界であって、各センサの他方の電極を実質的に取り囲むセンサ境界を少なくとも前記チャネル幅に沿って形成し、
前記共通導電層または前記共通半導電層は、
2次元材料の単一層、
2次元材料の二層、
2次元材料の複数層から選択された2次元材料を含む
装置。 - 前記共通導電層または前記共通半導電層は、機能変換層と対応付けられている
請求項1に記載の装置。 - 各センサは、前記ドレイン電極および前記ソース電極間の前記チャネルの導電率を調整するように配列されたゲート電極を備え、誘電材料が前記ゲート電極と前記共通導電層または前記共通半導電層との間に配置される
請求項1または2に記載の装置。 - 前記実質的に途切れのないセンサ境界を形成する前記電極は、前記アレイ内のセンサ全てまたはセンササブセットに対する共通電極を備える
請求項1〜3のいずれかに記載の装置。 - 前記実質的に途切れのないセンサ境界を形成する前記電極は、前記アレイ内の各センサの境界を規定する格子状に配列される
請求項4に記載の装置。 - 前記アレイ内の各センサの前記ソース電極、前記ゲート電極、および、前記ドレイン電極は、電界効果トランスデューサ(FET)の一部として構成される
請求項3に記載の装置。 - 前記複数のセンサは基板上に形成され、前記共通導電層は前記基板の第一面に位置し、前記アレイ内の複数のセンサの出力を読み取る読み出し回路は、
前記第一面に対向する前記基板の第二面に配置されて、貫通ビアを介して前記複数のセンサと相互接続されるか、
前記複数のセンサの下方にある前記基板に埋め込まれて、前記アレイの前記ソース電極、および、前記ドレイン電極と接続されるか、または、
別個の基板上に配置されて、電気接続により前記アレイと接続される
請求項1〜6のいずれかに記載の装置。 - 前記共通導電層または前記共通半導電層はグラフェンである
請求項1〜7のいずれかに記載の装置。 - 前記機能変換層は、
リガンドでカプセル化されたコロイド量子ドットの層、
導体または半導体ナノ結晶の層、
圧電材料、
焦電膜、
生化学種
から選択される
請求項2に記載の装置。 - 前記ソース電極は、境界部と、前記境界部から内側へ延在する1以上のフィンガー部とを備え、
前記アレイの1以上のセンサに対して、前記ソース電極の1以上のフィンガー部と互いに入り込むように設けられる1以上のフィンガー部を形成するように前記1以上のセンサの前記ドレイン電極および前記ゲート電極を配列する
請求項3に記載の装置。 - 第1センサ電極は前記ソース電極と前記ゲート電極との間に延在し、第2センサ電極は前記ゲート電極と前記ドレイン電極との間に延在し、
前記読み出し回路は、センサごとに前記ソース電極、前記ドレイン電極、前記第1センサ電極、および、前記第2センサ電極からの電気的パラメータの測定結果を用いて各センサの検知値を検出する
請求項3に従属する場合の請求項7に記載の装置。 - 各電極対がソース電極とドレイン電極とを含む、アレイ状に配列された複数の電極対を受け取るステップと、
前記アレイ状の複数の電極対全体に延在するように配列され、各電極対の少なくとも前記ソース電極および前記ドレイン電極と電気的に接し、複数のセンサからなるアレイを作成する共通導電層または共通半導電層を生成するステップとを含み、
前記共通導電層または前記共通半導電層は途切れがなく前記複数のセンサにわたって実質的にパターン化されておらず、
各センサがソース電極とドレイン電極と前記共通導電層または共通半導電層の一部で形成されたチャネルとを有し、前記ソース電極および前記ドレイン電極のいずれか一方が前記チャネルに注入する荷電キャリアの流れを受け取り、他方が前記チャネルからの前記荷電キャリアの流れに対する電流シンクとなり、前記ソース電極と前記ドレイン電極とは細長く、前記チャネルのチャネル幅は前記ソース電極および/または前記ドレイン電極の長手方向範囲で定義され、前記チャネルのチャネル長は前記ソース電極と前記ドレイン電極との間隔によって定義され、
各センサの前記ソース電極および前記ドレイン電極のいずれか一方が、実質的に途切れのないセンサ境界であって、各センサの他方の電極を実質的に取り囲むセンサ境界を少なくとも前記チャネル幅に沿って形成し、
前記共通導電層または前記共通半導電層は、
2次元材料の単一層、
2次元材料の二層、
2次元材料の複数層から選択された2次元材料を含む
装置形成方法。 - 前記共通導電層または前記共通半導電層を生成するステップの後に、
機能変換層を前記共通導電層または前記共通半導電層に生成するステップを含む
請求項12に記載の方法。
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