JP6645164B2 - Power converter - Google Patents

Description

  The present invention relates to a power converter.

  For a semiconductor module that controls a large amount of power, such as an IGBT (Insulated Gate Bipolar Transistor) mounted on a power converter, cooling efficiency is generally improved by directly screwing to a heat sink. is there. More specifically, the mounting screws are fastened to the screw fastening holes of the heat sink through the screw insertion holes provided in the screw fastening portions of the semiconductor module, so that they are in close contact with each other, and the heat generated in the semiconductor module is efficiently removed by the heat sink. (For example, see Patent Document 1).

Japanese Patent No. 4780349

  By the way, in a state where the semiconductor module is mounted on the circuit board, a through hole is necessary in the circuit board when fastening the mounting screw to the heat sink. That is, it is necessary to insert a mounting screw from a through hole formed in the circuit board and fasten the mounting screw to the heat sink through the screw insertion hole of the semiconductor module. However, there is a gap between the circuit board and the heat sink by the height of the semiconductor module. For this reason, in the gap from the circuit board to the heat sink, it is difficult to hold the mounting screw, and the work of fastening the mounting screw becomes complicated. Specifically, there is a possibility that the mounting screw that is to be fastened may fall into the housing from the gap between the circuit board and the heat sink. In addition, when the mounting screws fall off, the work of collecting the screws from the inside of the housing must be performed, and the working efficiency is significantly impaired.

  The above-mentioned problem can be solved by applying the mounting screws longer than the gap between the circuit board and the heat sink and increasing the thickness of the base member of the heat sink according to the length of the mounting screws. It is. However, in this case, a new problem that work efficiency is impaired due to an increase in the time required to fasten the mounting screw is caused.

  The above-described problem is not limited to the case where the semiconductor module mounted on the circuit board is connected to the heat sink. That is, in the case of an electronic component mounted on a plate member, such as a capacitor mounted on a bus bar plate, the same applies to a case where the mounting screw is fastened from a through hole of the plate member and connected to a connection target such as a mounting board. It can happen.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a power conversion device capable of facilitating an operation for connecting an electronic component mounted on a plate member to a connection target.

  In order to achieve the above object, a power conversion device according to the present invention forms a through hole in a plate member on which an electronic component is mounted, and connects the through hole of the plate member to a connection target via a screw fastening portion of the electronic component. In a power converter configured to connect between the electronic component and the connection target by fastening a mounting screw, the mounting screw may be provided between a through hole of the plate member and a screw fastening portion of the electronic component. Is provided.

  Further, the present invention provides the power conversion device described above, wherein the electronic component is mounted on a circuit board, and is connected to a heat sink by fastening the mounting screw via the screw fastening portion. The guide member is provided between a through hole formed in the circuit board and a screw fastening portion of the semiconductor module.

  Further, in the above-described power conversion device, the electronic component may include a bus bar plate connected to a terminal, a fixed band wound around an outer peripheral portion, and the mounting screw screwed through a screw fastening portion of the fixed band. A capacitor that is connected to a mounting board by being fastened, wherein the guide member is provided between a through hole formed in the bus bar plate and a screw fastening portion of the fixed band.

  Further, according to the present invention, in the above-described power conversion device, the guide member is formed in a tubular shape, and the guide member is attached to the through hole of the plate member in a state where the distal end surface is in contact with a screw fastening portion of the electronic component. It is characterized by.

  Further, according to the present invention, in the above-described power conversion device, the guide member may have a stopper portion that comes into contact with the surface of the plate member when the distal end surface is brought into contact with a screw fastening portion of the electronic component. Features.

  Further, according to the present invention, in the above-described power conversion device, the guide member has a slit formed in the axial direction from a base end.

  Further, according to the present invention, in the above-described power converter, the guide member has an inner diameter smaller than a length of the mounting screw along an axial direction.

  According to the present invention, since the guide member for guiding the mounting screw is provided between the through hole of the plate member and the screw fastening portion of the electronic component, the mounting screw drops in the gap between the plate member and the connection target. There is no danger of inviting situations. Therefore, it is not necessary to use a mounting screw having a large length in the axial direction, and the operation for screwing the electronic component to the connection target can be facilitated.

FIG. 1 is a perspective view illustrating an appearance of a power conversion device according to Embodiment 1 of the present invention. FIG. 2 is an exploded perspective view of a main part of the power converter shown in FIG. FIG. 3 is a perspective view of a circuit board applied to the power converter shown in FIG. FIG. 4 is a sectional side view of the power converter shown in FIG. FIG. 5 is an exploded cross-sectional side view of the power conversion device shown in FIG. FIG. 6 is a perspective view of a guide member applied to the power converter shown in FIG. FIG. 7 is a perspective view of a support plate applied to the power converter shown in FIG. FIG. 8 is a perspective view of a frame member constituting a ventilation part of the power converter shown in FIG. FIG. 9 is a perspective view illustrating an appearance of a power conversion device according to Embodiment 2 of the present invention. FIG. 10 is a sectional side view of the power converter shown in FIG. FIG. 11 is a perspective view showing an assembled state of a capacitor, a mounting board, and a bus bar plate applied to the power converter shown in FIG. FIG. 12 is an exploded perspective view of a capacitor, a mounting board, and a busbar plate applied to the power converter shown in FIG. FIG. 13 is an exploded cross-sectional side view of a capacitor, a mounting board, and a busbar plate applied to the power converter illustrated in FIG. 9. FIG. 14 is a cross-sectional view showing an assembled state of the capacitor, the mounting board, and the busbar plate applied to the power converter shown in FIG.

  Hereinafter, preferred embodiments of a power conversion device according to the present invention will be described in detail with reference to the accompanying drawings.

(Embodiment 1)
1 and 2 show a power converter according to a first embodiment of the present invention. The power converter illustrated here is for converting an AC voltage supplied from a commercial power supply into a desired frequency and amplitude, and then supplying the converted voltage to a load such as a motor. In the first embodiment, the accommodating portion 1A for accommodating the circuit boards (plate members) 10A and 10B therein, and the semiconductor module (electronic component) 11 such as an IGBT and the capacitor 12 which are components of the power converter are cooled. Power conversion device provided with a ventilation section 1 </ b> B.

  The accommodation section 1A is a space formed between the main body plate 1a and the support plate 2 provided so as to cover the main body plate 1a. The main body plate 1a constitutes a part of the outer shell of the power conversion device 1, and is configured to have a substantially rectangular flat plate shape made of a resin material. On the inner surface side of the main body plate 1a, two circuit boards 10A and 10B having different sizes from each other are supported in a state of being mutually laminated. As shown in FIGS. 2, 3, and 4, a circuit board having a large external dimension (hereinafter, referred to as a main circuit board 10A) is formed in a rectangular shape slightly smaller than the main body plate 1a. It is arranged facing the inner surface. A circuit board having a small external dimension (hereinafter, referred to as a sub-circuit board 10B) has a width almost half of that of the main body plate 1a, and is disposed in a right half of the main body plate 1a in FIG. I have. On the sub-circuit board 10B, mainly the heat-generating components such as the semiconductor module 11 and the capacitor 12 described above are collectively mounted. Although not explicitly shown in the figure, the main circuit board 10A and the sub-circuit board 10B are electrically connected to each other and constitute a control circuit required for power conversion.

  As shown in FIG. 3, the semiconductor module 11 applied in the first embodiment has a substantially rectangular parallelepiped shape, and has screw fastening portions 11a on upper and lower side surfaces that are parallel to each other. The screw fastening portion 11a is a tongue-shaped portion protruding from an edge located on the side of the heat radiation surface 11b separated from the sub-circuit board 10B on the side surface of the semiconductor module 11. Each of the screw fastening portions 11a is provided with a screw insertion hole 11c for inserting the mounting screw B. As shown in FIGS. 3 to 5, the main circuit board 10 </ b> A and the sub-circuit board 10 </ b> B each have a through hole 10 a at a portion facing the screw insertion hole 11 c of the semiconductor module 11. The through-hole 10a is a circular opening having a larger inner diameter than the screw insertion hole 11c, and has a guide member 20 inside each.

  4 to 6, the guide member 20 is a cylindrical insulating resin member having a bottom wall 21 at the tip. The guide member 20 is disposed in the through-hole 10a of the main circuit board 10A and the sub-circuit board 10B in a state where the bottom wall 21 having the screw insertion hole 21a is in contact with the screw fastening portion 11a of the semiconductor module 11. . The inner diameter of the guide member 20 is set smaller than the length of the mounting screw B along the axial direction. The guide member 20 has a plurality of slits 22 and stopper portions 23. The slit 22 is formed along the axial direction from the base end opening of the guide member 20, and divides the base end of the guide member 20 into four parts in the circumferential direction. The stopper portion 23 is a protruding portion that protrudes from the outer peripheral surface of the guide member 20 toward the outer periphery. When the bottom wall 21 is brought into contact with the screw fastening portion 11a of the semiconductor module 11, the stopper portion 23 of the guide member 20 has a surface facing the main plate 1a of the main circuit board 10A and a main circuit board of the sub-circuit board 10B. It is formed at a position in contact with the surface facing 10A.

  The support plate 2, as shown in FIGS. 2, 4 and 7, is a resin molded product having a size that covers the main body plate 1a. The support plate 2 is provided with a capacitor accommodating portion 2 a at a portion corresponding to the capacitor 12 and a communication hole 2 b at a portion corresponding to the semiconductor module 11. The capacitor accommodating portion 2a is for individually accommodating the individual capacitors 12 mounted on the sub-circuit board 10B. Although not explicitly shown in the drawing, the capacitor housing portion 2a is formed in a bottomed cylindrical shape that is opened only on the opposing surface of the support plate 2 facing the main body plate 1a. The communication hole 2b is a substantially rectangular opening having a smaller outer shape than a heat receiving surface 30a of a heat sink (target to be connected) 30 described later, while the semiconductor module 11 can be inserted therethrough. Around the communication hole 2b, a seal groove 2c is provided on the back surface side that is not opposed to the main body plate 1a. The seal groove 2 c is a recess for accommodating the endless sealing material 3.

  As is clear from FIG. 2, the support plate 2 is provided with a partition wall portion 2d so as to divide the back surface into two right and left sides, and a ventilation plate portion is provided on the upper edge portion of the right half in FIG. 2e is provided. The partition wall 2d is a plate-like member that stands upright so as to be substantially perpendicular to the main body plate 1a. The ventilation plate portion 2e is a flat plate member having a large number of ventilation holes 2f, and is provided so as to cover the upper right half of the support plate 2 in FIG.

  The ventilation section 1B is a rectangular tube-shaped space formed between the support plate 2 and the frame member 4 and extending in the up-down direction. The upper end opening of the ventilation portion 1B is in a state of being covered by the ventilation plate portion 2e provided on the support plate 2. The frame member 4 is formed of a high heat conductive material having good heat conductivity, such as aluminum or an aluminum alloy. As shown in FIGS. 2 and 8, the frame member 4 has a main plate portion 4a, a side plate portion 4b, and an auxiliary side plate portion 4c. The main plate portion 4a has an outer dimension capable of covering a portion of the support plate 2 located on the right side of the partition wall portion 2d. On the inner surface of the main plate portion 4a facing the support plate 2, a large number of fin fitting grooves 4d are provided along the vertical direction. The side plate portion 4b is a portion extending in a direction substantially perpendicular to the support plate 2 from one edge of the main plate portion 4a. The side plate portion 4b is configured to be disposed to face the partition wall portion 2d of the support plate 2 when the main plate portion 4a faces the support plate 2. The auxiliary side plate portion 4c is a portion that extends in a direction substantially perpendicular to the support plate 2 from the other edge of the main plate portion 4a. As is clear from the drawing, the auxiliary side plate portion 4c is configured to have a smaller extension length from the main plate portion 4a than the side plate portion 4b. The auxiliary side plate portion 4c is configured to be overlapped on the partition wall portion 2d when the main plate portion 4a faces the support plate 2.

  A ventilation fan 40 and a heat sink 30 are provided on the inner surface of the frame member 4. As shown in FIG. 2, the ventilation fan 40 is provided at the lower end of the inner surface of the frame member 4. When the ventilation fan 40 is driven, the ventilation fan 40 operates to introduce external air into the ventilation section 1B through the ventilation holes 2f of the ventilation plate section 2e, while discharging the air of the ventilation section 1B from the opening at the lower end. Things.

  The heat sink 30 is formed of a high heat conductive material having good heat conductivity, such as aluminum or an aluminum alloy, like the frame member 4. In the first embodiment, a heat sink 30 having a flat heat receiving surface 30a on one surface of a base member and a number of cooling fins 30b standing on the other surface is applied. The heat receiving surface 30a of the heat sink 30 is formed in a rectangular shape large enough to contact the entire circumference of the seal member 3 housed in the seal groove 2c of the support plate 2. The heat sink 30 is attached to the frame member 4 while being thermally connected to the frame member 4 by fitting the distal ends of the cooling fins 30b into the fin fitting grooves 4d of the main plate portion 4a. The position where the heat sink 30 is attached to the frame member 4 covers the communication hole 2b of the support plate 2 when the main plate portion 4a is opposed to the support plate 2, and the entirety of the sealing material 3 on the peripheral edge of the heat receiving surface 30a. This is the position where the circumferences face each other.

  As shown in FIG. 8, a pair of screw fastening holes 30c is provided on the heat receiving surface 30a of the heat sink 30. The screw fastening holes 30c are provided corresponding to the screw insertion holes 11c of the screw fastening portions 11a provided in the semiconductor module 11. As shown in FIG. 4, mounting screws B are provided in the screw fastening holes 30 c of the heat sink 30 through the through holes 10 a of the main circuit board 10 A, the through holes 10 a of the sub circuit board 10 B, and the screw insertion holes 11 c of the semiconductor module 11. Has been concluded. The mounting screw B has a function of bringing the heat-dissipating surface 11b of the semiconductor module 11 into close contact with the heat-receiving surface 30a of the heat sink 30 and a function of bringing the sealing material 3 of the support plate 2 into close contact with the heat-receiving surface 30a of the heat sink 30. .

  The power converter 1 configured as described above is installed with, for example, the ventilation section 1B exposed outside the room. The support plate 2 separates the accommodation section 1A accommodating the main circuit board 10A and the sub-circuit board 10B from the ventilation section 1B exposed outside. Therefore, even when water such as rainwater enters the ventilation section 1B, there is no risk of affecting the control circuits and electronic components mounted on the main circuit board 10A and the sub-circuit board 10B.

  When the ventilation fan 40 is driven in the above-described installation state, external air is introduced into the ventilation unit 1B through the ventilation holes 2f of the ventilation plate unit 2e. After the air introduced into the ventilation part 1B exchanges heat with the condenser housing part 2a and the heat sink 30 sequentially, it is discharged from the opening at the lower end to the outside of the ventilation part 1B. Therefore, heat generated in the capacitor 12 and the semiconductor module 11 when the power converter 1 is operating is radiated by the air passing through the ventilation part 1B through the capacitor housing part 2a and the heat sink 30. The influence of heat on the electronic components mounted on the main circuit board 10A and the sub-circuit board 10B can be prevented. In particular, with respect to the semiconductor module 11, since the heat-dissipating surface 11 b can be in close contact with the heat-receiving surface 30 a of the heat sink 30 by the mounting screw B, a high heat-dissipating effect can be expected by the heat sink 30.

  Moreover, in the above-described power conversion device 1, since the guide member 20 is provided in the through-hole 10a provided in the main circuit board 10A and the sub-circuit board 10B, the work when fastening the mounting screw B is extremely easy. Become. That is, since the mounting screw B is guided to the screw fastening portion 11a of the semiconductor module 11 by the guide member 20, there is no possibility that the mounting screw B will fall off in the middle. Furthermore, since the inner diameter of the guide member 20 is set smaller than the length of the mounting screw B along the axial direction, there is no possibility that the mounting screw B will fall or change direction in the middle. . Therefore, as long as a tool is inserted together with the mounting screw B into the guide member 20, the mounting screw B can be reliably guided to the screw fastening hole 30c of the heat sink 30 and can be fastened.

  After the fastening screw B is fastened, the stopper 23 provided on the guide member 20 comes into contact with the surfaces of the main circuit board 10A and the sub-circuit board 10B. For this reason, the main circuit board 10A and the sub-circuit board 10B are supported by the stopper portion 23, so that problems such as bending of the circuit boards 10A and 10B do not occur. Furthermore, since the guide member 20 is provided with the slit 22, the stopper 23 supporting the sub-circuit board 10B passes through the through-hole 10a of the main circuit board 10A when the guide member 20 is inserted into the through-hole 10a. It doesn't hinder you when.

  In the above-described first embodiment, the guide member 20 is provided over the main circuit board 10A and the sub-circuit board 10B, but the guide member 20 does not necessarily need to be provided at a portion extending over the plurality of circuit boards 10A and 10B. . The semiconductor module 11 to which the mounting screw B is fastened does not necessarily need to be an IGBT, and may be another heat-generating electronic component.

(Embodiment 2)
9 and 10 show a power converter according to a second embodiment of the present invention. The power converter 1 'exemplified here is for converting an AC voltage supplied from a commercial power supply to a desired frequency and amplitude and then supplying the converted AC voltage to a load such as a motor, as in the first embodiment. The body 50 is provided. The main body housing 50 is formed in a rectangular parallelepiped shape having an open back surface, and a semiconductor module 61 such as an IGBT and a plurality of capacitors (electronic components) 62 are provided inside the mounting case 60 via a sheet metal mounting board (connection target) 60. It is set up. The second embodiment particularly exemplifies a power conversion device 1 ′ including six cylindrical capacitors (electrolytic capacitors) 62. Ventilation holes 51 are provided on the upper surface and the lower surface of the main body housing 50, respectively, and a ventilation fan 52 is provided inside the main body housing 50. The ventilation fan 52 introduces external air into the main body housing 50 through the ventilation holes 51 when driven. Reference numeral 53 in FIG. 10 denotes a heat sink for releasing heat generated in the semiconductor module 61.

  The mounting board 60 is a flat member provided inside the main body housing 50 so as to be parallel to the front surface of the main body housing 50. As shown in FIGS. 11 and 12, the mounting board 60 is provided with mounting holes 60a at positions where the capacitors 62 are mounted, and two screw fastening holes 60b corresponding to each mounting hole 60a. It is provided. The mounting holes 60a are circular notches through which the capacitors 62 can be inserted, and are arranged in two rows of three in the left-right direction. The two screw fastening holes 60b are provided at positions shifted from each other by 180 ° around the mounting hole 60a.

  The capacitor 62 has two positive and negative terminals 62b and 62c on one end surface of a cylindrical capacitor body 62a. In each of the capacitors 62, a fixed band 63 is wound around a capacitor body 62a, and different bus bar plates (plate members) 64, 65 are connected to the respective terminals 62b, 62c.

  As shown in FIGS. 13 and 14, the fixed band 63 is a band-shaped metal annular member, and is attached around the capacitor main body 62a. Each of the fixing bands 63 is provided with two screw fastening portions 63a. The screw fastening portion 63a is a tongue-shaped portion provided so as to protrude from the peripheral surface of the capacitor main body 62a, and extends along a direction orthogonal to the central axis of the capacitor main body 62a. A screw insertion hole 63b is formed in each screw fastening portion 63a along the central axis of the capacitor main body 62a.

  A bus bar plate (hereinafter, referred to as a first terminal 62b and a first bus bar plate 64) connected to one terminal 62b has a first window hole 64a and a first through hole 64b at a portion corresponding to each capacitor 62. have. The first window hole 64a is for exposing the other terminal of the capacitor 62 (hereinafter, referred to as a second terminal 62c for distinction) to the outside when the first bus bar plate 64 is connected to the terminal 62b of the capacitor 62. It is a notch and is formed in a rectangular shape so as to include one screw fastening hole 60b of the mounting board 60. The first through hole 64b is a circular opening formed at a position corresponding to the other screw fastening hole 60b of the mounting board 60 on the outer periphery of the capacitor main body 62a.

  The bus bar plate (hereinafter, referred to as a second bus bar plate 65 for distinction) connected to the second terminal 62c has a second window hole 65a and a second through hole 65b at a portion corresponding to each capacitor 62. . The second window hole 65a is a notch for exposing the first terminal 62b and the first through hole 64b to the outside when the second bus bar plate 65 is connected to the second terminal 62c of the capacitor 62, and has a rectangular shape. It is formed in. The second through-hole 65b is a circular opening formed at a position corresponding to the screw fastening hole 60b of the mounting board 60 on the outer periphery of the capacitor main body 62a.

  In each of the bus bar plates 64 and 65, a guide member 70 is disposed in the first through hole 64b and the second through hole 65b. The guide member 70 is a cylindrical insulating resin member having a center hole 70a. A stopper 71 is provided on the outer peripheral surface of the base end of the guide member 70. The stopper portion 71 has an outer diameter larger than the inner diameter of the through-holes 64b and 65b. Each of the guide members 70 has the distal end surface thereof in contact with the screw fastening portion 63a of the fixing band 63 and the stopper portion 71 in contact with the peripheral edges of the openings 64b, 65b. The through holes 64b and 65b are provided. The inner diameter of the guide member 70 is set smaller than the length of the mounting screw B to be applied along the axial direction.

  In the capacitor 62 having the above-described configuration, the capacitor main body 62a is inserted into the mounting hole 60a of the mounting board 60, and the mounting screw B is fastened to the screw fastening hole 60b of the mounting board 60 via the screw fastening portion 63a of the fixing band 63. As a result, it is attached to the main housing 50 via the attachment board 60.

  Here, also in the power converter 1 ′ of the second embodiment, the guide member 70 is disposed between the through holes 64 b, 65 b of the bus bar plates 64, 65 and the screw fastening portion 63 a of the fixing band 63. . Therefore, there is no danger that the mounting screw B will drop off in the middle when the mounting screw B is fastened to the screw fastening hole 60b of the mounting board 60 via the screw fastening portion 63a, and the fastening operation of the mounting screw B can be performed extremely easily. Can be. Further, since the inner diameter of the guide member 70 is set to be smaller than the length of the mounting screw B along the axial direction, the mounting screw B does not fall down or change direction in the middle. . As a result, as long as the tool is inserted together with the mounting screw B into the guide member 70, the mounting screw B can be surely guided to the screw fastening hole 60b of the mounting substrate 60 and can be fastened.

  In the above-described first and second embodiments, the guide member has a cylindrical shape, but may have a polygonal cylindrical shape. Further, a mesh-like or lattice-like guide member may be applied as long as the attachment screw B can be prevented from dropping around. Further, the guide member does not necessarily need to be an independent member. For example, the guide member 20 may be provided on the screw fastening portion 11a of the semiconductor module 11, or the guide member may be provided on the screw fastening portion 63a of the fixing band 63.

10B Circuit board 10a Through hole 11 Semiconductor module 11a Screw fastening portion 20 Guide member 21 Bottom wall 22 Slit 23 Stopper portion 30 Heat sink 30c Screw fastening hole 60 Mounting board 60b Screw fastening hole 62 Capacitor 63 Fixed band 63a Screw fastening portion 63b Screw insertion hole 64 First bus bar plate 64b First through hole 65 Second bus bar plate 65b Second through hole 70 Guide member B Mounting screw

Claims (5)

A through hole is formed in the plate member on which the electronic component is mounted, and a mounting screw is fastened from the through hole of the plate member to a connection target via a screw fastening portion of the electronic component, whereby the electronic component and the connection target are connected. In a power converter that is designed to connect between
A guide member for guiding the mounting screw is provided between a through hole of the plate member and a screw fastening portion of the electronic component ,
The guide member has a cylindrical shape, and is mounted on the through hole of the plate member in a state where a distal end surface is in contact with a screw fastening portion of the electronic component. A power converter having a slit formed .   The guide member is provided with stopper portions at two different positions in the axial direction, the stopper portions being in contact with the surface of the plate member when the front end surface is in contact with the screw fastening portion of the electronic component. The power converter according to claim 1. The electronic component is a semiconductor module mounted on a circuit board, and connected to a heat sink by fastening the mounting screw via the screw fastening portion,
The power converter according to claim 1, wherein the guide member is provided between a through hole formed in the circuit board and a screw fastening portion of the semiconductor module. The electronic component has a capacitor connected to a mounting board by connecting a bus bar plate to a terminal, winding a fixing band around an outer peripheral portion, and fastening the mounting screw through a screw fastening portion of the fixing band. And
The power converter according to claim 1, wherein the guide member is provided between a through hole formed in the bus bar plate and a screw fastening portion of the fixing band.   The power converter according to claim 1, wherein the guide member has an inner diameter smaller than a length of the mounting screw along the axial direction.

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