CN105991043A - A power conversion device - Google Patents
A power conversion device Download PDFInfo
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- CN105991043A CN105991043A CN201610140949.0A CN201610140949A CN105991043A CN 105991043 A CN105991043 A CN 105991043A CN 201610140949 A CN201610140949 A CN 201610140949A CN 105991043 A CN105991043 A CN 105991043A
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- Prior art keywords
- screw
- hole
- power inverter
- guiding elements
- electronic component
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A power conversion device allowing an electronic component to be mounted on a plate part to be easily connected to a connection object is provided. A through hole (10a) is formed in a circuit substrate (10B) on which a semiconductor module (11) is mounted so that a mounting screw (B) is connected to a radiator (30) from the through hole (10a) through a screw fixing part (11a) of the semiconductor module (11). A cylindric guide part (20) for guiding the mounting screw (B) is disposed between the through hole (10a) of the circuit substrate (10B) and the screw fixing part (11a) of the semiconductor module (11).
Description
Technical field
The present invention relates to a kind of power inverter.
Background technology
With regard to IGBT (the Insulated Gate Bipolar being mounted in power inverter
Transistor, insulated gate bipolar transistor) etc. control the semiconductor module of bigger electric power like that,
In general, by this semiconductor module is directly threadedly secured in improve on radiator cooling effect
Rate.Specifically, installation screw is made to lead to via the screw of the screw fixed part being arranged at semiconductor module
The screw fixed hole of hole and radiator is fixed, so that semiconductor module closely connects to each other with radiator
Close, the heat that semiconductor module produces is delivered to radiator (referring for example to patent document 1) efficiently.
Prior art literature
Patent document
Patent document 1: No. 4780349 publications of Japanese Patent No.
Make installation screw in addition, work as and dissipate in the state of being installed to semiconductor module on circuit substrate
In the case that hot device is fixed, circuit substrate needs to be provided with through hole.That is, it needs to from being formed at circuit base
Through hole on plate inserts installs screw, makes installation screw via the screwing through hole of semiconductor module and heat radiation
Device is fixed.But, the amount pair of the height of existence and semiconductor module between circuit substrate and radiator
The gap answered.Therefore, in the gap from circuit substrate to radiator, it is difficult to keep screw is installed,
The fixed operation installing screw becomes numerous and diverse.Specifically, it is desirable to fixing installation screw may be from electricity
It is shed to the inside of framework in the gap of base board and radiator.And, toner screw is being installed
In the case of, it is necessary to carry out the operation of internal recovering from framework, hence it is evident that affect operating efficiency.
By the use installation screw longer than the length of circuit substrate and the gap of radiator, and according to
The thickness of slab of the base component of the length increase radiator of screw is installed, can solve the problem that above-mentioned problem.But
It is in this case, to result in new problem, i.e. till installation screw is fixed
Time lengthening, makes operating efficiency be affected.
In addition, the problems referred to above are not limited to semiconductor module and the heat radiation making to be arranged on circuit substrate
The situation that device connects.That is, as long as be mounted in plate as capacitor of being arranged on bus bar plate etc.
Installation screw will be fixed and and installation base plate by the electronic component on component with the through hole from board member
Similarly there are the problems referred to above in situation about connecting Deng connecting object.
Content of the invention
The present invention is in view of above-mentioned actual conditions, it is therefore intended that provide one can make to be arranged on board member
Operation power inverter easy to perform when being connected with connecting object for the electronic component.
In order to achieve the above object, the power inverter of the present invention is being provided with the plate structure of electronic component
It is formed with through hole on part, make installation screw from the through hole of above-mentioned board member via the spiral shell of above-mentioned electronic component
Nail fixed part is connected with connecting object, thus will be connected between above-mentioned electronic component with above-mentioned connecting object,
It is characterized in that, from the through hole of above-mentioned board member to the screw fixed part of above-mentioned electronic component arrange
There is the guiding elements guiding above-mentioned installation screw.
In addition, the present invention is on the basis of above-mentioned power inverter, it is characterised in that above-mentioned electronics
Part is mounted on circuit substrate, and carries out above-mentioned installation screw via above-mentioned screw fixed part
Fixing, thus the semiconductor module being connected with radiator, from the through hole being formed at foregoing circuit substrate
It is provided with above-mentioned guiding elements between the screw fixed part of above-mentioned semiconductor module.
In addition, the present invention is on the basis of above-mentioned power inverter, it is characterised in that above-mentioned electronics
Part is to be connected with bus bar plate at terminal, and is wound with fixed band at peripheral part, fixes via above-mentioned
Above-mentioned installation screw is fixed by the screw fixed part of band, thus the capacitor being connected with installation base plate,
It is provided with above-mentioned from the through hole being formed at above-mentioned bus bar plate to the screw fixed part of above-mentioned fixed band
Guiding elements.
In addition, the present invention is on the basis of above-mentioned power inverter, it is characterised in that above-mentioned guiding
Component is formed as tubular, pacifies in the state of front end face abuts with the screw fixed part of above-mentioned electronic component
It is contained in the through hole of above-mentioned board member.
In addition, the present invention is on the basis of above-mentioned power inverter, it is characterised in that above-mentioned guiding
Component has stopper section, in the case of making front end face abut with the screw fixed part of above-mentioned electronic component,
Above-mentioned stopper section abuts with the surface of above-mentioned board member.
In addition, the present invention is on the basis of above-mentioned power inverter, it is characterised in that above-mentioned guiding
Component has the slit being axially formed from base end part.
In addition, the present invention is on the basis of above-mentioned power inverter, it is characterised in that above-mentioned guiding
Component has the internal diameter less than the length vertically of above-mentioned installation screw.
Use the present invention, owing to arranging the screw fixed part from the through hole of board member to electronic component
Have guide install screw guiding elements, therefore can not cause install screw board member be connected right
The state of affairs coming off in the gap of elephant.Thus, it is also required for the bigger installation screw of axial length,
Operation when can make to be screwed on electronic component connecting object is easily carried out.
Brief description
Fig. 1 is the stereogram of the outward appearance of the power inverter representing embodiment of the present invention 1.
Fig. 2 is the major part exploded perspective view of the power inverter shown in Fig. 1.
Fig. 3 is the stereogram applying the circuit substrate in the power inverter shown in Fig. 1.
Fig. 4 is the sectional view of the power inverter shown in Fig. 1.
Fig. 5 is by the sectional view of the power inverter exploded representation shown in Fig. 1.
Fig. 6 is the stereogram applying the guiding elements in the power inverter shown in Fig. 1.
Fig. 7 is the stereogram applying the support plate in the power inverter shown in Fig. 1.
Fig. 8 is the stereogram of the framing component of the ventilation unit of the power inverter shown in pie graph 1.
Fig. 9 is the stereogram of the outward appearance of the power inverter representing embodiment of the present invention 2.
Figure 10 is the sectional view of the power inverter shown in Fig. 9.
Figure 11 be represent the capacitor applied in the power inverter shown in Fig. 9, installation base plate with
And the stereogram of the assembled state of bus bar plate.
Figure 12 is the capacitor applied in the power inverter shown in Fig. 9, installation base plate and mother
The exploded perspective view of line plate.
Figure 13 is the capacitor applied in the power inverter shown in Fig. 9, installation base plate and mother
The exploded side sectional view of line plate.
Figure 14 be represent the capacitor applied in the power inverter shown in Fig. 9, installation base plate with
And the sectional view of the assembled state of bus bar plate.
(symbol description)
10B ... circuit substrate
10a ... through hole
11 ... semiconductor module
11a ... screw fixed part
20 ... guiding elements
21 ... diapire
22 ... slit
23 ... stopper section
30 ... radiator
30c ... screw fixed hole
60 ... installation base plate
60b ... screw fixed hole
62 ... capacitor
63 ... fixed band
63a ... screw fixed part
63b ... screwing through hole
64 ... the first bus bar plate
64b ... the first through hole
65 ... the second bus bar plate
65b ... the second through hole
70 ... guiding elements
B ... install screw
Detailed description of the invention
Hereinafter, referring to the drawings the preferable embodiment of the power inverter of the present invention is carried out in detail
Explanation.
(embodiment 1)
Fig. 1 and Fig. 2 represents the power inverter of embodiment of the present invention 1.The electric power illustrating at this
Conversion equipment for by from the alternating voltage that source power supply supplies after being converted to desired frequency and amplitude
It is supplied to motor even load.In present embodiment 1, illustration is to include resettlement section 1A and ventilation
The power inverter of portion 1B, above-mentioned resettlement section 1A contain in inside circuit substrate (board member) 10A,
10B, above-mentioned ventilation unit 1B are for by the constituent part of power inverter, the i.e. semiconductor modules such as IGBT
Block (electronic component) 11 and capacitor 12 cool down.
Resettlement section 1A is the space constituting between main board 1a and support plate 2, above-mentioned support plate 2
It is set to cover main board 1a.Main board 1a constitutes a part for the profile of power inverter 1, and
Utilize the tabular that resin material is formed as a generally rectangular.Two circuit substrates differing in size from one another
10A, 10B with the state support that is layered on top of each other in the inner surface side of this main board 1a.Such as Fig. 2, Fig. 3
And shown in Fig. 4, the bigger circuit substrate of appearance and size (hereinafter referred to as main circuit substrate 10A) is configured to
The rectangle more slightly smaller than main board 1a, and the inner surface relative configuration with main board 1a.Appearance and size is relatively
Little circuit substrate (hereinafter referred to as secondary circuit substrate 10B) has the width of substantially the 1/2 of main board 1a,
Configuration becomes the part of the right half part of main board 1a in fig. 2.On secondary circuit substrate 10B mainly
Collect heating parts such as being provided with above-mentioned semiconductor module 11 and capacitor 12.Though it is not bright in figure
Show, but above-mentioned main circuit substrate 10A and secondary circuit substrate 10B is electrically connected to each other, and constitutes electric power conversion
Required control circuit.
As it is shown on figure 3, the semiconductor module 11 of application is shaped generally as rectangular in present embodiment 1
Body shape, has screw fixed part 11a on upper and lower side parallel to each other.Screw fixed part 11a
It is to dash forward from the edge of the radiating surface 11b side away from secondary circuit substrate 10B in the side of semiconductor module 11
The tongue-shaped part going out.Each screw fixed part 11a is provided with the screw running through for installing screw B lead to
Hole 11c.As shown in Figures 3 to 5, on main circuit substrate 10A and secondary circuit substrate 10B with half
The part that the screwing through hole 11c of conductor module 11 is relative is respectively formed with through hole 10a.Through hole 10a is
The big circular opening of the internal diameter than screwing through hole 11c for the internal diameter, has in the inside of each through hole 10a and draws
Lead component 20.
Guiding elements 20 as shown in Figures 4 to 6, be there is diapire 21 in front end be formed as cylinder
The resin component element of the insulating properties of shape.Guiding elements 20 is to have the diapire 21 and half of screwing through hole 21a
The state configuration that the screw fixed part 11a of conductor module 11 abuts is at main circuit substrate 10A and secondary circuit
In the through hole 10a of substrate 10B.The internal diameter of guiding elements 20 is set to ratio and installs screw B vertically
Length little.This guiding elements 20 is provided with a plurality of slit 22 and stopper section 23.Slit 22 is from guiding
The cardinal extremity opening of component 20 is axially formed, and circumferentially splits the base end part four of guiding elements 20.
Stopper section 23 is the protuberance prominent from the outer peripheral face of guiding elements 20 towards periphery.Guiding elements 20
Stopper section 23 be respectively formed at following location, i.e. at the spiral shell making diapire 21 and semiconductor module 11
It in the case that nail fixed part 11a abuts, is connected to the relative with main board 1a of main circuit substrate 10A
The position on the surface relative with main circuit substrate 10A of surface and secondary circuit substrate 10B.
Support plate 2, as shown in Fig. 2, Fig. 4 and Fig. 7, is to have the size covering main board 1a
Resin forming product.It is provided with capacitor to house at the corresponding position with capacitor 12 of this support plate 2
Portion 2a, and position corresponding with semiconductor module 11 is provided with intercommunicating pore 2b.Capacitor houses
Portion 2a is for housing each capacitor 12 being arranged on secondary circuit substrate 10B independently.
Though figure is not expressed, but capacitor resettlement section 2a be configured to only on support plate 2 with main board 1a phase
To the cylindrical shape with the end of opposite face opening.Intercommunicating pore 2b is to run through for semiconductor module 11,
But little substantially rectangular the opening of the profile than the heating surface 30a of radiator described later (connecting object) 30
Mouthful.Around this intercommunicating pore 2b, not relative with main board 1a rear side is provided with seal groove
2c.Seal groove 2c is the recess for housing ring-type seal 3.
Can clearly learn according to Fig. 2, this support plate 2 sets in the way of about by the back side two segmentations
Being equipped with divider wall parts 2d, the rising wood of the local becoming right half part in fig. 2 is provided with ventilating board portion
2e.Divider wall parts 2d is to erect the plate-like members of setting with main board 1a in the way of being substantially orthogonal.
Ventilating board portion 2e is the plate-like members with many air vent 2f, is set to supporting in Fig. 2
The top of the right half part of plate 2 covers.
Ventilation unit 1B is the square tube shape along the vertical direction constituting between support plate 2 and framing component 4
Space.The upper end open of ventilation unit 1B is in the ventilating board portion 2e being arranged on support plate 2 and covers
The state of lid.Framing component 4 is had the high heat transfer of good heat conductivity by aluminium and aluminium alloy etc.
Property material forming obtains.This framing component 4, as shown in Fig. 2 and Fig. 8, has main board portion 4a, side plate
Portion 4b and auxiliary side plates portion 4c.Main board portion 4a has and can will be positioned at score wall part 2d on support plate 2
The appearance and size that the part of position on the right side covers.In main board portion 4a relative with support plate 2 in
It is provided with many fin embeded slot 4d along the vertical direction on surface.Side plate 4b is from main board portion 4a
The part that extends along the direction substantially at right angles with main board portion 4a towards support plate 2 of the edge of a side.
In the case of making main board portion 4a relative with support plate 2, the separation of this side plate 4b and support plate 2
Wall portion 2d is oppositely disposed.Auxiliary side plates portion 4c is that the edge of the opposing party from main board portion 4a is towards supporting
The part that plate 2 extends along the direction substantially at right angles with main board portion 4a.Also can clearly learn with reference to the accompanying drawings,
Auxiliary side plates portion 4c is configured to shorter than side plate 4b from the development length that main board portion 4a extends.Make
In the case that main board portion 4a is relative with support plate 2, this auxiliary side plates portion 4c overlaps with divider wall parts 2d.
The inner surface of framing component 4 is provided with draught fan 40 and radiator 30.Draught fan
40 as in figure 2 it is shown, configure the bottom at inner surface on framing component 4.To this draught fan
40 in the case of carried out driving, this draught fan 40 with by outside air via ventilating board portion 2e
Air vent 2f import to ventilation unit 1B, and the opening from lower end for the air of ventilation unit 1B discharged
Mode carries out action.
Radiator 30, as framing component 4, is had good heat conductivity by aluminum or aluminum alloy etc.
High thermal conductivity material shapes and obtains.In present embodiment 1, use at the one of base component
There is on the surface of side smooth heating surface 30a, and erect on the surface of the opposing party and be provided with many
The radiator 30 of cooling fins 30b.The heating surface 30a of radiator 30 is configured to and is housed in supporting
The rectangle of the size that the complete cycle of the seal 3 in the seal groove 2c of plate 2 abuts.By making this radiator
The leading section of the cooling fins 30b of 30 is chimeric with the fin embeded slot 4d of main board portion 4a respectively, should
Radiator 30 is installed on framing component 4 with state hot linked with framing component 4.Relative to framework
The position that radiator 30 installed by component 4 is following location, i.e. make main board portion 4a and support plate 2
In the case of relatively, the intercommunicating pore 2b of support plate 2 is covered and makes complete cycle and the heating surface of seal 3
Relative position, the circumference of 30a.
As shown in Figure 8, the heating surface 30a of radiator 30 is provided with pair of screws fixing hole 30c.
The screwing through hole 11c of screw fixed hole 30c and the screw fixed part 11a being arranged at semiconductor module 11
It is correspondingly arranged.As shown in Figure 4, the through hole 10a via main circuit substrate 10A for the screw B, pair will be installed
The screwing through hole 11c of the through hole 10a of circuit substrate 10B and semiconductor module 11 is fixed on radiator
In the screw fixed hole 30c of 30.This installation screw B has following function, i.e. make semiconductor module
The radiating surface 11b of 11 is in close contact with the heating surface 30a of radiator 30, and makes the close of support plate 2
The function that the heating surface 30a of sealing 3 and radiator 30 is in close contact.
The state that power inverter 1 configured as described is for example exposed at outdoor with ventilation unit 1B sets
Put.House the resettlement section 1A of main circuit substrate 10A and secondary circuit substrate 10B and the ventilation being exposed at outdoor
It is supported by plate 2 between portion 1B to completely cut off.Thus, even if having entered in ventilation unit 1B at water such as rainwater
In the case of, also will not be to the control electricity being arranged on main circuit substrate 10A and secondary circuit substrate 10B
Road and electronic component produce impact.
When driving draught fan 40 under state in above-mentioned arranging, then leading to via ventilating board portion 2e
Outside air is imported to the inside of ventilation unit 1B by air holes 2f.It is directed to the sky in ventilation unit 1B
Gas is after having carried out heat exchange with capacitor resettlement section 2a and radiator 30 successively, from the opening of lower end
It is discharged to the outside of ventilation unit 1B.Thus, product in the case that power inverter 1 carries out action
It is born in capacitor 12 and the heat of semiconductor module 11, the air warp passing through at ventilation unit 1B can be utilized
Shed by capacitor resettlement section 2a and radiator 30, be prevented to being arranged on main circuit substrate 10A
And the electronic component on pair circuit substrate 10B produces the impact of heat.Especially since peace can be utilized
Cartridge screw B makes the radiating surface 11b of semiconductor module 11 closely connect with the heating surface 30a of radiator 30
Touch, therefore, it is possible to utilize radiator 30 to expect higher radiating effect.
And, it in above-mentioned power inverter 1, is being arranged at owing to configuring guiding elements 20
In the through hole 10a of main circuit substrate 10A and secondary circuit substrate 10B, when therefore fixedly mounting screw B
Operation also extremely easy.That is, utilize guiding elements 20 that installation screw B is directed to semiconductor module
The screw fixed part 11a of 11, therefore installing screw B will not come off in midway.Further, since will draw
Lead the length vertically that the internal diameter of component 20 is set to than installing screw B little, be therefore also not result in
Install screw B midway crooked or towards change that state of affairs.Thus, as long as screw B will be installed
And instrument is inserted into the inside of guiding elements 20, just can reliably be directed to radiator by installing screw B
In the screw fixed hole 30c of 30, fix this installation screw B.
In addition, after securing installation screw B, the stopper section 23 being arranged at guiding elements 20 is in
The state abutting with the surface of main circuit substrate 10A and secondary circuit substrate 10B.Stop accordingly, it is capable to utilize
Main circuit substrate 10A and secondary circuit substrate 10B is supported by stopper 23, is not result in making circuit base
The problem that plate 10A, 10B occur flexure etc..Further, since be provided with slit on guiding elements 20
22, therefore when extending through guiding elements 20 in through hole 10a, the secondary circuit substrate 10B of supporting stops
Stopper 23 will not become guiding elements 20 by the obstacle during through hole 10a of main circuit substrate 10A.
In addition, in above-mentioned embodiment 1, guiding elements 20 is arranged on main circuit substrate 10A
And on pair circuit substrate 10B two side, but guiding elements 20 is not necessarily provided through multiple circuit base
The position of plate 10A, 10B.With regard to the semiconductor module 11 of fixed installation screw B, need not be
IGBT, it is also possible to be other heating electronic component.
(embodiment 2)
Fig. 9 and Figure 10 represents the power inverter of embodiment of the present invention 2.The electric power illustrating at this
Conversion equipment 1 ' is as embodiment 1, for being converted to the alternating voltage supplying from source power supply
Being supplied to after desired frequency and amplitude in motor even load, power inverter 1 ' includes body frame
Body 50.Main body framework 50 is formed as the rectangular-shaped of backside openings, in inside by the installation of sheet metal
Substrate (connecting object) 60 is configured with the semiconductor modules such as IGBT 61 and multiple capacitor (electronics zero
Part) 62.In present embodiment 2, illustrate especially is to include being configured to columned six capacitors
The power inverter 1 ' of (electrolytic capacitor) 62.Upper surface and lower surface in main body framework 50 divide
It is not provided with air vent 51, and be internally provided with draught fan 52 in main body framework 50.Right
In the case that draught fan 52 has carried out driving, outside air is imported to main through air vent 51
The inside of body framework 50.In addition, the symbol 53 in Figure 10 is for producing at semiconductor module 61
The radiator that raw heat is released.
Installation base plate 60 is to be arranged on main body framework in the way of parallel with the front surface of main body framework 50
The plate-like members of the inside of 50.This installation base plate 60 as shown in FIG. 11 and 12, is supplying capacitor
62 positions installed are respectively arranged with installing hole 60a, and set respectively accordingly with each installing hole 60a
It is equipped with two screw fixed hole 60b.Installing hole 60a is the circular breach that can run through for capacitor 62,
Respectively configure three ground configuration two row in left-right direction.Two screw fixed hole 60b are installing hole 60a's
It is arranged around offseting one from another the position of 180 °.
Capacitor 62 includes positive side on the end face being respectively structured as columned capacitor main body 62a
And two terminals 62b, 62c of minus side.Each capacitor 62 is wound with fixing on capacitor main body 62a
Band 63, and 64th, each terminal 62b, 62c and bus bar plate (board member) different from each other 65 be connected.
Fixed band 63 as shown in FIG. 13 and 14, is the metal circular component being configured to banding,
It is arranged on around capacitor main body 62a.Fixed band 63 is respectively arranged with two screw fixed parts
63a.Screw fixed part 63a is arranged to the tongue-shaped part highlighting from the side face of capacitor main body 62a,
Direction extension along the orthogonality of center shaft with capacitor main body 62a.At each screw fixed part 63a along electricity
The central shaft of container body 62a is formed with screwing through hole 63b.
The bus bar plate being connected with the terminal 62b of a side (is referred to as first below in the case of making a distinction
Terminal 62b and the first bus bar plate 64) at position corresponding with each capacitor 62, there is the first fenestra 64a
And the first through hole 64b.First fenestra 64a is at the end that the first bus bar plate 64 is connected to capacitor 62
It is used in the case of sub-62b making the terminal of the opposing party of capacitor 62 (below in situation about making a distinction
It is referred to as down the second terminal 62c) expose at outside breach, to comprise the screw of a side of installation base plate 60
The mode of fixing hole 60b is formed as rectangle.First through hole 64b is more outer than capacitor main body 62a
The part in week is formed at the circle of the corresponding position of screw fixed hole 60b of the opposing party with installation base plate 60
The opening of shape.
The bus bar plate being connected with the second terminal 62c (is referred to as second female below in the case of making a distinction
Line plate 65) at position corresponding with each capacitor 62, there is the second fenestra 65a and the second through hole 65b.
Second fenestra 65a is the feelings at the second terminal 62c that the second bus bar plate 65 is connected to capacitor 62
For making the first terminal 62b and the first through hole 64b of the opposing party expose at outside breach under condition, the
Two fenestra 65a are formed as rectangle.Second through hole 65b is in the portion than capacitor main body 62a outer circumferential side
Divide the circular opening being formed at the corresponding position of screw fixed hole 60b with installation base plate 60.
Each bus bar plate the 64th, 65 the first through hole 64b and the second through hole 65b in be configured with guiding elements
70.Guiding elements 70 is the resin component element of the insulating properties being formed as cylindrical shape with centre bore 70a.
The outer peripheral face of the base end part of guiding elements 70 is provided with stopper section 71.It is logical that stopper section 71 has ratio
The big external diameter of the internal diameter of hole 64b, 65b.Each guiding elements 70 is with the screw of front end face and fixed band 63
Fixed part 63a abuts, and the shape that stopper section 71 abuts with the opening circumference of through hole 64b, 65b
State configuration bus bar plate the 64th, 65 through hole 64b, 65b in.The internal diameter of guiding elements 70 is set as ratio
The length vertically of the installation screw B being used is little.
By capacitor main body 62a being inserted in the installing hole 60a of installation base plate 60, spiral shell will be installed
Nail B is fixed on the screw fixed hole 60b of installation base plate 60 via the screw fixed part 63a of fixed band 63
In, the capacitor 62 with said structure can be installed in main body framework 50 by installation base plate 60.
Here, in the power inverter 1 ' of embodiment 2, from each bus bar plate the 64th, 65
Through hole 64b, 65b are also configured with guiding elements 70 between the screw fixed part 63a of fixed band 63.
Thus, the screw that installation screw B is fixed to installation base plate 60 via screw fixed part 63a is being fixed
When in the 60b of hole, installing screw B can not come off in midway, can make the fixed operation of installation screw B
Very easily carry out.Further, since the internal diameter of guiding elements 70 is set as, and ratio installs screw B's
Length vertically is little, is therefore also not result in that installing screw B changes like that in crooked halfway or direction
The state of affairs.Thus, as long as instrument is inserted into together with installing screw B the inside of guiding elements 70,
Just reliably can be directed to installing screw B in the screw fixed hole 60b of installation base plate 60, fixing should
Screw B is installed.
In addition, in above-mentioned embodiment 1 and embodiment 2, as guiding elements, example respectively
Show the component being configured to cylindric, but guiding elements has also been configured to polygonal tubular.Additionally,
As long as being prevented from installing screw B and be shed to around, it is also possible to application mesh-shape or cancellate
Guiding elements.In addition, as guiding elements, it is not necessary to must be independent component.For example also can be
The screw fixed part 11a of semiconductor module 11 arranges guiding elements 20, can also be at fixed band 63
Screw fixed part 63a arranges guiding elements.
Claims (7)
1. a power inverter, is formed with through hole on the board member be provided with electronic component, makes
Screw is installed from the through hole of described board member via the screw fixed part of described electronic component and connecting object
Connect, thus will be connected between described electronic component with described connecting object, it is characterised in that
It is provided with guiding institute from the through hole of described board member to the screw fixed part of described electronic component
State the guiding elements installing screw.
2. power inverter as claimed in claim 1, it is characterised in that
Described electronic component is mounted on circuit substrate, and via described screw fixed part to described
Screw is installed be fixed, thus the semiconductor module being connected with radiator,
From the through hole being formed at described circuit substrate to the screw fixed part of described semiconductor module
It is provided with described guiding elements.
3. power inverter as claimed in claim 1, it is characterised in that
Described electronic component is to be connected with bus bar plate at terminal, and is wound with fixed band at peripheral part,
Described installation screw is fixed by the screw fixed part via described fixed band, thus and installation base plate
The capacitor connecting,
It is provided with to the screw fixed part of described fixed band from the through hole being formed at described bus bar plate
Described guiding elements.
4. power inverter as claimed in claim 1, it is characterised in that
Described guiding elements is formed as tubular, and the screw fixed part at front end face and described electronic component supports
It is arranged in the state of connecing in the through hole of described board member.
5. power inverter as claimed in claim 4, it is characterised in that
Described guiding elements has stopper section, at the screw fixed part making front end face and described electronic component
In the case of abutting, described stopper section abuts with the surface of described board member.
6. power inverter as claimed in claim 4, it is characterised in that
Described guiding elements has the slit being axially formed from base end part.
7. power inverter as claimed in claim 1, it is characterised in that
Described guiding elements has the internal diameter less than the length vertically of described installation screw.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| JP2015-243097 | 2015-12-14 | ||
| JP2015243097A JP6645164B2 (en) | 2015-03-17 | 2015-12-14 | Power converter |
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| CN105991043B CN105991043B (en) | 2019-06-07 |
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| WO2019220485A1 (en) * | 2018-05-14 | 2019-11-21 | 三菱電機株式会社 | Electric power converter |
| JP6955047B2 (en) * | 2020-03-31 | 2021-10-27 | 本田技研工業株式会社 | Power control unit |
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| CN2727956Y (en) * | 2004-07-06 | 2005-09-21 | 鸿富锦精密工业（深圳）有限公司 | Fastener for radiator |
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| JP2008047789A (en) * | 2006-08-21 | 2008-02-28 | Toshiba Mitsubishi-Electric Industrial System Corp | Clamp and method for fixing housing floor |
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Also Published As
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| JP6645164B2 (en) | 2020-02-14 |
| JP2016174518A (en) | 2016-09-29 |
| CN105991043B (en) | 2019-06-07 |
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