CN105991043B - Power inverter - Google Patents
Power inverter Download PDFInfo
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- CN105991043B CN105991043B CN201610140949.0A CN201610140949A CN105991043B CN 105991043 B CN105991043 B CN 105991043B CN 201610140949 A CN201610140949 A CN 201610140949A CN 105991043 B CN105991043 B CN 105991043B
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- Prior art keywords
- hole
- power inverter
- guiding elements
- screw
- fixed part
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Classifications
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
Abstract
A kind of power inverter, operation when connecting the electronic component that will be mounted on board member with connecting object are easy to carry out.Through-hole (10a) is formed on the circuit substrate (10B) for being equipped with semiconductor module (11), it connect mounting screw (B) via the screw fixed part (11a) of semiconductor module (11) with radiator (30) from through-hole (10a), the cylindric guiding elements (20) of guidance mounting screw (B) is provided with the screw fixed part (11a) from the through-hole (10a) of circuit substrate (10B) to semiconductor module (11).
Description
Technical field
The present invention relates to a kind of power inverters.
Background technique
About IGBT (Insulated Gate Bipolar Transistor, the insulation being mounted in power inverter
Grid bipolar junction transistor) etc. control the semiconductor module of biggish electric power like that, in general, by by this semiconductor module
Directly it is threadedly secured on radiator to improve cooling efficiency.Specifically, make mounting screw via being set to semiconductor module
The screwing through hole of screw fixed part and the screw fixed hole of radiator fix, to make semiconductor module and radiator to each other
It is tightly engaged into, the heat that semiconductor module is generated efficiently is transmitted to radiator (referring for example to patent document 1).
Existing technical literature
Patent document
Patent document 1: No. 4780349 bulletins of Japanese Patent No.
In addition, when fixing mounting screw and radiator in the state that semiconductor module is installed on circuit substrate
In the case of, circuit substrate needs to be provided with through-hole.That is, it needs to be inserted into mounting screw from the through-hole being formed on circuit substrate, make
Mounting screw is fixed via the screwing through hole of semiconductor module with radiator.But exist between circuit substrate and radiator
Gap corresponding with the amount of the height of semiconductor module.Therefore, in the gap from circuit substrate to radiator, it is difficult to keep peace
Cartridge screw, the fixed operation of mounting screw become many and diverse.Specifically, it is desirable to fixed mounting screw may from circuit substrate with
The inside of framework is fallen in the gap of radiator.Moreover, in the case where mounting screw has fallen off, it is necessary to carry out from framework
The operation of internal recovering, hence it is evident that influence operating efficiency.
By using the mounting screw longer than the length of circuit substrate and the gap of radiator, and according to mounting screw
Length increases the plate thickness of the base component of radiator, is able to solve above-mentioned problem.But in this case, cause to generate
New problem, that is, because the time until fixing mounting screw extends, operating efficiency is made to be affected.
In addition, the above problem is not limited to make to be mounted on the feelings that the semiconductor module on circuit substrate is connect with radiator
Condition.As long as that is, be mounted in the electronic component on board member as capacitor for being mounted on bus bar plate etc., will with from
Mounting screw is fixed and the above problem occurs in the same manner as the case where connecting objects such as installation base plate connect by the through-hole of board member.
Summary of the invention
The present invention is in view of above-mentioned actual conditions, and it is an object of the present invention to provide a kind of electronic component that can make be mounted on board member
Operation power inverter easy to perform when being connect with connecting object.
In order to achieve the above object, power inverter of the invention is formed on the board member for be equipped with electronic component
Through-hole connect mounting screw via the screw fixed part of above-mentioned electronic component with connecting object from the through-hole of above-mentioned board member,
To will be connected between above-mentioned electronic component and above-mentioned connecting object, which is characterized in that from the through-hole of above-mentioned board member to above-mentioned
The guiding elements for guiding above-mentioned mounting screw is provided between the screw fixed part of electronic component.
In addition, the present invention is on the basis of above-mentioned power inverter, which is characterized in that above-mentioned electronic component is mounted in
On circuit substrate, and above-mentioned mounting screw is fixed via above-mentioned screw fixed part, thus connect with radiator half
Conductor module is provided with from the through-hole being formed on foregoing circuit substrate to the screw fixed part of above-mentioned semiconductor module
State guiding elements.
In addition, the present invention is on the basis of above-mentioned power inverter, which is characterized in that above-mentioned electronic component is in terminal
It is connected with bus bar plate, and is wound with fixing belt in peripheral part, via the screw fixed part of above-mentioned fixing belt to above-mentioned installation spiral shell
Nail is fixed, thus the capacitor being connect with installation base plate, from the through-hole being formed on above-mentioned bus bar plate to above-mentioned fixing belt
Screw fixed part between be provided with above-mentioned guiding elements.
In addition, the present invention is on the basis of above-mentioned power inverter, which is characterized in that above-mentioned guiding elements is formed as cylinder
Shape is mounted in the through-hole of above-mentioned board member in the state that front end face is abutted with the screw fixed part of above-mentioned electronic component.
In addition, the present invention is on the basis of above-mentioned power inverter, which is characterized in that above-mentioned guiding elements has backstop
Portion, in the case where abutting front end face with the screw fixed part of above-mentioned electronic component, above-mentioned stopper section and above-mentioned board member
Surface abuts.
In addition, the present invention is on the basis of above-mentioned power inverter, which is characterized in that above-mentioned guiding elements has from base
The slit that end is axially formed.
In addition, the present invention is on the basis of above-mentioned power inverter, which is characterized in that above-mentioned guiding elements has than upper
State the internal diameter small along axial length of mounting screw.
Using the present invention, due to being provided with guidance installation the screw fixed part from the through-hole of board member to electronic component
The guiding elements of screw, therefore the state of affairs that mounting screw can not be caused to fall off in the gap of board member and connecting object.Cause
And the axial biggish mounting screw of length need not be also used, work when electronic component to be screwed on to connecting object can be made
Industry is easy to carry out.
Detailed description of the invention
Fig. 1 is the perspective view for indicating the appearance of power inverter of embodiment of the present invention 1.
Fig. 2 is the major part exploded perspective view of power inverter shown in FIG. 1.
Fig. 3 is the perspective view using the circuit substrate in power inverter shown in Fig. 1.
Fig. 4 is the sectional view of power inverter shown in FIG. 1.
Fig. 5 is by the sectional view of power inverter exploded representation shown in FIG. 1.
Fig. 6 is the perspective view using the guiding elements in power inverter shown in Fig. 1.
Fig. 7 is the perspective view using the support plate in power inverter shown in Fig. 1.
Fig. 8 is the perspective view for constituting the framing component of ventilation unit of power inverter shown in FIG. 1.
Fig. 9 is the perspective view for indicating the appearance of power inverter of embodiment of the present invention 2.
Figure 10 is the sectional view of power inverter shown in Fig. 9.
Figure 11 is capacitor, installation base plate and the bus bar plate indicated using in power inverter shown in Fig. 9
The perspective view of assembled state.
Figure 12 is the decomposition using capacitor, installation base plate and bus bar plate in power inverter shown in Fig. 9
Perspective view.
Figure 13 is the decomposition using capacitor, installation base plate and bus bar plate in power inverter shown in Fig. 9
Sectional view.
Figure 14 is capacitor, installation base plate and the bus bar plate indicated using in power inverter shown in Fig. 9
The cross-sectional view of assembled state.
(symbol description)
10B ... circuit substrate
10a ... through-hole
11 ... semiconductor modules
11a ... screw fixed part
20 ... guiding elements
21 ... bottom walls
22 ... slits
23 ... stopper sections
30 ... radiators
30c ... screw fixed hole
60 ... installation base plates
60b ... screw fixed hole
62 ... capacitors
63 ... fixing belts
63a ... screw fixed part
63b ... screwing through hole
64 ... first bus bar plates
64b ... first through hole
65 ... second bus bar plates
The second through-hole of 65b ...
70 ... guiding elements
B ... mounting screw
Specific embodiment
Hereinafter, being described in detail referring to ideal embodiment of the attached drawing to power inverter of the invention.
(embodiment 1)
Fig. 1 and Fig. 2 indicates the power inverter of embodiment of the present invention 1.The power inverter illustrated herein is used for
The alternating voltage supplied from source power supply is supplied to the load such as motor after being converted to desired frequency and amplitude.In this reality
It applies in mode 1, illustration is the power inverter for including receiving portion 1A and ventilation unit 1B, and above-mentioned receiving portion 1A is accommodated in inside
There are circuit substrate (board member) 10A, 10B, above-mentioned ventilation unit 1B to be used for the constituent part of power inverter, i.e. IGBT etc. half
Conductor module (electronic component) 11 and capacitor 12 are cooling.
Receiving portion 1A is the space constituted between main board 1a and support plate 2, and above-mentioned support plate 2 is set as covering main body
Plate 1a.Main board 1a constitutes a part of the profile of power inverter 1, and is put down using what resin material was formed as a generally rectangular
Plate.Two circuit substrates 10A, the 10B to differ in size from one another with the state support that is layered on top of each other main board 1a interior table
Surface side.As shown in Fig. 2, Fig. 3 and Fig. 4, the biggish circuit substrate of outer dimension (hereinafter referred to as main circuit substrate 10A) is configured to
The rectangle more slightly smaller than main board 1a, and be oppositely disposed with the inner surface of main board 1a.The lesser circuit substrate of outer dimension is (following
Referred to as pair circuit substrate 10B) substantially 1/2 width with main board 1a, configure the right side for becoming main board 1a in Fig. 2
The part divided.Mainly collect on secondary circuit substrate 10B and the fever such as above-mentioned semiconductor module 11 and capacitor 12 is installed
Part.Though not expressing in figure, above-mentioned main circuit substrate 10A and pair circuit substrate 10B are electrically connected to each other, and constitute electrical power conversion institute
The control circuit needed.
As shown in figure 3, the semiconductor module 11 applied in present embodiment 1 is shaped generally as rectangular-shape, each other
There is screw fixed part 11a on parallel upper and lower side.Screw fixed part 11a is in the side of semiconductor module 11 from separate
The edge tongue-shaped part outstanding of the side radiating surface 11b of secondary circuit substrate 10B.It is provided in each screw fixed part 11a for peace
The perforative screwing through hole 11c of cartridge screw B.As shown in Figures 3 to 5, on main circuit substrate 10A and secondary circuit substrate 10B with
The part that the screwing through hole 11c of semiconductor module 11 is opposite is respectively formed with through-hole 10a.Through-hole 10a is that internal diameter compares screwing through hole
The big circular opening of the internal diameter of 11c has guiding elements 20 in the inside of each through-hole 10a.
Guiding elements 20 is the tree for being formed as cylindric insulating properties for having bottom wall 21 in front end as shown in Figures 4 to 6
Rouge component.Guiding elements 20 is abutted with the bottom wall 21 with screwing through hole 21a with the screw fixed part 11a of semiconductor module 11
State configuration is in the through-hole 10a of main circuit substrate 10A and secondary circuit substrate 10B.The internal diameter of guiding elements 20 is set as than peace
Cartridge screw B's is small along axial length.The guiding elements 20 is provided with a plurality of slit 22 and stopper section 23.Slit 22 from guidance structure
The cardinal extremity opening of part 20 is axially formed, and circumferentially divides the base end part four of guiding elements 20.Stopper section 23 is from guidance structure
The outer peripheral surface of part 20 is towards periphery protruding portion outstanding.The stopper section 23 of guiding elements 20 is respectively formed at following position, that is,
In the case where abutting bottom wall 21 with the screw fixed part 11a of semiconductor module 11, be connected to main circuit substrate 10A's and main body
The position on the surface opposite with main circuit substrate 10A on plate 1a opposite surface and secondary circuit substrate 10B.
Support plate 2 as shown in Fig. 2, Fig. 4 and Fig. 7, is had the resin forming product of the main board 1a size covered.?
The position corresponding with capacitor 12 of the support plate 2 is provided with capacitor receiving portion 2a, and corresponding with semiconductor module 11
Position be provided with intercommunicating pore 2b.Capacitor receiving portion 2a is used for each capacitor 12 that will be mounted on secondary circuit substrate 10B
Independently receiving is got up.Though not expressing in figure, capacitor receiving portion 2a is configured to only opposite with main board 1a on support plate 2
Opposite face opening cylindrical shape with the end.Intercommunicating pore 2b is to run through for semiconductor module 11, but (connect than aftermentioned radiator
Connect object) the small substantially rectangular opening of the shape of 30 heating surface 30a.Around intercommunicating pore 2b, not with main board
1a opposite back side is provided with seal groove 2c.Seal groove 2c is the recess portion for accommodating cricoid sealing element 3.
It can clearly learn according to fig. 2, be provided with divider wall parts in a manner of dividing back side or so two on the support plate 2
The rising wood of 2d, the part in Fig. 2 as right half part are provided with ventilating board portion 2e.Divider wall parts 2d be with main board 1a
Substantially orthogonal mode erects the plate-like members of setting.Ventilating board portion 2e is the tabular structure with many a ventilation hole 2f
Part is set as the top covering of the right half part of support plate 2 in Fig. 2.
Ventilation unit 1B is the space of the square tube shape along the vertical direction constituted between support plate 2 and framing component 4.Ventilation
The upper end opening of portion 1B is in the state for the ventilating board portion 2e covering being arranged on support plate 2.Framing component 4 is by aluminium and aluminium
There is alloy etc. the high thermal conductivity material of good heat conductivity to shape to obtain.The framing component 4 is as shown in Fig. 2 and Fig. 8, tool
There are main board portion 4a, side plate 4b and auxiliary side plates portion 4c.Main board portion 4a has and can lean on score wall part 2d is located on support plate 2
The outer dimension of the part covering of the position on right side.On main board portion 4a on the inner surface opposite with support plate 2 along the vertical direction
There are many a fin embeded slot 4d for setting.Side plate 4b be from the edge of a side of main board portion 4a towards support plate 2 along with mainboard
The part that direction portion 4a substantially at right angles extends.In the case where keeping main board portion 4a and support plate 2 opposite, side plate 4b with
The divider wall parts 2d of support plate 2 is oppositely disposed.Auxiliary side plates portion 4c is from the edge of another party of main board portion 4a towards support plate 2
Along the part extended with direction main board portion 4a substantially at right angles.Also can clearly learn with reference to the accompanying drawings, auxiliary side plates portion 4c from
The development length that main board portion 4a extends is configured to shorter than side plate 4b.It, should in the case where making main board portion 4a and support plate 2 is opposite
Auxiliary side plates portion 4c and divider wall parts 2d is overlapped.
Draught fan 40 and radiator 30 are provided on the inner surface of framing component 4.Draught fan 40 as shown in Fig. 2,
Configuration is in the lower end of inner surface on framing component 4.In the case where being driven to the draught fan 40, the ventilation wind
Fan 40 external air is imported into ventilation unit 1B via the ventilation hole 2f of ventilating board portion 2e, and by the air of ventilation unit 1B from
The mode of the opening discharge of lower end is acted.
Radiator 30 and framing component 4 are same, have the high thermal conductivity of good heat conductivity by aluminum or aluminum alloy etc.
Material forming obtains.In present embodiment 1, use has flat heating surface on the surface of a side of base component
30a, and there are many a radiators 30 of cooling fins 30b for setting setting on the surface of another party.The heating surface of radiator 30
30a is configured to the rectangle of the size abutted with the complete cycle of the sealing element 3 in the seal groove 2c for being housed in support plate 2.By making
The front end of the cooling fins 30b of the radiator 30 is chimeric with the fin embeded slot 4d of main board portion 4a respectively, by the radiator 30
To be installed on framing component 4 with the hot linked state of framing component 4.The position of radiator 30 is installed relative to framing component 4
It is following position, that is, in the case where making main board portion 4a and support plate 2 is opposite, the intercommunicating pore 2b of support plate 2 is covered and made close
The complete cycle of sealing 3 position opposite with the peripheral part of heating surface 30a.
As shown in figure 8, being provided with a pair of screws fixation hole 30c on the heating surface 30a of radiator 30.Screw fixed hole
The screwing through hole 11c of 30c and the screw fixed part 11a for being set to semiconductor module 11 are correspondingly arranged.As shown in figure 4, will installation
Screw B via main circuit substrate 10A through-hole 10a, the through-hole 10a of secondary circuit substrate 10B and the screw of semiconductor module 11
Through-hole 11c is fixed in the screw fixed hole 30c of radiator 30.Mounting screw B has following function, that is, makes semiconductor module
The radiating surface 11b of block 11 and the heating surface 30a of radiator 30 are in close contact, and make the sealing element 3 and radiator 30 of support plate 2
Heating surface 30a be in close contact function.
Power inverter 1 configured as described is exposed at outdoor state setting for example with ventilation unit 1B.Accommodate main electricity
Completely cut off between the receiving portion 1A of base board 10A and secondary circuit substrate 10B and the ventilation unit 1B for being exposed at outdoor by support plate 2.Thus,
Even if, will not be to being mounted on main circuit substrate 10A and secondary circuit in the case where the water such as rainwater have entered in ventilation unit 1B
Control circuit and electronic component on substrate 10B have an impact.
It, then will be external via the ventilation hole 2f of ventilating board portion 2e when driving draught fan 40 under above-mentioned setting state
Air imported into the inside of ventilation unit 1B.Be directed to air in ventilation unit 1B successively with capacitor receiving portion 2a and dissipate
After hot device 30 has carried out heat exchange, the outside of ventilation unit 1B is discharged to from the opening of lower end.Thus, in power inverter 1
The heat of capacitor 12 and semiconductor module 11 is resulted from the case where being acted, and can utilize the air passed through in ventilation unit 1B
It sheds, can be prevented to being mounted on main circuit substrate 10A and secondary circuit substrate 10B via capacitor receiving portion 2a and radiator 30
On electronic component generate heat influence.Especially since the radiating surface of semiconductor module 11 can be made using mounting screw B
The heating surface 30a of 11b and radiator 30 is in close contact, therefore can expect higher heat dissipation effect using radiator 30.
Moreover, in above-mentioned power inverter 1, since the configuration of guiding elements 20 is being set to main circuit substrate
In the through-hole 10a of 10A and secondary circuit substrate 10B, therefore operation when fixed installation screw B is also extremely easy.That is, utilizing guidance
Mounting screw B is directed to the screw fixed part 11a of semiconductor module 11 by component 20, therefore mounting screw B will not be de- in midway
It falls.Further, since setting smaller along axial length than mounting screw B for the internal diameter of guiding elements 20, therefore will not lead
Cause mounting screw B in that crooked or towards change state of affairs halfway.Thus, draw as long as mounting screw B and tool are inserted into
The inside of component 20 is led, mounting screw B can be reliably directed in the screw fixed hole 30c of radiator 30, fix the peace
Cartridge screw B.
In addition, the stopper section 23 for being set to guiding elements 20 is in and main circuit substrate after securing mounting screw B
The state that the surface of 10A and secondary circuit substrate 10B abut.It therefore, can be using stopper section 23 to main circuit substrate 10A and secondary circuit
Substrate 10B is supported, and not will lead to the problem for making circuit substrate 10A, 10B that flexure etc. occur.Further, since in guiding elements
It is provided with slit 22 on 20, therefore when extending through guiding elements 20 in through-hole 10a, supports the backstop of secondary circuit substrate 10B
Portion 23 will not become obstacle when guiding elements 20 passes through the through-hole 10a of main circuit substrate 10A.
In addition, in above-mentioned embodiment 1, by the setting of guiding elements 20 in main circuit substrate 10A and secondary circuit substrate
On two side of 10B, but guiding elements 20 is not provided through the position of multiple circuit substrate 10A, 10B necessarily.Pacify about fixed
The semiconductor module 11 of cartridge screw B, needs not be IGBT, is also possible to other fever electronic components.
(embodiment 2)
Fig. 9 and Figure 10 indicates the power inverter of embodiment of the present invention 2.The power inverter 1 ' that illustrates herein with
Embodiment 1 is same, for being supplied to electricity after the alternating voltage supplied from source power supply is converted to desired frequency and amplitude
In the load such as motivation, power inverter 1 ' includes main body framework 50.Main body framework 50 is formed as the rectangular-shape of backside openings,
In inside by the installation base plate (connecting object) 60 of sheet metal configured with semiconductor modules 61 and multiple capacitors such as IGBT
(electronic component) 62.In present embodiment 2, especially illustrate be include be configured to columned six capacitors (electrolysis electricity
Container) 62 power inverter 1 '.Ventilation hole 51 is respectively arranged in the upper surface and the lower surface of main body framework 50, and
Main body framework 50 is internally provided with draught fan 52.In the case where being driven to draught fan 52, by external sky
Gas imported into the inside of main body framework 50 by ventilation hole 51.In addition, the symbol 53 in Figure 10 is for will be in semiconductor module
The radiator that 61 heat generated are released.
Installation base plate 60 is the inside that main body framework 50 is arranged in the mode parallel with the front surface of main body framework 50
Plate-like members.The installation base plate 60 as shown in FIG. 11 and 12, is respectively arranged with installation in the position installed for capacitor 62
Hole 60a, and be accordingly respectively set with each mounting hole 60a there are two screw fixed hole 60b.Mounting hole 60a is can be for capacitor
The perforative circular notch of device 62, in left-right direction three ground configurations two of each configuration arrange.Two screw fixed hole 60b are in mounting hole
180 ° of the position of offseting one from another is set around 60a.
Capacitor 62 includes the two of positive side and negative side on the end face for being respectively structured as columned capacitor main body 62a
A terminal 62b, 62c.Each capacitor 62 is wound with fixing belt 63 on capacitor main body 62a, and each terminal 62b, 62c and that
The connection of this different bus bar plate (board member) 64,65.
Fixing belt 63 as shown in FIG. 13 and 14, is to be configured to band-like metal circular component, is mounted on capacitor
Around device main body 62a.Screw fixed part 63a there are two being respectively set in fixing belt 63.Screw fixed part 63a is arranged to
From the circumferential surface of capacitor main body 62a tongue-shaped part outstanding, prolong along the direction with the orthogonality of center shaft of capacitor main body 62a
It stretches.Screwing through hole 63b is formed with along the central axis of capacitor main body 62a in each screw fixed part 63a.
The bus bar plate connecting with the terminal 62b of a side (is known as first terminal 62b and the in the case where distinguishing below
One bus bar plate 64) position corresponding with each capacitor 62 have the first fenestra 64a and first through hole 64b.First fenestra 64a is
It is used to make the terminal of another party of capacitor 62 in the case where the first bus bar plate 64 to be connected to the terminal 62b of capacitor 62
(being known as Second terminal 62c in the case where distinguishing below) exposes in external notch, with one comprising installation base plate 60
The mode of the screw fixed hole 60b of side is formed as rectangle.First through hole 64b is in the part of specific capacitance device main body 62a outer circumferential side
It is formed in the circular opening of position corresponding with the screw fixed hole 60b of another party of installation base plate 60.
The bus bar plate (below in the case where distinguishing be known as the second bus bar plate 65) being connect with Second terminal 62c with
The corresponding position of each capacitor 62 has the second fenestra 65a and the second through-hole 65b.Second fenestra 65a is by the second bus bar plate
65 are connected in the case where the Second terminal 62c of capacitor 62 for revealing the first terminal 62b and first through hole 64b of another party
Out in external notch, the second fenestra 65a is formed as rectangle.Second through-hole 65b is in the portion of specific capacitance device main body 62a outer circumferential side
Divide the circular opening for being formed in position corresponding with the screw fixed hole 60b of installation base plate 60.
Guiding elements 70 is configured in the first through hole 64b and the second through-hole 65b of each bus bar plate 64,65.Guiding elements
70 be the resin component for being formed as cylindric insulating properties with centre bore 70a.In the periphery of the base end part of guiding elements 70
Stopper section 71 is provided on face.Stopper section 71 has the outer diameter bigger than the internal diameter of through-hole 64b, 65b.Each guiding elements 70 is with front end
Face is abutted with the screw fixed part 63a of fixing belt 63, and the shape that stopper section 71 is abutted with the opening peripheral part of through-hole 64b, 65b
State configures in through-hole 64b, 65b of bus bar plate 64,65.The internal diameter of guiding elements 70 is set as than used mounting screw B
It is small along axial length.
By being inserted into capacitor main body 62a in the mounting hole 60a of installation base plate 60, by mounting screw B via fixation
Screw fixed part 63a with 63 is fixed in the screw fixed hole 60b of installation base plate 60, can be by the capacitor with above structure
62 are installed in main body framework 50 by installation base plate 60.
Here, in the power inverter 1 ' of embodiment 2, in through-hole 64b, 65b from each bus bar plate 64,65 to admittedly
Determine to be also configured with guiding elements 70 between the screw fixed part 63a of band 63.Thus, by mounting screw B via screw fixed part
When 63a is fixed in the screw fixed hole 60b of installation base plate 60, mounting screw B can not fall off halfway, can make mounting screw
The fixed operation of B very easily carries out.Further, since being set as the internal diameter of guiding elements 70 than mounting screw B along axis
To length it is small, therefore mounting screw B will not be caused to change such state of affairs in midway skew or direction.As long as a result, will
Tool is inserted into the inside of guiding elements 70 together with mounting screw B, mounting screw B reliably can be directed to installation base plate
In 60 screw fixed hole 60b, mounting screw B is fixed.
In addition, as guiding elements, illustrating respectively in above-mentioned embodiment 1 and embodiment 2 and being configured to cylinder
The component of shape, but guiding elements is also configured to the tubular of polygon.As long as in addition, can prevent mounting screw B from falling to
Around, it can also be using mesh-shape or the guiding elements of clathrate.In addition, as guiding elements, it is not necessary to must be independent
Component.Such as guiding elements 20 can also be set in the screw fixed part 11a of semiconductor module 11, it can also be in fixing belt 63
Screw fixed part 63a be arranged guiding elements.
Claims (7)
1. a kind of power inverter, is formed with through-hole on the board member for be equipped with electronic component, make mounting screw from described
The through-hole of board member is connect via the screw fixed part of the electronic component with connecting object, thus by the electronic component and institute
It states and is connected between connecting object, which is characterized in that
The guidance mounting screw is provided with screw fixed part from the through-hole of the board member to the electronic component
Guiding elements,
The guiding elements is set to the inside of the through-hole.
2. power inverter as described in claim 1, which is characterized in that
The electronic component is mounted on circuit substrate, and is consolidated via the screw fixed part to the mounting screw
It is fixed, thus the semiconductor module being connect with radiator,
From the through-hole being formed on the circuit substrate to being provided with described draw the screw fixed part of the semiconductor module
Lead component.
3. power inverter as described in claim 1, which is characterized in that
The electronic component is to be connected with bus bar plate in terminal, and be wound with fixing belt in peripheral part, via the fixing belt
Screw fixed part the mounting screw is fixed, thus the capacitor being connect with installation base plate,
The guiding elements is provided with from the through-hole being formed on the bus bar plate to the screw fixed part of the fixing belt.
4. power inverter as described in claim 1, which is characterized in that
The guiding elements is formed as tubular, installs in the state that front end face is abutted with the screw fixed part of the electronic component
In the through-hole of the board member.
5. power inverter as claimed in claim 4, which is characterized in that
The guiding elements has stopper section, in the case where abutting front end face with the screw fixed part of the electronic component,
The stopper section is abutted with the surface of the board member.
6. power inverter as claimed in claim 4, which is characterized in that
The guiding elements has the slit being axially formed from base end part.
7. power inverter as described in claim 1, which is characterized in that
The guiding elements has the internal diameter small along axial length than the mounting screw.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-053819 | 2015-03-17 | ||
| JP2015053819 | 2015-03-17 | ||
| JP2015243097A JP6645164B2 (en) | 2015-03-17 | 2015-12-14 | Power converter |
| JP2015-243097 | 2015-12-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105991043A CN105991043A (en) | 2016-10-05 |
| CN105991043B true CN105991043B (en) | 2019-06-07 |
Family
ID=57008366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610140949.0A Active CN105991043B (en) | 2015-03-17 | 2016-03-11 | Power inverter |
Country Status (2)
| Country | Link |
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| DE112018007612T5 (en) * | 2018-05-14 | 2021-02-04 | Mitsubishi Electric Corporation | Power conversion device |
| JP6955047B2 (en) * | 2020-03-31 | 2021-10-27 | 本田技研工業株式会社 | Power control unit |
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Also Published As
| Publication number | Publication date |
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| CN105991043A (en) | 2016-10-05 |
| JP2016174518A (en) | 2016-09-29 |
| JP6645164B2 (en) | 2020-02-14 |
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