JP6639672B2 - 被覆材を有する電気装置 - Google Patents

被覆材を有する電気装置 Download PDF

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Publication number
JP6639672B2
JP6639672B2 JP2018527197A JP2018527197A JP6639672B2 JP 6639672 B2 JP6639672 B2 JP 6639672B2 JP 2018527197 A JP2018527197 A JP 2018527197A JP 2018527197 A JP2018527197 A JP 2018527197A JP 6639672 B2 JP6639672 B2 JP 6639672B2
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JP
Japan
Prior art keywords
electrical device
thermal buffer
buffer particles
electrical
cement
Prior art date
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Active
Application number
JP2018527197A
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English (en)
Japanese (ja)
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JP2018536996A (ja
Inventor
ハーツァー アンドレアス
ハーツァー アンドレアス
ハイトマン ゲオアク
ハイトマン ゲオアク
ヒンダーベアガー シュテファン
ヒンダーベアガー シュテファン
ピアク タャルフ
ピアク タャルフ
シュテーヴィング フェリックス
シュテーヴィング フェリックス
エプレ ラース
エプレ ラース
ステディーレ ペトラ
ステディーレ ペトラ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JP2018536996A publication Critical patent/JP2018536996A/ja
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Publication of JP6639672B2 publication Critical patent/JP6639672B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Inorganic Insulating Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Thermistors And Varistors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2018527197A 2015-11-26 2016-11-17 被覆材を有する電気装置 Active JP6639672B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102015223422.3 2015-11-26
DE102015223422.3A DE102015223422A1 (de) 2015-11-26 2015-11-26 Elektrische Vorrichtung mit einer Umhüllmasse
PCT/EP2016/077920 WO2017089208A1 (de) 2015-11-26 2016-11-17 Elektrische vorrichtung mit einer umhüllmasse

Publications (2)

Publication Number Publication Date
JP2018536996A JP2018536996A (ja) 2018-12-13
JP6639672B2 true JP6639672B2 (ja) 2020-02-05

Family

ID=57421824

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018527197A Active JP6639672B2 (ja) 2015-11-26 2016-11-17 被覆材を有する電気装置

Country Status (5)

Country Link
JP (1) JP6639672B2 (zh)
CN (1) CN108292635B (zh)
DE (1) DE102015223422A1 (zh)
MY (1) MY195445A (zh)
WO (1) WO2017089208A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017114595A1 (de) * 2017-06-29 2019-01-03 MAGENWIRTH Technologies GmbH Elektronische Schaltung
DE102018215694A1 (de) 2018-09-14 2020-03-19 Robert Bosch Gmbh Vergussmasse, elektrisch isoliertes elektrisches oder elektronisches Bauteil und Verfahren zu dessen elektrischer Isolierung

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS482057Y1 (zh) * 1968-10-23 1973-01-19
JPS5111303B1 (zh) * 1970-06-18 1976-04-10
JPS5144873A (ja) * 1974-10-16 1976-04-16 Hitachi Ltd Moorudogatahandotaisoshi
JPH0239461A (ja) * 1988-07-28 1990-02-08 Semiconductor Energy Lab Co Ltd 半導体装置
JPH1050900A (ja) * 1996-08-06 1998-02-20 Nippon Kayaku Co Ltd 樹脂封止型半導体装置
US6815486B2 (en) * 2002-04-12 2004-11-09 Dow Corning Corporation Thermally conductive phase change materials and methods for their preparation and use
JP4148351B2 (ja) * 2002-07-08 2008-09-10 独立行政法人科学技術振興機構 誘電体材料
JP2006201689A (ja) * 2005-01-24 2006-08-03 Fuji Xerox Co Ltd 光学組成物、光学素子、及び調光方法
JP4589269B2 (ja) * 2006-06-16 2010-12-01 ソニー株式会社 半導体装置およびその製造方法
GB0721847D0 (en) * 2007-11-07 2007-12-19 Ciba Sc Holding Ag Heat storage compositions and their manufacture
CN101869008B (zh) * 2007-12-26 2012-08-29 松下电器产业株式会社 半导体装置和多层配线基板
KR20090107882A (ko) * 2008-04-10 2009-10-14 삼성전자주식회사 고정층을 포함하는 경사 조성 봉지 박막 및 그의 제조방법
DE102009002519A1 (de) * 2009-04-21 2010-10-28 Robert Bosch Gmbh Gekapselte Schaltungsvorrichtung für Substrate mit Absorptionsschicht sowie Verfahren zu Herstellung derselben
US8936864B2 (en) * 2010-07-07 2015-01-20 GM Global Technology Operations LLC Batteries with phase change materials
US9346991B2 (en) * 2011-04-14 2016-05-24 Ada Technologies, Inc. Thermal interface materials and systems and devices containing the same
WO2013076909A1 (ja) * 2011-11-21 2013-05-30 パナソニック株式会社 電気部品用樹脂、半導体装置、及び配線基板
US9963627B2 (en) * 2012-11-09 2018-05-08 Bioastra Technologies Inc. Nanostructured phase change materials for solid state thermal management
DE102013112267A1 (de) 2013-11-07 2015-05-07 Heraeus Deutschland GmbH & Co. KG Halbleitermodul mit einer einen Halbleiterbaustein bedeckenden Umhüllungsmasse

Also Published As

Publication number Publication date
MY195445A (en) 2023-01-21
DE102015223422A1 (de) 2017-06-01
WO2017089208A1 (de) 2017-06-01
CN108292635B (zh) 2020-12-22
JP2018536996A (ja) 2018-12-13
CN108292635A (zh) 2018-07-17

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