MY195445A - Electrical Device Having A Covering Material - Google Patents

Electrical Device Having A Covering Material

Info

Publication number
MY195445A
MY195445A MYPI2018701733A MYPI2018701733A MY195445A MY 195445 A MY195445 A MY 195445A MY PI2018701733 A MYPI2018701733 A MY PI2018701733A MY PI2018701733 A MYPI2018701733 A MY PI2018701733A MY 195445 A MY195445 A MY 195445A
Authority
MY
Malaysia
Prior art keywords
covering material
electrical device
electrical component
cement material
electrical
Prior art date
Application number
MYPI2018701733A
Inventor
Andreas Harzer
Georg Hejtmann
Stefan Hinderberger
Tjalf Pirk
Felix Stewing
Lars Epple
Petra Stedile
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of MY195445A publication Critical patent/MY195445A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H01L23/4275—Cooling by change of state, e.g. use of heat pipes by melting or evaporation of solids

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Thermistors And Varistors (AREA)
  • Inorganic Insulating Materials (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention relates to an electrical device (10) comprising an electrical component (12) that is at least partially covered by a covering material (20) that comprises a cement material (22). Said covering material (20) comprises thermal buffer particles (24) which are located in the cement material (22) and are additionally designed to undergo a phase transition absorbing at least one portion of an amount of heat (26) emitted by said electrical component (12). (Figure 1)
MYPI2018701733A 2015-11-26 2016-11-17 Electrical Device Having A Covering Material MY195445A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015223422.3A DE102015223422A1 (en) 2015-11-26 2015-11-26 Electric device with a wrapping compound
PCT/EP2016/077920 WO2017089208A1 (en) 2015-11-26 2016-11-17 Electrical device having a covering material

Publications (1)

Publication Number Publication Date
MY195445A true MY195445A (en) 2023-01-21

Family

ID=57421824

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2018701733A MY195445A (en) 2015-11-26 2016-11-17 Electrical Device Having A Covering Material

Country Status (5)

Country Link
JP (1) JP6639672B2 (en)
CN (1) CN108292635B (en)
DE (1) DE102015223422A1 (en)
MY (1) MY195445A (en)
WO (1) WO2017089208A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017114595A1 (en) * 2017-06-29 2019-01-03 MAGENWIRTH Technologies GmbH Electronic switch
DE102018215694A1 (en) 2018-09-14 2020-03-19 Robert Bosch Gmbh Potting compound, electrically insulated electrical or electronic component and method for its electrical insulation

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS482057Y1 (en) * 1968-10-23 1973-01-19
JPS5111303B1 (en) * 1970-06-18 1976-04-10
JPS5144873A (en) * 1974-10-16 1976-04-16 Hitachi Ltd MOORUDOGATAHANDOTAISOSHI
JPH0239461A (en) * 1988-07-28 1990-02-08 Semiconductor Energy Lab Co Ltd Semiconductor device
JPH1050900A (en) * 1996-08-06 1998-02-20 Nippon Kayaku Co Ltd Resin-sealed semiconductor device
US6815486B2 (en) * 2002-04-12 2004-11-09 Dow Corning Corporation Thermally conductive phase change materials and methods for their preparation and use
JP4148351B2 (en) * 2002-07-08 2008-09-10 独立行政法人科学技術振興機構 Dielectric material
JP2006201689A (en) * 2005-01-24 2006-08-03 Fuji Xerox Co Ltd Optical composite, optical element, and light control method
JP4589269B2 (en) * 2006-06-16 2010-12-01 ソニー株式会社 Semiconductor device and manufacturing method thereof
GB0721847D0 (en) * 2007-11-07 2007-12-19 Ciba Sc Holding Ag Heat storage compositions and their manufacture
CN101869008B (en) * 2007-12-26 2012-08-29 松下电器产业株式会社 Semiconductor device and multilayer wiring board
KR20090107882A (en) * 2008-04-10 2009-10-14 삼성전자주식회사 Graded composition encapsulation thin film comprising anchoring layer and method of fabricating the same
DE102009002519A1 (en) * 2009-04-21 2010-10-28 Robert Bosch Gmbh Encapsulated circuit device for substrates with absorption layer and method for producing the same
US8936864B2 (en) * 2010-07-07 2015-01-20 GM Global Technology Operations LLC Batteries with phase change materials
EP2699631A4 (en) * 2011-04-14 2015-01-21 Ada Technologies Inc Thermal interface materials and systems and devices containing the same
JP5591405B2 (en) * 2011-11-21 2014-09-17 パナソニック株式会社 Resin for electrical parts, semiconductor device, and wiring board
US9963627B2 (en) * 2012-11-09 2018-05-08 Bioastra Technologies Inc. Nanostructured phase change materials for solid state thermal management
DE102013112267A1 (en) 2013-11-07 2015-05-07 Heraeus Deutschland GmbH & Co. KG Semiconductor module with a semiconductor device covering a cover mass

Also Published As

Publication number Publication date
CN108292635A (en) 2018-07-17
JP6639672B2 (en) 2020-02-05
JP2018536996A (en) 2018-12-13
CN108292635B (en) 2020-12-22
WO2017089208A1 (en) 2017-06-01
DE102015223422A1 (en) 2017-06-01

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