JPS482057Y1 - - Google Patents
Info
- Publication number
- JPS482057Y1 JPS482057Y1 JP1968092341U JP9234168U JPS482057Y1 JP S482057 Y1 JPS482057 Y1 JP S482057Y1 JP 1968092341 U JP1968092341 U JP 1968092341U JP 9234168 U JP9234168 U JP 9234168U JP S482057 Y1 JPS482057 Y1 JP S482057Y1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Wire Bonding (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1968092341U JPS482057Y1 (en) | 1968-10-23 | 1968-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1968092341U JPS482057Y1 (en) | 1968-10-23 | 1968-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS482057Y1 true JPS482057Y1 (en) | 1973-01-19 |
Family
ID=33255915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1968092341U Expired JPS482057Y1 (en) | 1968-10-23 | 1968-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS482057Y1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018536996A (en) * | 2015-11-26 | 2018-12-13 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングＲｏｂｅｒｔ Ｂｏｓｃｈ Ｇｍｂｈ | Electrical device with coating |
-
1968
- 1968-10-23 JP JP1968092341U patent/JPS482057Y1/ja not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018536996A (en) * | 2015-11-26 | 2018-12-13 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングＲｏｂｅｒｔ Ｂｏｓｃｈ Ｇｍｂｈ | Electrical device with coating |