JP6635334B2 - Arc extinguishing resin composition - Google Patents

Description

  The present invention relates to an arc extinguishing resin composition. The present invention particularly relates to an arc-extinguishing resin composition constituting an arc-extinguishing resin used to extinguish an arc generated from a contact when current is interrupted in a circuit breaker.

  2. Description of the Related Art A conventional circuit breaker or the like includes an arc extinguishing device formed of an arc extinguishing insulating resin having an insulating property in order to extinguish an arc generated when a short circuit current and a load current are interrupted. The arc-extinguishing insulating resin is thermally decomposed and generates a decomposed gas when an arc of 5000 ° C. or more is generated. This decomposition gas cools the arc and extinguishes the arc.

  Conventionally, an arc-extinguishing insulating resin using microcapsules has been known (for example, see Patent Document 1). Patent Literature 1 discloses that an arc-extinguishing insulating resin can suppress a decrease in electric characteristics and a decrease in mechanical strength by releasing an adhesive from a microcapsule having an adhesive as a core material when a crack is formed. I have.

Further, an arc-extinguishing insulating resin using water-containing microcapsules is also known (for example, see Patent Document 2). The arc-extinguishing insulating resin disclosed in Patent Literature 2 generates H ₂ O to lower the arc temperature and extinguish the arc.

  An arc-extinguishing insulating resin in which glycol is encapsulated in a microcapsule by the present applicant is also known (for example, see Patent Document 3). The arc-extinguishing insulating resin of Patent Document 3 can extinguish an arc generated at the time of circuit interruption efficiently without causing an increase in internal pressure in an arc-extinguishing chamber under a relatively low temperature environment.

JP 2003-31063 A JP 2009-295419 A JP 2010-40471 A

  The technology disclosed in the prior art for encapsulating an arc-extinguishing material in microcapsules has a problem that the microcapsules are broken during kneading into the epoxy resin, and arc extinguishing performance is hardly exhibited. An object of the present invention is to mix microcapsules having a breaking strength that is not broken during kneading, efficiently exhibit an effect of cooling an arc generated at the time of breaking, improve breaking performance, and occur at that time. It provides a molded body made of an arc-extinguishing insulating material that improves heat resistance to withstand temperature rise and mechanical strength against internal pressure rise, and maintains corrosion resistance and insulation from generated gas components. To provide a circuit breaker comprising:

  The present inventors have conducted intensive studies and found that the microcapsules contained in the arc-quenching resin composition had at least a two-layer structure, thereby improving the strength of the microcapsules and, as a result, efficiently extinguishing the arc. The present inventors have found that an arc-extinguishing insulating resin capable of arcing can be obtained, and have completed the present invention.

  The present invention, according to one embodiment, is an arc-quenching resin composition, comprising a glycidyl ether type epoxy resin, a polyamine-based curing agent or an imidazole-based curing agent, and microcapsules, wherein the microcapsules are: A core material and a film covering the core material, wherein the film includes a first film containing at least one of melamine resin and urea resin, and a second film containing at least one of epoxy resin, urethane resin and acrylic resin. And two or more layers including a coating.

  In the arc extinguishing resin composition, it is preferable that the first film is in contact with the core substance.

  In the arc extinguishing resin composition, it is preferable that the core substance is mainly composed of a hydrophobic substance.

  In the arc-quenching resin composition, the microcapsules may contain at least 7% by mass of at least one selected from dibutyl phthalate, diheptyl phthalate, bis (2-ethylhexyl) phthalate, diisodecyl phthalate, and diisononyl phthalate. It is preferred to include.

  In the arc-quenching resin composition, the microcapsules preferably contain at least 7% by mass of at least one selected from dioctyl adipate, diisononyl adipate, and diisodecyl adipate.

  In the arc-quenching resin composition, it is preferable that the microcapsules are contained in an amount of 1% by mass or more.

  In the arc-quenching resin composition, 1 to 60 masses of one or more inorganic fillers and / or reinforcing fibers selected from barium titanate whiskers, silica gel fine particles, boehmite, talc, magnesium carbonate, and metal hydroxide are further added. %.

  According to another embodiment of the present invention, there is provided an arc-extinguishing resin processed product obtained by curing any one of the aforementioned arc-extinguishing resin compositions.

  According to still another embodiment of the present invention, there is provided a circuit breaker, comprising: a fixed contact having a fixed contact; and a movable contact having a contact with the fixed contact. A movable contact, and an arc extinguishing device that extinguishes an arc generated when the fixed contact and the movable contact perform opening and closing operations, wherein the arc extinguishing device is provided with the aforementioned arc-extinguishing resin processing. Goods.

  According to the arc-quenching resin composition according to the present invention, the microcapsules are not broken during kneading of the resin composition before molding, and the core substance is vaporized even when the ambient temperature is increased by energization. Can be suppressed. Therefore, it is possible to efficiently exhibit the cooling effect of the arc generated at the time of interruption, improve the interruption performance, improve the heat resistance to withstand the temperature rise that occurs at that time, and increase the mechanical strength against the internal pressure increase of the arc extinction chamber. An arc-extinguishing resin processed product that improves the corrosion resistance and insulation properties from the generated gas components can be obtained. Further, the shut-off device provided with the arc-extinguishing resin workpiece according to the present invention has excellent shut-off performance such as overload cut-off and short-circuit cut-off, and has a long product life and high reliability.

FIG. 1 is a conceptual cross-sectional view of a circuit breaker to which the arc-extinguishing resin composition of the present invention is applied. FIG. 2 is a perspective view showing an example of an arc-extinguishing device (molded product) formed from the arc-extinguishing resin composition of the present invention. FIG. 3 is a perspective view showing an example of a circuit breaker including an arc extinguishing device (molded body) formed from the arc extinguishing resin composition of the present invention.

  Hereinafter, an embodiment of the present invention will be described. However, the present invention is not limited by the embodiments described below.

[First Embodiment: Resin Composition for Arc Extinguishing]
The present invention relates to an arc extinguishing resin composition according to a first embodiment. The arc-extinguishing resin composition according to the present embodiment is an arc-extinguishing resin composition including a glycidyl ether type epoxy resin, a polyamine-based curing agent or an imidazole-based curing agent, and microcapsules.

  The glycidyl ether type epoxy resin is not particularly limited, and examples thereof include bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, cresol phenol polyglycidyl ether, novolak phenol polyglycidyl ether, and tetramethylbiphenyl diglycidyl ether. Among them, bisphenol A diglycidyl ether is preferable because it has a low viscosity and is excellent in mixing and dispersing properties of microcapsules.

  Further, the epoxy equivalent (g / eq) of the glycidyl ether type epoxy compound is preferably from 80 to 300, and more preferably from 150 to 200. By setting the epoxy equivalent in such a range, the viscosity of the resin composition can be reduced, and the microcapsules can be easily mixed and dispersed. The viscosity (Pa · s) of the glycidyl ether type epoxy compound is preferably 0.5 to 30, and more preferably 1 to 15. By setting the viscosity in such a range, the microcapsules can be easily mixed and dispersed.

  In the present embodiment, a polyamine-based curing agent or an imidazole-based curing agent can be used as the curing agent mixed with the glycidyl ether type epoxy compound. In particular, a resin processed product obtained using an imidazole-based curing agent has high heat resistance, and furthermore, the core material of the microcapsules is less likely to evaporate into the atmosphere, thereby improving the stability of the microcapsules at room temperature. Can be.

  There is no particular limitation on the polyamine-based curing agent, and examples thereof include aliphatic amines and aromatic amines. As the aliphatic amine, for example, ethylenediamine, diethylenetriamine, triethylenetetramine, dipropylenetriamine, dimethylaminopropylamine, cyclohexylaminopropylamine, monoethanolamine, diethanolamine, propanolamine, N-methylethanolamine, aminoethylethanolamine , Monohydroxyethyldiethylenetriamine, bishydroxyethyldiethylenetriamine, N- (2-hydroxypropyl) ethylenediamine, hexamethylenediamine, diethyleneglycol / bispropylenediamine, diethylaminopropylamine, m-xylylenediamine, 3,9-bis (3-amino Propyl) -2,4,8,10-tetraspiro [5,5] undecane, mensendiami , Isophorone diamine, bis (4-amino-3-methylcyclohexyl) methane, N- aminoethylpiperazine, triethanolamine, tetramethylguanidine, and benzyldimethylamine. Examples of the aromatic amines include phenylenediamine, diaminoanisole, toluenediamine, xylenediamine, diaminobishexysamicylenetriamine, diphenylamine, diaminodiphenylmethane, diaminodiphenylsulfone, α-methyldimethylamine, dimethylaminomethylphenol, and tridimethylamine. Examples include aminomethylbenzene and pyridine.

  Examples of the imidazole-based curing agent include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole, 1-benzyl-2-methylimidazole, -Cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, epoxy-imidazole adduct, 1-benzyl-2-phenylimidazole, 1-isobutyl-2 -Methylimidazole, 1,2-dimethylimidazole, 2-phenyl-4 (5) -methylimidazole and the like. Among them, 2-ethyl-4 (5) -methylimidazole is preferred because it is in a viscosity range in which the dispersibility of the microcapsules is possible.

  The blending amount (phr) of the polyamine-based curing agent is preferably 30 to 75 parts by mass, more preferably 45 to 65 parts by mass, per 100 parts by mass of the glycidyl ether type epoxy compound. Further, the blending amount (phr) of the imidazole-based curing agent is preferably 1 to 10 parts by mass, more preferably 3 to 6 parts by mass, per 100 parts by mass of the glycidyl ether type epoxy compound. By using such an amount, a cured product having excellent mechanical properties and electrical properties can be obtained.

  In the composition of the present embodiment, the microcapsules are composed of a core substance and a film covering the core substance. The film is laminated on at least two layers including a first film containing at least one of melamine resin and urea resin and a second film containing at least one of epoxy resin, urethane resin and acrylic resin. Become. With the structure having two or more layers, the second film covers the defect of the first film, and the heat resistance and strength of the microcapsule can be increased. By increasing the heat resistance of the microcapsules, the arc-extinguishing performance of the arc-extinguishing resin can be maintained for a long time.

  The melamine resin and the urea resin constituting the first film may be used alone, or may be an arbitrary mixture thereof. The epoxy resin constituting the second film is not particularly limited, and any epoxy resin can be used. For example, the glycidyl ether type epoxy compound described above as a component of the arc-quenching resin composition may be used, an alicyclic epoxy compound may be used, or a mixture of a plurality of types of epoxy compounds may be used. . The epoxy resin constituting the second film and the epoxy resin used as the resin component of the arc-quenching resin composition may be of the same type or different, but both have a high hydrogen atom content ratio. Is more preferred. As the acrylic resin constituting the second film, polymethyl methacrylate is particularly suitable. Further, an arbitrary mixture thereof, or an arbitrary mixture of these with an epoxy resin may be used.

  Of these, the first coating is preferably located in the innermost layer of the coating laminate in contact with the core material contained therein. Melamine resins and urea resins have less pinholes and cracks in the film, and are less likely to leak core materials. It is more preferable that the core substance contains a hydrophobic substance as the main component, because the compatibility between the innermost first coating and the core substance is excellent. Further, when the core material contains a phthalate ester described later as a main component, an embodiment in which the innermost first film is a melamine resin and the second film is an epoxy resin is particularly preferable. This is because melamine resin easily forms a particularly dense film with respect to phthalic acid ester which is a hydrophobic substance, and epoxy resin easily forms a more dense film when laminated on the first film.

  When the film has a structure of three or more layers, for example, between the first film and the second film, or outside the second film, for example, another thermosetting resin that increases heat resistance and strength. Layers may be included.

  The mass of the coating in the entire mass of the microcapsules is preferably 40% by mass or more, and more preferably 50% by mass or more. This is for ensuring the strength of the microcapsule. When the coating has a two-layer structure, the thickness ratio between the first coating and the second coating is preferably 1: 1 to 10: 1, and more preferably 3: 1 to 5: 1. More preferred. This is because the resin constituting the first film has better arc extinguishing performance as the resin than the resin constituting the second film.

  As described above, the breaking strength of the microcapsules can be improved by forming the film into at least a two-layer structure containing a specific resin. The breaking strength of the microcapsules in the present embodiment is preferably 0.5 MPa or more, more preferably 1 MPa or more. When the breaking strength is smaller than 0.5 MPa, the microcapsules are broken during kneading of the resin composition, and the core substance is vaporized when the temperature rises, and the arc-extinguishing property may be reduced. Alternatively, the core substance (arc extinguishing material) may cause curing inhibition of the epoxy resin. Here, the breaking strength of the microcapsules is measured by a micro compression tester.

The core material of the microcapsule may be any material that efficiently generates hydrogen gas, H ₂ O, O ₂ , and O (atomic oxygen) at the time of decomposition. For example, hydrophilic materials such as water and ethylene glycol are mainly used. What is used as a component is mentioned. Ethylene glycol can be preferably used when the temperature in the arc-extinguishing chamber at the time of energization is about 60 ° C.

  Alternatively, a hydrophobic substance such as a hydrocarbon having a high hydrogen atom content (the ratio of the number of hydrogen atoms to the total number of atoms constituting the molecule) can be used as a main component of the core material. In particular, from the viewpoint of compatibility with the first film of the microcapsule, a hydrophobic substance is suitable as a main component of the core substance. Above all, the temperature of the arc-extinguishing chamber at the time of energization becomes 80 ° C. or higher, and even under high-temperature conditions exceeding 100 ° C. in some cases, there is no fear of mass reduction and the viewpoint of an arc-extinguishing resin excellent in arc-extinguishing properties. Therefore, it is preferable to contain a phthalic acid ester having 16 to 26 carbon atoms and / or an adipic acid ester as a main component of the core substance. This is because these ester compounds are hardly volatilized and can release a decomposition gas having a high quenching effect when an arc is generated. These core materials are particularly advantageously used in high-current equipment applications, specifically in breakers with high current specifications of about 1000 to 100,000 A.

  Examples of the phthalic acid ester having 16 to 26 carbon atoms include, but are not limited to, dibutyl phthalate, diheptyl phthalate, bis (2-ethylhexyl) phthalate, diisodecyl phthalate, and diisononyl phthalate. These phthalic acid esters have a large molecular weight and a relatively high boiling point of around 300 ° C., so that they hardly volatilize even at a temperature in the arc-extinguishing device during energization, for example, around 100 ° C. Further, since the ratio of hydrogen atoms is relatively large, a sufficient amount of decomposition gas having a high quenching effect can be released when an arc is generated. The decomposition reaction of the phthalic acid ester is an endothermic reaction, and is effective in lowering the temperature of the arc. Further, there is no possibility that a toxic substance is generated by the decomposition reaction.

  As the adipic acid ester, it is particularly preferable to use an adipic acid ester having a hydrogen atom ratio of 60% or more. Here, the hydrogen atom ratio refers to the ratio of the number of hydrogen atoms to the total number of atoms constituting the compound. Above all, an adipic acid ester having a hydrogen atom ratio of 61% or more and 62% or more, for example, 65.0% or less is preferable. Further, those having a large molecular weight and a high boiling point, for example, those having a boiling point of about 220 ° C. or higher are preferable, and those having a boiling point of 280 ° C. or higher are more preferable. Examples of such adipates include, but are not limited to, dioctyl adipate, diisononyl adipate, and diisodecyl adipate. Like the phthalic acid ester, the adipic acid ester is also effective from the viewpoints of decomposing gas release performance, temperature lowering effect by endothermic reaction, and safety.

  It is preferable that these core materials contain 7% by mass or more when the total mass of the microcapsules is 100%, regardless of whether the core materials are mainly composed of a hydrophilic substance or hydrophobic components. , 8 to 60% by mass. If the content of the core substance is less than 7% by mass relative to the total mass of the microcapsules, the arc cooling effect may not be sufficiently exhibited. When the content exceeds 60% by mass, the core substance is apt to evaporate into the air due to the thinning of the microcapsule film, and the arc cooling effect by the core substance may not be sufficiently obtained at the time of disappearance.

  When the core material of the microcapsule is mainly composed of a hydrophobic component, in addition to the phthalic acid ester and / or adipic acid ester, a hydrophilic material may be contained as long as the arc-extinguishing performance is not impaired, For example, it may further contain gelatin or the like. These contents are preferably less than 10 parts by mass, more preferably less than 5 parts by mass, per 100 parts by mass of the core substance. If it exceeds 5 parts by mass, it may be difficult to generate a gas having a high quenching effect when the arc is quenched. In addition, as a core substance, the above-mentioned phthalic acid ester and the above-mentioned adipic acid ester may be included in one microcapsule in a mixed state. In this case, it is preferable that the total amount of the phthalic acid ester and the adipic acid ester is contained in the entire amount of the microcapsules within the range of the above mass%.

  The average particle size of the microcapsules is preferably from 1 μm to 150 μm, more preferably from 1 to 100 μm. Here, the particle size refers to a value obtained by a laser diffraction / scattering method. If the particle diameter is smaller than the above range, the microcapsules may aggregate due to a cohesive force, and the arc-quenching material may be unevenly distributed, resulting in a decrease in arc-quenching properties. If the particle size is larger than the above range, the breaking strength of the microcapsule itself may decrease, and the mechanical strength and dimensional stability of the molded product may decrease.

  The microcapsules preferably contain 1% by mass or more when the mass of the entire resin composition is 100%, and more preferably 7 to 50% by mass. If the content of the microcapsules in the resin composition is less than 1% by mass, the above effects may not be obtained at all. In particular, in the microcapsules of the present invention, the inclusions are less likely to leak due to the improvement in the heat resistance and strength of the film, so that the amount of added microcapsules can be increased as compared with the conventional case.

  Various known methods can be used for preparing the microcapsules. As an example, an in situ material is prepared by mixing a core substance in a solvent such as water and stirring to prepare an emulsion, and further mixing a polymer prepolymer and a curing agent to form a cured film gradually. It can be carried out by a legal method or an interfacial polymerization method.

  The resin composition according to the present embodiment preferably contains an inorganic additive composed of an inorganic filler and / or a reinforcing fiber. The inorganic filler may be at least one selected from barium titanate whiskers, silica gel fine particles, boehmite, talc, kaolin clay, mica, magnesium carbonate, and metal hydroxide. By containing these inorganic additives, the strength, pressure resistance, and heat resistance of the arc-extinguishing resin processed product can be improved, and the dimensional stability can be improved.

  For example, the reinforcing fibers include glass fibers and the like, and it is preferable to use glass fibers in view of strength and adhesiveness with a resin or an inorganic filler. These reinforcing fibers may be used alone or in combination of two or more, or may be those treated with a known surface treatment agent such as a silane coupling agent. Further, it is preferable that the glass fiber has been subjected to a surface treatment and further covered with a resin. Thereby, the adhesion between the glass fiber and the resin can be further improved.

  The metal hydroxide having a particle size of 1 to 10 μm is more preferable since the dispersibility with the resin is high. The metal hydroxide emits hydrogen gas, water, oxygen, and atomic oxygen, which are excellent in arc extinguishing property when decomposed, so that the arc extinguishing efficiency can be improved. Aluminum hydroxide, boehmite and magnesium hydroxide are preferred because the increase in internal pressure can be further suppressed.

  And it is preferable to contain 1-70 mass% of the inorganic additive which consists of an inorganic filler and / or a reinforcing fiber in a resin composition. If the content of the inorganic additive is less than 1% by mass, the effect of the addition may hardly be obtained. If the content exceeds 70% by mass, the amount of generated pyrolysis gas is reduced, so that the arc extinguishing property is poor. There is.

  Further, the resin composition, heat resistance, pressure resistance, arc extinction properties of the object of the present invention, as long as the physical properties such as strength is not significantly impaired, other commonly used additional components other than the above, for example, a crystal nucleating agent, Additives such as a colorant, an antioxidant, a release agent, a plasticizer, a heat stabilizer, a lubricant, and an ultraviolet inhibitor can be added.

  The arc-extinguishing resin processed product made of the arc-extinguishing resin composition according to the first embodiment is obtained by preparing the resin composition according to the present embodiment, molding and curing the resin composition. The resin composition is prepared by mixing an epoxy resin, a curing agent, and optionally an inorganic additive or other additives in a usual manner, and then mixing and dispersing the microcapsules in the resin. it can. In the present embodiment, in particular, since the breaking strength of the microcapsules is improved, it is advantageous in that the microcapsules are hardly broken even during dispersion and mixing. As a molding method, a conventionally known method is used. For example, after the resin composition is melt-kneaded and pelletized, it can be molded by conventionally known injection molding, extrusion molding, vacuum molding, inflation molding, or the like. Melt kneading can be carried out using a conventional melt kneading machine such as a single-screw or twin-screw extruder, a Banbury mixer, a kneader, and a mixing roll. Further, the curing method may be curing at room temperature or heating and curing, and is not particularly limited.

[Second embodiment: circuit breaker]
According to a second embodiment of the present invention, there is provided a circuit breaker including a fixed contact having a fixed contact, and a movable contact in contact with the fixed contact, and an opening / closing operation for the fixed contact. And an arc extinguishing device that extinguishes an arc generated when the fixed contact and the movable contact perform opening and closing operations.

FIG. 1 is a conceptual sectional view of a circuit breaker to which the arc-extinguishing resin composition of the present invention is applied.
A circuit breaker 10 shown in FIG. 1 is provided with a movable contact 1 having a movable contact 2 and a fixed contact 4 having a fixed contact 3, and has a side wall provided with the arc-extinguishing resin described in the first embodiment. An arc extinguishing device 5 including a molded product is provided. An arc is generated between the fixed contact 3 and the movable contact 2 between the electrodes of the circuit breaker 10 when the short-circuit current and the load current are interrupted. At this time, the arc extinguishing device 5 is decomposed by the heat of the arc, and the volatile gas of the core substance is released from the microcapsules described above in detail, thereby lowering the temperature of the arc and extinguishing the arc efficiently. it can.

  FIG. 2 is a perspective view showing an example of a formed body constituting the arc extinguishing device. The arc extinguishing device shown in FIG. 2 is composed of the arc-extinguishing resin processed product formed integrally. However, the circuit breaker of the present invention is not limited to such a molded body, and an arc-extinguishing resin processed product in an amount sufficient to generate a decomposition gas is arranged in the vicinity of an arc generation location. Just do it. For example, an arc-extinguishing resin product may be partially disposed at least on a surface portion of the molded body shown in FIG. 2 that is close to the arc.

  FIG. 3 is a perspective view illustrating an example of the circuit breaker 10 including the arc extinguishing device 5 formed of the molded body illustrated in FIG. 2. The arc extinguishing device 5 forms a side wall of the arc extinguishing chamber with respect to the fixed contact 4 and the movable contact 1. Decomposed gas having a high arc-extinguishing property is released into such an arc-extinguishing chamber, thereby facilitating the cooling of the arc and quickly extinguishing the arc. Note that the structural features and functions of the circuit breaker itself are also described in detail in, for example, Patent Document 3 by the present applicant, and a similar structure can be adopted.

  Hereinafter, the present invention will be described in more detail with reference to examples. However, the following examples do not limit the present invention.

(Example 1)
27% by mass of glycidyl ether type epoxy resin (trade name: "828" manufactured by Japan Epoxy Resin Co., Ltd.) and 33 mass% of acid anhydride-based curing agent (trade name: "YH306" manufactured by Japan Epoxy Resin Co., Ltd.) % And a core material containing 85% of phthalic acid (2-ethylhexyl), an epoxy resin as an inner layer, a melamine resin as an outer layer, an average particle size of 100 μm, and a breaking strength of 1.0 MPa. (Manufactured by K.K.) was stirred and mixed to obtain an arc-quenching resin composition. The composition was molded by casting and cured at room temperature to obtain an arc-extinguishing resin processed product having the shape shown in FIG.

(Example 2)
33% by mass of glycidyl ether type epoxy resin (trade name: "828" manufactured by Japan Epoxy Resin Co., Ltd.) and 27% by mass of acid anhydride-based curing agent (trade name: "HN5500" manufactured by Hitachi Chemical Co., Ltd.) 40% by mass of microcapsules (manufactured by Nissei Technica) having a core material containing 85% of dibutyl phthalate, an epoxy resin as an inner layer, and a melamine resin as an outer layer, having an average particle size of 50 μm and a breaking strength of 10 MPa. The mixture was stirred and mixed to obtain an arc-quenching resin composition. The composition was molded by casting and cured at room temperature to obtain an arc-extinguishing resin processed product having the shape shown in FIG.

(Example 3)
30% by mass of a glycidyl ether type epoxy resin (trade name: "828" manufactured by Japan Epoxy Resin Co., Ltd.) and 15% by mass of an imidazole-based curing agent (trade name: "EMI24" manufactured by Japan Epoxy Resin Co., Ltd.) 35% by mass of microcapsules (manufactured by Nissei Technica) containing 85% of dibutyl phthalate as a core material, an epoxy resin as an inner layer, and a melamine resin as an outer layer, having an average particle size of 100 μm and a breaking strength of 1.0 MPa. And 10% by mass of magnesium hydroxide (trade name; “N-4” Kamishima Chemical Industry Co., Ltd.) and 10% by mass of glass fiber (trade name: “03.JAF2Ak25” manufactured by Asahi Fiber Glass Co., Ltd.) as inorganic fillers. Was mixed with stirring to obtain an arc-quenching resin composition. The composition was molded by casting and cured at room temperature to obtain an arc-extinguishing resin processed product having the shape shown in FIG.

(Comparative Example 1)
In Example 1, a microcapsule coating was stirred and mixed under the same conditions as in Example 1 except that only the epoxy resin was used for the microcapsule coating and water was used as the core substance, to obtain a resin composition for arc quenching. The breaking strength of the microcapsules in Comparative Example 1 was 0.08 MPa. The composition was molded by casting and cured at room temperature to obtain an arc-extinguishing resin processed product having the shape shown in FIG.

(Comparative Example 2)
In Example 2, an arc quenching resin composition was obtained by stirring and mixing under the same conditions as in Example 2 except that the microcapsule coating was only epoxy resin and water was used as the core substance. The breaking strength of the microcapsules in Comparative Example 2 was 0.1 MPa. The composition was molded by casting and cured at room temperature to obtain an arc-extinguishing resin processed product having the shape shown in FIG.

(Comparative Example 3)
In Example 3, an arc-quenching resin composition was obtained by stirring and mixing under the same conditions as in Example 3 except that the melamine resin alone was used for the microcapsule coating and water was used as the core substance. The breaking strength of the microcapsule in Comparative Example 3 was 0.3 MPa. The composition was molded by casting and cured at room temperature to obtain an arc-extinguishing resin processed product having the shape shown in FIG.

  The moldability of the arc-extinguishing resin processed products of Examples 1 to 3 and Comparative Examples 1 to 3 was evaluated. This arc-extinguishing resin processed product was applied to the arc-extinguishing device of the circuit breaker shown in FIG. 3, and a short-circuit test and a heat resistance test were performed. In the short-circuit test, in the open state, an electric current is applied under the condition of three-phase 440 V / 50 kA to separate the movable contact to generate an arc current. The presence or absence of breakage (internal pressure) and heat resistance were confirmed. The interrupting property was judged to be acceptable when the short-circuit current was interrupted. In addition, as a heat resistance test, the rate of change in mass after being left at 85 ° C. for 2 hours was measured.

The test results are summarized in Table 1. In Examples 1 to 3, the blocking performance was particularly good. Good breaking means that the short-circuit current is quickly broken at the time of short-circuit.

  The arc-extinguishing resin composition according to the present invention is used as a circuit breaker for electric equipment. In particular, it is used as a circuit breaker for a breaker.

DESCRIPTION OF SYMBOLS 1 Movable contact 2 Movable contact 3 Fixed contact 4 Fixed contact 5 Arc extinguishing device (molded object)
6. Circuit breaker

Claims (9)

A glycidyl ether type epoxy resin, a polyamine-based curing agent or an imidazole-based curing agent, and a resin composition for arc extinction including microcapsules,
The microcapsule includes a core material and a film covering the core material,
The film is formed by laminating at least two layers including a first film containing at least one of melamine resin and urea resin and a second film containing at least one of epoxy resin, urethane resin and acrylic resin. the first film is that in contact with the core material, the arc extinguishing resin composition. The arc-extinguishing resin composition according to claim 1, wherein the core substance is mainly composed of a hydrophobic substance. A glycidyl ether type epoxy resin, a polyamine-based curing agent or an imidazole-based curing agent, and an arc-quenching resin composition including microcapsules,
The microcapsule includes a core material and a film covering the core material,
The film is formed by laminating at least two layers including a first film containing at least one of melamine resin and urea resin and a second film containing at least one of epoxy resin, urethane resin and acrylic resin. the core substance, Ru least Tanedea carbon atoms selected from phthalic acid esters, and adipate esters of 16 to 26, arc-extinguishing resin composition. A glycidyl ether type epoxy resin, a polyamine-based curing agent or an imidazole-based curing agent, and a resin composition for arc extinction including microcapsules,
The microcapsule includes a core material and a film covering the core material,
The film is formed by laminating at least two layers including a first film containing at least one of melamine resin and urea resin and a second film containing at least one of epoxy resin, urethane resin and acrylic resin. the microcapsules, dibutyl phthalate, diheptyl phthalate, bis (2-ethylhexyl) phthalate, diisodecyl phthalate, one or more selected from diisononyl phthalate, 7% by mass or more including a resin composition for extinguishing object. A glycidyl ether type epoxy resin, a polyamine-based curing agent or an imidazole-based curing agent, and a resin composition for arc extinction including microcapsules,
The microcapsule includes a core material and a film covering the core material,
The film is formed by laminating at least two layers including a first film containing at least one of melamine resin and urea resin and a second film containing at least one of epoxy resin, urethane resin and acrylic resin. the microcapsules, dioctyl adipate, diisononyl adipate, one or more selected from diisodecyl adipate, 7 mass% or more including, extinguishing resin composition. The arc-quenching resin composition according to any one of claims 1 to 5 , wherein the microcapsules are contained in an amount of 1% by mass or more. Moreover, barium titanate whiskers, silica gel particles, boehmite, talc, one or more inorganic fillers and / or reinforcing fibers selected from magnesium carbonate and metal hydroxides, containing 1 to 60 wt%, claim 1-6 The arc-extinguishing resin composition according to any one of the above. An arc-extinguishing resin processed product obtained by curing the arc-extinguishing resin composition according to any one of claims 1 to 7 . A fixed contact having a fixed contact, a movable contact having a movable contact that comes into contact with the fixed contact, and performing an opening and closing operation with respect to the fixed contact, and an opening and closing operation of the fixed contact and the movable contact A circuit breaker comprising: an arc extinguishing device that extinguishes an arc generated when the arc is extinguished, wherein the arc extinguishing device includes the arc-extinguishing resin processed product according to claim 8 .

Images