JP6610612B2 - 支持体付き樹脂シート - Google Patents

支持体付き樹脂シート Download PDF

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Publication number
JP6610612B2
JP6610612B2 JP2017089867A JP2017089867A JP6610612B2 JP 6610612 B2 JP6610612 B2 JP 6610612B2 JP 2017089867 A JP2017089867 A JP 2017089867A JP 2017089867 A JP2017089867 A JP 2017089867A JP 6610612 B2 JP6610612 B2 JP 6610612B2
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Japan
Prior art keywords
resin
resin composition
support
resin sheet
circuit board
Prior art date
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JP2017089867A
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English (en)
Japanese (ja)
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JP2017136864A (ja
JP2017136864A5 (enExample
Inventor
亮 宮本
茂雄 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
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Ajinomoto Co Inc
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Priority to JP2017089867A priority Critical patent/JP6610612B2/ja
Publication of JP2017136864A publication Critical patent/JP2017136864A/ja
Publication of JP2017136864A5 publication Critical patent/JP2017136864A5/ja
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  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2017089867A 2017-04-28 2017-04-28 支持体付き樹脂シート Active JP6610612B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2017089867A JP6610612B2 (ja) 2017-04-28 2017-04-28 支持体付き樹脂シート

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017089867A JP6610612B2 (ja) 2017-04-28 2017-04-28 支持体付き樹脂シート

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2015164030A Division JP6176294B2 (ja) 2015-08-21 2015-08-21 支持体付き樹脂シート

Publications (3)

Publication Number Publication Date
JP2017136864A JP2017136864A (ja) 2017-08-10
JP2017136864A5 JP2017136864A5 (enExample) 2018-09-20
JP6610612B2 true JP6610612B2 (ja) 2019-11-27

Family

ID=59566284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017089867A Active JP6610612B2 (ja) 2017-04-28 2017-04-28 支持体付き樹脂シート

Country Status (1)

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JP (1) JP6610612B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7514655B2 (ja) 2020-05-28 2024-07-11 新光電気工業株式会社 電子部品内蔵基板及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI674972B (zh) * 2013-08-23 2019-10-21 日商味之素股份有限公司 零件封裝用薄膜之製造方法
JP6350093B2 (ja) * 2013-12-16 2018-07-04 味の素株式会社 部品内蔵基板の製造方法および半導体装置

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Publication number Publication date
JP2017136864A (ja) 2017-08-10

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